Telect Modular E1 DSX Panels Copper :: The Dynamic Solution for Copper Connectivity Flexibility for today’s networks... Telect DSX features and advantages reliability for tomorrow • Patch, monitor and cross-connect E1 circuits • Choose fully configured high-density panels or empty chassis Modular Telect DSX panels provide a versatile, fully configurable and individual four-port modules for flexibility platform for signal management in E1 network applications. The • Chassis and module options enable customization modular design enables customization to fit the environment, as • Modules come with four jacks that accept all standard patch well as effective cost deferral and expense management – users cords and accessories can purchase and deploy connectivity modules as needed when • Wall-mount/total front access panels available for applications circuits are ready to earn revenue. with limited rear access • Modular design enables you to add modules as your application With a variety of chassis and modules available, you can build a grows panel to fit specific network requirements. Each four- termination • Telect DSX products include a lifetime guarantee module snaps into place in the chassis. Choose from wire-wrap, coaxial or RJ48C connectors to fit your standards. The result is a Options to fit the application high-quality, reliable and dynamic platform for cross-connecting, patching, testing and monitoring E1 circuits. • Chassis: 483 mm (19-in.) and 584 mm (23-in.) sizes, 56 or 64 terminations In use...a typical DSX application • Modules: 4-port DSX, with wire-wrap, coaxial or RJ48C I/O interface field With a modular DSX, you can add flexibility, versatility and advanced connectivity functionality to traditional E1 distribution frame applications. The DSX panel provides a multiple interface point for testing, patching, monitoring and cross- connecting E1 circuits. With three backplane options, you can terminate a variety of E1 switch and MUX equipment with a single set of components. Individual modules snap into the chassis for instant power connection. The overall result is vastly improved cable management, distribution frame space savings and DSX capabilities (non-intrusive patch, test, monitor, cross-connect) for E1 systems. Choose from a variety of chassis (above) and modules (right) to build the panel that fits your application best. See reverse for ordering details A fully loaded 64-termination modular DSX panel. © Telect, Inc., All Rights Reserved, 11.2.11/rev.8 1 1.509.926.6000 :: telect.com Telect Modular E1 DSX Panels Copper :: The Dynamic Solution for Copper Connectivity Ordering Information 4000 Series System Description/Capacity Dimensions Part Number 84-term/4 RU loaded panel 584mmWx178mmHx211mm D 010-4084-4011 64-term./3 RU loaded panel 483mmWx133mmHx211mm D 010-4064-4000 64-term./4 RU loaded panel 483mmWx178mmHx211mm D 010-4064-4010 64-term./4 RU loaded total front access panel 483mmWx177mmHx135mm D 010-4264-0001RE 64-term./3 RU empty chassis (16 module capacity) 483 mm W x 133 mm H x 211 mm D 010-0000-4000 64-term./4 RU empty chassis (16 module capacity) 483mmWx178mmHx211mm D 010-0000-4010 56-term./3 RU empty chassis (14 module capacity) 483 mm W x 133 mm H x 216 mm D 010-0000-4006 56-term./4 RU empty chassis (14 module capacity) 483mmWx178mmHx216mm D 010-0000-4016 36-term. wall-mount empty chassis (9 module capacity) 279 mm W x 178 mm H x 152 mm D 010-0000-4020 8-term. wall-mount empty chassis (2 module capacity) 53mmWx127mmHx79mmD 010-0000-4030 4-termination E1 DSX module 010-4004-E100RE 4-termination T1 DSX module 010-4004-0000 SuperMIX System 56-term/3 RU chassis 483 mm W x 133 mm H x 240 mm D 010-0000-2709 (14 module capacity) Includes 10 cm cable management rings 56-term./3 RU chassis (14 module capacity) 483mmWx133mmHx240mm D 010-0000-2702 64-term./3 RU chassis (16 module capacity) 584 mm W x 133 mm H x 240 mm D 010-0000-2701 4-term. module, wire-wrap I/O backplane 010-2704-1100RE 4-term. module, BNC connector I/O backplane 010-2704-1200RE 4-term. module, RJ48C connector I/O backplane 010-2704-1800RE Jack Specifications Connections Electrical Jack type E1 Standard Bantam Insertion loss BNC: 0.7 dB at 1.024 MHz Wire- wrap: 0.1 dB at 1.024 MHz Environmental Crosstalk BNC: Adjacent channel -70 dB at Salt spray Per MIL-STD-202F, method 101D 1.024 MHz; inter-channel -70 dB Moisture resistance Per MIL-STD-202F, method 106E at 1.024 MHz Wire-wrap: Adjacent channel -60 Thermal limits -40 to 65° C operating dB at 1.024 MHz; inter-channel -55 to 85° C non-operating -70 dB at 1.024 MHz Thermal shock Per MIL-STD-202, method 107D Return loss BNC: -20 dB at 1.024 MHz Wire- Humidity 0 to 95% operating and non-operating wrap: -30 dB at 1.024 MHz Monitor level -20 dB (-1 dB + 0.5 dB) © Telect, Inc., All Rights Reserved, 11.2.11/rev.8 2 1.509.926.6000 :: telect.com