CONCURRENT TECHNOLOGIES PP 410/03x
Datasheet
Extracted Text
Intel® Core™ 2 Duo Processor, Dual PMC, Rugged Conduction-Cooled RoHS 2002/95/EC APPLICATIONS The PP 452/03x-RC is a PC-compatible, high Ethernet ports, and is compliant with the PICMG® 2.16 functionality, dual PMC, single XMC (PCI Express™ specification. Full system monitoring is provided by the Mezzanine Card), ruggedized conduction-cooled PICMG 2.9 compliant IPMI interface. The PP 452/03x-RC, CompactPCI® board supporting the Intel® Core™ 2 Duo as a ruggedized conduction-cooled board, is suitable for processor and the Intel® E7520 server class chipset. The a range of demanding applications within the defense, processor contains two CPU cores and shared L2 cache. industrial control, telemetry, transportation, and The PP 452/03x features 4 Gbytes DDR2 ECC SDRAM and a aerospace markets. To simplify the board’s integration variety of I/O interfaces. The PP 452/03x-RC will operate many popular standard operating systems are supported. in a system slot, a peripheral slot or independently from This board is rear I/O plug compatible with the the CompactPCI bus. The board supports two Gigabit PP 452/03x and PP 452/03x-RA families. HIGHLIGHTS � Ruggedized 6U single board computer: � 2 x 10/100/1000Mbps Ethernet interfaces: conduction-cooled to IEEE 1101.2 - Dual Gigabit Packet Switching Backplane (PICMG 2.16) - supports 2 conduction-cooled PMC modules conforming - � Watchdog timer and Long Duration Timer to ANSI/VITA 20 � CompactPCI controller: -40°C to +85°C operating temperature, designed to - operates in system slot or peripheral slot - VITA 47 Class C4 32/64-bit at 33/66 MHz CompactPCI interface - conformally coated - � Option to bypass CompactPCI bus (Satellite Mode) � 1.5 GHz Intel® Core™ 2 Duo processor: 667 MHz Front Side Bus - � IPMI (Intelligent Platform Management Interface) 4 Mbytes L2 cache - � PICMG 2.9 (System Management Specification) Intel® 64 Technology (64-bit computing support) - � Single slot (for all option combinations) � 4 Gbytes of dual channel DDR2-400 ECC SDRAM � Non-ruggedized air-cooled versions available: � 1 x PMC/XMC site and 1 x PMC site, both with rear user see PP 452/03x datasheet - I/O: rear plug compatible with ruggedized versions - both PMC sites support 32/64-bit; 33/66MHz PCI-X - useful for bench development - XMC site supports up to x8 PCI Express™ - use in commercial (non-rugged) applications - � 2 x SATA150 interfaces via rear � Ruggedized air-cooled version (RA-Series) planned: � EIDE onboard mass storage interfaces: see PP 452/03x-RA datasheet - onboard soldered Flash drive - -40°C to +75°C, conformally coated - option for removable Flash drive - � Support for Linux®, Windows® XP, Windows® XP option for removable CompactFlash® carrier - Embedded, Windows® Server 2003, Windows® 2000, � 3 x Universal Serial Bus (USB 2.0), 1 x RS232 interfaces QNX®, Solaris™ and VxWorks® 4 Gilberd Court, Colchester, Essex, CO4 9WN, UK CONCURRENT Tel: +44 (0)1206 752626 Fax: +44 (0)1206 751116 6 Tower Office Park, Woburn, MA 01801, USA TECHNOLOGIES Tel: (781) 933 5900 Fax: (781) 933 5911 x8 Ruggedized dual PMC/XMC controller � conduction-cooled to IEEE 1101.2 3x Flash DDR2 USB 2.0 Disk Option SDRAM � supports 2 x conduction-cooled PMC/XMC modules conforming to ANSI/VITA 20 � conformally coated Real-Time Clock Central Processor x4 EIDE Intel Intel Interface � Intel® dual-core processor 6300ESB E7520 BIOS x4 PCI-X 66 � 1.5 GHz Intel® Core™ 2 Duo processor L7400:- Flash EPROM � 4 Mbytes of secondary (L2) on-die cache Fixed x1 � 667 MHz Front Side Bus x4 Core 2 Duo PCIe 1 x Serial CF Flash Processor Switch Interface Disk � Intel® 64 Technology (64-bit computing) TM � uses �FC-BGA 478 (micro Flip-Chip Ball Grid Array) package x1 x1 PCIe � utilizes Intel® E7520 server class chipset:- SATA Intel Intel to PCI GPIO IPMI 150 82574L 82574L Bridge � uses Intel® 6300ESB I/O Controller Hub � provision for XDP debug port SDRAM PMC 1x 3x 5xGPIO IPMB0 IPMB1 2 x Ethernet (PSB) CompactPCI � supports 4 Gbytes DDR2-400 ECC SDRAM:- RS232 USB 10/100/1000Mbps Rear I/O 2xSATA � 4 Gbytes soldered on-board � up to four bit error correction Firmware Support � peak bandwidth of 6.4 Gbytes/s � storage temperatures (VITA 47 Class C4) � Phoenix® Server BIOS � dual channel architecture � -55°C to +105°C � comprehensive Power-On Self-Test (POST) � accessible from processor and CompactPCI bus � 5% to 95% Relative Humidity, non condensing � LAN boot firmware included (operating and storage) Mass Storage Interfaces � altitude (operating): � 2 x SATA-150 interfaces via J5 Software Support -1,000 to 50,000 feet (-305 to 15,240 metres) � support for Linux®, Windows® XP, Windows® � on-board EIDE interfaces:- � ruggedized and commercial air-cooled XP Embedded, Windows® Server 2003, � 4 Gbytes on-board soldered Flash disk versions, see separate datasheets Windows® 2000, QNX®, Solaris™ and VxWorks® � option for 4 Gbytes Flash Disk Module � rear plug compatible � option for ruggedized CompactFlash™ carrier CompactPCI Interface � commercial: PP 452/03x (available) (uses PMC site) � compliant with PICMG 2.0 R3.0; 3.3V or 5V � air-cooled: PP 452/03x-RA (planned) signaling levels (universal signaling support) Ethernet Interfaces Mechanical Specification � 33/66 MHz, 32/64-bit interface accessed via � 2 x rear interfaces implemented by Intel® � 6U form-factor: 9.2inches x 6.3inches (233mm J1/J2 connectors 82574L controllers via x1 PCI Express™ links:- x 160mm) � PCI Express to PCI bridge for off-board � support for PICMG 2.16 R1.0 - Packet � single-slot: 0.8inches (20.3mm) accesses Switching Backplane (PSB) � connectors: IEC-1076-4-101 for J1-J5 � J4 connector not fitted � supports 10 Base-T, 100 Base-TX, 1000 Base-T � operating shock (VITA 47, conduction-cooled): � PICMG 2.1 R2.0 Hot Swap compliant 40g, 11ms, ½ sine PMC/XMC Interfaces � operates as a System Slot controller or in a � 1 x PMC/XMC site and 1 x PMC site � operating random vibration (VITA 47 Class V3): Peripheral slot PSD increasing at +3dB/octave (5Hz to 100Hz) � common features for both PMC sites:- � option to disable CompactPCI interface 2 PSD = 0.1 g /Hz (100Hz to 1kHz) � 32/64-bit, 33/66 MHz PCI/PCI-X operation (Satellite Mode):- PSD decreasing at -6dB/octave (1kHz to 2kHz) � 3.3V or 5V PCI signaling levels � receives power from CompactPCI bus � PMC connectors used for rear I/O � board can be hot swapped (PSD = Power Spectral Density) � XMC (PCI Express™ Mezzanine Card) site IPMI interface supported via x8 PCI Express link � PICMG 2.9 R1.0 (System Management Serial Interface Specification):- � 1 x RS232 serial channels:- � implements the IPMB0 interface � Tx, Rx, RI, CTS, RTS, DSR, DTR and DCD � implements an IPMB1 interface signals via J5 � on-board Baseboard Management Controller � 16550 compatible UART � supports 8 Kbytes of non-volatile memory Other Peripheral Interfaces Electrical Specification � PC Real Time Clock (Year 2000 compliant) � +5V@ � watchdog timer � 1 x 32-bit Long Duration Timer with processor � +3.3V@ interrupt capability � +12V@ � system fan monitor; CPU temperature monitor; � +12V and -12V routed to PMC slots voltages monitor:- Safety � accessible via IPMI � PCB (PWB) manufactured with flammability � 5 GPIO signals accessed via J5 rating of 94V-0 � 3 x USB 2.0 interfaces accessed via J5 � independent legacy speaker output via J3 Environmental Specification Flash EPROM � operating temperatures (VITA 47 Class CC4):- � 1 Mbyte of BIOS Flash EPROM - 8-bits wide � -40°C to +85°C ORDERING INFORMATION Order Number Product Description (Hardware) Replace the order number suffix (xy) with selections from the following: ere x = where y = memory size 3.3V PMC, Ethernet via rear panel 3.3V PMC, Ethernet via PICMG 2.16 3 - 4 Gbytes 3 - 5V PMC, Ethernet via rear panel 4 - 5V PMC, Ethernet via PICMG 2.16 AD 200/002-10RC Ruggedized Dual CompactFlash Carrier AD 230/001-04RC Ruggedized EIDE 4Gbytes Flash Disk Module All companies and product names are trademarks of their respective organizations. Datasheet Code 1583/0309 Specification subject to change; E and OE. RoHS 2002/95/EC compliant. © Concurrent Technologies 2009 XMC PMC Module 2 PMC Module 1
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