[Print This Datasheet] Procelerant CEQM57XT Next Generation Performance FEATURE SUMMARY The Procelerant® CEGM57XT combines the next generation performance Intel® Core™ i5 and i7 � -25C to 70C Extended processors and the Mobile Intel® QM57 Express chipset with RadiSys -25C to +70C extended Temperature Range temperature and vibration specifications to provide breakthrough processing performance on a ruggedized COM Express module. The basic size 95mm x 125mm module is ideal for compute � Intel® Core™ i5 and i7 intensive applications such as military–aerospace, transportation and industrial applications requiring Processor options high levels of performance and durability. RadiSys delivers the CEQM57XT module in a Type 2 pin � Intel Core™ i7 610E 2.53GHz out, enabling customers to easily upgrade from their previous generation module while boosting � Intel Core™ i7 620LE 2.0GHz features and performance with up to 8GB memory, additional PCI Express lanes, and improved storage, graphics and audio. � Intel Core™ i7 620UE 1.06GHz The RadiSys Procelerant® CE family of COM Express products enable customers to start designing at the same time as processor release, saving months of development time and resources. OEM � Intel Core™ i5 520E 2.4GHz focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades � Mobile Intel® QM57 Express can be handled without product re–designs using the Procelerant CE family. Procelerant CE modules chipset can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime. � Dual–channel DDR3, up to 8GB EXTREME CAPABILITY AND SUSTAINED RELIABILITY � Type 2 and Type 3 pin–out options RadiSys Extended Temperature products are designed with higher capability components and are subjected to an extensive suite of environmental tests to demonstrate capability of operation in -25C � TPM to +70C temperature range. With thorough design verification and 100% HASS screening, OEMs can � Support for SSDDR (Solid State depend on the sustained reliability of the Procelerant® CEQM57XT in harsh, ruggedized Disk on SODIMM form factor) for environments as required by Military, Aerospace, Government, Transportation and Industrial up to 32 GB NAND flash memory Automation applications. or up to 8 GB DDR3 memory COM EXPERT DESIGN SERVICES � Six PCI Express x1 ports, one OEMs can depend on the RadiSys COM Expert team to support their design at every stage, from PCI Express x8 port schematic checks to the handling of entire custom carrier and system designs. RadiSys COM Expert � Single or dual Gigabit Ethernet services include options for software utilities, custom BIOS, mechanical models, debug assistance options and more to customers using RadiSys Procelerant® CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage. � Conformal Coat Option - Humiseal 1B31 In addition to the custom BIOS and carrier design services, OEMs can depend on RadiSys for custom thermal consulting or design to support their extended temperature system design. RadiSys also offers Humiseal 1B31 conformal coating option for the CEQM57. Ask your RadiSys Sales Manager for more information KICKSTART YOUR APPLICATION DEVELOPMENT WITH COM EXPRESS STARTER KITS Accelerate a product's development, improve its time to market and reduce overall cost by minimizing the design team's installation requirements and maximizing their efficiency. Procelerant® COM Express Starter Kits arrive integrated onto a CR202 or CR203 development carrier board with heatsink, memory modules, hard drive, DVD drive, and power supply––all using only a single order code. Procelerant CEQM57XT Specifications FEATURE FUNCTION DESCRIPTION PROCESSOR 610E Core™ i7 610E 2.53GHz / 4MB cache / 1067MHz FSB/ 35W 520E Core™ i5 520E 2.4GHz / 3MB cache 1067MHz FSB / 35W 620LE Core™ i7 620LE 2.0GHz / 4MB Cache / 1067MHz FSB/ 25W 620UE Core™ i7 620UE 1.06GHz / 4MB Cache / 800MHz FSB /18W CHIPSET Mobile Intel® QM57 Express chipset MEMORY Type Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800. Capacity Up to 4GB per channel, for a maximum of 8GB memory FLASH 4MB system flash for BIOS storage VIDEO Intel® Gen 5.0 integrated graphics engine Dual LVDS supports (2) 18 bit or (2) 24 bit panel support resolutions up to 1920x1200 pixels at 60 Hz VGA One SDVO interface (default) support resolutions up to 1920x1200 pixels at 60 Hz External Build option to support one x16 PCI Express interface for external PCIe x16 graphics device, Embedded Display Port eDP mux'ed with PEG interface NETWORKING Type 2 One 10/100/1000BaseT Type 3 (Build Option) Two 10/100/1000BaseT AUDIO High Definition Audio Speaker Out STORAGE SATA 4 SATA ports supporting both 1.5 and 3.0 Gbps operation Supports RAID 0, 1, 5 and 10 USB One microSD socket (option) PCI EXPRESS Six PCI Express x1 ports � Ports 0–3 configurable as one x4, or two x2; or one x2 and two x1; or four x1 ports � Ports 4–5 configurable as two x1 or one x2 ports One PCI Express x8 from PCI Express graphics port supports x1, x2, x4 and x8 devices (Build Option) One PCI Express x16 Graphics Expansion Port PCI One PCI 2.3 compliant 32-bit, 33MHz bus USB Eight USB 2.0 expansion ports (Build Option for 4 additional USB 2.0 via on–board headers) LPC One LPC interface TPM Nuvoton (Windbond) WPCT210A POWER +12 power rail, primary input Supports 9.0V–16.8V power supply POWER MANAGEMENT ACPI 3.0 supporting states G0/S0, G1/S3, G2/S5, and G3 MISCELLANEOUS One 100KHz SMBus from PCH 2 One 400KHz I C bus from MCU Eight GPIO (four GPI and four GPO) Watchdog timer BIOS AMI EFI Firmware OS Windows XP® Embedded Professional Professional 64bit Windows Vista Ultimate Edition Ultimate Edition 64bit Windows 7 Ultimate Edition Ultimate Edition 64bit Red Hat Linux Enterprise Enterprise 64bit Microware® Hypervisor   Physical Specifications PHYSICAL Dimensions 95mm x 125mm Compliance PICMG COM Express R1.0 Basic Form Factor Conformal Coat Optional - Humiseal 1B31 ENVIRONMENT Cooling Forced air Class EAC1 as defined in the ANSI/VITA 47-2005 Conduction Class ECC1 as defined in the ANSI/VITA 47-2005 Temperature Operating Up to 2300m (7500ft) -25°C to +70°C, derated 1.1°C per 300m over 2300m Non-operating -40°C to +85°C Shock Operating 40G, half sine shock pulse, 11ms duration, 3 times per face Non-Operating/Unpacked 50G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged) Transportation/Packaged Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces Vibration Operating Random 5Hz to 2KHz, 12.07 grms, (random) 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to .01g2/Hz(3dB/oct) 100Hz - 1000Hz: 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6dB/oct) Non-Operating/Storage Random 5Hz to 2KHz, 12.07 grms, 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to 0.1g2/Hz (3dB/oct) 100Hz to 1000Hz 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6db/oct) 5 - 500Hz swept sine, 2.5 (0-p), Humidity Operating 5% to 95% non-condensing. 95% RH@30C, linear derating to 25% RH@70C Non-Operating/Storage 5% to 95% non-condensing Altitude Operating To 15,000ft (4570m) Up to 2300m (7500 ft), -25°C to +70°C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) Non-Operating/Storage To 40,000ft (12000m) REGULATORY Safety UL60950-1, EN60950-1, IEC60950-1 Shall meet RoHS at time of production EMC EN55024, EN55022, and FCC Part 15, Subpart B, Class B WARRANTY Standard Two years, parts only Ordering Information Module Order Codes: � CEQMXT–610E–0: Core™ i7 610E 2.53GHz, 4MB cache, Type 2, single LAN, SDVO, TPM, -25C to +70C � CEQMXT–520E–0: Core™ i5 520E 2.4GHz, 3MB cache, Type 2, single LAN, SDVO, TPM, -25C to +70C � CEQMXT–620L–0: Core™ i7 620LE 2.0GHz, 4MB cache, Type 2, single LAN, SDVO, TPM, -25C to +70C � CEQMXT–620U–0: Core™ i7 620UE 1.06GHz, 4MB cache, Type 2, single LAN,SDVO, TPM, -25C to +70C Supporting Products: � S–CEQM57XTE–AHS: Active heatsink assembly � S-CE-2GB-DDR3XT: 1GB DDR3 SODIMM Memory, Extended Temp (-25 to +70C ) � S-CE-2GB-DDR3IT: 2GB DDR3 SODIMM Memory, Industrial Temp (-40 to +85C ) � -S-CE-4GB-DDR3IT: 4GB DDR3 SODIMM Memory, Industrial Temp (-40 to +85C )   © 2010 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Procelerant CEQM57XT DATA SHEET | © 2010 RadiSys Corporation * All other trademarks are the properties of their respective owners.