Not Recommended For New Designs bq3287/bq3287A ( ) Real-Time Clock RTC Module � Calendar in day of the week, day bq3287A version is identical to the Features of the month, months, and years bq3287, with the addition of the RAM � Direct clock/calendar replace- with automatic leap-year adjust- clear input. ® ment for IBM AT-compatible ment The bq3287 is a fully compatible computers and other applications � Programmable square wave out- real-time clock for IBM AT- � Functionally compatible with the put compatible computers and other ap- DS1287/DS1287A and MC146818A plications. The bq3287 write- � Three individually maskable in- protects the clock, calendar, and � 114 bytes of general nonvolatile terrupt event flags: storage registers during power fail- storage ure. The integral backup energy - Periodic rates from 122 μsto source then maintains data and op- � Integral lithium cell and crystal 500 ms erates the clock and calendar. � 160 ns cycle time allows fast bus As shipped from Benchmarq, the operation - Time-of-day alarm once per real time clock is turned off to maxi- second to once per day � Selectable Intel or Motorola bus mize battery capacity for in-system timing operation. - End-of-clock update cycle � 14 bytes for clock/calendar and The bq3287 is functionally equiva- � Better than one minute per control lent to the bq3285, except that the month clock accuracy battery (16, 20) and crystal (2, 3) � BCD or binary format for clock pins are not accessible. These pins and calendar data General Description are connected internally to a coin cell and quartz crystal. The coin cell � Time of day in seconds, minutes, The CMOS bq3287/bq3287A is a is sized to provide 10 years of data and hours low-power microprocessor periph- retention and clock operation in the eral providing a time-of-day clock absence of power. For a complete de- and 100-year calendar with alarm - 12- or 24-hour format scription of features, operating con- features and battery operation. ditions, electrical characteristics, Other features include three - Optional daylight saving bus timing, and pin descriptions, see maskable interrupt sources, square- adjustment the bq3285 data sheet. wave output, and 114 bytes of gen- eral nonvolatile storage. The Pin Connections Pin Names AD –AD Multiplexed address/data 0 7 RST Reset input input/output MOT 24 1 V CC SQW Square wave output MOT Bus type select input NC 2 23 SQW NC 3 22 NC NC No connect CS Chip select input AD 4 21 NC/RCL 0 AD 5 20 NC 1 RCL RAM clear input AS Address strobe input AD 6 19 INT 2 (bq3287A only) AD 18 7 RST 3 DS Data strobe input AD 8 17 DS 4 V +5V supply CC AD 9 16 NC 5 R/W Read/write input AD 10 15 R/W 6 V Ground SS AD 11 14 AS 7 INT Interrupt request output V 12 13 CS SS 24-Pin DIP Module PN328701.eps Sept. 1996 D 1 Not Recommended For New Designs bq3287/bq3287A Absolute Maximum Ratings Symbol Parameter Value Unit Conditions V DC voltage applied on V relative to V -0.3 to 7.0 V CC CC SS DC voltage applied on any pin excluding V CC V VV≤V + 0.3 T -0.3 to 7.0 T CC relative to V SS 0 to +70 °C Commercial T Operating temperature OPR -20 to +70 °C Extended “I” -40 to +70 °C Commercial T Storage temperature STG -40 to +70 °C Extended “I” -10 to +70 °C Commercial T Temperature under bias BIAS -20 to +70 °C Extended “I” T Soldering temperature 260 °C For 10 seconds SOLDER Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional opera- tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Expo- sure to conditions beyond the operational limits for extended periods of time may affect device reliability. Recommended DC Operating Conditions (T =T ) A OPR Symbol Parameter Minimum Typical Maximum Unit V Supply voltage 4.5 5.0 5.5 V CC V Supply voltage 0 0 0 V SS V Input low voltage -0.3 - 0.8 V IL V Input high voltage 2.2 - V + 0.3 V IH CC Note: Typical values indicate operation at T = 25°C. A DC Electrical Characteristics (T =T ,V =5V ± 10%) A OPR CC Symbol Parameter Minimum Typical Maximum Unit Conditions/Notes I Input leakage current - - ± 1 μAV =V to V LI IN SS CC AD –AD , INT and SQW 0 7 I Output leakage current - - ± 1 μA LO in high impedance V Output high voltage 2.4 - - V I = -1.0 mA OH OH V Output low voltage - - 0.4 V I = 4.0 mA OL OL Min. cycle, duty = 100%, I Operating supply current - 7 15 mA CC IOH = 0mA, IOL = 0mA V Supply switch-over voltage - 3.0 - V SO V Power-fail-detect voltage 4.0 4.17 4.35 V PFD Internal 30K pull-up I Input current when RCL=V - - 185 μA RCL SS (bq3287A only) I Input current when MOT = - - -185 μA Internal 30K pull-down MOTH V CC Note: Typical values indicate operation at T = 25°C, V =5V. A CC Sept. 1996 D 2 Not Recommended For New Designs bq3287/bq3287A Power-Down/Power-Up Timing (T =T A OPR) Symbol Parameter Minimum Typical Maximum Unit Conditions t V slew from 4.5V to 0V 300 - - μs F CC t V slew from 0V to 4.5V 100 - - μs R CC Internal write-protection t CS at V after power-up 20 - 200 ms period after V passes V CSR IH CC PFD on power-up. Data-retention and time- t 10 - - years T = 25°C. DR A keeping time Note: Clock accuracy is better than ± 1 minute per month at 25°C for the period of t . DR Caution: Negative undershoots below the absolute maximum rating of -0.3V in battery-backup mode may affect data integrity. Power-Down/Power-Up Timing Sept. 1996 D 3 Not Recommended For New Designs bq3287/bq3287A 24-Pin MT (T-type module) 24-Pin MT (T-type module) Dimension Minimum Maximum A 0.360 0.375 A1 0.015 - B 0.015 0.022 C 0.008 0.013 D 1.320 1.335 E 0.685 0.700 e 0.590 0.620 G 0.090 0.110 L 0.120 0.130 S 0.100 0.120 All dimensions are in inches. Sept. 1996 D 4 Not Recommended For New Designs bq3287/bq3287A Data Sheet Revision History Change No. Page No. Description Nature of Change 1 1 Address strobe input Clarification Was 4.1 min, 4.25 max; 1 2 Power-fail detect voltage V PFD is 4.0 min, 4.35 max Was : “As shipped from Benchmarq, the backup cell is electrically isolated from the memory. ” 21 Clarification Is: “As shipped from Benchmarq, the backup cell is electrically isolated from the active circuitry. ” Changed temperature from N (industrial, -40 to 22,4 Specification change +85°C) to I (extended, -20 to +70°C) I max. was 275; is now 185. Pull-up = 30K RCL 32 Changed values I max. was -275; is now -185. Pull-down = 30K MOTH Notes: Change 1 = Nov. 1992 B changes from June 1991 A. Change 2 = Nov. 1995 C changes from Nov. 1992 B. Change 3 = Sept. 1996 D changes from Nov. 1995 C. Ordering Information bq3287 MT - Temperature: blank = Commercial (0 to +70°C) I = Extended* (-20 to +70°C) Package Option: MT = T-type module RAM Clear Option: A = RAM clear on pin 21 no mark = No connect on pin 21 Device: bq3287 Real-Time Clock Module *Contact factory for availability. Sept. 1996 D 5 PACKAGE OPTION ADDENDUM www.ti.com 24-Feb-2011 PACKAGING INFORMATION (1) (2) (3) Orderable Device Package Type Package Pins Package Qty Lead/ Samples Status Eco Plan MSL Peak Temp Drawing Ball Finish (Requires Login) BQ3287AMT-I NRND DIP MODULE MT 24 15 Pb-Free (RoHS) Call TI N / A for Pkg Type BQ3287AMT-SB2 NRND DIP MODULE MT 24 15 Pb-Free (RoHS) Call TI N / A for Pkg Type BQ3287MT-I ACTIVE DIP MODULE MT 24 15 Pb-Free (RoHS) Call TI N / A for Pkg Type BQ3287MT-SB2 ACTIVE DIP MODULE MT 24 15 Pb-Free (RoHS) Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDI064 – MAY 2001 MT (R-PDIP-T**) PLASTIC DUAL-IN-LINE 28 PINS SHOWN Inches Millimeters Dimension Min. Max. Min. Max. 0.360 0.390 A 9.14 9.91 A1 0.015 – 0.38 – 0.015 0.022 B 0.38 0.56 0.008 C 0.013 0.20 0.33 D/24 PIN 1.320 1.335 33.53 33.91 D/28 PIN 1.520 1.535 38.61 38.99 0.740 18.03 E 0.710 18.80 D e 0.590 0.630 14.99 16.00 G 0.110 2.29 2.79 0.090 L 0.110 3.30 0.130 2.79 S 0.100 0.120 3.05 2.54 E A1 A C B L S G e 4201978/A 03/01 NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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