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                    Part Number
                    Description
                    Manufacturer
                    Price & Lead Time
                
                    
                        H-2303-03-9017-05-A
                        Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260
                        EMULATION TECHNOLOGY
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                        H-2503-01-9031-05-A
                        Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260
                        EMULATION TECHNOLOGY
                        Request Quote
                    
                    
                        H-2703-05-9000-05-A
                        Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260
                        EMULATION TECHNOLOGY
                        Request Quote
                    
                    
                    
                        H-3503-07-9038-05-A
                        Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260
                        EMULATION TECHNOLOGY
                        Request Quote
                    
                    
                        H-3753-07-9015-05-A
                        Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260
                        EMULATION TECHNOLOGY
                        Request Quote
                    
                    
                        H-4003-07-9040-05-A
                        Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260
                        EMULATION TECHNOLOGY
                        Request Quote
                    
                    
                        H-4253-09-9020-05-A
                        Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260
                        EMULATION TECHNOLOGY
                        Request Quote
                    
                    
                        H-4503-07-9016-05-A
                        Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260
                        EMULATION TECHNOLOGY
                        Request Quote
                    
                    
            
                
                
                
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