RADISYS CEZ5XT
Specifications
Audio
HD Audio, Speaker out
BIOS
Phoenix
Board Type
COM Express
Chipset
Intel System Controller Hub US15W
CPU
Intel Atom Z530/Z510
Dimensios
80 x 70 mm
Ethernet
Optional 10/100/1000 Base-T, requires one x1 PCI Express lane
Expansion
1x PCIe
Flash
4MB SP flash ROM (3MB reserved)
IDE
1x IDE interface
Memory
Eight (8) 400/533 DDR2 memory devices, Up to 2GB
Power
+12 power rail, validated over 9V to 16.8V range
Processor
Intel Atom
SDIO
microSD socket
USB
8x USB 2.0
Video
VGA, Dual LVDS, SDVO, PCIe x16 expansion
Features
- 1.6GHz and 1.1GHz Intel ATOM™ processor
- 85mm x 70mm size
- Gigabit Ethernet
- microSD socket
- Type 2 COM Express pinout
- Up to 2GB DDR2 memory down
Datasheet
Extracted Text
[Print This Datasheet] Procelerant CEZ5XT Extended Temp Intel® ATOM™ Small Form Factor COM Express Module FEATURE SUMMARY The RadiSys Procelerant® CEZ5XT is based on Intel’s low power 1.6GHz ATOM™ processor on an � 1.6GHz and 1.1GHz Intel 85mm x 70mm standardized Type 2 pin-out COM module. The ATOM™ processor delivers ATOM™ processor unprecedented performance and ultra low power in the smallest COM footprint possible. The Procelerant® CEZ5XT delivers powerful performance with sub-5watt power dissipation, along with up � 85mm x 70mm size to 2GB memory down, a microSD socket, Gigabit Ethernet, and extended voltage range to make it � Up to 2GB DDR2 memory down ideal for battery powered handheld or mobile applications. � Type 2 COM Express pinout EXTREME CAPABILITY AND SUSTAINED RELIABILITY � microSD socket RadiSys Extended Temperature products are designed with higher capability components and are subjected to an extensive suite of environmental tests to demonstrate capability of operation in -25C � Gigabit Ethernet to +70C temperature range. With thorough design verification and 100% HASS screening, OEMs can depend on the sustained reliability of the Procelerant® CEZ5XT in harsh, ruggedized environments as required by Military, Aerospace, Government, Transportation and Industrial Automation applications. CUSTOM SERVICES FROM THE COM EXPERTS AT RADISYS In addition to the custom BIOS and carrier design services, OEMs can depend on RadiSys for custom thermal consulting or design to support their extended temperature system design. RadiSys also offers Humiseal 1B31 conformal coating option for the CEZ5XT. Ask your RadiSys Sales Manager for more information. Procelerant CEZ5XT Specifications FEATURE FUNCTION DESCRIPTION PINOUT Type 2 COM Express Compatible PROCESSOR Intel® Atom™ Processor Z530: 1.60GHz, 512K cache, 533MHz FSB Intel® Atom™ Processor Z510: 1.10GHz, 512K cache, 400MHz FSB CHIPSET Intel System Controller Hub US15W MEMORY Type Eight (8) 400/533 DDR2 memory devices Capacity Up to 2GB memory FLASH 4MB SP flash ROM (3MB reserved) VIDEO US15W Integrated Graphics Single channel LVDS interface with 18-bit or 24-bit format Support resolutions up to 1366x768 pixels at 85Hz Integrated PWM interface for LCD backlight inverter control One SDVO interface Supports resolutions up to 1280x1024 pixels at 85Hz NETWORKING Optional 10/100/1000 Base-T, requires one x1 PCI Express lane AUDIO High Definition Audio Speaker Out STORAGE IDE One IDE interface capable of supporting two Ultra ATA/100 devices SDIO microSD socket PCI EXPRESS One x1 PCI Express link expansion ports USB Eight USB 2.0 expansion ports USB Client mode on port 2 LPC One LPC interface POWER +12 power rail, validated over 9V to 16.8V range POWER MANAGEMENT ACPI 3.0 supporting states S0, S3, S4, S5, G3, and C0, C1, C2, C3, C4/C4E MISCELLANEOUS One SMBus One I2C bus Eight GPIO (four GPI and four GPO) BIOS Phoenix OPERATING SYSTEM Windows XP® Embedded Windows XP® Professional Windows Vista® Ultimate Edition Windows Vista® Embedded Edition Windows CE® 6.0 Red Hat® Embedded Linux RadiSys Microware® OS-9 PHYSICAL SPECIFICATIONS PHYSICAL Dimensions 85mm x 70mm Compatibility Compliant with the PICMG R1.0 COM Express Type 2 pinouts Optional Conformal Coating Humiseal 1B31 ENVIRONMENT Cooling Forced air Class EAC1 as defined in the ANSI/VITA 47-2005 Conduction Class ECC1 as defined in the ANSI/VITA 47-2005 Temperature Operating Up to 2300m (7500 ft) -25°C to +70°C, derated 1.1°C per 305m (1000 ft) above 2300 m (7500 ft) Non-operating -40°C to +85°C Shock Operating 40g, half sine shock pulse, 11ms duration 3 times per face Non-Operating/Unpacked 50g, half sine shock pulse, 11ms duration 3 times per face Transportation/Packaged Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop each of six faces Vibration Operating Random 5Hz – 2KHz, 12.07 grms, 1hr in each of 3 axes 5 – 40Hz 0.04 g2/Hz 40 – 100Hz 0.04 g2/Hz ramping up to 0.1g2/Hz (3dB/oct) 100Hz – 1000Hz 0.1 g2/Hz 1000Hz – 2000Hz: 0.1g2/Hz ramping down to 0.025g2/Hz (6dB/oct) Non-Operating/Storage Random 5Hz – 2KHz, 12.07 grms, 1hr in each of 3 axes 5 – 40Hz 0.04 g2/Hz 40 – 100Hz 0.04 g2/Hz ramping up to 0.1g2/Hz (3dB/oct) 100Hz – 1000Hz 0.1 g2/Hz 1000Hz – 2000Hz: 0.1g2/Hz ramping down to 0.025g2/Hz (6dB/oct) 5 – 500 Hz swept sine, 2.5g (0-p), 25.4mm(p-p) MAX displacement, 5 min dwell at 3 resonances in each of 3 axes. Humidity Operating 5% to 95% non-condensing. 95% RH@30C, linear derating to 25% RH@70C" Non-Operating/Storage 5% to 95% non-condensing Altitude Operating To 15,000ft (4570m) Up to 2300m (7500 ft), -25°C to +70°C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) Non-Operating/Storage To 40,000ft (12000m) REGULATORY Safety UL60950-1, EN60950-1, IEC60950-1 RoHS at time of production EMC EN55022, EN55024, and FCC Part 15, Subpart B, Class B WARRANTY Standard Two years, parts only Ordering Information Information unavailable at this time. © 2010 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Procelerant CEZ5XT DATA SHEET | © 2010 RadiSys Corporation * All other trademarks are the properties of their respective owners.
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