Class 3 Y5V 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors FEATURES • Class 3 dielectric • Four standard sizes • High capacitance per unit volume • Supplied in tape on reel • For high frequency applications • Ni-barrier with 100 % tin terminations. APPLICATIONS • Consumer electronics • Telecommunications • Data processing GENERAL SPECIFICATIONS • Mobile applications NOTE: Electrical characteristics values - temperature at 20 ± 1 °C, pressure at 86 to 106 Kpa and Temperature Coefficient: humidity at 63 to 67 % unless otherwise stated Rated Voltage U (DC): 10 V; 16 V; 25 V; 50 V; 100 V + 30/ - 80% R Capacitance Range: 0.01 µF to 10 µF Insulation Resistance after 120 seconds at UR (DC): Tolerance on Capacitance: R 10 GΩ minimum or 500ΩF mininimum, whichever is less ins After 1000 hours; ± 20 %; - 20/+ 80% Climatic Category (IEC 68): 25/85/21 Tan δδδδ: Test Voltage (DC) for 1 minute: 2.5 x U R Ageing: typical 7 % per time decade see Tests and requirements DIMENSIONS in inches [millimeters] SIZE T LW MB CODE MAX. 0.040 ± 0.002 0.020 ± 0.002 0.022 0.010 + 0.002/- 0.004 0402 [1.0 ± 0.05] [0.5 ± 0.05] [0.55] [0.25 + 0.05/− 0.0.1] 0.063 ± 0.004 0.030 ± 0.004 0.035 0.015 ± 0.006 W T 0603 [1.6 ± 0.10] [0.8 ± 0.07] [0.87] [0.40 ± 0.15] 0.080 ± 0.006 0.050 ± 0.006 0.053 0.020 ± 0.008 MB MB 0805 [2.0 ± 0.15] [1.25 ± 0.15] [1.35] [0.50 ± 0.20] L 0.125 ± 0.006 0.063 ± 0.006 0.069 0.025 ± 0.008 1206 [3.2 ± 0.15] [1.6 ± 0.15] [1.80] [0.60 ± 0.20] ORDERING INFORMATION VJ0402 V 103 M X Q C W1BC SIZE CODE DIELECTRIC CAPACITANCE TOLERANCE TERMINATION VOLTAGE PACKAGING TECHNOLOGY 0402 V = Y5V two signiŢcant digits M = ± 20 % X = Ni-Barrier Q = 10 V C = 7 inch followed by the reel/paper 0603 Z = - 20/+ 80 % J = 16 V number of zeros: P = 13 inch 0805 X = 25 V 103 = 10000 reel/paper 1206 A = 50 V T = 7 inch B = 100 V reel/blister R = 13 inch reel/blister www.vishay.com For technical questions contact MLCC@vishay.com Document Number 28505 22 Revision 01-Dec-03 Class 3 Y5V 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors SELECTION CHART FOR 10/16/25/50 AND 100 V DIELECTRIC Y5V EIA CAP SIZE 0402 0603 0805 1206 CODE VDC W 10 V 16 V 25 V 50 V 100 V 10 V 16 V 25 V 50 V 100 V 10 V 16 V 25 V 50 V 100 V 10 V 16 V 25 V 50 V 100 V 102 1000 pF 122 1200 152 1500 182 1800 222 2200 272 2700 332 3300 392 3900 472 4700 562 5600 682 6800 822 8200 103 N N N N SSSS AAAA B BBBB B 0.01 µF 123 N N N N SSSS AAAA BBBB 0.012 153 N N N N SSSS AAAA B BBBB B 0.015 183 N N N N SSSS AAAA BBBB 0.018 223 N N N N SSSS AAAA B BBBB B 0.022 273 N N N N SSSS AAAA BBBB 0.027 333 N N N N SSSS AAAA B BBBB B 0.033 393 N N N SSSS AAAA BBBB 0.039 473 N N N SSSS AAAA B BBBB B 0.047 563 N N SSSS AAAA BBBB 0.056 683 N N SSSS AAAA B BBBB B 0.068 823 N N SSSS AAAA BBBB 0.082 104 N N SSSS AAAA B BBBB B 0.1 µF 154 N SSSS AAAA BBBB C 0.15 224 N SSS AAAA BBBB C 0.22 334 SSS BBBB BBBB 0.33 474 SS BBB BBBB 0.47 684 S B B D BBBB 0.68 105 S B B D CCCC 1 µF 155 DD CCC 1.5 225 DD CCC 2.2 335 DDDD 3.3 475 DDD 4.7 685 D 6.8 106 D 10 µF 226 22 µF Document Number 28505 For technical questions contact MLCC@vishay.com www.vishay.com Revision 01-Dec-03 23 Class 3 Y5V 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors PACKAGING QUANTITIES THICKNESS AMOUNT PER REEL CLASSIFICATION ∆∆ ∆∆180 mm; 7 inch (mm) 0402 0603 0805 1206 A = 0.6 ± 0.1 - - Paper 4 Kp/Reel - B = 0.8 ± 0.1 - - Paper 4 Kp/Reel Paper 4 Kp/Reel C = 0.95 ± 0.1 - - - Plastic 3 Kp/Reel D = 1.25 ± 0.1 - - Plastic 3 Kp/Reel Plastic 3 Kp/Reel G = 1.60 ± 0.2 - - - Plastic 2 Kp/Reel S = 0.8 ± 0.07 - Paper 4 Kp/Reel - - N = 0.50 ± 0.05 Paper 10 Kp/Reel - - - K = 2.00 ± 0.2 ---- M = 2.5 ± 0.30 ---- PACKAGING QUANTITIES AMOUNT PER REEL THICKNESS CLASSIFICATION ∆∆∆∆330 mm; 13 inch (mm) 0402 0603 0805 1206 A = 0.6 ± 0.1 - - Paper 15 Kp/Reel - B = 0.8 ± 0.1 - - Paper 15 Kp/Reel Paper 15 Kp/Reel C = 0.95 ± 0.1 - - - Plastic 10 Kp/Reel D = 1.25 ± 0.1 - - Plastic 10 Kp/Reel Plastic 10 Kp/Reel G = 1.60 ± 0.2 ---- S = 0.8 ± 0.07 - Paper 15 Kp/Reel - - N = 0.50 ± 0.05 Paper 50 Kp/Reel - - - K = 2.00 ± 0.2 ---- M = 2.5 ± 0.30 ---- COVER TAPE (POLYESTER - ANTISTATIC) CARRIER TAPE (POLYCARBONATE) PROPERTIES OF COVER TAPE PROPERTIES OF CARRIER TAPE WIDTH WIDTH PARAMETER PARAMETER 5.5 ± ± ± ± 0.1 mm 8.1 ± ± ± ± 0.2 mm Breaking force ≥ 10.7 N Thickness 190 to 280 µm 2 Elongation at break ≥ 63 % Tensile strength at break > 60 N /mm 10 Surface resistance < 10 Ω /sq. Elongation at break 100 to 150 % 12 Softening point 71 ± 5 °C Surface resistance > 10 Ω /sq. Thickness 62 µm PAPER TAPE SPECIFICATIONS DIMENSIONS OF PAPER TAPE in millimeters T 1 P 0 PRODUCT SIZE CODE P D 2 0 SYMBOL 0402 0603 0805 1206 SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL. E A 0.62 ± 0.05 1.02 ± 0.05 1.50 ± 0.10 2.00 ± 0.15 0 B 1.12 ± 0.05 1.82 ± 0.05 2.30 ± 0.10 3.50 ± 0.15 0 F W W 8.00 ± 0.10 8.00 ± 0.10 8.00 ± 0.10 8.00 ± 0.10 B 0 E 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 F 3.50 ± 0.05 3.50 ± 0.05 3.50 ± 0.05 3.50 ± 0.05 D 1.55 ± 0.05 1.55 ± 0.05 1.55 ± 0.05 1.55 ± 0.05 0 P 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 A 0 0 P 1 P 2.00 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 1 T 2 P 2.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 2 www.vishay.com For technical questions contact MLCC@vishay.com Document Number 28505 24 Revision 01-Dec-03 Class 3 Y5V 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors BLISTER TAPE SPECIFICATIONS DIMENSIONS OF BLISTER TAPE in millimeters K P 0 0 PRODUCT T D P 2 DIMENSION TOLERANCE 0 0805 1206 A < 1.55 < 2.00 - E 0 B < 2.45 < 3.60 - 0 W 8.00 8.00 ± 0.20 F cover tape W E 1.75 1.75 ± 0.10 F 3.50 3.50 ± 0.05 B 0 D 1.50 1.50 + 0.10/ - 0 0 D 1.00 1.00 ± 0.10 1 P 4.00 4.00 ± 0.05 0 T A D 1 0 1 P 4.00 4.00 ± 0.10 direction of unreeling 1 T P 2 1 P 2.00 2.00 ± 0.05 2 REEL SPECIFICATIONS DC A B REEL DIMENSIONS AND TAPE WIDTH in millimeters ∅∅ ∅∅ ∅∅ 180 mm; 7 inch ∅∅ 330 mm; 13 inch A 13.0 ± 1.0 13.0 ± 0.5 B 9.0 ± 1.0 9.0 ± 0.5 C 178.0 ± 1.0 330.0 ± 1.0 D 60.5 ± 1.0 100.0 ± 1.0 METHOD OF MOUNTING AND DIMENSIONS OF SOLDER LANDS For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering and reflow soldering. An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with the chip size and with temperature fluctuations (> 100 °C) Therefore, it is advised to use the smallest possible size and follow the dimensional recommendations given. Document Number 28505 For technical questions contact MLCC@vishay.com www.vishay.com Revision 01-Dec-03 25 Class 3 Y5V 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors SOLDERING GRAPHS IR REFLOW WITH SnPb SOLDER IR REFLOW WITH SnAgCu SOLDER 300 300 Max temperature T T (°C) (°C) Max temperature 250 250 > 215°C: 20 ~ 40 seconds 200 200 Sn-Ag-Cu solder paste 150 150 Min temperature Min temperature 100 100 Sn-Pb Eutectic solder paste 50 50 0 0 30 ~ 60 sec time time 60 ~ 120 seconds 60 ~ 120 seconds 60 ~ 120 seconds 30 ~ 60 seconds 30 ~ 60 seconds 30 ~ 60 seconds WAVE SOLDERING REFLOW SOLDERING 300 300 10 s 10 s T T (°C) 260 °C (°C) 245 °C 250 250 235 °C to 260 °C second wave 10 s 215 °C 200 200 5 K/s first wave 40 s 180 °C 2 K/s 200 K/s 150 150 130 °C 100 °C to 130 °C forced 100 100 cooling 2 K/s 2 K/s 50 50 0 0 0 50 100 150 200 250 0 50 100 150 200 250 t (s) t (s) RECOMMENDED DIMENSIONS OF SOLDER LANDS in millimeters solder land / solder paste pattern solder resist DG pattern occupied area E C B A tracks F www.vishay.com For technical questions contact MLCC@vishay.com Document Number 28505 26 Revision 01-Dec-03 preferred direction during wave soldering Class 3 Y5V 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors REFLOW SOLDERING FOOTPRINT DIMENSIONS in mm SIZE PLACEMENT PROCESSING REMARKS CODE ACCURACY AB CD E F G 0402 1.50 0.50 0.50 0.50 0.10 1.75 0.95 ± 0.15 0603 2.30 0.70 0.80 0.80 0.20 2.55 1.40 ± 0.25 IR or hot plate soldering 0805 2.80 1.00 0.90 1.30 0.40 3.08 1.85 ± 0.25 1206 4.00 2.20 0.90 1.60 1.60 4.25 2.25 ± 0.25 WAVE SOLDERING FOOTPRINT DIMENSIONS in mm PROPOSED NUMBER AND DIMENSIONS PLACEMENT SIZE OF DUMMY TRACKS ACCURACY CODE A BCD E F G (mm) (mm) 0603 2.40 1.00 0.70 0.80 0.20 3.10 1.90 1 x (0.2 x 0.8) ± 0.10 0805 3.20 1.40 0.90 1.30 0.36 4.10 2.50 1 x (0.3 x 1.3) ± 0.15 1206 4.80 2.30 1.25 1.70 1.25 5.90 3.20 3 x (0.25 x 1.7) ± 0.25 TEST CONDITIONS IN STATIC SOLDER BATH PARAMETER DESCRIPTION SOLDERABILITY CECC requirement: 235 ± 5 °C for 2 ± 0.5 seconds 95 % covered with smooth and bright solder coating IEC requirement: 215 ± 3 °C for 3 ± 0.3 seconds RESISTANCE TO LEACHING 10 % of the metallization of the edges of the head face may be missing 260 ± 5 °C for 30 ± 1 second (inner electrodes are not visible) TESTS AND REQUIREMENTS TESTS PROCEDURES AND REQUIREMENTS TEST PROCEDURE REQUIREMENTS Visual and no visible damage dimensions in accordance mechanical with speciŢcation C ≤ 10 µF; 1.0 ± 0.2 Vrms; 1 kHz ± 10 % shall not exceed the limits given in the detailed Capacitance speciŢcation C > 10 µF; 0.5 ± 0.2 Vrms; 120 kHz ± 20 % DF: ≤ 5.0 %: 50 V, 25 V (except 0603 ≥ 0.1 µF; 0805 ≥ 0.33 µF; C ≤ 10 µF; 1.0 ± 0.2 Vrms; 1 kHz ± 10 % Dissipation factor 1206 ≥ 0.1 µF, ≤ 7.0 %) C > 10 µF; 0.5 ± 0.2 Vrms; 120 kHz ± 20 % ≤ 7.0 % (C < 1.0 µF, 16 V); ≤ 9.0 % (C ≥ 1.0 µF, 16 V); ≤ 12.5 % (10 V) 250 % of rated voltage for 1 to 5 seconds, charge and discharge Dielectric strength no visible damage or ţash-over during test current less than 50 mA 10 GΩ minimum or 500 ΩF minimum, Insulation resistance at U (DC) for maximum 120 seconds R whichever is less Temperature with no electrical load: within + 30/− 80% coefŢcient − 25 to 85 °C at T = 20 °C amb no visible damage the middle part of the substrate shall be pressurized by means of ∆C/C: ≤ ± 30 % the pressurizing rod at a rate of about 1 mm per second until the this capacitance change means the change of Bending test deţection becomes 1 mm and then the pressure shall be capacitance under speciŢed ţexure of maintained for 5 ± 1 second; measurement after 48 ± 4 hours at substrate from the capacitance measured room temperature before the test Document Number 28505 For technical questions contact MLCC@vishay.com www.vishay.com Revision 01-Dec-03 27 Class 3 Y5V 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors TESTS PROCEDURES AND REQUIREMENTS TEST PROCEDURE REQUIREMENTS 95 % minimum coverage of entire Solderability 230 ± 5 °C for 2 ± 0.5 seconds; Solder: SN63A metallized area Solder temperature: 260 ± 5 °C Dipping time: 10 ± 1 seconds no visible damage Solder: SN63A Resistance to Before initial measurement: Perform 150 + 0/ - 10 °C for 1 hour ∆C/C: ≤ ± 20 % and then set for 48 ± 4 hours at room temperature. soldering heat DF, R and dielectric strength to meet initial ins Preheating: 120 to 150 °C for 1 minute before immerse the requirements capacitor in a eutectic solder. Measurement to be made after 48 ± 4 hours at room temperature Test temperature − 55 to 85 °C: no visible damage − 55 °C − 3/+ 0 °C for 30 ± 3 minutes; Room temperature for 2 to 3 minutes; ∆C/C: ≤ ± 20 % Temperature cycle X5R: 85 °C + 3/− 0 °C for 30 ± 3 minutes; DF, R and dielectric strength to meet initial ins Room temperature for 2 to 3 minutes requirements Measurement to be made after 48 ± 4 hours at room temperature ∆C/C: ≤ ± 30 % DF: ≤ 7.5 % U (DC): ≥ 50 V, 25 V R Test temperature: 40 ± 2 °C (except 0603 ≥ 0.1 µF; Humidity test Humidity: 90 to 95 % RH 0805 ≥ 0.33 µF; 1206 ≥ 1 µF, ≤ 10 %) (damp heat steady Test time: 500 + 24/− 0 hours ≤ 10 % (C < 1.0 µF, 16 V); state) Measurement to be made after 48 ± 4 hours at room temperature ≤ 12.5 % (C ≥ 1.0 µF, 16 V; 0402 ≥ 0.068 µF) ≤ 15 % (10 V) R : 1 GΩ minimum or 50 ΩF minimum, ins whichever is less no visual damage ∆C/C: ± 30 % DF: Test temperature: 40 ± 2 °C ≤ 7.5 % U (DC): ≥ 50 V, 25 V R Humidity: 90 to 95 % RH (except 0603 ≥ 0.1 µF; Humidity load Test time: 500 + 24/− 0 hours 0805 ≥ 0.33 µF; 1206 ≥ 1 µF, ≤ 10 %) (damp heat) To apply voltage: rated voltage ≤ 10 % (C < 1.0 µF, 16 V); Measurement to be made after 48 ± 2 hours at room temperature ≤ 12.5 % (C ≥ 1.0 µF, 16 V; 0402 ≥ 0.068 µF) ≤ 15 % (10 V) R : 500 MΩ minimum or 25 ΩF minimum, ins whichever is less Adhesive strength of Pressurizing force 5 N (≤ 0603) and 10 N (> 0603) no visible damage termination Test time10 ± 1 second Vibration frequency: 10 to 55 Hz/minute; Total amplitude: 1.5 mm no visible damage or removal of the Vibration resistance Test time: 6 hours (2 hours each in 3 mutually perpendicular terminations directions) no visual damage ∆C/C: ≤ ± 30 % DF: ≤ 7.5 % U (DC): ≥ 50 V, 25 V R Test temperature 85 ± 3 °C; (except 0603 ≥ 0.1 µF; High temperature To apply voltage: 200 % of rated voltage 0805 ≥ 0.33 µF; 1206 ≥ 0.1 µF, ≤ 10 %) load (endurance) Test time: 1000 + 24/− 0 hours; ≤ 10 % (C < 1.0 µF, 16 V); Measurement after 48 ± 4 hours at room temperature ≤ 12.5 % (C ≥ 1.0 µF, 16 V; 0402 ≥ 0.068 µF) ≤ 15 % (10 V) R : 1 GΩ minimum. or 50 ΩF minimum, ins whichever is less www.vishay.com For technical questions contact MLCC@vishay.com Document Number 28505 28 Revision 01-Dec-03