[Print This Datasheet] Procelerant CEGSXT Extended Temp Core™2 Duo Processor COM Express Module FEATURE SUMMARY The Procelerant® CEGSXT combines the next generation performance Intel® Core™ 2 Duo, � Core™ 2 Duo and Celeron Celeron® M processors and the GS45 chipset with RadiSys-designed dual channel memory to processor options provide breakthrough processing performance on a basic size COM Express module. Featuring � 2.26GHz Core™ 2 Duo DDR3 memory and enhanced 3D graphics, the CEGSXT is available in both Type 2 and Type 3 COM Express pin-out options. The CEGSXT supports existing and new carrier designs while maximizing � 1.2 GHz and 1.86GHz Core™ feature content. 2 Duo EXTREME CAPABILITY AND SUSTAINED RELIABILITY � 1.2GHz Celeron® M ULV RadiSys Extended Temperature products are designed with higher capability components and are subjected to an extensive suite of environmental tests to demonstrate capability of operation in -25C � GS45 Express chipset and ICH9M to +70C temperature range. With thorough design verification and 100% HASS screening, OEMs can depend on the sustained reliability of the Procelerant® CEGSXT in harsh, ruggedized environments � Dual-channel DDR3, up to 8GB as required by Military, Aerospace, Government, Transportation and Industrial Automation applications. � Type 2 and Type 3 pinout options CUSTOM SERVICES FROM THE COM EXPERTS AT RADISYS In addition to the custom BIOS and carrier design services, OEMs can depend on RadiSys for custom thermal consulting or design to support their extended temperature system design. RadiSys also offers Humiseal 1B31 conformal coating option for the CEGSXT. Ask your RadiSys Sales Manager for more information. COM EXPRESS AND REAL-TIME HYPERVISOR The greatest challenge companies face in adopting new technology is the difficulty they experience adapting it into their current products and also in utilizing it to its fullest advantage. Multi-core processing, one of the newest technological advances in COM Express modules, operates with the greatest efficiency when utilized with RadiSys Microware® Hypervisor middleware. One of the main benefits of Hypervisor's innovation is the ability to run legacy software on the latest-generation platforms without going through complex porting development. This saves time, and resources and total cost of ownership while advancing product features and functionality. Procelerant CEGSXT Specifications FEATURE FUNCTION DESCRIPTION PROCESSOR SP9300 2.26 GHz Core™ 2 Duo SV processor / 6MB Cache / 1067MHz FSB /25W SL9400 1.86 GHz Core™ 2 Duo SV processor / 6MB Cache / 1067MHz FSB /17W SU9300 1.2 GHz Core™ 2 Duo processor / 3MB Cache /800MHz FSB/10W ICP722 1.2 GHz Celeron® M processor / 1MB Cache / 800MHz FSB/5.5W CHIPSET Intel GS45 Express and ICH9M I/O Hub MEMORY Type Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800 Capacity Up to 4GB per channel, for a maximum of 8GB memory FLASH 4MB system flash for BIOS storage VIDEO Intel® Gen 5.0 integrated graphics engine Dual LVDS supports 2 x 18 bpp OR 2 x 24 bpp panel support VGA Default Output: SDTV/Standard Definition TV Also Supported: Composite, S-Video, Component Video, HDTV Dual-channel SDVO, multiplexed on the PCI Express Graphic port display interface Three DisplayPort, multiplexed on the PCI Express Graphic port display interface External One PCI Express x16 Graphics expansion port NETWORKING Type 2 One 10/100/1000BaseT Type 3 Two 10/100/1000BaseT AUDIO High Definition Audio Speaker Out STORAGE SATA Four SATA interfaces, each capable of supporting one SATA device Supports both 1.5 and 3.0 Gbps operation IDE (for type 2 only) One IDE interface (build option) capable of supporting two UltraATA/100 devices PCI EXPRESS Type 2 and 3 One x16 PCI Express Graphics expansion port Type 2 One PCI Express x1 Interface Four x1 PCI Express link expansion ports, configurable as: � Four x1 � One x4 � One x2 and two x1 � One x3 and one x1 Type 3 Four x1 PCI Express link expansion ports, configurable as: � Four x1 � One x4 � One x2 and two x1 � One x3 and one x1 PCI One PCI 2.3 compliant 32-bit, 33MHz bus USB Eight USB 2.0 expansion ports LPC One LPC interface POWER +12 power rail, primary input Supports 6.0V-16.8V (SL9400, SP9300, SU9300, ICP722) Supports 6.0V-15.5V (T9400 only) POWER MANAGEMENT ACPI 3.0 supporting states S0, S3, S4, S5, G3, and C0, C1, C2, C3, C4/C4E MISCELLANEOUS One SMBus Eight GPIO (four GPI and four GPO) One I2C BIOS Phoenix® EmbeddedBIOS® with StrongFrame® Technology OS Windows XP® Embedded Windows XP® Professional Windows Vista® Ultimate Edition Red Hat® Enterprise Linux RadiSys® Microware® OS-9 Microware® Hypervisor PHYSICAL SPECIFICATIONS PHYSICAL Dimensions 95mm x 125mm Compliance PICMG COM.0 COM Express R1.0 Basic Form Factor Optional Conformal Coating Humiseal 1B31 ENVIRONMENT Cooling Forced air Class EAC1 as defined in the ANSI/VITA 47-2005 Conduction Class ECC1 as defined in the ANSI/VITA 47-2005 Temperature Operating Up to 2300m (7500ft) -25°C to +70°C, derated 1.1°C per 300m over 2300m Non-operating -40°C to +85°C Shock Operating 40G, half sine shock pulse, 11ms duration, 3 times per face Non-Operating/Unpacked 50G, half sine shock pulse, 11ms duration, 3 times per face Transportation/Packaged Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces Vibration Operating Random 5Hz to 2KHz, 12.07 grms, (random) 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to .01g2/Hz(3dB/oct) 100Hz - 1000Hz: 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6dB/oct) Non-Operating/Storage Random 5Hz to 2KHz, 12.07 grms, 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to 0.1g2/Hz (3dB/oct) 100Hz to 1000Hz 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6db/oct) 5 - 500Hz swept sine, 2.5 (0-p), 25.4mm(p-p) MAX displacement, 5 min dwell at 3 resonances in each of 3 axes Humidity Operating 5% to 95% non-condensing. 95% RH@30C, linear derating to -25°C to +70°C Non-Operating/Storage 5% to 95% non-condensing Altitude Operating To 15,000ft (4570m) Up to 2300m (7500 ft), -25°C to +70°C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) Non-Operating/Storage To 40,000ft (12000m) REGULATORY Safety UL60950-1, EN60950-1, IEC60950-1 Shall meet RoHS at time of production EMC EN55024, EN55022, and FCC Part 15, Subpart B, Class B WARRANTY Standard Two years, parts only Ordering Information Module Order Codes: CEGSXTT2-SP9-0: Type2, -25C to +70C, 2.26GHz Core™ 2 Duo SP9300 SV, Computer CEGSXTT3-SP9-0: Type3, -25C to +70C, 2.26GHz Core™ 2 Duo SP9300 SV, Computer CEGSXTT2-SL9-0: Type2, -25C to +70C, 1.86GHz Core™ 2 Duo SL9400 LV, Computer CEGSXTT2-SU9-0: Type2, -25C to +70C, 1.2GHz Core™ 2 Duo SU9300 ULV, Computer CEGSXTT2-722-0: Type2, -25C to +70C, 1.2GHz Celeron® 722 ULV, Computer Supporting Products: CR202-PCIE16: Type 2, ATX development carrier, PCI Express x16 CR203-VGA: Type 3, ATX development carrier, VGA CEGSXT-AHS: CEGSXT active heatsink assembly © 2010 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Procelerant CEGSXT DATA SHEET | © 2010 RadiSys Corporation * All other trademarks are the properties of their respective owners.