Class 2 X7R 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors FEATURES • Stable class 2 dielectric • Four standard sizes • High capacitance per unit volume • Supplied in tape on reel • For high frequency applications • Ni-barrier with 100 % tin terminations. APPLICATIONS • Consumer electronics • Telecommunications • Data processing GENERAL SPECIFICATIONS δδ Tan δδ: NOTE: Electrical characteristics values - 50 V ≤ 2.5 % temperature at 20 ± 1 °C, pressure at 86 to 106 Kpa and 25 V and 16 V ≤ 3.5 % humidity at 63 to 67 % unless otherwise stated 10 V ≤ 5 % Rated Voltage U (DC): 10 V; 16 V; 25 V; 50 V; 100 V R Temperature Coefficient: ± 15 % Capacitance Range: 100 pF to 1.0 µF Insulation Resistance after 120 seconds at U (DC): R Tolerance on Capacitance: R 10 GΩ minimum or 500ΩF minimum, whichever is less ins After 1000 hours; ± 5; ± 10, ± 20 Climatic Category (IEC 68): 55/125/56 DIMENSIONS in inches [millimeters] SIZE T LW MB CODE MAX. 0.040 ± 0.002 0.020 ± 0.002 0.022 0.010 + 0.002/- 0.004 0402 [1.0 ± 0.05] [0.5 ± 0.05] [0.55] [0.25 +0.05/− 0.1] 0.063 ± 0.004 0.030 ± 0.004 0.035 0.015 ± 0.006 W 0603 T [1.6 ± 0.10] [0.8 ± 0.07] [0.87] [0.40 ± 0.15] 0.080 ± 0.006 0.050 ± 0.006 0.053 0.020 ± 0.008 MB MB 0805 [0.50 ± 0.20] [2.0 ± 0.15] [1.25 ± 0.15] [1.35] L 0.125 ± 0.006 0.063 ± 0.006 0.069 0.025 ± 0.008 1206 [3.2 ± 0.15] [1.6 ± 0.15] [1.80] [0.60 ± 0.20] ORDERING INFORMATION VJ0402 Y 101 J X Q C W1BC SIZE CODE DIELECTRIC CAPACITANCE TOLERANCE TERMINATION VOLTAGE PACKAGING TECHNOLOGY 0402 Y = X7R two signiŢcant digits J = ± 5 % X = Ni Barrier Q = 10 V C = 7 inch followed by the reel/paper 0603 J = 16 V K = ± 10 % number of zeros: P = 13 inch 0805 X = 25 V M = ± 20 % 101 = 100 reel/paper 1206 A = 50 V 102 = 1000 T = 7 inch B = 100 V reel/blister 152 = 1500 R = 13 inch 103 = 10000 reel/blister Document Number 28503 For technical questions contact MLCC@vishay.com www.vishay.com Revision 01-Dec-03 15 Class 2 X7R 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors SELECTION CHART FOR 10/16/25/50 AND 100 V DIELECTRIC X7R EIA CAP SIZE 0402 0603 0805 1206 CODE VDC W 10 V 16 V 25 V 50 V 100 V 10 V 16 V 25 V 50 V 100 V 10 V 16 V 25 V 50 V 100 V 10 V 16 V 25 V 50 V 100 V 101 100 pF N N N N SSSS S BBBB B 121 120 N N N N SSSS S BBBB B 151 N N N N SSSS S BBBB B B* B* B* B* B* 150 181 180 N N N N SSSS S BBBB B B* B* B* B* B* 221 220 N N N N SSSS S BBBB B B* B* B* B* B* 271 270 N N N N SSSS S BBBB B B* B* B* B* B* 331 330 N N N N SSSS S BBBB B B* B* B* B* B* 391 N N N N SSSS S BBBB B B* B* B* B* B* 390 471 470 N N N N SSSS S BBBB B B* B* B* B* B* 561 560 N N N N SSSS S BBBB B B* B* B* B* B* 681 680 N N N N SSSS S BBBB B B* B* B* B* B* 821 820 N N N N SSSS S BBBB B BBBB B 102 N N N N SSSS S BBBB B BBBB B 1000 pF 122 1200 N N N N SSSS S BBBB B BBBB B 152 1500 N N N N SSSS S BBBB B BBBB B 182 1800 N N N N SSSS S BBBB B BBBB B 222 2200 N N N N SSSS S BBBB B BBBB B 272 N N N N SSSS S BBBB B BBBB B 2700 332 3300 N N N N SSSS S BBBB B BBBB B 392 3900 N N N N SSSS S BBBB B BBBB B 472 4700 N N N N SSSS S BBBB B BBBB B 562 5600 N N N SSSS S BBBB B BBBB B 682 N N N SSSS S BBBB B BBBB B 6800 822 8200 N N N SSSS S BBBB B BBBB B 103 0.01 µF N N N SSSS S BBBB B BBBB B 123 0.012 N N SSSS BBBB B BBBB B 153 0.015 N N SSSS BBBB B BBBB B 183 0.018 N N SSSS BBBB B BBBB B 223 0.022 N N SSSS BBBB B BBBB B 273 0.027 N SSSS BBBB D BBBB B 333 0.033 N SSS BBBB D BBBB B 393 0.039 N SSS BBBB BBBB B 473 0.047 N SSS BBBB BBBB B 563 0.056 SSS BBBB BBBB B 683 0.068 SSS BBBB BBBB B 823 0.082 SS BBB D BBBB D 104 0.1 µF SS BBB D BBBB D 124 0.12 S BBB D BBBB 154 0.15 S D DDD CCCC 184 0.18 S D DD CCCC 224 0.22 S D DD CCCC 274 0.27 DDD CCC 334 0.33 DDD CCC 394 0.39 DD CC 474 0.47 DD DD 564 0.56 DD DD 684 0.68 DDD 824 0.82 DDD 105 1 µF DDD Note 1. * Items are made by NME (Nobel Metal Electrode) www.vishay.com For technical questions contact MLCC@vishay.com Document Number 28503 16 Revision 01-Dec-03 Class 2 X7R 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors PACKAGING QUANTITIES THICKNESS AMOUNT PER REEL CLASSIFICATION ∆∆ ∆∆180 mm; 7 inch (mm) 0402 0603 0805 1206 A = 0.6 ± 0.1 - - Paper 4 Kp/Reel - B = 0.8 ± 0.1 - - Paper 4 Kp/Reel Paper 4 Kp/Reel C = 0.95 ± 0.1 - - - Plastic 3 Kp/Reel D = 1.25 ± 0.1 - - Plastic 3 Kp/Reel Plastic 3 Kp/Reel G = 1.60 ± 0.2 - - - Plastic 2 Kp/Reel S = 0.8 ± 0.07 - Paper 4 Kp/Reel - - N = 0.50 ± 0.05 Paper 10 Kp/Reel - - - K = 2.00 ± 0.2 ---- M = 2.5 ± 0.30 ---- PACKAGING QUANTITIES AMOUNT PER REEL THICKNESS CLASSIFICATION ∆∆∆∆330 mm; 13 inch (mm) 0402 0603 0805 1206 A = 0.6 ± 0.1 - - Paper 15 Kp/Reel - B = 0.8 ± 0.1 - - Paper 15 Kp/Reel Paper 15 Kp/Reel C = 0.95 ± 0.1 - - - Plastic 10 Kp/Reel D = 1.25 ± 0.1 - - Plastic 10 Kp/Reel Plastic 10 Kp/Reel G = 1.60 ± 0.2 ---- S = 0.8 ± 0.07 - Paper 15 Kp/Reel - - N = 0.50 ± 0.05 Paper 50 Kp/Reel - - - K = 2.00 ± 0.2 ---- M = 2.5 ± 0.30 ---- COVER TAPE (POLYESTER - ANTISTATIC) CARRIER TAPE (POLYCARBONATE) PROPERTIES OF COVER TAPE PROPERTIES OF CARRIER TAPE WIDTH WIDTH PARAMETER PARAMETER 5.5 ± ± ± ± 0.1 mm 8.1 ± ± ± ± 0.2 mm Breaking force ≥ 10.7 N Thickness 190 to 280 µm 2 Elongation at break ≥ 63 % Tensile strength at break > 60 N /mm 10 Surface resistance < 10 Ω /sq. Elongation at break 100 to 150 % 12 Softening point 71 ± 5 °C Surface resistance > 10 Ω /sq. Thickness 62 µm PAPER TAPE SPECIFICATIONS DIMENSIONS OF PAPER TAPE in millimeters P 0 PRODUCT SIZE CODE D P 2 0 SYMBOL 0402 0603 0805 1206 E SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL. A 0.62 ± 0.05 1.02 ± 0.05 1.50 ± 0.10 2.00 ± 0.15 0 B 1.12 ± 0.05 1.82 ± 0.05 2.30 ± 0.10 3.50 ± 0.15 0 F W W 8.00 ± 0.10 8.00 ± 0.10 8.00 ± 0.10 8.00 ± 0.10 B E 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 0 F 3.50 ± 0.05 3.50 ± 0.05 3.50 ± 0.05 3.50 ± 0.05 D 1.55 ± 0.05 1.55 ± 0.05 1.55 ± 0.05 1.55 ± 0.05 0 P 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 0 A 0 P 2.00 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 1 P 1 P 2.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 2 Document Number 28503 For technical questions contact MLCC@vishay.com www.vishay.com Revision 01-Dec-03 17 Class 2 X7R 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors BLISTER TAPE SPECIFICATIONS DIMENSIONS OF BLISTER TAPE in millimeters P 0 PRODUCT D P 2 DIMENSION TOLERANCE 0 0805 1206 A < 1.55 < 2.00 - E 0 B < 2.45 < 3.60 - 0 W 8.00 8.00 ± 0.20 F W E 1.75 1.75 ± 0.10 F 3.50 3.50 ± 0.05 B 0 D 1.50 1.50 + 0.10/- 0 0 D 1.00 1.00 ± 0.10 1 P 4.00 4.00 ± 0.05 0 A D 0 1 P 4.00 4.00 ± 0.10 direction of unreeling 1 P 1 P 2.00 2.00 ± 0.05 2 REEL SPECIFICATIONS DC A B REEL DIMENSIONS AND TAPE WIDTH in millimeters ∅∅∅∅ 180 mm; 7 inch ∅∅∅∅ 330 mm; 13 inch A 13.0 ± 1.0 13.0 ± 0.5 B 9.0 ± 1.0 9.0 ± 0.5 C 178.0 ± 1.0 330.0 ± 1.0 D 60.5 ± 1.0 100.0 ± 1.0 METHOD OF MOUNTING AND DIMENSIONS OF SOLDER LANDS For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering and reflow soldering. An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with the chip size and with temperature fluctuations (> 100 °C) Therefore, it is advised to use the smallest possible size and follow the dimensional recommendations given. www.vishay.com For technical questions contact MLCC@vishay.com Document Number 28503 18 Revision 01-Dec-03 Class 2 X7R 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors SOLDERING GRAPHS IR REFLOW WITH SnPb SOLDER IR REFLOW WITH SnAgCu SOLDER 300 300 Max temperature T T (°C) Max temperature (°C) 250 250 > 215°C: 20 ~ 40 seconds 200 200 Sn-Ag-Cu solder paste 150 150 Min temperature Min temperature 100 100 Sn-Pb Eutectic solder paste 50 50 0 0 time 30 ~ 60 sec time 30 ~ 60 seconds 30 ~ 60 seconds 30 ~ 60 seconds 60 ~ 120 seconds 60 ~ 120 seconds 60 ~ 120 seconds WAVE SOLDERING REFLOW SOLDERING 300 300 10 s 10 s T T (°C) (°C) 260 °C 245 °C 250 250 235 °C to 260 °C second wave 10 s 215 °C 200 5 K/s 200 first wave 40 s 180 °C 2 K/s 200 K/s 150 150 130 °C 100 °C to 130 °C forced 100 100 cooling 2 K/s 2 K/s 50 50 0 0 0 50 100 150 200 250 0 50 100 150 200 250 t (s) t (s) RECOMMENDED DIMENSIONS OF SOLDER LANDS in millimeters solder land / solder paste pattern solder resist DG pattern occupied area E C B A tracks F Document Number 28503 For technical questions contact MLCC@vishay.com www.vishay.com Revision 01-Dec-03 19 preferred direction during wave soldering Class 2 X7R 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors REFLOW SOLDERING FOOTPRINT DIMENSIONS in mm SIZE PLACEMENT PROCESSING REMARKS CODE ACCURACY AB CD E F G 0402 1.50 0.50 0.50 0.50 0.10 1.75 0.95 ± 0.15 0603 2.30 0.70 0.80 0.80 0.20 2.55 1.40 ± 0.25 IR or hot plate soldering 0805 2.80 1.00 0.90 1.30 0.40 3.08 1.85 ± 0.25 1206 4.00 2.20 0.90 1.60 1.60 4.25 2.25 ± 0.25 WAVE SOLDERING FOOTPRINT DIMENSIONS in mm PROPOSED NUMBER AND DIMENSIONS PLACEMENT SIZE OF DUMMY TRACKS ACCURACY CODE AB C D E F G (mm) (mm) 0603 2.40 1.00 0.70 0.80 0.20 3.10 1.90 1 x (0.2 x 0.8) ± 0.10 0805 3.20 1.40 0.90 1.30 0.36 4.10 2.50 1 x (0.3 x 1.3) ± 0.15 1206 4.80 2.30 1.25 1.70 1.25 5.90 3.20 3 x (0.25 x 1.7) ± 0.25 TEST CONDITIONS IN STATIC SOLDER BATH PARAMETER DESCRIPTION SOLDERABILITY CECC requirement: 235 ± 5 °C for 2 ± 0.5 seconds 95 % covered with smooth and bright solder coating IEC requirement: 215 ± 3 °C for 3 ± 0.3 seconds RESISTANCE TO LEACHING 10 % of the metallization of the edges of the head face may be missing 260 ± 5 °C for 30 ± 1 second (inner electrodes are not visible) TESTS AND REQUIREMENTS TEST PROCEDURES AND REQUIREMENTS TEST PROCEDURE REQUIREMENTS no visible damage Visual and mechanical dimensions in accordance with specification C ≤ 10 µF; 1.0 ± 0.2 Vrms; 1 kHz ± 10 % shall not exceed the limits given in the Capacitance detailed specification C > 10 µF; 0.5 ± 0.2 Vrms; 120 kHz ± 20 % ≤ 2.5 % UR: 50 V C ≤ 10 µF; 1.0 ± 0.2 Vrms; 1 kHz ± 10 % Dissipation factor ≤ 3.5 % UR: 25 V, 16 V C > 10 µF; 0.5 ± 0.2 Vrms; 120 kHz ± 20 % ≤ 5.0 % UR: 10 V 250 % of rated voltage for 1 to 5 seconds, charge and discharge no visible damage or flash-over during Dielectric strength current less than 50 mA test 10 GΩ minimum or 500 ΩF minimum, Insulation resistance at UR (DC) for max. 120 seconds whichever is less with no electrical load: Temperature coefficient within ± 15 % − 55 to 125 °C at T = 25 °C amb no visible damage the middle part of the substrate shall be pressurized by means of ∆C/C: ≤ ± 12.5 % the pressurizing rod at a rate of about 1 mm per second until the Bending test deflection becomes 1 mm and then the pressure shall be this capacitance change means the maintained for 5 ± 1 second; change of capacitance under specified measurement after 24 ± 2 hours at room temperature flexure of substrate from the capacitance measured before the test www.vishay.com For technical questions contact MLCC@vishay.com Document Number 28503 20 Revision 01-Dec-03 Class 2 X7R 10/16/25/50/100 V Vishay BCcomponents Surface Mount Multilayer Chip Capacitors TEST PROCEDURES AND REQUIREMENTS TEST PROCEDURE REQUIREMENTS 230 ± 5 °C for 2 ± 0.5 seconds; Solder: SN63A 95 % minimum coverage of entire Solderability metallized area Solder temperature: 260 ± 5 °C Dipping time: 10 ± 1 seconds no visible damage Solder: SN63A Resistance to soldering ∆C/C: ≤ ± 7.5 % Before initial measurement: Perform 150 + 0/-10 °C for 1 hour and heat then set for 48 ± 4 hours at room temperature. DF, R and dielectric strength to meet ins Preheating: 120 to 150 °C for 1 minute before immerse the initial requirements capacitor in a eutectic solder. Measurement to be made after 48 ± 4 hrs at room temperature Test temperature − 55 to 85 °C: no visible damage − 55 °C − 3/+ 0 °C for 30 ± 3 minutes; Room temperature for 2 to 3 minutes; ∆C/C: ≤ ± 7.5 % Temperature cycle X5R: 85 °C + 3/− 0 °C for 30 ± 3 minutes; DF, R and dielectric strength to meet ins Room temperature for 2 to 3 minutes initial requirements Measurement to be made after 48 ± 4 hours at room temperature no visual damage ∆C/C: ≤ ± 12.5 % Test temperature: 40 ± 2 °C DF: Humidity test Humidity: 90 to 95 % RH ≤ 3.0 % UR: 50 V (damp heat steady state) Test time: 500 + 24/− 0 hours ≤ 5.0 % UR: 25 V, 16 V Measurement to be made after 48 ± 4 hours at room temperature ≤ 7.5 % UR: 10 V R : 1 GΩ minimum or 50 ΩF minimum, ins whichever is less no visual damage ∆C/C: ≤ ± 12.5 % Test temperature: 40 ± 2 °C DF: Humidity: 90 to 95 % RH Humidity load ≤ 3.0 % UR: 50 V Test time: 500 + 24/− 0 hours (damp heat) ≤ 5.0 % UR: 25 V, 16 V To apply voltage: rated voltage ≤ 7.5 % UR: 10 V Measurement to be made after 48 ± 2 hours at room temperature R : 500 MΩ minimum or 25 ΩF minimum, ins whichever is less Adhesive strength of Pressurizing force 5 N (≤ 0603) and 10 N (> 0603) no visible damage Test time 10 ± 1 second termination Vibration frequency: 10 to 55 Hz/minute; Total amplitude: 1.5 mm no visible damage or removal of the Vibration resistance Test time: 6 hours (2 hours each in 3 mutually perpendicular terminations directions) no visual damage ∆C/C: ≤ ± 12.5 % Test temperature:125 ± 3 °C; DF: High temperature load To apply voltage: 200 % of rated voltage ≤ 3.0 % UR: 50 V (endurance) Test time1000 + 24/− 0 hours; ≤ 5.0 % UR: 25 V, 16 V Measurement after 48 ± 4 hours at room temperature ≤ 7.5 % UR: 10 V R : 1 GΩ minimum or 50 ΩF minimum, ins whichever is less Document Number 28503 For technical questions contact MLCC@vishay.com www.vishay.com Revision 01-Dec-03 21