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INNOVATIVE INTEGRATION X5-RX

Image of INNOVATIVE INTEGRATION X5-RX

Description

Innovative Integration X5-RX - PCI Express XMC Module with Four 200 MSPS 16-bit A/Ds, Virtex5 FPGA, 512MB DRAM/ 4MB SRAM

Part Number

X5-RX

Price

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Manufacturer

INNOVATIVE INTEGRATION

Lead Time

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Category

PRODUCTS - X

Specifications

Analog A/D Resolution

16-bit (all devices)

Analog Connectors SMA

female

Analog Input Range

+/- 1.5V

Analog Inputs

4

Device

Xilinx Virtex5, XC5VSX95T-1FF1136C, XC5VLX155T-1FF1136C

DRAM Size

512 MB total 4 devices @ 64Mx16 each

Form Factor

Single width IEEE 1386 Mezzanine Card

Rocket IO

16 lanes @ 2.5 Gbps

Size

75 x 150 mm

Type

PCI Express 8 lanes

Features

Datasheet

pdf file

X5-RX-pd-116483348f.pdf

2052 KiB

Extracted Text

X5-RX V1.1 PCI Express XMC Module with Four 200 MSPS 16-bit A/Ds, Virtex5 FPGA, 512MB DRAM/ 4MB SRAM FEATURES • Four 200 MSPS 16-bit A/D channels • +/-1.5V, Dual-Coupled, 50 ohm, SMA inputs - AC-coupled 200 MSPS A/D per channel - DC-coupled 250 kHz A/D per channel • 85dB SFDR for 70 MHz IF input • Xilinx Virtex5, SX95T • 512MByte DDR2 DRAM • 4MByte QDR-II SRAM • 8 RocketIO private links, 2.5 Gbps each • >1 GB/s, 8-lane PCI Express Host Interface • XMC Module (75x150 mm) • PCI Express (VITA 42.3) • Ruggedization levels offered up to • -40 to +85C operation DESCRIPTION 2 • 0.1 g /Hz random vibration The X5-RX is a high performance digitizing and signal processing module for • 40 g, 11 ms half-sine shock wireless, RADAR and medical imaging applications. The FPGA computing core supports real-time 200 MHz signal acquisition and processing for • Conduction cooled operation supported channelization, down-conversion and spectral analysis. The module features four simultaneously digitizing channels; each channel is dual coupled, APPLICATIONS providing low (DC to 125 kHz) and high frequency (1 to 450 MHz) bands. The high speed band samples at 200 MSPS A/Ds with 16-bit resolution. • Wireless Receivers • RADAR A Xilinx Virtex5 SX95T with 512MB DDR2 DRAM and 4MB QDR-II memory provide a very high performance DSP core that is tightly integrated with the • Medical Imaging I/O and PCI Express interface. The close integration of the analog IO, • IF recording to HDD with Andale Datalogger at memory and host interface with the FPGA enables real-time signal 1.2 GB/s sustained rates processing at extremely high rates exceeding 300 GMACs per second. • IP development The X5 XMC modules couple Innovative's powerful Velocia architecture with a high performance, 8-lane PCI Express interface that provides over 1 GB/s SOFTWARE sustained transfer rates to the host. Private links to host cards with >1.6 GB/ s capacity using P16 are provided for system integration. • MATLAB/VHDL FrameWork Logic • Windows/Linux Drivers The X5 family logic can be fully customized using VHDL and MATLAB using the FrameWork Logic toolset. The MATLAB BSP supports real-time • C++ Host Tools hardware-in-the-loop development using the graphical, block diagram Simulink environment with Xilinx System Generator. IP CORES IP libraries for the FPGA are also available for down-conversion and • Flexible 4 Channelizer DDC with programmable channelization of up to 128 simultaneous channels, baseband demodulation tuning, filters and decimation for PSK, FSK and MSK, and spectral analysis. MATLAB simulation models provided logic integration in to the X5-RX Framework Logic. • 128 Channel DDC with programmable filters and decimation Software tools for host development include C++ libraries and drivers for • PSK and FSK demodulation Windows and Linux. Application examples demonstrating the module features and use are provided. IF Recording with Andale Datalogger supports up to 1.2 GB/s continuous recording to disk. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Innovative Integration products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Innovative Integration standard warranty. Production processing does not necessarily include testing of all parameters. 04/14/11 © 2007 Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com X5-RX This electronics assembly can be damaged by ESD. Innovative Integration recommends that all electronic assemblies and components circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION Product Part Number Description X5- RX (SX95T FPGA) 80222-0 PCI Express XMC module with four channels of 200 MSPS, 16-bit A/Ds, dual-coupled inputs, Virtex5 SX95T FPGA, 4MB SRAM, 512MB DRAM. X5- RX (LX155T FPGA) 80222-1 PCI Express XMC module with four channels of 200 MSPS, 16-bit A/Ds, dual-coupled inputs, Virtex5 LX155T FPGA, 4MB SRAM, 512MB DRAM. Logic and IP Cores X5-RX FrameWork Logic 55028 X5-RX FrameWork Logic board support package for RTL and MATLAB. Includes technical support for one year. Cables SMA to BNC cable 67048 IO cable with SMA (male) to BNC (female), 1 meter Adapters XMC-PCIe x1 Adapter 80172-0 PCI Express Carrier card for XMC PCI Express modules, x1 lanes XMC- PCIe x8 Adapter 80173-0 PCI Express Carrier card for XMC PCI Express modules, x8 lanes XMC-PCI Adapter 80167 PCI Carrier card for XMC PCI Express modules, 64-bit PCI-X XMC-cPCI Adapter 80207 3U Compact PCI Carrier card for XMC PCI Express modules, 64-bit PCI-X XMC-Cabled PCIe Adapter 90181 Cabled PCI Express Carrier card for XMC PCI Express modules, single-lane. Embedded PC Host Embedded PC XMC host 90199 eInstrument embedded PC with Linux or Windows, USB, SATA, Gigabit Ethernet, dual HDD option, two XMC modules for standalone applications. Optional four HDD array for datalogging. Low Power Embedded PC 90201 eInstrument embedded PC with Intel Atom, Linux or Windows, USB, SATA, Gigabit Ethernet, XMC host dual HDD option, two XMC modules for standalone applications. Optional four array HDD for datalogging. Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 2 of 15 X5-RX Operating Environment Ratings X5 modules rated for operating environment temperature, shock and vibration are offered. The modules are qualified for wide temperature, vibration and shock to suit a variety of applications in each of the environmental ratings L0 through L4 and 100% tested for compliance. Environment Rating L0 L1 L2 L3 L4 Environment Office, controlled Outdoor, stationary Industrial Vehicles Military and heavy lab industry Applications Lab instruments, Outdoor monitoring Industrial Manned vehicles Unmanned vehicles, research and controls applications with missiles, oil and gas moderate vibration exploration Cooling Forced Air Forced Air Conduction Conduction Conduction 2 CFM 2 CFM Operating Temperature 0 to +50C -40 to +85C -20 to +65C -40 to +70C -40 to +85C Storage Temperature -20 to +90C -40 to +100C -40 to +100C -40 to +100C -50 to +100C Vibration Sine - - 2g 5g 10g 20-500 Hz 20-2000 Hz 20-2000 Hz 2 2 2 Random - - 0.04 g /Hz 0.1 g /Hz 0.1 g /Hz 20-2000 Hz 20-2000 Hz 20-2000 Hz Shock - - 20g, 11 ms 30g, 11 ms 40g, 11 ms Humidity 0 to 95%, 0 to 100% 0 to 100% 0 to 100% 0 to 100% non-condensing Conformal coating Conformal coating Conformal coating, Conformal coating, Conformal coating, extended extended extended temperature range temperature range temperature range devices devices, devices, Thermal conduction Thermal conduction assembly assembly, Epoxy bonding for devices Testing Functional, Functional, Functional, Functional, Functional, Temperature cycling Temperature Temperature Temperature Testing per MIL- cycling, cycling, cycling, STD-810G for vibration, shock, Wide temperature Wide temperature Wide temperature temperature, testing testing testing humidity Vibration, Shock Vibration, Shock Contact sales support for pricing and availability. Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 3 of 15 X5-RX Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 4 of 15 X5-RX Standard Features FPGA Analog Device Xilinx Virtex5 XC5VSX95T-1FF1136C Inputs 4 XC5VLX155T-1FF1136C Input Range +/- 1.5V Speed Grade -1 (commercial) Input Type Dual-coupled inputs with 2 bands each Size SX95T :~9M gate equivalent DC-coupled : 0 to 200kHz LX155T :~15M gate equivalent AC-coupled: 1 to 450MHz Flip-Flops SX95T: 69120 Input 50 ohm LX155T : 97280 Impedance A/D Device High speed AC-coupled input : Multipliers SX95T: 640 Texas Instruments ADS5485 LX155T: 128 Lower speed DC-coupled input: Slices SX95T: 17,280 Linear Technology LTC1865 LX155T: 24,320 A/D Resolution 16-bit (all devices) Block RAMs SX95T: 296 (5328 Kbits) LX155T: 212 A/D Sample High Speed: 1 MHz to 200 MHz Rate Low Speed: 250 ksps Rocket IO 16 lanes @ 2.5 Gbps Data Format 2's complement, 16-bit integer Configuration SelectMAP from on-board FLASH Connectors SMA female FLASH holds 2 images JTAG during development Calibration Factory calibrated. Gain and offset errors are digitally corrected in the FPGA. Non-volatile FPGA Usage SX95T: LUT=21% FF=29% BR=26% EEPROM coefficient memory. DSP48E=1% (Framework Logic) Memories DRAM Size 512 MB total 4 devices @ 64Mx16 each DRAM Type DDR2 DRAM DRAM Controller for DRAM implemented in logic. Controller DRAM is controlled as a single bank. DRAM Rate 3.8 GB/ sustained transfer rate SRAM Size 4 MB total 2 devices @ 512Kx32 each SRAM Two independent SRAM controllers Controller implemented in FPGA logic SRAM Type QDR-II SRAM Rate 1.2 GB/s sustained transfer rate for read and write simultaneously (2.4 GB/s total) Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 5 of 15 X5-RX Host Interface Type PCI Express; 8 lanes Acquisition Monitoring Sustained Data Rate 1 GB/s Alerts Trigger Start, Trigger Stop, Queue Overflow, Channel Over-range, Protocol PCI Express with Velocia packet system Timestamp Rollover, Temperature Warning, Temperature Failure Connector XMC P15 Alert Timestamping 5 ns resolution, 32-bit counter Interface Standard PCIe 1.0a; VITA 42.3 Logic Update In-system reconfiguration P16 Digital IO Rocket IO Channels 8 Clocks and Triggering Rocket IO data rate 2.5 Gbps/lane (2 Gbps effective rate Clock Sources Programmable PLL: TI CDCE72010, when 8b/10b encoded) output sample clock rates to 1 GHz DIO Bits, total 16 External: Sine/square 100 MHz to 200 MHz, 0.5-3.3Vp-p (-2 to +14.3 dBm) Signal Standard LVTTL (3.3V) AC-coupled, 50-ohm terminated. 500 MHz max if used as PLL reference Drive +/-12 mA (programmable in logic) Jitter PLL: <200 fs RMS @ 200 MHz Connector XMC P16 External: 30 fs additive, divider = 1, 500 MHz Power Management Triggering External or software; Continuous or N- sample-wide frame Temperature Monitor May be read by the host software Ext Trigger SMA female input Alarms Software programmable warning and 0.25-3.3Vp-p (-8 to +14.3 dBm) failure levels AC-coupled, 50-ohm terminated. Over-temp Monitor Disables power supplies Decimation 1:1 to 1:4095 in FPGA Power Control Channel enables and power up enables Channel Clocking All channels are synchronous Heat Sinking Conduction cooling supported Multi-card External triggering input is used to (VITA20 subset) Synchronization synchronize sample clocks or an external clock and trigger may be used. Physicals Form Factor Single width IEEE 1386 Mezzanine Card Size 75 x 150 mm Weight 130g Hazardous Materials Lead-free and RoHS compliant Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 6 of 15 X5-RX ABSOLUTE MAXIMUM RATINGS Exposure to conditions exceeding these ratings may cause damage! Parameter Min Max Units Conditions Supply Voltage, 3.3V to GND +3.0 +3.6 V Supply Voltage, VPWR to GND +4.5 +12.5 V Analog Input Voltage, Vin+ or Vin- to GND -5.7 +5.7 V Operating Temperature 0 70 C Non-condensing, forced air cooling required Storage Temperature -65 +150 C ESD Rating - 1k V Human Body Model Vibration - 5 g 9-200 Hz, Class 3.3 per ETSI EN 300 019-1-3 V2.1.2 (2003-04) Shock - 40 g peak RECOMMENDED OPERATING CONDITIONS Parameter Min Typ Max Units Supply Voltage +3.15 +3.3 +3.45 V Supply Voltage +11 +12 +13 V Operating Temperature 0 60 C Forced Air Cooling 2** 5 - CFM ELECTRICAL CHARACTERISTICS Over recommended operating free-air temperature range at 0°C to +60°C, unless otherwise noted. Parameter Typ Units Notes Analog Input Bandwidth 450 MHz -3dB SFDR 84.9 dB Fin = 70 MHz, 1.3Vp-p sine input; Fs = 200 MSPS, 64K FFT S/N 72.6 dB Fin = 70 MHz, 1.3Vp-p sine input; Fs = 200 MSPS, 64K FFT THD 77.6 % Fin = 70 MHz, 1.3Vp-p sine input; Fs = 200 MSPS, 64K FFT Channel Crosstalk -95 dB Worst case, Fin = 70.1 MHz, 2V p-p input Noise Floor -117 dB Input Grounded, Fs = 200 MSPS, 64K sample FFT, non- averaged Power Consumption 28 W Framework Logic installed, 200 MSPS operation Gain Error <0.02 % of FS Calibrated Offset Error <500 μV Calibrated Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 7 of 15 X5-RX SFDR = 71.1 dB SNR= 71.1 dB ENOB= 11.2 bits THD = -82.0 dB Noise = -118 dB Fin = 70 MHz, 1.3Vp-p Fs = 200MSPS FFT=64K Wideband Signal Quality, Fin = 70 MHz, 1.4Vp-p, Fs = 200 MSPS Narrowband Signal Quality, Fin = 70 MHz, 1.4Vp-p, Fs = 200 MSPS Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 8 of 15 X5-RX Architecture and Features The X5-RX module architecture integrates analog IO with an FPGA computing core, memories and PCI Express host interface. This architecture tightly couples the FPGA to the analog and enables the module to perform real-time signal processing with low latency and extremely high rates making it ideal as a front-end for demanding applications in wireless, RADAR and medical imaging applications. Data flows between the IO and the Analog IO host using a packet system The analog front end of the X5-RX module has four simultaneously sampling channels of 16-bit, Data A/D. Each channel is dual-coupled, providing both Buffer A/D Packetizer 128M low frequency spectrum from DC to 125 kHz, and A/D x16 high speed spectrum from 1 to 450 MHz by 4 channels, utilizing a 200 MSPS, AC-coupled A/D in parallel PCIe 2 A/Ds per channel Alerts with a DC-coupled 250 ksps A/D for each channel. Controller Host The A/Ds are directly connected to the FPGA for 8 lanes minimum data latency. In the standard logic, the A/Ds have an interface component that receives the Triggering data, provides digital error correction, and a FIFO memory for buffering. The digital error correction is used to compensate for gain and offset errors. A non-volatile ROM on the card is used to store the calibration coefficients for the analog and is X5 Architecture programmed during factory test. The A/D channels operate synchronously for simultaneously sampling systems using the external clock input. Controls for triggering allow precise control over the collection of data and are integrated into the FPGA logic. Trigger modes include frames of programmable size, external and software. Multiple cards can sample simultaneously by using external trigger inputs. The trigger component in the logic can be customized in the logic to accommodate a variety of triggering requirements. FPGA Core The X5 Module family has a Virtex5 FPGA and memory at its core for DSP and control. The Virtex5 FPGA is capable of 9 >300x10 MACs (SX95T operating at 500 MHz internally), about 20x faster than competing DSPs. In addition to the raw processing power, the FPGA fabric integrates logic, memory and connectivity features that make the FPGA capable of applying this processing power to virtually any algorithm and sustaining performance in real-time. The FPGA has direct access to 512MB of DDR2 DRAM capable of 3.8 GB/s data transfer rate and two independent banks of 2 MB QDR SRAM, each capable of 1.2GB/s transfer rate in each direction. These memories provide the FPGA working space for computations typically required by DSP functions like FFTs, and bulk data storage needed for system data buffering and algorithms like Doppler delay. A DRAM buffer control component in the FPGA implements a large virtual FIFO buffer in the DRAM that is used for system data buffering and algorithm support. The X5 module family uses the Virtex5 FPGA as a system-on-chip to integrate all the features for highest performance. As such, all IO, memory and host interfaces connect directly to the FPGA – providing direct connection to the data and control for maximum flexibility and performance. Firmware for the FPGA completely defines the dataflow, signal processing, controls and host interfaces, allowing complete customization of the X5 module functionality. PCI Express Host Interface The X5 architecture delivers over 1.2 GB/s sustained data rates over PCI Express using the Velocia packet system. The Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 9 of 15 X5-RX Velocia packet system is an application interface layer on top of the fundamental PCI Express interface that provides an efficient and flexible host interface supporting high data rates with minimal host support. Using the Velocia packet system, data is transferred to the host as variable sized packets using the PCIe controller interface. The packet data system controls the flow of packets to the host, or other recipient, using a credit system managed in cooperation with the host software. The packets may be transmitted continuously for streams of data from the A/Ds, or as occasional packets for status, controls and analysis results. For all types of applications, the data buffering and flow control system delivers high throughput with low latency and complete flexibility for data types and packet sizes to match the application requirements. Firmware components for assembling and dissembling packets are provided in the FrameWork Logic that allow applications to rapidly integrate data streams and controls into the packet system with minimum effort. The PCI Express interface is implemented in the Virtex5 FPGA using 8 Rocket IO ports, for a maximum bit rate of over 20 Gbps, full duplex. Data encoding and protocol limit practical in-system data rates to about 200 MB/s per lane. Since PCI Express is not a share bus, but rather a point-to-point channel, system architectures can achieve high sustained data rates between devices – resulting in higher system-level performance and lower overall cost. Private Data Links The X5 module family has private data links on the P16 connector that can be used for system integration. The P16 connector has 8 Rocket IO links, each capable of 2.5 Gbps, and 16 sideband signals. The 8 RIO lanes can be used to provide low- latency, high rate data to the system in addition to the PCI Express interface. Maximum data rates, with deterministic performance can be implemented in performance-driven systems using little or no protocol. For more complex systems, protocols such as Aurora can be used. Module Management The data acquisition process can be monitored using the X5 alert mechanism. The alerts provide information on the timing of important events such as triggering, overranges and thermal overload. Packets containing data about the alert including an absolute system timestamp of the alert, and other information such as current temperature. This provides a precise overview of the card data acquisition process by recording the occurrence of these real-time events making the X5 cards easier to integrate into larger systems. FPGA Configuration The X5 modules have a 128Mb FLASH that holds the FPGA application image. The FLASH can be reprogrammed in- system using a software applet for field upgrades. A second logic image for backup is provided and is enabled by a hardware jumper. During development, the JTAG interface to the FPGA is used for development tools such as ChipScope and MATLAB. The FPGA JTAG connector is compatible with Xilinx cables such as Platform USB Cable. Software Tools Software development tools for the X5 modules provide comprehensive support including device drivers, data buffering, card controls, and utilities that allow developers to be productive from the start. At the most fundamental level, the software tools deliver data buffers to your application without the burden of low-level real-time control of the cards. Software classes provide C++ developers a powerful, high-level interface to the card that makes real-time, high speed data acquisition easier to integrate into applications. Software for data logging and analysis are provided with every X5 module. Data can be logged to system memory at full rate or to disk drives at rates supported by the drive and controller. Triggering and sample rate controls allow you to use the X5 performance in your applications without ever writing code. Innovative software applets include Binview which provides data viewing, analysis and import to MATLAB for large data files. Support for MS Visual C++ is provided. Supported OS include Windows and Linux. For more information, the software Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 10 of 15 X5-RX tools User Guide and on-line help may be downloaded. Logic Tools High speed DSP, analysis, customized triggering and other unique features may be added to the X5 modules by modifying the logic. The FrameWork Logic tools provide support for RTL and MATLAB developments. The standard logic provides a hardware interface layer that allows designers to concentrate on the application-specific portions of the design. Designer can build upon the Innovative components for packet handling, hardware interfaces and system functions, the Xilinx IP core library, and third party IP. RTL source for the FrameWork Logic is provided for customization. Each design is provided as a Xilinx ISE project, with a ModelSim testbench illustrating logic functionality. Using MATLAB Simulink for X5 Logic Design The MATLAB Board Support Package (BSP) allows logic development using Simulink and Xilinx System Generator. These tools provide a graphical design environment that integrates the logic into MATLAB Simulink for complete hardware-in-the- loop testing and development. This is an extremely power design methodology since MATLAB can be used to generate, analyze and display the signals in the logic real-time in the system. Once the development is complete, the logic can be embedded in the FrameWork logic using the RTL tools under Xilinx ISE. The FrameWork Logic User sales brochure and User Guide more fully detail the development tools. IP for X5 Modules Innovative provides a range of down-conversion channelizer logic cores for wideband and narrowband receiver applications for the X5 family. When fitted with these cores, the X5 modules provide powerful receiver functionality integrated for IF processing. The DDC channelizers are offered in channel densities from 4 to 128. The four channel DDC offers complete flexibility and independence in the channels, while the 128 channel core offers higher density for uniform channel width applications. The DDC cores are highly configurable and include programmable channel filters, decimation rates, tuning and gain controls. An integrated power meter allows the DDC to measure any channel power for AGC controls. Each IP core is provided with a MATLAB simulation model that shows bit-true, cycle-true functionality. Signal processing designers can then use this model for channel design and performance studies. Filter coefficients and other parameters from the MATLAB simulation can be directly loaded to the hardware for verification. Part IP Core Channels Tuning Decimation Max Channel Filter Number Bandwidth 58014 IP-MDDC4 4 Fs/2^32 16 to 32768 Fs/16 Programmable 100 tap filter 58015 IP-MDDC128 128 Fs/2^32 512 to 16384 Fs/512 Programmable 100 tap filter 58016 IP-MDDC-2GSPS 4 Fs/2^32 128 to 32768 Fs/128 Front-end 48 tap bandpass, Programmable 80 tap filter Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 11 of 15 X5-RX Additional IP cores are offered for IF processing and baseband demodulation. Part Number IP Core Features 58001 PSK Demodulation N=2,4,8,PI/4. Integrated carrier tracking and bit decision. 58002 FSK Demodulation Programmable discrimination filters, bit decision logic. 58003 TinyDDS Tiny DDS, 1/3 to ½ size of Xilinx DDS with equal SFDR, clock rates to 400 MHz with flow control 58011 XLFFT IP core for 64K to 1M FFTs with windowing functions. 58012 Windowing IP core for Hann, Blackman and uniform data windowing functions. 58013 CORDIC IP core for sine/cosine generation using CORDIC method, resulting in 1/3 logic size of standard DDS cores. Applications Information Cables The X5-RX module uses coaxial cable assemblies for the analog I/O. The mating cables are SMA male termination with 50 ohm characteristic impedance. XMC Adapter Cards XMC modules can be used in standard desktop system or compact PCI/PXI using a XMC adapter card. An auxiliary power connector to the PCI Express adapters provides additional power capability for XMC modules when the slot is unable to provide sufficient power. The adapter cards allow the XMC modules to be used in any PCIe or PCI system. The X5 module family uses the auxiliary P16 connector as a private host interface. Eight Rocket IO lanes with 16 LVTTL signals provide support for data transfer rates up to 1.6 GB/s sustained, as well as sideband signals for control and status. Protocols such as Serial Rapid IO and Aurora may be implemented for host communications or custom protocols. Note that the high speed Rocket IO lanes require a host card electrically capable of supporting the high speed signal pairs. Only the eight lane adapter, P/N 80195 is suitable for high speed P16 applications. PCIe-XMC Adapter (80172) PCIe-XMC Adapter x8 lane PCI-XMC Adapter (80167) Compact PCI-XMC Adapter (80207) x1 PCIe to XMC (80173) 64-bit, 133 MHz PCI-X host 64-bit, 133 MHz PCI-X host Clock and trigger inputs x8 PCIe to XMC x4 PCIe to XMC x4 PCIe to XMC x8 RIO ports supported on P16 PXI triggers and clock support Applications that need remote or portable IO can use either the eInstrument PC or eInstrument Node with X3 modules. The Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 12 of 15 X5-RX eInstrument PC hosts two XMC modules and provides an embedded Windows or Linux PC in a compact form-factor. The eInstrument Node hosts a single XMC module in a compact chassis that communicates with the host computer over cabled PCI Express. Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 13 of 15 X5-RX eInstrument DAQ Node – Remote IO using cabled PCI Express eInstrument PC with Dual PCI Express XMC Modules (90199 or 90201) (90181) PCI Express system expansion Windows/Linux embedded PC Up to 7 meter cable Low Power Intel Atom or high performance Penryn CPUs electrically isolated from host computer 8x USB, GbE, cable PCIe, VGA software transparent High speed x8 interconnect between modules GPS disciplined, programmable sample clocks and triggers to XMCs 100 MB/s, 400 GB datalogger 12V operation Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 14 of 15 X5-RX IMPORTANT NOTICES Innovative Integration Incorporated reserves the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to Innovative Integration’s terms and conditions of sale supplied at the time of order acknowledgment. Innovative Integration warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with Innovative Integration’s standard warranty. Testing and other quality control techniques are used to the extent Innovative Integration deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. Innovative Integration assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using Innovative Integration products. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. Innovative Integration does not warrant or represent that any license, either express or implied, is granted under any Innovative Integration patent right, copyright, mask work right, or other Innovative Integration intellectual property right relating to any combination, machine, or process in which Innovative Integration products or services are used. Information published by Innovative Integration regarding third-party products or services does not constitute a license from Innovative Integration to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from Innovative Integration under the patents or other intellectual property of Innovative Integration. Reproduction of information in Innovative Integration data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. Innovative Integration is not responsible or liable for such altered documentation. Resale of Innovative Integration products or services with statements different from or beyond the parameters stated by Innovative Integration for that product or service voids all express and any implied warranties for the associated Innovative Integration product or service and is an unfair and deceptive business practice. Innovative Integration is not responsible or liable for any such statements. For further information on Innovative Integration products and support see our web site: www.innovative-dsp.com Mailing Address: Innovative Integration, Inc. 2390A Ward Avenue, Simi Valley, California 93065 Copyright ©2007, Innovative Integration, Incorporated Innovative Integration • phone 805.578.4260 • fax 805.578.4225 • www.innovative-dsp.com 15 of 15

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Bucher Emhart Glass

EXCELLENT SERVICE

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With our strict fundamentals and high expectations, we were surprised when we came across GID Industrial and their competitive pricing. When we approached them with our issue, they were incredibly confident in being able to provide us with a seamless solution at the best price for us. GID Industrial quickly understood our needs and provided us with excellent service, as well as fully tested product to ensure what we received would be the right fit for our company.

Fuji

HARD TO FIND A BETTER PROVIDER

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Our company provides services to aid in the manufacture of technological products, such as semiconductors and flat panel displays, and often searching for distributors of obsolete product we require can waste time and money. Finding GID Industrial proved to be a great asset to our company, with cost effective solutions and superior knowledge on all of their materials, it’d be hard to find a better provider of obsolete or hard to find products.

Applied Materials

CONSISTENTLY DELIVERS QUALITY SOLUTIONS

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Over the years, the equipment used in our company becomes discontinued, but they’re still of great use to us and our customers. Once these products are no longer available through the manufacturer, finding a reliable, quick supplier is a necessity, and luckily for us, GID Industrial has provided the most trustworthy, quality solutions to our obsolete component needs.

Nidec Vamco

TERRIFIC RESOURCE

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This company has been a terrific help to us (I work for Trican Well Service) in sourcing the Micron Ram Memory we needed for our Siemens computers. Great service! And great pricing! I know when the product is shipping and when it will arrive, all the way through the ordering process.

Trican Well Service

GO TO SOURCE

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When I can't find an obsolete part, I first call GID and they'll come up with my parts every time. Great customer service and follow up as well. Scott emails me from time to time to touch base and see if we're having trouble finding something.....which is often with our 25 yr old equipment.

ConAgra Foods

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