2322 661 97... Vishay BCcomponents Horizontal Surface Mount PTC Thermistors For Overload Protection FEATURES • Ideal for pick-and-place circuit assembly • Low mounting height • Suitable for reflow soldering • Small ceramic diameter for faster response • Low heat transfer to substrate • Flat terminations for stable positioning and good solderability. APPLICATIONS • Telecom – Central office switching (C.O.) QUICK REFERENCE DATA – Subscriber terminal equipment (T.E.) – Set top box VALUE DESCRIPTION – Modems STANDARD TELECOM (1)(2) (1)(2) TYPES TYPES – Cable TV communications Nominal R25 2 to 500 10 to 70 • General industry and automotive Resistance tolerance ±10%; ±15%; ±20% – Low power supplies overload protection Maximum overload current 2 to 10 A (voltage dependent) – Data bus protection. Non-trip current 50 to 500 mA 50 to 100 mA DESCRIPTION at 25 °C at 70 °C The component consists of a high-performance PTC Maximum voltage 16 to 400 V 220 to 600 V ceramic disc mounted in a lead-frame for direct soldering (RMS) ( RMS) onto a printed-circuit board (PCB) or substrate. Response time at 25 °C and <1 s 20 W overload power The ceramic is soldered to the leadframe by a local reflow Matching − down to 0.5 Ω process, during which the solder layer is melted to the Maximum continuous power at 2 W metallized ceramic surface using a low residue flux. Notes MARKING 1. Customized products are available on request. • All SMD PTCs are marked with the last 3-digits of the type 2. Coated and/or reinforced types are available on request. number (XXX) and a date code (YYWW). ELECTRICAL DATA AND ORDERING INFORMATION RESISTANCE I at I at V MAX. CATALOG nt t MATCHING I at max MAX. TRIP-TIME NUMBER R TOL 25 °C 70 °C 25 °C 25 Ω V (A) max (V) at 1 A (s) 2322 661 ..... (Ω) (%) (mA) (mA) (mA) Telecommunication types (1) 10 20 no 245 165 100 270 3.0 2.0 97012 (1) 10 20 0.5 245 165 100 270 3.0 2.0 97016 40 25 no 265 80 50 130 0.8 2.0 97002 (1) 25 20 1 265 120 70 220 1.3 2.0 97005 (1) 15 to 20 − no 300 150 100 250 1.5 1.5 97004 (1) 15 to 20 − 0.5 300 150 100 250 1.5 2.0 97003 (1) 20 20 0.5 300 120 70 250 1.4 1.5 97018 (1) 35 +15/−20 1 425 110 70 175 1.0 0.7 97009 50 20 1 425 90 60 150 0.8 0.7 97019 General industrial types (1) 3.3 25 − 24 400 − 650 6.0 8.0 97013 (1) 9.4 25 − 60 150 100 300 1.8 3.0 97011 Note 1. These types pass ITU-K20-21-45 edition 2003 telecommunication protection recommendation. Document Number: 29068 For technical questions contact: nlr.europe@vishay.com www.vishay.com Revision: 07-Sep-04 1 2322 661 97... Horizontal Surface Mount PTC Thermistors Vishay BCcomponents For Overload Protection PTC OUTLINES DIMENSIONS OF SOLDER LANDS in millimeters PTC SMD ceramic size: 6.5 mm. 0 7.2 8.0 2 −0.2 2 3.45 ±0.15 5 0.2 1 10°  max. +0.6 0.6 0 7.6 ±0.25 3.6 ±0.1 1.2 10 ±0.25 11 2.8 4 ±0.2 4 ±0.1 DIMENSIONS in millimeters MATERIAL INFORMATION 2 3 REF. DESCRIPTION MATERIAL AND REMARKS 1 1 ceramic BaTiO3 doped NiCr Ag layer 2 metallization (vacuum deposition) Ni plated phosphor bronze material 3 leadframe 3 2 covered by PbSn8 solder layer SOLDERING CONDITIONS This SMD thermistor is only suitable for reflow soldering, in accordance with “CECC 00802”. Soldering processes which can be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 °C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. Typical examples of a soldering processes that will provide reliable joints without damage, are shown below. Reflow soldering. Vapour phase soldering. 300 300 10 s T T ( C) ( C) 260 C 245 C 250 20 to 40 s 250 10 s 215 C 215 C 200 200 40 s 180 C 180 C 150 150 130 C forced 130 C cooling external preheating 100 100 C 100 2 K/s internal preheating, 50 e.g. by infrared, 50 max. 2 K/s 0 0 50 100 150 200 250 0 t (s) 0 50 100 150 200 250 t (s) Typical values (solid line). Typical values (solid line). Process limits (dotted lines). Process limits (dotted lines). HANDLING PRECAUTIONS The special leadframe construction and the applied processes do not allow high handling forces on the component. Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence component behaviour at high temperatures. Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to 10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered product. For those applications where higher handling forces can be present, a re-inforced version is available on request. www.vishay.com For technical questions contact: nlr.europe@vishay.com Document Number: 29068 2 Revision: 07-Sep-04