® Industrial CompactFlash Card (ICF) Vox Global Sourcing ICF Series ® Industrial CompactFlash Card Data Sheet Rev. 1.0 Page: 1/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) Table of contents REVISION HISTORY........................................................................................................................................... 3 LIST OF TABLES................................................................................................................................................ 4 LIST OF FIGURES.............................................................................................................................................. 5 1. INTRODUCTION ........................................................................................................................................ 6 2. FEATURES ................................................................................................................................................. 6 3. PIN ASSIGNMENT ..................................................................................................................................... 7 4. PIN DESCRIPTION .................................................................................................................................... 9 5. SPECIFICATIONS .................................................................................................................................... 12 5.1 CE AND FCC COMPATIBILITY ............................................................................................................. 12 5.2 ENVIRONMENTAL SPECIFICATIONS....................................................................................................... 12 5.2.1 Temperature Ranges ................................................................................................................. 12 5.2.2 Humidity...................................................................................................................................... 12 5.2.3 Shock and Vibration .................................................................................................................. 12 5.2.4 Mean Time between Failures (MTBF)....................................................................................... 12 5.3 MECHANICAL DIMENSIONS .................................................................................................................. 12 5.4 ELECTRICAL SPECIFICATIONS ............................................................................................................. 13 5.4.1 Electric Characteristic ............................................................................................................... 13 5.4.2 Maximum Absolute Ratings...................................................................................................... 14 5.4.3 Recommended Operation Conditions ..................................................................................... 14 5.4.4 Timing Specifications................................................................................................................ 15 5.5 SUPPORTED IDE COMMANDS ............................................................................................................. 16 6. PHYSICAL OUTLINE ............................................................................................................................... 18 Page: 2/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) REVISION HISTORY Revision Description Date 1.0 Release September 2005 Page: 3/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) List of Tables TABLE 1: ICF PIN ASSIGNMENTS.................................................................................................................... 7 TABLE 2: ICF PIN DESCRIPTION ..................................................................................................................... 9 TABLE 3: SHOCK/VIBRATION TESTING FOR ICF ........................................................................................ 12 TABLE 4: ICF MTBF ......................................................................................................................................... 12 TABLE 5: ICF ELECTRIC CHARACTERISTIC................................................................................................ 13 TABLE 6: ICF MAXIMUM ABSOLUTE RATINGS ........................................................................................... 14 TABLE 7: ICF RECOMMENDED OPERATION CONDITIONS........................................................................ 14 TABLE 8: READING TIMING SPECIFICATIONS, PIO MODE 4 ..................................................................... 15 TABLE 9: WRITING TIMING SPECIFICATIONS, PIO MODE 4 ...................................................................... 15 TABLE 10: RESET TIMING SPECIFICATIONS ............................................................................................... 16 TABLE 11: IDE COMMANDS ........................................................................................................................... 16 Page: 4/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) List of Figures FIGURE 1: MECHANICAL DIMENSION OF ICF ............................................................................................. 13 FIGURE 2: READING TIMING DIAGRAM, PIO MODE 4 ................................................................................ 15 FIGURE 3: WRITING TIMING DIAGRAM, PIO MODE 4 ................................................................................. 15 FIGURE 4: RESET TIMING DIAGRAM ............................................................................................................ 16 FIGURE 5: ICF PHYSICAL OUTLINE .............................................................................................................. 18 Page: 5/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) 1. Introduction ® The IGS Industrial CompactFlash Memory Card (ICF) products provide high capacity solid-state flash memory that electrically complies with the Personal Computer Memory Card International Association (PCMCIA) ATA (PC Card ® ATA) standard. (In Japan, the applicable standards group is JEIDA.) The CompactFlash and PCMCIA cards support True IDE Mode that is electrically compatible with an IDE disk drive. The original CF form factor card can be used in ® any system that has a CF slot. Designed to replace traditional rotating disk drives, IGS Industrial CompactFlash Memory Cards are embedded solid-state data storage systems for mobile computing and the industrial work place. These ® Industrial CompactFlash feature an extremely lightweight, reliable, low-profile form factor. 2. Features The Industrial ATA products provide the following system features: ‧ Capacities: 32, 64, 128, 256, 512 and 1024MB ‧ PCMCIA v2.1 and PC Card v2.01 ATA compatible ‧ Three access mode - Memory Card Mode - I/O Mode - True IDE Mode ‧ High reliability based on the internal ECC (Error Correction Code) function ‧ +3.3V/+5V single power supply operation ‧ Non-volatile storage (no battery required) ‧ Support Auto Stand-by and Sleep Mode. ‧ Support Master/Slave mode ‧ Industrial class, very rigid & rugged design ‧ MTBF >3,000,000 hours ‧ Minimum 10,000 insertions ‧ Shock: 30G, Vibration: 1500G ‧ High performance: - Read: 10MBytes/s - Write: 9MBytes/s ‧ Temperature range: - Industrial: -10°C ~ +70°C - Wide: -40°C ~ +85°C ‧ ABS Mechanical Cover Page: 6/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) 3. Pin Assignment See Table 1 for ICF pin assignments. Table 1: ICF Pin Assignments 1 Pin No. Name I/O Pull Up/Down Schmitt Trigger Driving Capability 1 GND Power GND 2 HD[3] I/O V 4 or 8 mA 3 HD[4] I/O V 4 or 8 mA 4 HD[5] I/O V 4 or 8 mA 5 HD[6] I/O V 4 or 8 mA 6 HD[7] I/O V 4 or 8 mA 7 CE1B I Up V 8 HA[10] I V 9 OEB I Up V 10 HA[9] I V 11 HA[8] I V 12 HA[7] I V 13 HOST VCC Power HOST VCC 14 HA[6] I V 15 HA[5] I V 16 HA[4] I V 17 HA[3] I V 18 HA[2] I V 19 HA[1] I V 20 HA[0] I V 21 HD[0] I/O V 4 or 8 mA 22 HD[1] I/O V 4 or 8 mA 23 HD[2] I/O V 4 or 8 mA 24 IOIS16B O 4 or 8 mA 25 GND Power GND 26 GND Power GND 27 HD[11] I/O V 4 or 8 mA 28 HD[12] I/O V 4 or 8 mA 29 HD[13] I/O V 4 or 8 mA 30 HD[14] I/O V 4 or 8 mA 31 HD[15] I/O V 4 or 8 mA 32 CE2B I Up V 33 VS1 Power GND 34 IORB I Up V 35 IOWB I Up V 36 WEB I Up V 37 IREQ O 4 or 8 mA 38 HOST VCC Power HOST VCC Page: 7/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) 1 Pin No. Name I/O Pull Up/Down Schmitt Trigger Driving Capability 39 CSELB I Up 40 VS2 Power GND 41 RESET I Up V 42 WAITB O 4 mA 43 INPACKB O 4 or 8 mA 44 REGB I Up V 45 DASPB I/O Up V 4 or 8 mA 46 PDIAGB I/O Up V 4 or 8 mA 47 HD[8] I/O V 4 or 8 mA 48 HD[9] I/O V 4 or 8 mA 49 HD[10] I/O V 4 or 8 mA 50 GND Power GND 1. The Driving Capability “4 or 8 mA” means --- When in 5V environment, the output driving capability is 4mA, When in 3.3V environment, the output driving capability is 8mA, but these PAD is 5V design, so the really output capability is UNDER 8mA. Page: 8/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) 4. Pin Description Table 2 describes the pin descriptions for ICF Table 2: ICF Pin Description Pin No. Pin Name I/O Description If this signal is asserted high, the card internal initialization begins to RESET operate. During the card internal initialization RDY/BSY# is low. After the I (PC Card Memory Mode) card internal initialization RDY/BSY# is high. If this signal is asserted high, the card internal initialization begins to RESET operate. In this mode, RDY/BST# signal can not be used, so using Status 41 I (PC Card I/O Mode) Register the Ready/Busy status can be confirmed. If this signal is asserted low, all the registers in this card are reset. In this RESET# mode, RDY/BSY# signal can not be used, so using Status Register the I (True IDE Mode) Ready/Busy status can be confirmed. This signal is not used. CSELB (PC Card Memory Mode) I (PC Card I/O Mode) 39 When MSB signal is High, this signal is used to configure this device as a CSELB Master or Slave when configured in the True IDE mode. When this pin is I (True IDE Mode) grounded, this device is configured as a Master. When the pin is High, this device is configured as a Slave. CE[2:1]B CE1B and CE2B are low active card select signals. Byte/Word/Odd byte (PC Card Memory Mode) I mode is defined by combination of CE1B, CE2B and HA0. (PC Card I/O Mode) 7, 32 CE2B is used for select the Alternate Status Register and the Device CE[2:1]B I Control Register while CE1B is the chip select for the other task file (True IDE Mode) registers. REGB is used during memory cycles to distinguish between task file and REGB I attribute memory access. High for task file, Low for attribute memory is (PC Card Memory Mode) accessed. 44 REGB REGB is constantly low when task file or attribute memory is accessed. I (PC Card I/O Mode) REGB This input signal is not used and should be connected to VCC. I (True IDE Mode) OEB OEB is used for the control of reading register’s data in attribute area or I (PC Card Memory Mode) task file area. OEB OEB is used for the control of reading register’s data in attribute area. 9 I (PC Card I/O Mode) ATASEL# To enable True IDE mode, this input should be grounded by the host. I (True IDE Mode) WEB is used for the control of writing register’s data in attribute area or task WEB I file area. (PC Card Memory Mode) WEB is used for the control of writing register’s data in attribute area. WEB 36 I (PC Card I/O Mode) To enable True IDE mode, this input should be connected to VCC by the WEB I host. (True IDE Mode) Page: 9/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) Pin No. Pin Name I/O Description IORB This signal is not used. I (PC Card Memory Mode) IORB IORB is used for control of read data in I/O task file area. This card does not 34 I (PC Card I/O Mode) respond to IORB until I/O card interface setting up. IORB IORB is used for control of read data in I/O task file area. This card does not I (True IDE Mode) respond to IORB until I/O card interface setting up. IOWB This signal is not used. I (PC Card Memory Mode) IOWB IOWB is used for control of write data in I/O task file area. This card does 35 I (PC Card I/O Mode) not respond to IOWB until I/O card interface setting up. IOWB IOWB is used for control of write data in I/O task file area. This card does I (True IDE Mode) not respond to IOWB until I/O card interface setting up. HA[10:0] Address bus 8, 10, 11, 12, (PC Card Memory Mode) I 14, 15, 16, 17, (PC Card I/O Mode) 18, 19, 20 HA[10:0] Address bus. Only HA[2:0] are used. I (True IDE Mode) WAITB The WAITB signal is always driven high to signal the host to zero-delay (PC Card Memory Mode) O completion of a memory or I/O cycle that is in progress. 42 (PC Card I/O Mode) IORDY In True IDE Mode this output signal may be used as IORDY, and always O (True IDE Mode) driven pull-high. The signal turns low level during the card internal initialization operation at RDY/BSY# O VCC applied or reset applied, so next access to the card should be after the (PC Card Memory Mode) signal turned high level. 37 IREQ The signal of low level indicates that the card is requesting software service O (PC Card I/O Mode) to host, and high indicates that the card is not requesting. INTRQ This signal is the active high Interrupt Request to the host. O (True IDE Mode) INPACKB This signal is not used and should not be connected at the host. O (PC Card Memory Mode) This signal is asserted low by this card when the card is selected and INPACKB responding to an I/O read cycle at the address that is on the address bud 43 O (PC Card I/O Mode) during CE# and IORD# are low. This signal is used for the input data buffer control. INPACKB This signal is not used and should not be connected at the host. O (True IDE Mode) WP WP is held low because this card does not have write-protect switch. O (PC Card Memory Mode) IOIS16B IOIS16B is asserted (Low) when task file registers are accessed in 16-bit or O (PC Card I/O Mode) add byte only mode. 24 This output signal is asserted low when this device is expecting a word data IOIS16B transfer cycle. Default mode is 16-bit. The card operates in byte mode, if O (True IDE Mode) the user issued a Set Feature Command to put the device in Byte access mode. Host data bus. HD0 is the LSB of the even byte of the word. HD8 is the LSB 31, 30, 29, 28, HD[15:0] of the odd byte of the word. 27, 49, 48, 47, (PC Card Memory Mode) I/O 6, 5, 4, 3, 2, (PC Card I/O Mode) 23, 22, 21 (True IDE Mode) Page: 10/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) Pin No. Pin Name I/O Description BVD2 output the battery voltage status in the card. This output line is BVD2 I/O constantly driven to a high state since a battery is not required for this (PC Card Memory Mode) product. 45 SPKR# SPKR# output speaker signal. This output line is constantly driven to a high I/O (PC Card I/O Mode) state since this product does not support the audio function. DASPB DASPB is the Slave Present signal in the Master/Slave handshake I/O (True IDE Mode) protocol. And is Disk Active signal after power on diagnostic command. BVD2 output the battery voltage status in the card. This output line is BVD1 I/O constantly driven to a high state since a battery is not required for this (PC Card Memory Mode) product. 46 STSCHG# STSCHG# is used for changing the status of Configuration and Status (PC Card I/O Mode) Register in attribute area. PDIAGB PDIAGB is the Pass Diagnostic signal in Master/Slave handshake protocol. (True IDE Mode) Page: 11/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) 5. Specifications 5.1 CE and FCC Compatibility ICF conforms to CE requirements and FCC standards. 5.2 Environmental Specifications 5.2.1 Temperature Ranges Temperature Range: -10°C to +70°C Storage Temperature: -40°C to +85°C 5.2.2 Humidity Relative Humidity: 10-95%, non-condensing 5.2.3 Shock and Vibration Table 3: Shock/Vibration Testing for ICF Reliability Test Conditions Reference Standards Vibration 7 Hz to 2 KHz, 5 g, 3 axes IEC 68-2-6 Mechanical Shock Duration: 10ms, 50 g, 3 axes IEC 68-2-27 Drop Unit From a height of 1.5 m IEC 68-2-32 5.2.4 Mean Time between Failures (MTBF) Table 5 summarizes the MTBF prediction results for various ICF configurations. The analysis was performed using a ™ RAM Commander failure rate prediction. ‧ Failure Rate: The total number of failures within an item population, divided by the total number of life units expended by that population, during a particular measurement interval under stated condition. ‧ Mean Time between Failures (MTBF): A basic measure of reliability for repairable items: The mean number of life units during which all parts of the item perform within their specified limits, during a particular measurement interval under stated conditions. Table 4: ICF MTBF Product Condition MTBF (Hours) Failure Rate per Million Hours ICF Telcordia SR-332 GB, 25 °C 6,188,875 0.1616 5.3 Mechanical Dimensions Mechanical Dimension: 42.80/36.40/3.30mm (W/T/H) Page: 12/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) Figure 1: Mechanical Dimension of ICF 5.4 Electrical Specifications 5.4.1 Electric Characteristic Table 5: ICF Electric Characteristic V =4.5V~5.5V DD Value Measuring Item Symbol Unit Min Standard Max conditions Input voltage V 2.0 - - V IH (TTL Level) V - - 0.8 V IL Input voltage V 3.5 - - V IH (CMOS Level) V - - 1.5 V IL Schmitt trigger V - 1.51 2.15 V + input V 0.6 1.01 - V - (TTL Level) V 0.25 - - V h V 3.7 - - V I =2mA~-24mA OH OH Output voltage V - - 0.4 V I =2mA~-24mA OL OL Input leakage I -10 - 10 μA V =V IH IN DD current I -10 - 10 μA V =GND IL IN Output leakage I -10 - 10 μA Hi-Z state OZ current Pull-up resistor R 50 - 500 KOhm V =GND PU IN Pull-down resistor R 15.7 - 128 KOhm V =V PD IN DD V =3.0V~3.6V DD Page: 13/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) Value Measuring Item Symbol Unit Min Standard Max conditions Input voltage V 1.75 - - V IH (TTL Level) V - - 0.65 V IL Input voltage V 2.15 - - V IH (CMOS Level) V - - 0.95 V IL Schmitt trigger V - 1.32 1.75 V + input V 0.45 0.86 - V - (TTL Level) V 0.25 - - V h V 2.4 - - V I =1mA~-12mA OH OH Output voltage V - - 0.4 V I =1mA~-12mA OL OL Input leakage I -10 - 10 μA V =V IH IN DD current I -10 - 10 μA V =GND IL IN Output leakage I -10 - 10 μA Hi-Z state OZ current Pull-up resistor R 76.6 - 750 KOhm V =GND PU IN Pull-down resistor R 24 - 200 KOhm V =V PD IN DD 5.4.2 Maximum Absolute Ratings Table 6: ICF Maximum Absolute Ratings (Referenced to GND) Item Symbol Rating Unit V (HVCC) -0.6 ~ +6.0 V DD Power supply voltage V (CVCC/FVCC) -0.3 ~ +4.0 V DD V (HVCC) -0.6 ~ V +0.6 V IN DD Input voltage V (CVCC/FVCC) -0.3 ~ V +0.3 V IN DD V (5V) -0.3 ~ +7.3 V IN Output current I ±15 (8mA buffer) mA OUT Storage temperature T -55 ~ +125 °C STG 5.4.3 Recommended Operation Conditions Table 7: ICF Recommended Operation Conditions item Symbol Rating Unit 3.0~3.6 V V (HVCC) DD Power supply voltage 4.5~5.5 V V (CVCC/FVCC) 3.0~3.6 V DD Ambient operating T (Pin Capacitance : 40pF) -40~+85 °C A temperature T (Pin Capacitance : 80pF) 0~+70 °C A Page: 14/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) 5.4.4 Timing Specifications Figure 2: Reading Timing Diagram, PIO Mode 4 Table 8: Reading Timing Specifications, PIO Mode 4 Item Symbol Min［ns］ Max［ns］ Cycle Time t0 120 － IORD Data Setup t5 20 － IORD Data Hold Time t6 5 － IORD Data Tri-state Time t6Z － 30 IORD Width Time t2 70 － IORD Recovery Time t2i 25 － Address Setup Time t1 25 － Address Hold Time t9 10 － IOIS16 Delay Falling from Address t7 － 40 IOIS16 Delay Rising from Address t8 － 30 Figure 3: Writing Timing Diagram, PIO Mode 4 Table 9: Writing Timing Specifications, PIO Mode 4 Item Symbol Min［ns］ Max［ns］ Cycle Time t0 120 － Page: 15/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) Item Symbol Min［ns］ Max［ns］ IOWR Data Setup Time t3 20 － IOWR Data Hold Time t4 10 － IOWR Width Time t2 70 － Address Setup Time t1 25 － Address Hold Time t9 10 － IOIS16 Delay Falling from Address t7 － 40 IOIS16 Delay Rising From Address t8 － 30 Figure 4: Reset Timing Diagram Table 10: Reset Timing Specifications Item Symbol Min Max Unit RESET Setup T (RESET) 2 ms SU RESET Width T (RESET) 25 μs W 5.5 Supported IDE Commands ICF supports the commands listed in Table 11. Table 11: IDE Commands Command Name Command Code CHECK POWER MODE 98H or E5H EXECUTE DEVICE DIAGNOSTIC 90H FORMAT TRACK 50H IDENTIFY DEVICE ECH IDLE 97H or E3H IDLE IMMEDIATE 95H or E1H INITIALIZE DEVICE PARAMETERS 91H NOP 00H READ BUFFER E4H Page: 16/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) Command Name Command Code READ LONG SECTOR 22H or 23H READ MULTIPLE C4H READ SECTOR(S) 20H or 21H READ VERIFY SECTOR 40H or 41H RECALIBRATE 1XH SEEK 7XH SET FEATURES EFH SET MULTIPLE MODE C6H SET SLEEP MODE 99H or E6H STANDBY 96H or E2H STANDBY IMMEDIATE 94H or E0H WRITE BUFFER E8H WRITE LONG SECTOR E8H WRITE MULTIPLE C5H WRITE SECTOR(S) 30H or 31H WRITE VERIFY 3CH Page: 17/ 18 Rev. 1.0 Data Sheet, September 2005 ® Industrial CompactFlash Card (ICF) 6. Physical Outline Figure 5: ICF Physical Outline Page: 18/ 18 Rev. 1.0 Data Sheet, September 2005