[Print This Datasheet] Procelerant CEQM57 Next Generation Performance FEATURE SUMMARY The Procelerant® CEQM57 combines the next generation performance Intel® Core™ i5 and i7 � Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with RadiSys design expertise to provide Processor options breakthrough processing performance on a basic size COM Express module. The compact 95mm x � Intel Core™ i7 610E 2.53GHz 125mm module is ideal for compute intensive applications such as medical imaging, communications, military–aerospace and test and measurement applications that require high levels � Intel Core™ i7 620LE 2.0GHz of performance. RadiSys delivers the CEQM57 module in a Type 2 and Type 3 pin out, enabling � Intel Core™ i7 620UE customers to easily upgrade from their previous generation module while boosting features and 1.06GHz performance with up to 8GB memory, SSDDR3 options, additional PCI Express lanes, and improved storage, graphics and audio. The CEQM57 module can support error–correcting code (ECC) for � Intel Core™ i5 520E 2.4GHz applications where memory integrity is required. The RadiSys Procelerant® CE family of COM Express products enable customers to start designing � Mobile Intel® QM57 Express at the same time as processor release, saving months of development time and resources. OEM chipset focus can remain on core competencies such as software and application development rather than � Dual–channel DDR3, up to 8GB high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re–designs using the Procelerant CE family. Procelerant CE modules � Type 2 and Type 3 pin–out can reduce service repair inventories, and simplify upgrades, contributing to the success of the options product over its lifetime. � TPM COM EXPERT DESIGN SERVICES � Support for SSDDR (Solid State OEMs can depend on the RadiSys COM Expert team to support their design at every stage, from Disk on SODIMM form factor) for schematic checks to the handling of entire custom carrier and system designs. RadiSys COM Expert up to 32 GB NAND flash memory services include options for software utilities, custom BIOS, mechanical models, debug assistance or up to 8 GB DDR3 memory and more to customers using RadiSys Procelerant® CE processor modules. Design consulting and � Six PCI Express x1 ports, one debug services are also available to support OEM product development at any stage. Ask your PCI Express x8 port (or a build– RadiSys Sales Manager for more information. option to support PCI Express KICKSTART YOUR APPLICATION DEVELOPMENT WITH COM EXPRESS x16 expansion port) STARTER KITS � Single or dual Gigabit Ethernet Accelerate a product's development, improve its time to market and reduce overall cost by minimizing options the design team's installation requirements and maximizing their efficiency. Procelerant® COM Express Starter Kits arrive integrated onto a CR202 or CR203 development carrier board with heatsink, memory modules, hard drive, DVD drive, and power supply––all using only a single order code. Procelerant CEQM57 Specifications FEATURE FUNCTION DESCRIPTION PROCESSOR 610E Core™ i7 610E 2.53GHz / 4MB cache / 1067MHz FSB/ 35W 520E Core™ i5 520E 2.4GHz / 3MB cache 1067MHz FSB / 35W 620LE Core™ i7 620LE 2.0GHz / 4MB Cache / 1067MHz FSB/ 25W 620UE Core™ i7 620UE 1.06GHz / 4MB Cache / 800MHz FSB /18W CHIPSET Mobile Intel® QM57 Express chipset MEMORY Type Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800. Capacity Up to 4GB per channel, for a maximum of 8GB memory FLASH 4MB system flash for BIOS storage SSDDR3 Option for 1GB DDR3 + 8GB SSD Option for 2GB DDR3+ 8GB SSD VIDEO Intel® Gen 5.0 integrated graphics engine Dual LVDS supports (2) 18 bit or (2) 24 bit panel support resolutions up to 1920x1200 pixels at 60 Hz VGA One SDVO interface (default) support resolutions up to 1920x1200 pixels at 60 Hz External Build option to support one x16 PCI Express interface for external PCIe x16 graphics device, Embedded Display Port eDP mux'ed with PEG interface NETWORKING Type 2 One 10/100/1000BaseT Type 3 (Build Option) Two 10/100/1000BaseT AUDIO High Definition Audio Speaker Out STORAGE SATA 4 SATA ports supporting both 1.5 and 3.0 Gbps operation Supports RAID 0, 1, 5 and 10 Other SSDDR3 with 8-32GB NAND flash (option) USB One microSD socket (option) PCI EXPRESS Six PCI Express x1 ports � Ports 0–3 configurable as one x4, or two x2; or one x2 and two x1; or four x1 ports � Ports 4–5 configurable as two x1 or one x2 ports One PCI Express x8 from PCI Express graphics port supports x1, x2, x4 and x8 devices (Build Option) One PCI Express x16 Graphics Expansion Port PCI One PCI 2.3 compliant 32-bit, 33MHz bus USB Eight USB 2.0 expansion ports (Build Option for 4 additional USB 2.0 via on–board headers) LPC One LPC interface TPM Nuvoton (Windbond) WPCT210A POWER +12 power rail, primary input Supports 9.0V–16.8V power supply POWER MANAGEMENT ACPI 3.0 supporting states G0/S0, G1/S3, G2/S5, and G3 MISCELLANEOUS One 100KHz SMBus from PCH 2 One 400KHz I C bus from MCU Eight GPIO (four GPI and four GPO) Watchdog timer BIOS AMI EFI Firmware OS Windows XP® Embedded Professional Professional 64bit Windows Vista Ultimate Edition Ultimate Edition 64bit Windows 7 Ultimate Edition Ultimate Edition 64bit Red Hat Linux Enterprise Enterprise 64bit Microware® Hypervisor   Physical Specifications PHYSICAL Dimensions 95mm x 125mm Compliance PICMG COM Express R1.0 Basic Form Factor ENVIRONMENT Cooling Forced air Class EAC1 as defined in the ANSI/VITA 47-2005 Conduction Class ECC1 as defined in the ANSI/VITA 47-2005 Temperature Operating Up to 2300m (7500 ft), 0 to 60C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) Non-operating -40°C to +85°C Shock Operating 30G, half sine shock pulse, 11ms duration, 3 times per face Non-Operating/Unpacked 40G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged) Transportation/Packaged Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces Vibration Operating Random 5Hz to 2KHz, 7.7 grms, (random) 10min in each of 3 axes 5Hz - 20Hz: 0.004g2/Hz ramping up to 0.04g2/Hz 20Hz to 1000Hz: 0.04g2/Hz 1000Hz to 2000Hz: 0.04g2/Hz ramping down to 0.01g2/Hz Non-Operating/Storage Random 5Hz to 2KHz, 9.7 grms, 10min in each of 3 axes 5Hz - 20Hz: 0.006g2/Hz ramping up to 0.06g2/Hz 20Hz to 1000Hz: 0.06g2/Hz 1000Hz to 2000Hz: 0.06g2/Hz ramping down to 0.02g2/Hz Humidity Operating 5% to 95% non-condensing. 95% RH@30C, linear derating to 25% RH@60C Non-Operating/Storage 5% to 95% non-condensing Altitude Operating To 15,000ft (4570m) Non-Operating/Storage To 40,000ft (12000m) REGULATORY Safety UL60950-1, EN60950-1, IEC60950-1 Shall meet RoHS at time of production EMC EN55024, EN55022, and FCC Part 15, Subpart B, Class B WARRANTY Standard Two years, parts only Ordering Information Module Order Codes: � CEQM57–610E–0: Core™ i7 610E 2.53GHz, 4MB cache, Type 2, single LAN, SDVO, TPM � CEQM57–520E–0: Core™ i5 520E 2.4GHz, 3MB cache, Type 2, single LAN, SDVO, TPM � CEQM57–620L–0: Core™ i7 620LE 2.0GHz, 4MB cache, Type 2, single LAN, SDVO, TPM � CEQM57–620U–0: Core™ i7 620UE 1.06GHz, 4MB cache, Type 2, single LAN,SDVO, TPM Supporting Products: � S–CEQM57XTE–AHS: Active heatsink assembly � S–CE–1GB–DDR3: 1GB DDR3 SODIMM Memory � S–CE–2GB–DDR3: 2GB DDR3 SODIMM Memory � S–CE–4GB–DDR3: 4GB DDR3 SODIMM Memory � S–CE–1DDR3+8SSD: SSDR with 1GB DDR3 and 8GBSSD � S–CE–2DDR3+8SSD: SSDR with 2GB DDR3 and 8GBSSD © 2010 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Procelerant CEQM57 DATA SHEET | © 2010 RadiSys Corporation * All other trademarks are the properties of their respective owners.