Themis USPIIIi High-Performance Multiprocessing VME Computers New Dual-Processor UltraSPARC IIIi VMEbus Computers The new USPIIIi™ is Themis’ highest performance family of single-processor and dual-processor 1.28GHz UltraSPARC®-based VME computers available. The new USPIIIi architecture delivers the industry’s best data bandwidth, providing next generation I/O performance for government, industrial, military, and commercial VME embedded processing applications. The USPIIIi is a multi-slot VME board assembly that implements a dual SMP UltraSPARC IIIi architecture. Based on a standard Sun motherboard licensed reference design utilizing Sun's new UltraSPARC IIIi chipset, the USP IIIi is a next generation design suitable for demanding new applications or as an upgraded replacement of earlier USP-2 SMP VME products. The USPIIIi leverages Themis' USPIIe-USB™ product family, and may be configured with either one or two UltraSPARC IIIi CPUs. The single CPU configuration consists of an I/O board and a CPU board assembly occupying two VME slots. An additional processor board is available as an ordering option; it connects to the first CPU board via the UltraSPARC IIIi processor local bus. A dual- CPU configuration occupies three VME slots. Although the I/O board includes a rich complement of I/O functionality, up to two additional 6U VME I/O boards may be configured with the base I/O board. These additional boards can be PMC carriers (two different options) or TGA3D+ graphics boards. Like its USP-2 predecessor, the USPIIIi provides excellent Sun® graphics support. The Themis TGA3D+™ incorporates Sun XVR-500 graphics technologies and Solaris™ Operating Environment support. Each USPIIIi CPU has a local SMP readable memory module. A dual CPU configuration can have up to 8GB total memory. True SMP is maintained since each UltraSPARC IIIi CPU can access memory from the other CPU via the high-performance J-Bus. To provide CPU connection to I/O devices, two J-Bus bridge chips are used. Data-flow bottlenecks are minimized since each J-Bus device provides two separate and independent PCI buses. One of the J-Bus bridge devices connects to high-speed I/O devices such as Fibre Channel Arbitrated Loop (FC-AL), SCSI disk drive and Gigabit Ethernet. The other J-Bus bridge connects to a 64-bit/66 MHz PCI trunk for the local PMC connection and for PCI expansion to adjacent VME I/O cards (e.g. - optional PMC carrier, PMC/IO carrier and/or TGA3D+ graphics boards). An Ultra160 SCSI interface is used to support the increased bandwidth of today's high-performance LVD SCSI devices; while automatic backward-compatibility modes protect your investment by assuring that earlier single-ended SCSI devices will continue to function properly. Serial ports, SCSI port A, and keyboard/mouse I/O are available at the VME P2 user defined pins via an optional P2 Paddle Board Adapter. USPIIIi Features & Specifications • One or two 1.28 GHz UltraSPARC IIIi Processors • One (1) PMC Slot (64/32-bit @ 66 MHz) • PMC expansion – two (2) or three (3) PMC slots • SPECint2k peak (estimate) 605 @ 1.2 GHz • System Bus – Jbus: 128-bit @ 160MHz • SPECfp2k peak (estimate) 820@ 1.2 GHz • SNMP Compatible Environmental Monitor (Voltage, Temp) • Up to 8GB of DDR266 SDRAM Memory (4-GB per processor) • L2 Cache – 1MB (on-chip) • VME64x Injector/Ejector Handles (traditional VME ejectors available) • 2 MB Boot Flash and 8 MB User Flash • Temperature Range - Operating: -5 to 40.0°C (at 10,000 feet) • VME Interface – VME 64x via Tundra Universe II -5 to 50.0°C (at sea level) A24/D16, A32/D32 modes • VME Form Factor – 6U two (2) slot with one CPU, three (3) Non-Operating: -40 to 85°C • Humidity (non-condensing) – Operating: 0 to 95% slots for two CPUs, expandable to five (5) slots with optional • Shock - Operating/Non-Operating: 30G @ 40 ms features • Vibration - Operating: 0.90 grms – 10-2000Hz • Front panel access and I/O: - System and User Front Panel LEDs Non-Operating: 2.97 grms – 10-2000Hz - One 10/100/1000 Mb RJ-45 Ethernet port • Power Requirements: +5V @ 13.4 Amps, +12V @ 13 Amps • 64-bit Solaris 8, 9 and 10 Operating Environment Support - Four (4) serial ports - Two (2) Copper Fibre Channel Interface (FCAL) ports (DB-9 connectors) - Two (2) Ultra160 SCSI ports - PS/2 or USB keyboard and mouse support (ordering option) USPIIIi System Board 12V I2C PWR ADM I2C Bus ADM DC/DC DC/DC 1031 Bus Converter 1031 Converter Temp Mon Temp Mon MEM MEM J-Bus A B UltraSPARC IIIi UltraSPARC IIIi 2GB 2GB CPU A CPU B CPU 0 CPU 1 DDR 266 DDR 266 PCI-2B 64/66 53c1010 J-Bus 10/100/Gb Ultra160 Phy to BC5703 SCSI PCI Bus JIO Ichip 64/66MHz PMC QL2322 PCI-1B Fibre 64/66 Channel PCI Expansion J-Bus to to PMC Carrier/ PCI Bus PCI-1A TGA3D JIO 64/66 Universe II VME Interface PCI-2A 64/33 ADM Temp Mon PS/2 fp/p2 1031 USB A/B fp Connectors Located On CPU 0 I2C TTY A/B (fp/p2) Ali 1535D Bus SI/O AC97 AD1819 Codec PLX Located Xbus Status Bridge On CPU 0 LEDs M5823 OBP Siemens E-Bus TTY C/D (p2) RTC Flash SIO USPIIIi/AAA-BBBB-CCCC-D AAA = Board Configuration /1 = with no carrier cards BBBB = Memory 1024 = 1GB SDRAM memory /P2 = with P2 carrier cards 2048 = 2GB SDRAM memory /P3 = with P3 carrier cards 4096 = 4GB SDRAM memory /G = with TGA3D+ Graphics Card 8192 = 8GB SDRAM memory /G2 = with 2 TGA3D+ Graphics Cards /GP2 = with TGA3D+ Graphics Card and P2 /GP3 = with TGA3D+ Graphics Card and P3 CCCC = Frequency 1200 = 1.28 GHz D = No. Processors 1 = Single-processor configuration 2 = Dual-processor configuration Themis Themis Europe Sales Office 47200 Bayside Parkway 5 rue Irène Joliot-Curie Fremont, CA 94538 38320 Eybens, France Tel: 510-252-0870 Tel: +33.476.14.77.86 Email: info@themis.com Email: europe_sales@themis.com www.themis.com Themis, the Themis logo, USPIIIi, USPIIe-USB and TGA3D+ are trademarks or registered trademarks of Themis Computer. Sun, Sun Microsystems, and Solaris are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and other countries. UltraSPARC, the ULTRASPARC DRIVEN logo and SPARC trademarks are used under license and are trademarks or registered trademarks of SPARC International, Inc. in the United States and other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc. 070205 ©Copyright 2004 Themis Computer. Specifications subject to change without notice. All rights reserved.