OSRAM SFH409

GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter SFH 409 Wesentliche Merkmale Features • GaAs-LED mit sehr hohem WirkungsgradVery highly efficient GaAs-LED Hohe ZuverlässigkeitHigh reliability Hohe ImpulsbelastbarkeitHigh pulse handling capability Gute spektrale Anpassung an Good spectral match to silicon photodetectors Si-FotoempfängerSame package as SFH 309, SFH 487 Gehäusegleich mit SFH 309, SFH 487 Anwendungen Applications IR-Fernsteuerungen von Fernseh-, Rundfunk- IR remote control for hifi and TV sets, video und Videogeräten, Lichtdimmern tape recorders, dimmers Lichtschranken bis 500 kHzLight-reflection switches (max. 500 kHz) MünzzählerCoin counters SensorikSensor technology Diskrete OptokopplerDiscrete optocouplers Typ Bestellnummer Gehäuse Type Ordering Code Package SFH 409 Q62702-P860 3-mm-LED-Gehäuse (T 1), grau eingefärbt, Anschlüsse 1 im 2.54-mm-Raster ( / ’’), 10 SFH 409-2 Q62702-P1002 Kathodenkennzeichnung: kürzerer Anschluß 3 mm LED package (T 1), grey-colored epoxy resin, 1 solder tabs lead spacing 2.54 mm ( / ’’), 10 cathode marking: short lead 2001-02-22 1 SFH 409 Grenzwerte (T = 25 °C) A Maximum Ratings Bezeichnung Symbol Wert Einheit Parameter Symbol Value Unit Betriebs- und Lagertemperatur T ; T – 40 … + 100 °C op stg Operating and storage temperature range Sperrspannung V 5V R Reverse voltage Durchlaßstrom I 100 mA F Forward current Stoßstrom, τ ≤ 10 μs, D = 0 I 3A FSM Surge current Verlustleistung P 165 mW tot Power dissipation Wärmewiderstand R 450 K/W thJA Thermal resistance Kennwerte (T = 25 °C) A Characteristics Bezeichnung Symbol Wert Einheit Parameter Symbol Value Unit Wellenlänge der Strahlung λ 950 nm peak Wavelength at peak emission I = 100 mA, t = 20 ms F p Spektrale Bandbreite bei 50% von I Δλ 55 nm max Spectral bandwidth at 50% of I max I = 100 mA, t = 20 ms F p Abstrahlwinkel ϕ± 20 Grad Half angle deg. 2 Aktive Chipfläche 0.09 mm A Active chip area Abmessungen der aktiven Chipfläche L × B 0.3 × 0.3 mm Dimensions of the active chip area L × W Abstand Chipoberfläche bis Linsenscheitel 2.6 mm H Distance chip surface to lens top Kapazität, V = 0 V C 25 pF R o Capacitance 2001-02-22 2 SFH 409 Kennwerte (T = 25 °C) A Characteristics (cont’d) Bezeichnung Symbol Wert Einheit Parameter Symbol Value Unit Schaltzeiten, I von 10% auf 90% und von 90% t , t 0.5 μs e r f auf 10%, bei I = 100 mA, R = 50 Ω F L Switching times, Ι from 10% to 90% and from e 90% to 10%, I = 100 mA, R = 50 Ω F L Durchlaßspannung, Forward voltage I = 100 mA, t = 20 ms V 1.30 (≤ 1.5) V F p F I = 1 A, t = 100 μs V 1.9 (≤ 2.5) V F p F Sperrstrom, I 0.01 (≤ 1) μA R Reverse current, V = 5 V R Gesamtstrahlungsfluß, Φ 15 mW e Total radiant flux I = 100 mA, t = 20 ms F p Temperaturkoeffizient von I bzw. Φ , TC – 0.55 %/K e e I I = 100 mA F Temperature coefficient of I or Φ , e e I = 100 mA F Temperaturkoeffizient von V , I = 100 mA TC – 1.5 mV/K F F V Temperature coefficient of V , I = 100 mA F F Temperaturkoeffizient von λ , I = 100 mA TC + 0.3 nm/K peak F λ Temperature coefficient of λ , I = 100 mA peak F Gruppierung der Strahlstärke I in Achsrichtung e gemessen bei einem Raumwinkel Ω = 0.01 sr Grouping of Radiant Intensity I in Axial Direction e at a solid angle of Ω = 0.01 sr Bezeichnung Symbol Werte Einheit Parameter Values Unit 1) SFH 409 SFH 409-1 SFH 409-2 SFH 409-3 Strahlstärke Radiant intensity I = 100 mA, t = 20 ms I ≥ 6.3 6.3 … 12.5 >10 16 … 32 mW/sr F p e I = 1 A, t = 100 μs I – 75 120 – mW/sr F p e typ. 1) Nur auf Anfrage lieferbar. 1) Available only on request. 2001-02-22 3 SFH 409 Ι e Relative Spectral Emission Radiant Intensity = f (I ) Max. Permissible Forward Current F Ι 100 mA e I = f (λ) I = f (T ) rel F A Single pulse, t = 20 μs p OHR00864 OHR00883 OHR01938 100 Ι 120 e Ι (100 mA) mA e I % F 1 10 Ι rel 100 80 80 60 R = 450 K/W thjA 60 0 10 40 40 20 20 -1 10 0 0 -2 -1 0 1 880 920 960 1000 nm 1060 0 20 40 60 80 100 ˚C 120 10 10 10 A 10 λ Ι T F A Forward Current Permissible Pulse Handling I = f (V ), Single pulse, t = 20 μs Capability I = f (τ), T = 25 °C F F p F A duty cycle D = parameter OHR01041 4 OHR00865 1 10 10 A τ mA I I F F τ I D F = 5 T T D 0.005 = typ. max. 0 0.01 10 0.02 3 0.05 10 0.1 0.2 -1 5 10 0.5 DC 2 -2 10 10 -5 -4 -3 -2 -1 0 1 2 1 1.5 2 2.5 3 3.5 4 V 4.5 10 10 10 10 10 10 10 s 10 τ V F Radiation Characteristics Ι = f (ϕ) rel 40 30 20 10 0 OHR01887 1.0 50 0.8 60 0.6 0.4 70 0.2 80 0 90 100 1.0 0.8 0.6 0.4 020 40 60 80 100 120 2001-02-22 4 ϕ SFH 409 Maßzeichnung Package Outlines 5.2 (0.205) 4.5 (0.177) 4.1 (0.161) 3.9 (0.154) Area not flat 0.6 (0.024) 0.4 (0.016) 4.0 (0.157) 3.6 (0.142) (3.5 (0.138)) 1.8 (0.071) 1.2 (0.047) 0.4 (0.016) 29 (1.142) 6.3 (0.248) 27 (1.063) 5.9 (0.232) Chip position Cathode (SFH 409, SFH 4332) Anode (SFH 487, SFH 4301) GEXY6250 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical 1 2 components , may only be used in life-support devices or systems with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2001-02-22 5 2.54 (0.100) spacing 0.7 (0.028) 0.4 (0.016) 0.8 (0.031) 0.4 (0.016) ş3.1 (0.122) ş2.9 (0.114)