[Print This Datasheet] Procelerant CE 915GME COM Express Embedded Computing Module FEATURE SUMMARY Based on the open PICMG® standard, the RadiSys Procelerant™ CE COM Express module � PICMG Standard form factor combines Intel® Pentium® M and Celeron® M performance with key features vital for today’s ensures compatibility embedded applications. Paired with a RadiSys Procelerant™ CR carrier board, the RadiSys family of COM Express modules provides a final production or a design-specific development platform. � Modular form factor decreases time to market and provides PICMG STANDARD technology upgrade insurance COM Express is the PICMG standard for a Computer-On-Module (COM) based on new serial � Low power and high differential signaling technologies such as PCI Express, Serial ATA, USB 2.0, LVDS, and Serial performance processor options DVO. The COM Express modular concept enables OEMs to reduce time to market by reducing the to meet application needs time spent on processor design and enabling OEMs to focus on their core competencies and product differentiation. The modularity provides the ability for an OEM to plan for feature and performance � Small footprint 95mm x 110mm changes, contributing to the success of the product over its lifetime. APPLICATIONS RadiSys COM Express products are ideal for embedded applications that require a standard processor and memory subsystem at the center of their design – and require the modular flexibility to meet customer needs. Other ideal applications include designs that are size constrained and require the small footprint of COM Express. CARRIER DESIGNS SUPPORTED BY RADISYS Whether customers design their own carrier board or utilize RadiSys Design Services to design one, RadiSys supports the design each step of the way. Tools such as the Carrier Design Guide and Thermal Design Guide, as well as schematics and Gerber files are available for customers committed to using RadiSys Procelerant™ CE processor modules. Ask you RadiSys Sales Manager for more information. Procelerant CE 915GME Specifications FEATURE FUNCTION DESCRIPTION PHYSICAL Dimensions 95mm x 125mm - COM Express Basic Form Factor Compliance PICMG COM Express R1.0 Basic Form Factor, Type 2 PROCESSOR Options LV Pentium-M 738 Performance Clock Speed/FSB/Cache CE738A LV Pentium®-M: 1.4GHz/400MHz FSB/2MB Cache Package BGA Power  10W (Processor only) CHIPSET Supplier Intel® 915GME with ICH6M I/O Hub Features Integrated video, PCI, IDE, PCI-Express, SATA, USB, LPC, GPIO MEMORY Type Single 200-pin SO-DIMM socket, supports 400 and 533 Memory Capacity Up to 1GB DDR2 in a single channel BIOS Type 1MB, Phoenix Technologies AUDIO Compliance AC ‘97 Intel High Definition Audio via ICH6M I/O Hub VIDEO Type Dual Independent Displays via Intel 915GM Chipset Features Dual SVDO, LVDS 18-bit dual channel, Analog VGA, TV Out External PCI-Express x16 Graphics Port, Multi-plexed on SDVO interface pins NETWORKING Type IEEE 802.3 10BASE-T/100BASE- TX/1000BASE-T Compliant Physical Layer via Intel 82573V - Utilizes (1) PCI-Express x1 interface I/O USB Eight USB 2.0 / 1.1 ports SATA Two SATA 150 ports IDE One Ultra ATA100/66/33 port OTHER LPC, Smbus/I2C Bus SUPER I/O BIOS Support National Semiconductor PC8374, Ask about support for Winbond W83627HF-AW EXPANSION PCI Express 3*PCI-Express x1 and 1*PCI-Express x16 PCI PCI 2.3 32-bit 33MHz, four logical devices CONNECTORS COM Express (2) 220 pin COM Express standard connectors. POWER Input 12V input from carrier board (5V standby) Dissipation: CE738A: 20.7W 3D Mark (Max) PHYSICAL SPECIFICATIONS ENVIRONMENT Temperature Operating 0°C – 60°C Non-Operating -40°C – 85°C Humidity Operating 5% to 95% Condensing Non-Operating 5% – 90% RH Non-Condensing at 40°C Shock 30G, trapezoidal 11ms duration Vibration Operating 30G, half sine 11ms duration Storage 50G, half sine 11ms duration 30G REGULATORY Safety UL60950-1, EN60950-1, IEC60950-1 EMC EN55022, EN55024 and FCC Part 15, Subpart B, Class B. WARRANTY Two years Ordering Information Call for pricing and availability. Refer to the order codes below. ORDER CODES/description: Module Order Codes: CE738B-0 1.4GHz LV Pentium M, 0MB Supporting Products: CE-PHSA: Passive Heatsink & Assembly © 2010 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Procelerant CE 915GME DATA SHEET | © 2010 RadiSys Corporation * All other trademarks are the properties of their respective owners.