[Print This Datasheet] Procelerant CEQM57/ECC Next Generation Performance FEATURE SUMMARY The Procelerant® CEQM57-ECC combines the next generation performance Intel® Core™ i5 and i7 � Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with error-correcting code (ECC) memory  in Processor options a basic size COM Express module for applications where performance and memory integrity are � Intel Core™ i7 610E 2.53GHz requirements. The compact 95mm x 125mm module is ideal for compute intensive applications such as medical imaging, communications, military–aerospace and test and measurement applications � Intel Core™ i5 520E 2.4GHz that require high levels of performance. RadiSys delivers the CEQM57-ECC module in a Type 2 and Type 3 pin out, enabling customers to easily upgrade from their previous generation module while � Mobile Intel® QM57 Express boosting features and performance with up to 8GB ECC memory, additional PCI Express lanes, and chipset improved storage, graphics and audio. � Dual–channel DDR3 memory The RadiSys Procelerant® CE family of COM Express products enable customers to start designing with ECC, up to 8GB at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than � Type 2 and Type 3 pin–out high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades options can be handled without product re–designs using the Procelerant CE family. Procelerant CE modules � TPM can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime. � Six PCI Express x1 ports, one PCI Express x16 or eDP port COM EXPERT DESIGN SERVICES � Single or dual Gigabit Ethernet OEMs can depend on the RadiSys COM Expert team to support their design at every stage, from options schematic checks to the handling of entire custom carrier and system designs. RadiSys COM Expert services include options for software utilities, custom BIOS, mechanical models, debug assistance and more to customers using RadiSys Procelerant® CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage. Ask your RadiSys Sales Manager for more information. KICKSTART YOUR APPLICATION DEVELOPMENT WITH COM EXPRESS STARTER KITS Accelerate a product's development, improve its time to market and reduce overall cost by minimizing the design team's installation requirements and maximizing their efficiency. Procelerant® COM Express Starter Kits arrive integrated onto a CR202 or CR203 development carrier board with heatsink, memory modules, hard drive, DVD drive, and power supply––all using only a single order code. Procelerant CEQM57/ECC Specifications FEATURE FUNCTION DESCRIPTION PROCESSOR 610E Core™ i7 610E 2.53GHz / 4MB cache / 1067MHz FSB/ 35W TM 520E Core i5 520E 2.4GHz / 3MB cache / 1067MHz FSB / 35W CHIPSET Mobile Intel® QM57 Express chipset MEMORY Type Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800 with ECC. Capacity Up to 4GB per channel, for a maximum of 8GB memory FLASH 4MB system flash for BIOS storage VIDEO Intel® Gen 5.0 integrated graphics engine Dual LVDS supports (2) 18 bit or (2) 24 bit panel support resolutions up to 1920x1200 pixels at 60 Hz VGA One SDVO interface support resolutions up to 1920x1200 pixels at 60 Hz (build option) External One x16 PCI Express interface for external PCIe x16 graphics device, Embedded Display Port eDP mux'ed with PEG interface NETWORKING Type 2 One 10/100/1000BaseT Type 3 Two 10/100/1000BaseT AUDIO High Definition Audio Speaker Out STORAGE SATA 4 SATA ports supporting both 1.5 and 3.0 Gbps operation Supports RAID 0, 1, 5 and 10 USB One microSD socket (option) PCI EXPRESS Six PCI Express x1 ports � Ports 0–3 configurable as one x4, or two x2; or one x2 and two x1; or four x1 ports � Ports 4–5 configurable as two x1 or one x2 ports One PCI Express x16 Graphics Expansion Port or eDP port PCI One PCI 2.3 compliant 32-bit, 33MHz bus USB Eight USB 2.0 expansion ports (Build Option for 4 additional USB 2.0 via on–board headers) LPC One LPC interface TPM Nuvoton (Windbond) WPCT210A POWER +12 power rail, primary input Supports 9.0V–16.8V power supply POWER MANAGEMENT ACPI 3.0 supporting states G0/S0, G1/S3, G2/S5, and G3 MISCELLANEOUS One 100KHz SMBus from PCH 2 One 400KHz I C bus from MCU Eight GPIO (four GPI and four GPO) Watchdog timer BIOS AMI EFI Firmware OS Windows XP® Embedded Professional Professional 64bit Windows Vista Ultimate Edition Ultimate Edition 64bit Windows 7 Ultimate Edition Ultimate Edition 64bit Red Hat Linux Enterprise Enterprise 64bit Microware® Hypervisor   Physical Specifications PHYSICAL Dimensions 95mm x 125mm Compliance PICMG COM Express R1.0 Basic Form Factor ENVIRONMENT Cooling Forced air Class EAC1 as defined in the ANSI/VITA 47-2005 Conduction Class ECC1 as defined in the ANSI/VITA 47-2005 Temperature Operating Up to 2300m (7500 ft), 0 to 60C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) Non-operating -40°C to +85°C Shock Operating 30G, half sine shock pulse, 11ms duration, 3 times per face Non-Operating/Unpacked 40G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged) Transportation/Packaged Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces Vibration Operating Random 5Hz to 2KHz, 7.7 grms, (random) 10min in each of 3 axes 5Hz - 20Hz: 0.004g2/Hz ramping up to 0.04g2/Hz 20Hz to 1000Hz: 0.04g2/Hz 1000Hz to 2000Hz: 0.04g2/Hz ramping down to 0.01g2/Hz Non-Operating/Storage Random 5Hz to 2KHz, 9.7 grms, 10min in each of 3 axes 5Hz - 20Hz: 0.006g2/Hz ramping up to 0.06g2/Hz 20Hz to 1000Hz: 0.06g2/Hz 1000Hz to 2000Hz: 0.06g2/Hz ramping down to 0.02g2/Hz Humidity Operating 5% to 95% non-condensing. 95% RH@30C, linear derating to 25% RH@60C Non-Operating/Storage 5% to 95% non-condensing Altitude Operating To 15,000ft (4570m) Non-Operating/Storage To 40,000ft (12000m) REGULATORY Safety UL60950-1, EN60950-1, IEC60950-1 Shall meet RoHS at time of production EMC EN55024, EN55022, and FCC Part 15, Subpart B, Class B WARRANTY Standard Two years, parts only Ordering Information Module Order Codes: � CEQME3–610E–0: Core™ i7 610E 2.53GHz with ECC support, 4MB cache, Type 3, dual LAN, PEG, TPM � CEQME2–520E–0: Core™ i5 520E 2.4GHz with ECC support, 3MB cache, Type 2, single LAN, PEG, TPM � CEQME2–610E–0: Core™ i7 610E 2.53GHz with ECC support, 4MB cache, Type 2, single LAN, PEG, TPM Supporting Products: � S–CEQM57E–PHS: Passive heatsink assembly � S–CE–1GB–DDR3E: 1GB DDR3 SODIMM Memory with ECC � S–CE–2GB–DDR3E: 2GB DDR3 SODIMM Memory with ECC � S–CE–4GB–DDR3E: 4GB DDR3 SODIMM Memory with ECC   © 2010 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Procelerant CEQM57/ECC DATA SHEET | © 2010 RadiSys Corporation * All other trademarks are the properties of their respective owners.