ANALOG DEVICES AD9957
Description
Analog Devices AD9957 1 GSPS Quadrature Digital Up-converter with 18-Bit IQ Data Path 14-Bit Digital-to-Analog Converter
Part Number
AD9957
Price
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Manufacturer
ANALOG DEVICES
Lead Time
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Category
PRODUCTS - A
Specifications
Compliance Range (V)
0.5V
FS Iout (mA nom)
20mA
I/O Interface
Serial
Master fclk
1000MHz
REFCLK Multiplier
Yes
Resolution (Bits)
14bit
Tuning Word Width (bits)
32bit
Features
- 1 GSPS internal clock speed (up to 400 MHz analog output)
- 1.8 V and 3.3 V power supplies
- 100-lead TQFP_EP package
- 250 MSPS input data rate
- 8 programmable profiles for shift keying
- Easy interface to Blackfin SPORT
- Excellent dynamic performance >80 dB narrow-band SFDR
- Gain control DAC
- Integrated 1 GSPS 14-bit DAC
- Integrated RAM
- Internal divider allows references up to 2 GHz
- Internal oscillator for a single crystal operation
- Interpolation DAC mode
- Interpolation factors from 4× to 252×
- Multichip synchronization
- Phase modulation capability
- Phase noise = -125 dBc/Hz (400 MHz carrier @ 1 kHz offset)
- Reference clock multiplier
- Sin(x)/(x) correction (inverse sinc filter)
- Software and hardware controlled power-down
Datasheet
Extracted Text
1 GSPS Quadrature Digital Upconverter
with 18-Bit I/Q Data Path and 14-Bit DAC
Data Sheet
AD9957
FEATURES GENERAL DESCRIPTION
1 GSPS internal clock speed (up to 400 MHz analog output)
The AD9957 functions as a universal I/Q modulator and agile
Integrated 1 GSPS 14-bit DAC
upconverter for communications systems where cost, size, power
250 MSPS input data rate
consumption, and dynamic performance are critical. The AD9957
Phase noise ≤ −125 dBc/Hz (400 MHz carrier @ 1 kHz offset)
integrates a high speed, direct digital synthesizer (DDS), a high
Excellent dynamic performance >80 dB narrow-band SFDR
performance, high speed, 14-bit digital-to-analog converter (DAC),
8 programmable profiles for shift keying
clock multiplier circuitry, digital filters, and other DSP functions
Sin(x)/(x) correction (inverse sinc filter)
onto a single chip. It provides baseband upconversion for data
Reference clock multiplier
transmission in a wired or wireless communications system.
Internal oscillator for a single crystal operation
Software and hardware controlled power-down The AD9957 is the third offering in a family of quadrature
Integrated RAM
digital upconverters (QDUCs) that includes the AD9857 and
Phase modulation capability
AD9856. It offers performance gains in operating speed, power
Multichip synchronization
consumption, and spectral performance. Unlike its predecessors,
Easy interface to Blackfin SPORT
it supports a 16-bit serial input mode for I/Q baseband data.
Interpolation factors from 4× to 252×
The device can alternatively be programmed to operate either as
Interpolation DAC mode
a single tone, sinusoidal source or as an interpolating DAC.
Gain control DAC
The reference clock input circuitry includes a crystal oscillator,
Internal divider allows references up to 2 GHz
a high speed, divide-by-two input, and a low noise PLL for
1.8 V and 3.3 V power supplies
multiplication of the reference clock frequency.
100-lead TQFP_EP package
The user interface to the control functions includes a serial port
APPLICATIONS
easily configured to interface to the SPORT of the Blackfin®
HFC data, telephony, and video modems
DSP and profile pins to enable fast and easy shift keying of any
Wireless base station transmissions
signal parameter (phase, frequency, or amplitude).
Broadband communications transmissions
Internet telephony
FUNCTIONAL BLOCK DIAGRAM
I
DATA
FORMAT AND
FOR
14-BIT DAC
I/Q DATA
INTERPOLATE
XMIT
Q
NCO
AD9957
TIMING
AND
REFERENCE CLOCK
CONTROL
INPUT CIRCUITRY
USER INTERFACE
REFERENCE CLOCK INPUT
Figure 1.
Rev. C
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06384-001
AD9957 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1 RAM Control .................................................................................. 27
Applications ....................................................................................... 1 RAM Overview ........................................................................... 27
General Description ......................................................................... 1 RAM Segment Registers ............................................................ 27
Functional Block Diagram .............................................................. 1 RAM State Machine ................................................................... 27
Revision History ............................................................................... 4 RAM Trigger (RT) Pin ............................................................... 27
Specifications ..................................................................................... 5 Load/Retrieve RAM Operation ................................................ 28
Electrical Specifications ............................................................... 5 RAM Playback Operation ......................................................... 28
Absolute Maximum Ratings ............................................................ 8 Overview of RAM Playback Modes ......................................... 29
ESD Caution .................................................................................. 8 RAM Ramp-Up Mode ........................................................... 29
Pin Configuration and Function Descriptions ............................. 9 RAM Bidirectional Ramp Mode .......................................... 30
Typical Performance Characteristics ........................................... 12 RAM Continuous Bidirectional Ramp Mode .................... 32
Modes of Operation ....................................................................... 16 RAM Continuous Recirculate Mode ................................... 33
Overview ...................................................................................... 16 Clock Input (REF_CLK) ................................................................ 34
Quadrature Modulation Mode ................................................. 17 REFCLK Overview ..................................................................... 34
BlackFin Interface (BFI) Mode ................................................. 18 Crystal Driven REF_CLK ......................................................... 34
Interpolating DAC Mode .......................................................... 19 Direct Driven REF_CLK ........................................................... 34
Single Tone Mode ....................................................................... 20 Phase-Locked Loop (PLL) Multiplier ...................................... 35
Signal Processing ............................................................................ 21 PLL Charge Pump ...................................................................... 36
Parallel Data Clock (PDCLK) ................................................... 21 External PLL Loop Filter Components ................................... 36
Transmit Enable Pin (TxEnable) .............................................. 21 PLL Lock Indication .................................................................. 36
Input Data Assembler ................................................................ 22 Additional Features ........................................................................ 37
Inverse CCI Filter ....................................................................... 23 Output Shift Keying (OSK) ....................................................... 37
Fixed Interpolator (4×) .............................................................. 23 Manual OSK ............................................................................ 37
Programmable Interpolating Filter .......................................... 24 Automatic OSK ....................................................................... 37
QDUC Mode ........................................................................... 24 Profiles ......................................................................................... 38
BFI Mode ................................................................................. 24 I/O_UPDATE Pin ...................................................................... 38
Quadrature Modulator .............................................................. 25 Automatic I/O Update ............................................................... 38
DDS Core ..................................................................................... 25 Power-Down Control ................................................................ 39
Inverse Sinc Filter ....................................................................... 25 General-Purpose I/O (GPIO) Port .......................................... 39
Output Scale Factor (OSF) ........................................................ 26 Synchronization of Multiple Devices ........................................... 40
14-Bit DAC .................................................................................. 26 Overview ..................................................................................... 40
Auxiliary DAC ........................................................................ 26 Clock Generator ......................................................................... 40
Rev. C | Page 2 of 64
Data Sheet AD9957
Sync Generator ............................................................................ 40 I/O_RESET—Input/Output Reset ........................................ 48
Sync Receiver ............................................................................... 41 I/O_UPDATE—Input/Output Update ................................ 48
Setup/Hold Validation ................................................................ 42 Serial I/O Timing Diagrams ...................................................... 48
Synchronization Example .......................................................... 44 MSB/LSB Transfers ..................................................................... 48
I/Q Path Latency ......................................................................... 45 I/O_UPDATE, SYNC_CLK, and System Clock
Relationships ................................................................................ 49
Example ....................................................................................45
Register Map and Bit Descriptions ............................................... 50
Power Supply Partitioning ............................................................. 46
Register Map ................................................................................ 50
3.3 V Supplies .............................................................................. 46
Register Bit Descriptions............................................................ 55
DVDD_I/O (Pin 11, Pin 15, Pin 21, Pin 28, Pin 45, Pin 56,
Pin 66) ......................................................................................46 Control Function Register 1 (CFR1) .................................... 55
AVDD (Pin 74 to Pin 77 and Pin 83) ................................... 46 Control Function Register 2 (CFR2) .................................... 56
1.8 V Supplies .............................................................................. 46 Control Function Register 3 (CFR3) .................................... 58
DVDD (Pin 17, Pin 23, Pin 30, Pin 47, Pin 57, Pin 64) ..... 46 Auxiliary DAC Control Register ........................................... 58
AVDD (Pin 3) .......................................................................... 46 I/O Update Rate Register ....................................................... 58
AVDD (Pin 6) .......................................................................... 46 RAM Segment Register 0 ....................................................... 58
AVDD (Pin 89 and Pin 92) .................................................... 46 RAM Segment Register 1 ....................................................... 59
Serial Programming ........................................................................ 47 Amplitude Scale Factor (ASF) Register ............................... 59
Control Interface—Serial I/O .................................................... 47 Multichip Sync Register ......................................................... 59
General Serial I/O Operation .................................................... 47 Profile Registers ........................................................................... 60
Instruction Byte ........................................................................... 47 Profile<7:0> Register—Single Tone ...................................... 60
Instruction Byte Information Bit Map ................................. 47 Profile<7:0> Register—QDUC ............................................. 60
Serial I/O Port Pin Descriptions ............................................... 47 RAM Register .......................................................................... 60
SCLK—Serial Clock................................................................ 47 GPIO Configuration Register ............................................... 60
CS GPIO Data Register ................................................................ 60
—Chip Select Bar ............................................................... 47
Outline Dimensions ........................................................................ 61
SDIO—Serial Data Input/Output ......................................... 47
Ordering Guide ........................................................................... 61
SDO—Serial Data Out ........................................................... 48
Rev. C | Page 3 of 64
AD9957 Data Sheet
REVISION HISTORY
4/12—Rev. B to Rev. C 1/08—Rev. 0 to Rev. A
Changes to Table 1 ............................................................................ 7 Changes to REFCLK Multiplier Specification ............................... 3
Changes to Table 3 .......................................................................... 11 Changes to I/O_Update/Profile<2:0>/RT Timing
Change to Sync Generator Section ............................................... 41 Characteristics and I/Q Input Timing Characteristics ................. 5
Changes to Sync Receiver Section and Setup/Hold Validation Replaced Pin Configuration and Function Descriptions
Section .............................................................................................. 42 Section .................................................................................................8
Changes to Figure 25 Through Figure 29.................................... 15
Changes to Table 13 ........................................................................ 50
Changes to Table 19 ........................................................................ 57 Deleted Table 4, Renumbered Sequentially ................................ 20
Changes to Table 26 ........................................................................ 59 Changes to DDS Core Section ...................................................... 24
Changes to Figure 47 and Table 6................................................. 33
10/10—Rev. A to Rev. B Replaced Synchronization of Multiple Devices Section ............ 39
Changes to Data Rate in Features Section ..................................... 1 Added I/Q Path Latency Section .................................................. 44
Changes to Specifications Section .................................................. 6 Added Power Supply Partitioning Section .................................. 45
Added EPAD Notation to Figure 4 and Table 3 ........................... 9 Changes to General Serial I/O Operation Section ..................... 46
Changes to Table 13 ....................................................................... 48
Changes to XTAL_SEL Pin Description ...................................... 11
Changes to BlackFin Interface (BFI) Mode Section .................. 18 Changes to Table 14 ....................................................................... 49
Changes to Figure 30 and Figure 31 ............................................. 22 Changes to Table 19 ....................................................................... 54
Changes to Programmable Interpolating Filter Section ............ 24 Changes to Table 20 ....................................................................... 56
Changes to Fifth Paragraph of Quadrature Modulator Section...... 25 Changes to GPIO Configuration Register and
Changes to RAM Segment Registers Section ............................. 27 GPIO Data Register Sections ........................................................ 58
Changes to RAM Playback Operation Section ........................... 28
Changes to Control Interface—Serial I/O Section ..................... 47 5/07—Revision 0: Initial Version
Added to I/O_UPDATE, SYNC_CLK, and System Clock
Relationships Section and Figure 64 ............................................ 49
Changes to Default Values of Profile 0 Register—Single Tone
(0x0E) and Profile 0 Register—QDUC (0x0E) in Table 14 ....... 51
Changes to Default Values in Table 15 ......................................... 52
Changes to Default Values in Table 16 ......................................... 53
Changes to Default Values in Table 17 ......................................... 54
Updated Outline Dimensions ....................................................... 61
Rev. C | Page 4 of 64
Data Sheet AD9957
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
AVDD (1.8V) and DVDD (1.8V) = 1.8 V ± 5%, AVDD (3.3V) = 3.3 V ± 5%, DVDD_I/O (3.3V) = 3.3 V ± 5%, T = 25°C, R = 10 kΩ,
SET
I = 20 mA, external reference clock frequency = 1000 MHz with REFCLK multiplier disabled, unless otherwise noted.
OUT
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
REF_CLK INPUT CHARACTERISTICS
Frequency Range
1
REFCLK Multiplier Disabled 60 1000 MHz
Enabled 3.2 60 MHz
Maximum REFCLK Input Divider Frequency Full temperature range 1500 1900 MHz
Minimum REFCLK Input Divider Frequency Full temperature range 25 35 MHz
External Crystal 25 MHz
Input Capacitance 3 pF
Input Impedance (Differential) 2.8 kΩ
Input Impedance (Single-Ended) 1.4 kΩ
Duty Cycle REFCLK multiplier disabled 45 55 %
REFCLK multiplier enabled 40 60 %
REF_CLK Input Level Single-ended 50 1000 mV p-p
Differential 100 2000 mV p-p
REFCLK MULTIPLIER VCO GAIN CHARACTERISTICS
VCO Gain (K ) @ Center Frequency VCO0 range setting 429 MHz/V
V
VCO1 range setting 500 MHz/V
VCO2 range setting 555 MHz/V
VCO3 range setting 750 MHz/V
VCO4 range setting 789 MHz/V
2
VCO5 range setting 850 MHz/V
REFCLK_OUT CHARACTERISTICS
Maximum Capacitive Load 20 pF
Maximum Frequency 25 MHz
DAC OUTPUT CHARACTERISTICS
Full-Scale Output Current 8.6 20 31.6 mA
Gain Error −10 +10 %FS
Output Offset 2.3 µA
Differential Nonlinearity 0.8 LSB
Integral Nonlinearity 1.5 LSB
Output Capacitance 5 pF
Residual Phase Noise @ 1 kHz Offset, 20 MHz A
OUT
REFCLK Multiplier Disabled −152 dBc/Hz
Enabled @ 20× −140 dBc/Hz
Enabled @ 100× −140 dBc/Hz
AC Voltage Compliance Range −0.5 +0.5 V
SPURIOUS-FREE DYNAMIC RANGE (SFDR SINGLE TONE)
fOUT = 20.1 MHz −70 dBc
fOUT = 98.6 MHz −69 dBc
fOUT = 201.1 MHz −61 dBc
f = 397.8 MHz −54 dBc
OUT
Rev. C | Page 5 of 64
AD9957 Data Sheet
Parameter Test Conditions/Comments Min Typ Max Unit
NOISE SPECTRAL DENSITY (NSD)
Single Tone
fOUT = 20.1 MHz −167 dBm/Hz
f = 98.6 MHz −162 dBm/Hz
OUT
f = 201.1 MHz −157 dBm/Hz
OUT
f = 397.8 MHz −151 dBm/Hz
OUT
TWO-TONE INTERMODULATION DISTORTION (IMD) I/Q rate = 62.5 MSPS; 16× interpolation
f = 25 MHz −82 dBc
OUT
fOUT = 50 MHz −78 dBc
fOUT = 100 MHz −73 dBc
MODULATOR CHARACTERISTICS
Input Data
Error Vector Magnitude 2.5 Msymbols/s, QPSK, 4× oversampled 0.53 %
270.8333 ksymbols/s, GMSK, 32× 0.77 %
oversampled
2.5 Msymbols/s, 256-QAM, 4× 0.35 %
oversampled
WCDMA—FDD (TM1), 3.84 MHz Bandwidth,
5 MHz Channel Spacing
Adjacent Channel Leakage Ratio (ACLR) IF = 143.88 MHz −78 dBc
Carrier Feedthrough −78 dBc
SERIAL PORT TIMING CHARACTERISTICS
Maximum SCLK Frequency 70 Mbps
Minimum SCLK Pulse Width Low 4 ns
High 4 ns
Maximum SCLK Rise/Fall Time 2 ns
Minimum Data Setup Time to SCLK 5 ns
Minimum Data Hold Time to SCLK 0 ns
Maximum Data Valid Time in Read Mode 11 ns
I/O_UPDATE/PROFILE<2:0>/RT TIMING CHARACTERISTICS
Minimum Pulse Width High 1 SYNC_CLK
cycle
Minimum Setup Time to SYNC_CLK 1.75 ns
Minimum Hold Time to SYNC_CLK 0 ns
I/Q INPUT TIMING CHARACTERISTICS
Maximum PDCLK Frequency 250 MHz
Minimum I/Q Data Setup Time to PDCLK 1.75 ns
Minimum I/Q Data Hold Time to PDCLK 0 ns
Minimum TxEnable Setup Time to PDCLK 1.75 ns
Minimum TxEnable Hold Time to PDCLK 0 ns
MISCELLANEOUS TIMING CHARACTERISTICS
3
Wake-Up Time 1
4
Fast Recovery Mode 8 SYSCLK cycles
Full Sleep Mode 150 μs
4
Minimum Reset Pulse Width High 5 SYSCLK cycles
DATA LATENCY (PIPELINE DELAY)
Data Latency Single Tone Mode
4
Frequency, Phase-to-DAC Output 79 SYSCLK cycles
Rev. C | Page 6 of 64
Data Sheet AD9957
Parameter Test Conditions/Comments Min Typ Max Unit
CMOS LOGIC INPUTS
Voltage
Logic 1 2.0 V
Logic 0 0.8 V
Current
Logic 1 90 150 µA
Logic 0 90 150 µA
Input Capacitance 2 pF
XTAL_SEL INPUT
Logic 1 Voltage 1.25 V
Logic 0 Voltage 0.6 V
Input Capacitance 2 pF
CMOS LOGIC OUTPUTS 1 mA load
Voltage
Logic 1 2.8 V
Logic 0 0.4 V
POWER SUPPLY CURRENT
DVDD_I/O (3.3V) Pin Current Consumption QDUC mode 16 mA
DVDD (1.8V) Pin Current Consumption QDUC mode 610 mA
AVDD (3.3V) Pin Current Consumption QDUC mode 28 mA
AVDD (1.8V) Pin Current Consumption QDUC mode 105 mA
POWER CONSUMPTION
Single Tone Mode 800 mW
Continuous Modulation 8× interpolation 1400 1800 mW
Inverse Sinc Filter Power Consumption 150 200 mW
Full Sleep Mode 12 40 mW
1
The system clock is limited to 750 MHz maximum in BFI mode.
2
The gain value for VCO range Setting 5 is measured at 1000 MHz.
3
Wake-up time refers to the recovery from analog power-down modes. The longest time required is for the Reference Clock Multiplier PLL to relock to the reference.
4
SYSCLK cycle refers to the actual clock frequency used on-chip by the DDS. If the reference clock multiplier is used to multiply the external reference clock frequency,
the SYSCLK frequency is the external frequency multiplied by the reference clock multiplication factor. If the reference clock multiplier and divider are not used, the
SYSCLK frequency is the same as the external reference clock frequency.
Rev. C | Page 7 of 64
AD9957 Data Sheet
ABSOLUTE MAXIMUM RATINGS
DIGITAL INPUTS
Table 2. DVDD_I/O
Parameter Rating
AVDD (1.8V), DVDD (1.8V) Supplies 2 V
AVDD (3.3V), DVDD_I/O (3.3V) Supplies 4 V
INPUT
Digital Input Voltage −0.7 V to +4 V
XTAL_SEL −0.7 V to +2.2 V
Digital Output Current 5 mA
Storage Temperature Range −65°C to +150°C
AVOID OVERDRIVING DIGITAL INPUTS.
Operating Temperature Range −40°C to +85°C FORWARD BIASING ESD DIODES MAY
COUPLE DIGITAL NOISE ONTO POWER
θ 22°C/W PINS.
JA
θ 2.8°C/W
JC
Figure 2. Equivalent Input Circuit
Maximum Junction Temperature 150°C
DAC OUTPUTS
Lead Temperature, Soldering (10 sec) 300°C
AVDD
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
IOUT IOUT
maximum rating conditions for extended periods may affect
device reliability.
MUST TERMINATE OUTPUTS TO AGND
FOR CURRENT FLOW. DO NOT EXCEED
THE OUTPUT VOLTAGE COMPLIANCE
RATING.
Figure 3. Equivalent Output Circuit
ESD CAUTION
Rev. C | Page 8 of 64
06384-055 06384-003
Data Sheet AD9957
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NC 1 75 AVDD (3.3V)
PIN 1
74
PLL_LOOP_FILTER 2 INDICATOR AVDD (3.3V)
AVDD (1.8V) 3 73
AGND
72
AGND 4 NC
AGND 71
5 I/O_RESET
AVDD (1.8V) 6 70 CS
69
SYNC_IN+ 7 SCLK
SYNC_IN– 8 68
SDO
SYNC_OUT+ 9 67 SDIO
SYNC_OUT– 66
10 DVDD_I/O (3.3V)
DVDD_I/O (3.3V) 11 65 DGND
AD9957
64
SYNC_SMP_ERR 12 DVDD (1.8V)
TQFP-100 (E_PAD)
DGND 13 63
DGND
TOP VIEW
MASTER_RESET (Not to Scale)
14 62 DGND
DVDD_I/O (3.3V) 61
15 NC
DGND 16 60 OSK
DVDD (1.8V) 59
17 I/O_UPDATE
EXT_PWR_DWN
18 58
DGND
PLL_LOCK 57
19 DVDD (1.8V)
CCI_OVFL 20 56 DVDD_I/O (3.3V)
55 SYNC_CLK
DVDD_I/O (3.3V) 21
DGND 22 54 PROFILE0
DVDD (1.8V) 23 53 PROFILE1
NC 52 PROFILE2
24
D17 25 51 RT
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD SHOULD BE SOLDERED TO GROUND.
Figure 4. Pin Configuration
Rev. C | Page 9 of 64
D16 26
100 NC
D15
27 99 NC
DVDD_I/O (3.3V) 28
98 NC
DGND
29
97 NC
DVDD (1.8V)
30 96 AGND
D14
31 95 XTAL_SEL
D13 32 94 REFCLK_OUT
D12
33 93 NC
D11
34 92 AVDD (1.8V)
D10
35 91 REF_CLK
D9 REF_CLK
36 90
D8
37 89 AVDD (1.8V)
D7 AGND
38 88
D6
39 87
NC
PDCLK
40 86 NC
TxENABLE/FS 41 85
AGND
D5/SPORT I-DATA
42 84 DAC_RSET
D4/SPORT Q-DATA 83 AVDD (3.3V)
43
D3 44 82 AGND
DVDD_I/O (3.3V)
45 81 IOUT
46
DGND 80 IOUT
DVDD (1.8V)
47 79 AGND
D2
48 78 AGND
D1 49 AVDD (3.3V)
77
D0
50 76 AVDD (3.3V)
06384-004
AD9957 Data Sheet
Table 3. Pin Function Descriptions
1
Pin No. Mnemonic I/O Description
1, 24, 61, 72, 86, NC Not Connected. Allow device pin to float.
87, 93, 97 to 100
2 PLL_LOOP_FILTER I PLL-Loop Filter Compensation. See External PLL Loop Filter Components section.
3, 6, 89, 92 AVDD (1.8V) I Analog Core VDD. 1.8 V analog supplies.
74 to 77, 83 AVDD (3.3V) I Analog DAC VDD. 3.3 V analog supplies.
17, 23, 30, 47, 57, DVDD (1.8V) I Digital Core VDD. 1.8 V digital supplies.
64
11, 15, 21, 28, 45, DVDD_I/O (3.3V) I Digital Input/Output VDD. 3.3 V digital supplies.
56, 66
4, 5, 73, 78, 79, AGND I Analog Ground.
82, 85, 88, 96
13, 16, 22, 29, 46, DGND I Digital Ground.
58, 62, 63, 65
7 SYNC_IN+ I Synchronization Signal, Digital Input (Rising Edge Active). Synchronization signal from
external master to synchronize internal subclocks. See the Synchronization of Multiple
Devices section.
8 SYNC_IN− I Synchronization Signal, Digital Input (Falling Edge Active). Synchronization signal from
external master to synchronize internal subclocks. See the Synchronization of Multiple
Devices section.
9 SYNC_OUT+ O Synchronization Signal, Digital Output (Rising Edge Active). Synchronization signal from
internal device subclocks to synchronize external slave devices. See the Synchronization of
Multiple Devices section.
10 SYNC_OUT− O Synchronization Signal, Digital Output (Falling Edge Active). Synchronization signal from
internal device subclocks to synchronize external slave devices. See the Synchronization of
Multiple Devices section.
12 SYNC_SMP_ERR O Synchronization Sample Error, Digital Output (Active High). A high on this pin indicates
that the AD9957 did not receive a valid sync signal on SYNC_IN+/SYNC_IN−. See the
Synchronization of Multiple Devices section.
14 MASTER_RESET I Master Reset, Digital Input (Active High). This pin clears all memory elements and sets
registers to default values.
18 EXT_PWR_DWN I External Power-Down, Digital Input (Active High). A high level on this pin initiates the
currently programmed power-down mode. See the Power-Down Control section for
further details. If unused, tie to ground.
19 PLL_LOCK O PLL Lock, Digital Output (Active High). A high on this pin indicates that the clock multiplier
PLL has acquired lock to the reference clock input.
20 CCI_OVFL O CCI Overflow Digital Output, Active High. A high on this pin indicates a CCI filter overflow.
This pin remains high until the CCI overflow condition is cleared.
25 to 27, 31 to D<17:0> I/O Parallel Data Input Bus (Active High). These pins provide the interleaved, 18-bit, digital, I
39, 42 to 44, 48 and Q vectors for the modulator to upconvert. Also used for a GPIO port in Blackfin
to 50 interface mode.
42 SPORT I-DATA I In Blackfin interface mode, this pin serves as the I-data serial input.
43 SPORT Q-DATA I In Blackfin interface mode, this pin serves as the Q-data serial input.
40 PDCLK O Parallel Data Clock, Digital Output (Clock). See the Signal Processing section for details.
41 TxENABLE/FS I Transmit Enable, Digital Input (Active High). See the Signal Processing section for details.
In Blackfin interface mode, this pin serves as the FS input to receive the RFS output signal
from the Blackfin.
51 RT I RAM Trigger, Digital Input (Active High). This pin provides control for the RAM amplitude
scaling function. When this function is engaged, a high sweeps the amplitude from the
beginning RAM address to the end. A low sweeps the amplitude from the end RAM
address to the beginning. If unused, connect to ground or supply.
52 to 54 PROFILE<2:0> I Profile Select Pins, Digital Inputs (Active High). These pins select one of eight
phase/frequency profiles for the DDS core (single tone or carrier tone). Changing the state
of one of these pins transfers the current contents of all I/O buffers to the corresponding
registers. State changes should be set up to the SYNC_CLK pin.
55 SYNC_CLK O Output System Clock/4, Digital Output (Clock). The I/O_UPDATE and PROFILE<2:0> pins
should be set up to the rising edge of this signal.
Rev. C | Page 10 of 64
Data Sheet AD9957
1
Pin No. Mnemonic I/O Description
59 I/O_UPDATE I/O Input/Output Update; Digital Input Or Output (Active High) Depending on the Internal I/O
Update Active Bit. A high on this pin indicates a transfer of the contents of the I/O buffers
to the corresponding internal registers.
60 OSK I Output Shift Keying, Digital Input (Active High). When using OSK (manual or automatic),
this pin controls the OSK function. See the Output Shift Keying (OSK) section of the data
sheet for details. When not using OSK, tie this pin high.
67 SDIO I/O Serial Data Input/Output, Digital Input/Output (Active High). This pin can be either
unidirectional or bidirectional (default), depending on configuration settings. In
bidirectional serial port mode, this pin acts as the serial data input and output. In
unidirectional, it is an input only.
68 SDO O Serial Data Output, Digital Output (Active High). This pin is only active in unidirectional
serial data mode. In this mode, it functions as the output. In bidirectional mode, this pin is
not operational and should be left floating.
69 SCLK I Serial Data Clock. Digital clock (rising edge on write, falling edge on read). This pin
provides the serial data clock for the control data path. Write operations to the AD9957
use the rising edge. Readback operations from the AD9957 use the falling edge.
70 I
CS Chip Select, Digital Input (Active Low). Bringing this pin low enables the AD9957 to detect
serial clock rising/falling edges. Bringing this pin high causes the AD9957 to ignore input
on the serial data pins.
71 I/O_RESET I Input/Output Reset, Digital Input (Active High). Rather than resetting the entire device
during a failed communication cycle, when brought high, this pin resets the state machine
of the serial port controller and clears any I/O buffers that have been written since the last
I/O update. When unused, tie this pin to ground to avoid accidental resets.
80 IOUT O Open-Source DAC Complementary Output Source. Analog output, current mode. Connect
through 50 Ω to AGND.
81 IOUT O Open-Source DAC Output Source. Analog output, current mode. Connect through 50 Ω to
AGND.
84 DAC_RSET O Analog Reference Pin. This pin programs the DAC output full-scale reference current.
Attach a 10 kΩ resistor to AGND.
90 REF_CLK I Reference Clock Input. Analog input. See the REFCLK Overview section for more details.
91 REF_CLK I Complementary Reference Clock Input. Analog input. See the REFCLK Overview section
for more details.
94 REFCLK_OUT O Reference Clock Output. Analog output. See the REFCLK Overview section for more
details.
95 XTAL_SEL I Crystal Select (1.8 V Logic). Analog input (active high). Driving the XTAL_SEL pin high enables
the internal oscillator to be used with a crystal resonator. If unused, connect it to AGND.
(EPAD) Exposed Pad The EPAD should be soldered to ground.
(EPAD)
1
I = input, O = output.
Rev. C | Page 11 of 64
AD9957 Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
1 1
0
0
–10 –10
–20
–20
–30
–30
–40
–40
–50 –50
–60
–60
1
–70
–70
1
–80
–80
–90 –90
–100
–100
CENTER 102MHz 5kHz/DIV SPAN 50kHz
START 0Hz 50MHz/DIV STOP 500MHz
Figure 5. 15.625 kHz Quadrature Tone, Carrier = 102 MHz, Figure 8. Narrow-Band View of Figure 5
CCI = 16, f = 1 GHz (with Carrier and Lower Sideband Suppression)
S
1 1
0
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
1
–70
–70
1
–80
–80
–90
–90
–100
–100
CENTER 222MHz 5kHz/DIV SPAN 50kHz
START 0MHz 50MHz/DIV STOP 500MHz
Figure 9. Narrow-Band View of Figure 6
Figure 6. 15.625 kHz Quadrature Tone, Carrier = 222 MHz,
(with Carrier And Lower Sideband Suppression)
CCI = 16, fS = 1 GHz
1
1
0 0
–10
–10
–20 –20
–30 –30
–40 –40
–50
–50
1
–60 –60
–70 –70
1
–80 –80
–90
–90
–100 –100
START 0Hz 50MHz/DIV STOP 500MHz CENTER 372MHz 5kHz/DIV SPAN 50kHz
Figure 7. 15.625 kHz Quadrature Tone, Carrier = 372 MHz, Figure 10. Narrow-Band View of Figure 7
CCI = 16, f = 1 GHz (with Carrier and Lower Sideband Suppression)
S
Rev. C | Page 12 of 64
06384-052 06384-050 06384-048
06384-049
06384-053 06384-051
Data Sheet AD9957
0
0
–10 –10
–20 –20
–30
–30
–40
–40
–50 –50
–60 –60
–70
–70
–80
–80
–90 –90
–100 –100
START 0Hz 50MHz/DIV STOP 500MHz
CENTER 102MHz 2MHz/DIV SPAN 20MHz
Figure 11. QPSK, 7.8125 Msymbols/s, 4x Oversampled Raised Cosine, Figure 14. Narrow-Band View of Figure 11
α = 0.25, CCI = 8, Carrier = 102 MHz, f = 1 GHz
S
0
0
–10
–10
–20
–20
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
–80
–80
–90
–90
–100
–100
CENTER 222MHz 2MHz/DIV SPAN 20MHz
START 0MHz 50MHz/DIV STOP 500MHz
Figure 12. QPSK, 7.8125 Msymbols/s, 4x Oversampled Raised Cosine, Figure 15. Narrow-Band View of Figure 12
α = 0.25, CCI = 8, Carrier = 222 MHz, f = 1 GHz
S
0
0
–10 –10
–20 –20
–30 –30
–40
–40
–50
–50
–60 –60
–70 –70
–80 –80
–90
–90
–100 –100
START 0Hz 50MHz/DIV STOP 500MHz CENTER 372MHz 2MHz/DIV SPAN 20MHz
Figure 13. QPSK, 7.8125 Msymbols/s, 4x Oversampled Raised Cosine,
Figure 16. Narrow-Band View of Figure 13
α = 0.25, CCI = 8, Carrier = 372 MHz, f = 1 GHz
S
Rev. C | Page 13 of 64
06384-046 06384-045 06384-044
06384-041
06384-043 06384-042
AD9957 Data Sheet
–50 –90
f = 397.8MHz
OUT
–100
–55
–110
SFDR WITHOUT PLL f = 201.1MHz
OUT
–120
f = 98.6MHz
OUT
–60
–130
SFDR WITH PLL
–65
–140
–150
–70
–160
f = 20.1MHz
OUT
–75 –170
0 50 100 150 200 250 300 350 400 10 100 1k 10k 100k 1M 10M 100M
FREQUENCY OUT (MHz) FREQUENCY OFFSET (Hz)
Figure 17. Wideband SFDR vs. Output Frequency in Single Tone Mode,
Figure 20. Residual Phase Noise, System Clock = 1 GHz
PLL with REFCLK = 15.625 MHz × 64
–90
–45
f = 397.8MHz
OUT
LOW SUPPLY
–100
–50
HIGH SUPPLY
f = 201.1MHz
–110 OUT
–55
–120
–60
–130
–65
–140
f = 20.1MHz
OUT
–70
–150
f = 98.6MHz
OUT
–160
–75
0 50 100 150 200 250 300 350 400 450 10 100 1k 10k 100k 1M 10M 100M
FREQUENCY OFFSET (Hz)
FREQUENCY OUT (MHz)
Figure 21. Residual Phase Noise Using the REFCLK Multiplier,
Figure 18. SFDR vs. Output Frequency and Supply (±5%) in Single Tone
REFCLK = 50 MHz with 20x Multiplication, System Clock = 1 GHz
Mode, REFCLK = 1 GHz
1200
–50
DVDD 1.8V
–40°C
1000
+85°C
–55
800
–60
600
–65
400
AVDD 1.8V
AVDD 3.3V
DVDD 3.3V
–70
200
0
–75
100 200 300 400 500 600 700 800 900 1000
0 50 100 150 200 250 300 350 400 450
SYSTEM CLOCK FREQUENCY (MHz)
FREQUENCY OUT (MHz)
Figure 22. Power Dissipation vs. System Clock (PLL Disabled)
Figure 19. SFDR vs. Frequency and Temperature in Single Tone Mode,
REFCLK = 1 GHz
Rev. C | Page 14 of 64
SFDR (dBc) SFDR (dBc) SFDR (dBc)
06384-060 06384-059 06384-058
POWER DISSIPATION (mW) MAGNITUDE (dBc/ Hz) MAGNITUDE (dBc/Hz)
06384-062 06384-054 06384-061
Data Sheet AD9957
1200
–20
–30
1000
DVDD 1.8V
–40
800 –50
–60
600
–70
–80
400
–90
AVDD 1.8V
AVDD 3.3V
DVDD 3.3V
200 –100
–110
0
CENTER 143.86MHz 2.55MHz/DIV SPAN 25.5MHz
400 500 600 700 800 900 1000
SYSTEM CLOCK FREQUENCY (MHz)
Tx CHANNEL W-CDMA SGFF FWD
BANDWIDTH: 3.84MHz POWER: –11.88dBm
Figure 23. Power Dissipation vs. System Clock (PLL Enabled)
ADJACENT CHANNEL
BANDWIDTH: 3.84MHz LOWER: –78.27dB
SPACING: 3MHz UPPER: –78.50dB
ADJACENT CHANNEL
BANDWIDTH: 3.84MHz LOWER: –81.42dB
SPACING: 10MHz UPPER: –81.87dB
Figure 24. Typical ACLR for Wideband CDMA
Rev. C | Page 15 of 64
POWER DISSIPATION (mW)
06384-063
06384-064
AD9957 Data Sheet
MODES OF OPERATION
than that of the DAC. An internal chain of rate interpolation
OVERVIEW
filters the user data and upsamples to the DAC sample rate.
The AD9957 has three basic operating modes.
Combined, the filters provide for programmable rate interpola-
tion while suppressing spectral images and retaining the original
• Quadrature modulation (QDUC) mode (default)
baseband spectrum.
• Interpolating DAC mode
• Single tone mode QDUC mode employs both the DDS and the rate interpolation
filters. In this case, two parallel banks of rate interpolation
The active mode is selected via the operating mode bits in
filters allow baseband processing of in-phase and quadrature
Control Function Register 1 (CFR1). Single tone mode allows
(I/Q) signals with the DDS providing the carrier signal to be
the device to operate as a sinusoidal generator with the DDS
modulated by the baseband signals. A detailed block diagram of
driving the DAC directly.
the AD9957 is shown in Figure 25.
Interpolating DAC mode bypasses the DDS, allowing the user
The inverse sinc filter is available in all three modes.
to deliver baseband data to the device at a sample rate lower
AD9957
18 I
16
8 AUX
DAC GAIN
DAC
DDS
IS
DAC_RSET
8-BIT
18
I/Q IN
θ
QS
cos (ωt+θ)
IOUT
DAC
ω
16 14-BIT
IOUT
sin (ωt+θ)
18
CLOCK
OUTPUT
Q
SCALE
FACTOR
REFCLK_OUT
OSK
÷2
SYSCLK
PDCLK
REF_CLK
PARALLEL DATA
INTERNAL CLOCK TIMING AND CONTROL
PLL
TIMING AND CONTROL
REF_CLK
TxENABLE
XTAL_SEL
FTW POWER
SERIAL I/O
PROGRAMMING
RAM
DOWN
PORT
PW REGISTERS
CONTROL
2 2
3
I Q IS QS
Figure 25. Detailed Block Diagram
Rev. C | Page 16 of 64
DATA ASSEMBLER AND FORMATTER
BLACKFIN INTERFACE
PROFILE
I/O_UPDATE
SDIO
SDO
INVERSE INVERSE
SCLK
CCI CCI
I/O_RESET
CS
HALF-BAND HALF-BAND
FILTERS (4×) FILTERS (4×)
CCI CCI
RT (1× TO 63×) (1× TO 63×)
FTW PW
CCI_OVFL
OSK
EXT_PWR_DWN
SYNC_OUT
SYNC_IN
INVERSE
SINC
FILTER
PLL_LOCK
PLL_LOOP_FILTER
MASTER_RESET
CLOCK MODE
06384-005
Data Sheet AD9957
The PROFILE and I/O_UPDATE pins are also synchronous to
QUADRATURE MODULATION MODE
the PDCLK.
A block diagram of the AD9957 operating in QDUC mode is
shown in Figure 26; grayed items are inactive. The parallel input The DDS core provides a quadrature (sine and cosine) local
accepts 18-bit I- and Q-words in time-interleaved fashion. That
oscillator signal to the quadrature modulator, where the
is, an 18-bit I-word is followed by an 18-bit Q-word, then the
interpolated I and Q samples are multiplied by the respective
next 18-bit I-word, and so on. One 18-bit I-word and one 18-bit
phase of the carrier and summed together, producing a
Q-word together comprise one internal sample. The data assem-
quadrature modulated data stream. This data stream is routed
bler and formatter de-interleave the I- and Q-words so that each through the inverse sinc filter (optionally), and the output
sample propagates along the internal data pathway in parallel scaling multiplier. Then it is applied to the 14-bit DAC to
fashion. Both I and Q data paths are active; the parallel data produce the quadrature modulated analog output signal.
clock (PDCLK) serves to synchronize the input of I/Q data to
the AD9957.
AD9957
18 I
16
8 AUX
DAC GAIN
DAC
IS DDS
DAC_RSET
8-BIT
18
I/Q IN
θ
QS
cos (ωt+θ)
IOUT
DAC
ω
16 14-BIT
IOUT
sin (ωt+θ)
18
CLOCK
OUTPUT
Q
SCALE
FACTOR
REFCLK_OUT
OSK
÷2
SYSCLK
PDCLK
REF_CLK
PARALLEL DATA
INTERNAL CLOCK TIMING AND CONTROL
PLL
TIMING AND CONTROL
REF_CLK
TxENABLE
XTAL_SEL
FTW POWER
PROGRAMMING SERIAL I/O
RAM
DOWN
REGISTERS PORT
PW
CONTROL
2 2
3
I Q IS QS
Figure 26. Quadrature Modulation Mode
Rev. C | Page 17 of 64
DATA ASSEMBLER AND FORMATTER
BLACKFIN INTERFACE
PROFILE
I/O_UPDATE
SDIO
SDO
INVERSE INVERSE
SCLK
CCI CCI
I/O_RESET
CS
HALF-BAND HALF-BAND
FILTERS (4×) FILTERS (4×)
CCI CCI
RT (1× TO 63×) (1× TO 63×)
FTW PW
CCI_OVFL
OSK
EXT_PWR_DWN
SYNC_OUT
SYNC_IN
INVERSE
SINC
FILTER
PLL_LOCK
PLL_LOOP_FILTER
MASTER_RESET
CLOCK MODE
06384-006
AD9957 Data Sheet
The Blackfin interface includes an additional pair of half-band
BLACKFIN INTERFACE (BFI) MODE
filters in both I and Q signal paths (not shown explicitly in the
A subset of the QDUC mode is the Blackfin interface (BFI)
diagram). The two half-band filters increase the interpolation
mode, shown in Figure 27; grayed items are inactive. In this
of the baseband data by a factor of four, relative to the normal
mode, a separate I and Q serial bit stream is applied to the
QDUC mode.
baseband data port instead of parallel data-words. The two
serial inputs provide for 16-bit I- and Q-words (unlike the
The synchronization of the serial data occurs through the
18-bit words in normal QDUC mode). The serial bit streams
PDCLK signal. In BFI mode, the PDCLK signal is effectively
are delivered to the Blackfin interface. The Blackfin interface the bit clock for the serial data.
converts the 16-bit serial data into 16-bit parallel data to
Note that the system clock is limited to 750 MHz in BFI mode.
propagate down the signal processing chain.
AD9957
I
18
16
8 AUX
DAC GAIN
DAC
IS DDS
8-BIT DAC_RSET
2
I/Q IN
θ
QS cos (ωt+θ)
IOUT
DAC
ω
16 14-BIT
IOUT
sin (ωt+θ)
18
CLOCK
Q OUTPUT
SCALE
FACTOR
REFCLK_OUT
OSK
÷2
SYSCLK
PDCLK
REF_CLK
PARALLEL DATA
INTERNAL CLOCK TIMING AND CONTROL
PLL
TIMING AND CONTROL
REF_CLK
TxENABLE
XTAL_SEL
POWER
FTW SERIAL I/O
PROGRAMMING
RAM
DOWN
PORT
PW REGISTERS
CONTROL
2 2
3
I Q IS QS
Figure 27. Quadrature Modulation Mode, Blackfin Interface
Rev. C | Page 18 of 64
DATA ASSEMBLER AND FORMATTER
BLACKFIN INTERFACE
PROFILE
I/O_UPDATE
SDIO
SDO
INVERSE INVERSE
SCLK
CCI CCI
I/O_RESET
CS
HALF-BAND HALF-BAND
FILTERS (4×) FILTERS (4×)
CCI CCI
RT (1× TO 63×) (1× TO 63×)
FTW PW
CCI_OVFL
O OSK SK
EXT_PWR_DWN
SYNC_OUT
SYNC_IN
INVERSE
SINC
FILTER
PLL_LOCK
PLL_LOOP_FILTER
MASTER_RESET
CLOCK MODE
06384-007
Data Sheet AD9957
INTERPOLATING DAC MODE No modulation takes place in the interpolating DAC mode;
therefore, the spectrum of the data supplied at the parallel port
A block diagram of the AD9957 operating in interpolating DAC
remains at baseband. However, a sample rate conversion takes
mode is shown in Figure 28; grayed items are inactive. In this
place based on the programmed interpolation rate. The inter-
mode, the Q data path, DDS, and modulator are all disabled; only
polation hardware processes the signal, effectively performing
the I data path is active.
an oversample with a zero-stuffing operation. The original
As in quadrature modulation mode, the PDCLK pin functions
input spectrum remains intact and the images that otherwise
as a clock, synchronizing the input of data to the AD9957.
would occur from the sample rate conversion process are
suppressed by the interpolation signal chain.
AD9957
18 I
16
8 AUX
DAC GAIN
DAC
DDS
IS
DAC_RSET
8-BIT
18
I/Q IN
θ
QS
cos (ωt+θ)
IOUT
DAC
ω
16 14-BIT
IOUT
sin (ωt+θ)
18
CLOCK
Q OUTPUT
SCALE
FACTOR
REFCLK_OUT
OSK
÷2
SYSCLK
PDCLK
REF_CLK
PARALLEL DATA
INTERNAL CLOCK TIMING AND CONTROL
PLL
TIMING AND CONTROL
REF_CLK
TxENABLE
XTAL_SEL
FTW POWER
SERIAL I/O
PROGRAMMING
RAM
DOWN
PORT
PW REGISTERS
CONTROL
2 2
3
I Q IS QS
Figure 28. Interpolating DAC Mode
Rev. C | Page 19 of 64
DATA ASSEMBLER AND FORMATTER
BLACKFIN INTERFACE
PROFILE
I/O_UPDATE
SDIO
SDO
SCLK INVERSE INVERSE
CCI CCI
I/O_RESET
CS
HALF-BAND HALF-BAND
FILTERS (4×) FILTERS (4×)
CCI CCI
RT
(1× TO 63×) (1× TO 63×)
FTW PW
CCI_OVFL
OSK
EXT_PWR_DWN
SYNC_OUT
SYNC_IN
INVERSE
SINC
FILTER
PLL_LOCK
PLL_LOOP_FILTER
MASTER_RESET
CLOCK MODE
06384-008
AD9957 Data Sheet
SINGLE TONE MODE cosine or sine output of the DDS. The sinusoid at the DDS
output can be scaled using a 14-bit amplitude scale factor (ASF)
A block diagram of the AD9957 operating in single tone mode
and optionally routed through the inverse sinc filter.
is shown in Figure 29; grayed items are inactive. In this mode,
both I and Q data paths are disabled from the 18-bit parallel
Single tone mode offers the output shift keying (OSK) function.
data port up to, and including, the modulator. The internal
It provides the ability to ramp the amplitude scale factor between
DDS core produces a single frequency signal based on the
zero and an arbitrary preset value over a programmable time
programmed tuning word. The user may select either the
interval.
AD9957
18 I
16
8
AUX
DAC GAIN
DAC
IS DDS
8-BIT DAC_RSET
10
I/Q IN
θ
QS
cos (ωt+θ)
IOUT
DAC
ω
16 14-BIT
IOUT
sin (ωt+θ)
18
CLOCK
OUTPUT
Q
SCALE
FACTOR
REFCLK_OUT
OSK
÷2
SYSCLK
PDCLK
REF_CLK
PARALLEL DATA
INTERNAL CLOCK TIMING AND CONTROL
PLL
TIMING AND CONTROL
REF_CLK
TxENABLE
XTAL_SEL
POWER
FTW SERIAL I/O
PROGRAMMING
RAM
DOWN
PORT
REGISTERS
PW
CONTROL
2 2
3
I Q IS QS
Figure 29. Single Tone Mode
Rev. C | Page 20 of 64
DATA ASSEMBLER AND FORMATTER
BLACKFIN INTERFACE
PROFILE
I/O_UPDATE
SDIO
SDO
SCLK INVERSE INVERSE
CCI CCI
I/O_RESET
CS
HALF-BAND HALF-BAND
FILTERS (4×) FILTERS (4×)
CCI CCI
RT
(1× TO 63×) (1× TO 63×)
FTW PW
CCI_OVFL
OSK
EXT_PWR_DWN
SYNC_OUT
SYNC_IN
INVERSE
SINC
FILTER
PLL_LOCK
PLL_LOOP_FILTER
MASTER_RESET
CLOCK MODE
06384-009
Data Sheet AD9957
SIGNAL PROCESSING
For a better understanding of the operation of the AD9957, it TRANSMIT ENABLE PIN (TxENABLE)
is helpful to follow the signal path in quadrature modulation
The AD9957 accepts a user-generated signal applied to the
mode from the parallel data port to the output of the DAC,
TxENABLE pin that gates the user supplied data. Polarity of
examining the function of each block (see Figure 26).
the TxENABLE pin is set using the TxENABLE invert bit (see
the Register Map section for details). When TxENABLE is true,
The internal system clock (SYSCLK) signal that generates from
the device latches data into the device on the expected edge of
the timing source provided to the REF_CLK pins provides all
PDCLK (based on the PDCLK invert bit). When TxENABLE
timing within the AD9957.
is false, the device ignores the data supplied to the port, even
though the PDCLK may continue to operate. Furthermore,
PARALLEL DATA CLOCK (PDCLK)
when the TxENABLE pin is held false, then the device either
The AD9957 generates a signal on the PDCLK pin, which is a
forces the 18-bit data-words to Logic 0s, or it retains the last
clock signal that runs at the sample rate of the parallel data port.
value present on the data port prior to TxENABLE switching
PDCLK serves as a data clock for the parallel port in QDUC
to the false state (see the data assembler hold last value bit in
and interpolating DAC modes; in BFI mode, it is a bit clock.
the Register Map section).
Normally, the device uses the rising edges on PDCLK to latch
the user-supplied data into the data port. Alternatively, the
Alternatively, rather than operating the TxENABLE pin as a
PDCLK Invert bit selects the falling edges as the active edges.
gate for framing bursts of data, it can be driven with a clock
Furthermore, the PDCLK enable bit is used to switch off the
signal operating at the parallel port data rate. When driven by
PDCLK signal. Even when the output signal is turned off via the
a clock signal, the transition from the false to true state must
PDCLK enable bit, PDCLK continues to operate internally. The
meet the required setup and hold times on each cycle to ensure
device uses PDCLK internally to capture parallel data. Note that
proper operation.
PDCLK is Logic 0 when disabled.
In QDUC mode, on the false-to-true edge of TxENABLE, the
In QDUC mode, the AD9957 expects alternating I- and Q-
device is ready to receive the first I-word. The first I-word is
data-words at the parallel port (see Figure 31). Each active edge
latched into the device coincident with the active edge of PDCLK.
of PDCLK captures one 18-bit word; therefore, there are two
The next active edge of PDCLK latches in a Q-word, and so on,
PDCLK cycles per I/Q pair. In BFI mode, the AD9957 expects
until TxENABLE is returned to a static false state. The user may
two serial bit streams, each segmented into 16-bit words with
reverse the ordering of the I- and Q-words via the Q-First Data
PDCLK indicating each new bit. In either case, the output clock
Pairing bit. Furthermore, the user must ensure that an even
rate is f as explained in the Input Data Assembler section.
PDCLK
number of data words are delivered to the device as it must
capture both an I- and a Q-word before the data is processed
In QDUC applications that require a consistent timing relation-
along the signal chain.
ship between the internal SYSCLK signal and the PDCLK signal,
the PDCLK rate control bit is used to slightly alter the operation
In interpolating DAC mode, TxENABLE operation is similar to
of PDCLK. When this bit is set, the PDCLK rate is reduced by
QDUC mode, but without the need for I/Q data pairing; the
a factor of two. This causes rising edges on PDCLK to latch
even-number-of-PDCLK-cycles rule does not apply.
incoming I-words and falling edges to latch incoming Q-words.
Again, the edge polarity assignment is reversible via the PDCLK In BFI mode, operation of the TxENABLE pin is similar except
Invert bit. that instead of the false-to-true edge marking the first I-word,
it marks the first I and Q bits in a serial frame. The user must
ensure that all 16-bits of a serial frame are delivered because the
device must capture a full 16-bit I- and Q-word before the data
is processed along the signal chain.
The timing relationships between TxENABLE, PDCLK, and
DATA are shown in Figure 30, Figure 31, and Figure 32.
Rev. C | Page 21 of 64
AD9957 Data Sheet
TxENABLE
t
DS t
DH
PDCLK
t
DS
I I I I
D<17:0> I I
0 1 2 3 K – 1 K
t
DH
Figure 30. 18-Bit Parallel Port Timing Diagram—Interpolating DAC Mode
TxENABLE
t
DS
t
DH
PDCLK
t
DS
I Q I Q I Q
D<17:0> 0 0 1 1
N N
t
DH
Figure 31. 18-Bit Parallel Port Timing Diagram—Quadrature Modulation Mode
TxENABLE
PDCLK
I DATA I I I I I I I I I I I I I I I I
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
I
16n – 1
Q DATA
Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Q
16n – 1
Figure 32. Dual Serial I/Q Bit Stream Timing Diagram, BFI Mode
INPUT DATA ASSEMBLER When the PDCLK rate control bit is active in QDUC mode,
however, the frequency of PDCLK becomes
The input to the AD9957 is an 18-bit parallel data port in
QDUC mode or interpolating DAC mode. In BFI mode, it
f
SYSCLK
with PDCLK rate control active
f =
PDCLK
operates as a dual serial data port.
4R
In QDUC mode, it is assumed that two consecutive 18-bit In the interpolating DAC mode, the rate of PDCLK is the same
words represent the real (I) and imaginary (Q) parts of a as QDUC mode with the PDCLK rate control bit active, that is,
complex number of the form, I + jQ. The 18-bit words are
f
SYSCLK
supplied to the input of the AD9957 at a rate of f = for interpolating DAC mode
PDCLK
4R
f
SYSCLK
f = for QDUC mode In BFI mode, the 18-bit parallel input converts to a dual serial
PDCLK
2R
input that is, one pin is assigned as the serial input for the I-words
where:
and one pin is assigned as the serial input for the Q-words. The
fSYSCLK (for all of the PDCLK equations in this section) is the other 16 pins are not used. Furthermore, each I- and Q-word
sample rate of the DAC. has a 16-bit resolution. fPDCLK is the bit rate of the I- and Q-data
R (for all of the PDCLK equations in this section) is the streams and is given by
interpolation factor of the programmable interpolation filter.
f
SYSCLK
f = for BFI mode
PDCLK
R
Rev. C | Page 22 of 64
06384-012
06384-011 06384-010
Data Sheet AD9957
Encoding and pulse shaping of symbols must be implemented
FIXED INTERPOLATOR (4×)
before the data is presented to the input of the AD9957. Data
This block is a fixed 4× rate interpolator, implemented as a
delivered to the input of the AD9957 may be formatted as either
cascade of two half-band filters. Together, the sampling rate
twos complement or offset binary (see the Data Format bit in
of these two filters increases by a factor of four while preserving
Table 13). In BFI mode, the bit sequence order can be set to
the spectrum of the baseband signal applied at the input. Both
either MSB-first or LSB-first (via the Blackfin Bit Order bit).
are linear phase filters; virtually no phase distortion is intro-
duced within their pass bands. Their combined insertion loss
INVERSE CCI FILTER
is 0.01 dB, preserving the relative amplitude of the input signal.
The inverse cascaded comb integrator (CCI) filter predistorts
the data, compensating for the slight attenuation gradient imposed
The filters are designed to deliver a composite performance that
by the CCI filter (see the Programmable Interpolating Filter
yields a usable pass band of 40% of the input sample rate. Within
section). Data entering the first half-band filter occupies a maxi-
that pass band, ripple does not exceed 0.002 dB peak-to-peak.
mum bandwidth of ½ f as defined by Nyquist (where f is the
IQ IQ
The stop band extends from 60% to 340% of the input sample
sample rate at the input of the first half-band filter); see Figure 33.
rate and offers a minimum of 85 dB attenuation. Figure 34 and
Figure 35 show the composite response of the two half-band filters.
If the CCI filter is used, the inband attenuation gradient can pose a
10
problem for applications requiring an extremely flat pass band.
0
For example, if the spectrum of the data supplied to the AD9957
–10
occupies a significant portion of the ½ fDATA region, the higher
–20
frequencies of the data spectrum are slightly more attenuated
–30
than the lower frequencies (the worst-case overall droop from
–40
f = 0 to ½ f is <0.8 dB). The inverse CCI filter has a response
DATA –50
–60
characteristic that is the inverse of the CCI filter response over
–70
the ½ f region.
IQ
–80
–90
INBAND
ATTENUATION
–100
GRADIENT
–110
–120
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
f
I
CCI FILTER RESPONSE
Figure 34. Half-Band 1 and Half-Band 2 Composite Response
(Frequency Scaled to Input Sample Rate of Half-Band 1)
0.010
0.008
0.006
f
0.004
f 4f
IQ IQ
½f 0.002
IQ
0
Figure 33. CCI Filter Response
–0.002
The product of the two responses yields an extremely flat
–0.004
pass band (±0.05 dB over the baseband Nyquist bandwidth)
–0.006
eliminating the inband attenuation gradient introduced by the
–0.008
CCI filter. The cost is a slight attenuation of the input signal
(approximately 0.5 dB for a CCI interpolation rate of 2, and
–0.010
0 0.1 0.2 0.3 0.4 0.5
0.8 dB for higher interpolation rates).
f
I
The inverse CCI filter can be bypassed using the appropriate bit Figure 35. Composite Pass-Band Detail
(Frequency Scaled to Input Sample Rate of Half-Band 1)
in the register map; it is automatically bypassed if the CCI inter-
polation rate is 1×. When bypassed, power to the stage turns off
In BFI mode, there are two additional half-band filters resident,
to reduce power consumption.
yielding a total fixed interpolation factor of 16×. The extra BFI
filters use the same filter tap coefficient values as the QDUC
half-band filters, but their data pathway is 16 bits (instead of
18 bits as with the QDUC half-band filters). As such, baseband
quantization noise is higher in BFI mode.
Rev. C | Page 23 of 64
06384-013
(dB) (dB)
06384-015 06384-014
AD9957 Data Sheet
Knowledge of the frequency response of the half-band filters is response portion of the diagram to the right, as it must remain
essential to understanding their impact on the spectral properties aligned with the corresponding Mf point on the frequency
SYMBOL
of the input signal. This is especially true when using the quad- axis of the raised cosine spectral diagram. However, if f shifts
IQ
rature modulator to upconvert a baseband signal containing to the right, so does the half-band response, proportionally.
complex data symbols that have been pulse shaped.
The result is that the raised cosine spectral mask always lies
within the flat portion (dc to 0.4 fIQ) of the pass band response
Consider that a complex symbol is represented by a real (I) and
of the first half-band filter, regardless of the choice of α so long
an imaginary (Q) component, thus requiring two digital words
as M > 2. Therefore, for M > 2, the first half-band filter has
to represent a single complex sample of the form I + jQ. The
absolutely no negative impact on the spectrum of the baseband
sample rate associated with a sequence of complex symbols is
signal when raised cosine pulse shaping is employed. For the
referred to as f . If pulse shaping is applied to the symbols,
SYMBOL
case of M = 2, a problem can arise. This is highlighted by the
the sample rate must be increased by some integer factor, M
shaded area in the tail of the α = 1 trace on the raised cosine
(a consequence of the pulse shaping process). This new sample
spectral mask diagram. Notice that this portion of the raised
rate (fIQ) is related to the symbol rate by
cosine spectral mask extends beyond the flat portion of the
fIQ = MfSYMBOL
half-band response and causes unwanted amplitude and phase
where f is the rate at which complex samples must be supplied distortion as the signal passes through the first half-band filter.
IQ
to the input of the first half-band filter in both (I and Q) signal To avoid this, simply ensure that α ≤ 0.6 when M = 2.
paths. This rate should not be confused with the rate at which
PROGRAMMABLE INTERPOLATING FILTER
data is supplied to the AD9957.
The programmable interpolator is implemented as a low-pass
Typically, pulse shaping is applied to the baseband symbols via
CCI filter. It is programmable by a 6-bit control word, giving a
a filter having a raised cosine response. In such cases, an excess
range of 2× to 63× interpolation.
bandwidth factor (α, 0 ≤ α ≤ 1) is used to modify the bandwidth
The programmable interpolator is bypassed when programmed
of the data. For α = 0, the data bandwidth corresponds to fSYMBOL/2;
for an interpolation factor of 1. When bypassed, power to the
for α = 1, the data bandwidth extends to f . Figure 36 shows
SYMBOL
the relationship between α, the bandwidth of the raised cosine stage is removed and the inverse CCI filter is also bypassed,
response, and the response of the first half-band filter. because its compensation is not needed.
The output of the programmable interpolator is the data from
TYPICAL SPECTRUM OF A RANDOM SYMBOL SEQUENCE
the 4× interpolator further upsampled by the CCI filter, accord-
ing to the rate chosen by the user. This results in the upsampling of
NYQUIST
BAND
the input data by a factor of 8× to 252× in steps of four.
WIDTH
The transfer function of the CCI interpolating filter is
f
5
½f f 2f 3f
SYMBOL SYMBOL SYMBOL SYMBOL
R− 1
( )
−j 2π fk
H( f)= (1)
∑ e
k= 0
RAISED COSINE
SPECTRAL MASK
where R is the programmed interpolation factor, and f is the
frequency normalized to fSYSCLK.
SAMPLE RATE FOR
α = 1
α = 0.5 2× OVERSAMPLED
α = 0
PULSE SHAPING
Note that minimum R requirements exist depending on the
mode and frequency of fSYSCLK. The minimum R setting is
f
½f f 2f 4f
SYMBOL SYMBOL SYMBOL SYMBOL
defined under the follo wing conditions.
QDUC Mode
HALF-BAND
FILTER
RESPONSE
If fSYSCLK is between 500 MSPS to 1 GSPS, then the minimum R is 2.
INPUT SAMPLE INPUT SAMPLE
RATE OF FIRST RATE OF FIRST
If fSYSCLK is less than 500 MSPS, then the minimum R is 1.
HALF-BAND HALF-BAND
FILTER FILTER
BFI Mode
f
0.4f ½f f 2f
If f is between 500 MSPS to 750 MSPS, then the minimum
IQ IQ IQ IQ SYSCLK
R is 3.
Figure 36. Effect of the Excess Bandwidth Factor (α)
The responses in Figure 36 reflect the specific case of M = 2 (the If fSYSCLK is between 250 MSPS to 500 MSPS, then the minimum
interpolation factor for the pulse shaping operation). Increasing R is 2.
Factor M shifts the location of the f point on the half-band
IQ
If fSYSCLK is less than 250 MSPS, then the minimum R is 1.
Rev. C | Page 24 of 64
06384-016
Data Sheet AD9957
where the round() function means to round the result to the
QUADRATURE MODULATOR
nearest integer. For example, for f = 41 MHz and f =
OUT SYSCLK
The digital quadrature modulator stage shifts the frequency of
122.88 MHz, then FTW = 1,433,053,867 (0x556AAAAB).
the baseband spectrum of the incoming data stream up to the
desired carrier frequency (a process known as upconversion).
In single tone mode, the DDS frequency, phase, and amplitude
are all programmable via the serial I/O port. The amplitude
At this point, the baseband data, which was delivered to the
is controlled by means of a digital multiplier using a 14-bit
device at an I/Q sample rate of f , has been upsampled to a rate
IQ
fractional scale value called the amplitude scale factor (ASF).
equal to the frequency of SYSCLK, making the data sampling
−14
The LSB weight is 2 , yielding a multiplier range of 0 to
rate equal to the sampling rate of the carrier signal.
−14
0.99993896484375 (1 − 2 ). To bypass the ASF multiplier,
program the appropriate control register bit (see the details of
The frequency of the carrier signal is controlled by a direct
CFR2<24> in the Register Bit Descriptions section). When
digital synthesizer (DDS). The DDS very precisely generates the
desired carrier frequency from the internal reference clock bypassed, the ASF multiplier clocks are disabled to conserve
(SYSCLK). The carrier is applied to the I and Q multipliers in power. The phase offset is controlled by means of a digital adder
quadrature fashion (90° phase offset) and summed, yielding a that uses a 14-bit offset value called the phase offset word (POW).
data stream that represents the quadrature modulated carrier. The adder is situated between the phase accumulator and the
angle-to-amplitude conversion logic in the DDS core. The adder
The modulation is performed digitally, avoiding the phase
applies the POW to the instantaneous phase values produced by
offset, gain imbalance, and crosstalk issues commonly associated
the DDS phase accumulator. The adder is MSB aligned with the
with analog modulators. Note that the modulated, so-called −14
phase accumulator yielding an LSB weight of 2 (which equates to
signal is a number stream sampled at the rate of SYSCLK, the
a resolution of ~0.022° or ~0.000383 radians). Both the ASF and
same rate at which the DAC is clocked.
the POW are available for each of the eight profiles.
The orientation of the modulated signal with respect to the
INVERSE SINC FILTER
carrier is controlled by a spectral invert bit. This bit resides in
The sampled carrier data stream is the input to the digital-to-
each of the eight profile registers. By default, the time domain
analog converter. The DAC output spectrum is shaped by the
output of the quadrature modulator takes the form
characteristic sin(x)/x (or sinc) envelope, due to the intrinsic
I(t) × cos(ωt) − Q(t) × sin(ωt) (2)
zero-order hold effect associated with DAC-generated signals.
The shape of the sinc envelope is well known and can be
When the spectral invert bit is asserted, it becomes
compensated for. This compensation is provided by the inverse
I(t) × cos(ωt) + Q(t) × sin(ωt) (3)
sinc filter preceding the DAC.
DDS CORE
The inverse sinc filter is implemented as a digital FIR filter. Its
The direct digital synthesizer (DDS) block generates sine response characteristic very nearly matches the inverse of the
and/or cosine signals. In single tone mode, the DDS generates sinc envelope, as shown in Figure 37 (along with the sinc
either a digital sine or cosine waveform based on the select DDS envelope for comparison).
sine output bit. In QDUC mode, the DDS generates the quadra-
The inverse sinc filter is enabled through a bit in the register
ture carrier reference signal that digitally modulates the I/Q
map. The filter tap coefficients are listed in Table 4. The filter
baseband signal.
predistorts the data prior to its arrival at the DAC to compensate
The DDS output frequency is tuned using registers accessed via for the sinc envelope that otherwise distorts the spectrum.
the serial I/O port. This allows for both precise tuning and
When the inverse sinc filter is enabled, it introduces a ~3.0 dB
instantaneous changing of the carrier frequency.
insertion loss. The inverse sinc compensation is effective for
The equation relating output frequency (fOUT) of the DDS to the output frequencies up to 40% (nominally) of the DAC sample rate.
frequency tuning word (FTW) and the system clock (fSYSCLK) is
Table 4. Inverse Sinc Filter Tap Coefficients
FTW
Tap No. Tap Value Tap No.
f = f (4)
OUT SYSCLK
32
2
1 −35 7
2 +134 6
31
where FTW is a decimal number from 0 to 2,147,483,647 (2 − 1).
3 −562 5
4 +6729 4
Solving for FTW yields
f
32
OUT
FTW= round 2 (5)
f
SYSCLK
Rev. C | Page 25 of 64
AD9957 Data Sheet
14-BIT DAC
In Figure 37, it can be seen that the sinc envelope introduces a
The AD9957 incorporates an integrated 14-bit current-output
frequency dependent attenuation that can be as much as 4 dB at
DAC. The output current is delivered as a balanced signal using
the Nyquist frequency (half of the DAC sample rate). Without
two outputs. The use of balanced outputs reduces the amount of
the inverse sinc filter, the DAC output also suffers from the
common-mode noise at the DAC output, increasing signal-to-
frequency dependent droop of the sinc envelope. The inverse
noise ratio. An external resistor (R ) connected between the
SET
sinc filter effectively flattens the droop to within ±0.05 dB as
DAC_RSET pin and AGND establishes a reference current. The
shown in Figure 38, which shows the corrected sinc response
full-scale output current of the DAC (IOUT) is a scaled version of
with the inverse sinc filter enabled.
the reference current (see the Auxiliary DAC section that
1
follows).
SINC
Proper attention should be paid to the load termination to keep
0
the output voltage within the specified compliance range, as
voltages developed beyond this range cause excessive distortion
–1
and can damage the DAC output circuitry.
Auxiliary DAC
–2
The full-scale output current of the main DAC (IOUT) is con-
INVERSE
SINC
trolled by an 8-bit auxiliary DAC. An 8-bit code word stored in
–3
the appropriate register map location sets I according to the
OUT
following equation:
–4
0 0.1 0.2 0.3 0.4 0.5
86.4 CODE
FREQUENCY RELATIVE TO DAC SAMPLE RATE
I = 1+ (6)
OUT
R 96
SET
Figure 37. Sinc and Inverse Sinc Responses
–2.8
where:
RSET is the value of the RSET resistor (in ohms).
CODE is the 8-bit value supplied to the auxiliary DAC (default
is 127).
–2.9
For example, with RSET = 10,000 and CODE = 127, IOUT = 20.07 mA.
COMPENSATED RESPONSE
–3.0
–3.1
0 0.1 0.2 0.3 0.4 0.5
FREQUENCY RELATIVE TO DAC SAMPLE RATE
Figure 38. DAC Response with Inverse Sinc Compensation
OUTPUT SCALE FACTOR (OSF)
In QDUC and interpolating DAC modes, the output amplitude
is controlled using an 8-bit digital multiplier. The 8-bit multiplier
value is called the output scale factor (OSF) and is programmed
via the appropriate control registers. It is available for each of
−7
the eight profiles. The LSB weight is 2 , which yields a multiplier
−7
range of 0 to 1.9921875 (2 − 2 ). The gain extends to nearly a
factor of 2 to provide a means to overcome the intrinsic loss
through the modulator when operating in the quadrature
modulation mode.
In interpolating DAC mode, the OSF should not be programmed
to exceed unity, as clipping can result. Programming the 8-bit
multiplier to unity gain (0x80) bypasses the stage and reduces
power consumption.
Rev. C | Page 26 of 64
(dB) (dB)
06384-018 06384-017
Data Sheet AD9957
RAM CONTROL
Q-channel bits. In playback mode, when driving data directly
RAM OVERVIEW
into the baseband signal chain, the 16-bit data-words are
The AD9957 has an integrated 1024 × 32-bit RAM. This RAM
considered to be signed (that is, twos complement) values. The
is only accessible when the AD9957 is operating in QDUC or
16-bit I-and Q-words are MSB aligned with the 18-bit I and Q
interpolating DAC mode. The RAM has two fundamental
baseband data path. The two remaining LSBs of each 18-bit
modes of operation: data entry/retrieve mode and playback
baseband channel are driven by the MSB of the respective
mode. The mode is selected by programming the RAM Enable
channel. This ensures correct polarity coding when the 16-bit I
bit in CFR1 via the serial I/O port.
and Q data from the RAM translates into 18-bit words for the
baseband signal chain. Alternatively, when the RAM is driving
Data entry/retrieve mode is used to load or read back the RAM
the baseband scaling multipliers in playback mode, the RAM
contents via the serial I/O port. Playback mode is used to deliver
data is considered to represent unsigned, fractional values with a
RAM data to one of two internal destinations: the baseband
−16
range of 0 to 1 − 2 .
scaling multipliers (see Figure 25, the IS and QS labels) or the
baseband signal chain (see Figure 25, the I and Q labels). In
RAM SEGMENT REGISTERS
both cases, the RAM can be used to apply an arbitrary, time-
Two dedicated registers (RAM Segment Register 0 and RAM
varying waveform to the selected destination. A block diagram
Segment Register 1) control the operation of the RAM. Each
of the RAM and its control elements is shown in Figure 39.
contains the following:
The external parallel data port is disabled when the baseband
• 10-bit start address word
signal chain serves as the RAM playback destination.
• 10-bit end address word
RT
• 16-bit address step rate word
3
RAM MODE
16
ADDRESS STEP RATE RAM
• 3-bit RAM playback mode word
SEGMENT
10
START ADDRESS
REGISTERS
10
END ADDRESS
When programming these registers, the user must ensure that
DDS CLOCK
BASEBAND DATA CLOCK
the end address is greater than the start address.
With the RAM segment registers, the user can arbitrarily partition
CLK SDIO
U/D
32 32
10
SDO
STATE
the RAM into two independent memory segments. The segment
Q
RAM
MACHINE
SCLK
boundaries are specified with the start and end address words
I/O_RESET
CS
UP/DOWN COUNTER
in each RAM segment register. The playback rate is controlled
I
16
I CHANNEL
IS by the address step rate word (only meaningful when the base-
(MSBs)
band scaling multipliers serve as the playback destination). If the
Q
Q CHANNEL 16
baseband signal chain serves as the RAM playback destination,
QS
(LSBs)
the 16-bit address step rate words must be set to 1. The playback
mode of the RAM is controlled via the RAM playback mode word.
Figure 39. RAM Block Diagram
RAM STATE MACHINE
In Figure 39, the serial I/O port is used to program the contents
The state machine acts as an address generator for the RAM. It
of the two RAM segment registers as well as to load and retrieve
is clocked by either the serial I/O port (when the RAM is operating
the RAM contents. The state machine takes care of incrementing
in the load/retrieve mode) or the baseband data clock (when
or decrementing the RAM address locations and controlling the
the RAM is in playback mode). The state machine uses the
timing of the RAM address and data for proper operation. The
RAM mode bits of the active RAM segment register to establish
I-channel and Q-channel multiplexers route RAM data to base-
the proper sequence through the specified address range.
band scaling multipliers (IS/QS) or directly to the baseband
RAM TRIGGER (RT) PIN
signal chain (I/Q) when the RAM is used in playback mode.
The state of the RAM playback destination bit determines the
The RAM state machine monitors the RT pin for logic state tran-
destination of the RAM data during playback.
sitions. Any state transition triggers the state machine into action.
An I/O update (or a profile change) is necessary to enact a state
The direction of the logic state transition on the RT pin deter-
change of the RAM enable or RAM playback destination bits, or
mines which RAM segment register the state machine uses for
any of the RAM segment register bits.
playback instructions. RAM Segment Register 0 is used if the
state machine detects a 0-to-1 transition; RAM Segment Register 1
The 32-bit RAM data bus is partitioned so that the 16 MSBs are
is used if a 1-to-0 transition is detected.
designated as I-channel bits and the 16 LSBs are designated as
Rev. C | Page 27 of 64
ADDRESS
DATA
SERIAL I/O PORT
06384-019
AD9957 Data Sheet
rate when the playback destination is the baseband scaling
LOAD/RETRIEVE RAM OPERATION
multipliers.
Loading or retrieving the RAM contents is a three-step process.
Although RAM load/retrieve operations via the serial I/O port
1. Program the RAM segment registers with start and end
take precedence over playback, it is recommended that the user
addresses defining the boundaries of each independent
not attempt RAM access via the serial I/O port when the RAM
RAM segment.
enable bit is set.
2. Toggle the RT pin with the appropriate transition to select
Figure 41 is a block diagram showing the functional compo-
the desired RAM segment register.
nents used for RAM playback operation when the internal
destination is the baseband scaling multipliers.
3. Using the serial I/O port, write (or read) the address range
specified by the selected RAM segment register.
RT
3
RAM MODE
Figure 40 shows the RAM block diagram when used for loading
16
ADDRESS STEP RATE RAM
SEGMENT
10
START ADDRESS
or retrieve operations.
REGISTERS
10
END ADDRESS
DDS CLOCK
RT
3
BASEBAND DATA CLOCK
RAM MODE
16
ADDRESS STEP RATE RAM
SEGMENT
10
START ADDRESS
REGISTERS
CLK SDIO
10
END ADDRESS
U/D
32 32
10 SDO
STATE
Q RAM
DDS CLOCK
MACHINE
SCLK
BASEBAND DATA CLOCK
I/O_RESET
CS
UP/DOWN COUNTER
I
16
SDIO
CLK
I CHANNEL
IS
U/D
32 32
10
SDO
STATE (MSBs)
Q RAM
MACHINE SCLK
Q
Q CHANNEL
16
I/O_RESET
QS
CS
UP/DOWN COUNTER
I (LSBs)
16
NOTES
I CHANNEL
IS
1. NONESSENTIAL FUNCTIONAL COMPONENTS ARE RENDERED IN GRAY.
(MSBs)
Q
Figure 41. RAM Playback to Baseband Scaling Multipliers
Q CHANNEL
16
QS
(LSBs)
During playback to the baseband scaling multipliers, the
NOTES
1. NONESSENTIAL FUNCTIONAL COMPONENTS ARE RENDERED IN GRAY.
address step rate word in the active RAM segment register sets
Figure 40. RAM Load/Retrieve Operation the rate at which RAM data samples are delivered to the
multipliers. The following equations define the RAM sample
During a load or retrieve operation, the state machine controls
rate and sample interval (Δt):
an up/down counter to step through the required RAM locations.
f
SYSCLK
The counter is synchronized with the serial I/O port so that the
RAM Sample Rate=
4RM
serial/parallel conversion of the 32-bit words is correctly timed
with the generation of the appropriate RAM address to properly
4RM
∆t=
execute the desired read or write operation. The up/down
f
SYSCLK
counter always increments through the address range during
serial I/O port operations. where:
R is the rate interpolation factor for the CCI filter.
Because the RAM segment registers are completely independent,
M is the 16-bit value of the address step rate word stored in the
it is possible to define overlapping address ranges. However,
active RAM segment register.
doing so causes the overlapping address locations to be over-
written by the most recent write operation. It is recommended If the RAM enable bit is set and the baseband scaling multi-
that the user avoid defining overlapping address ranges. pliers are selected as the playback destination, then assertion
of an I/O update or profile change causes the multipliers to be
RAM PLAYBACK OPERATION
driven with a static value of zero. A subsequent state change on
When the RAM has been loaded, it can be used for playback
the RT pin causes the multipliers to be driven by the data played
operation. The destination of the playback data is selected via
back from the RAM instead of the static zero value.
the RAM playback destination bit. The active RAM segment
Figure 42 is a block diagram showing RAM playback operation
register is selected by the appropriate transition of the RT pin.
when the internal destination is the baseband data path. During
The active RAM segment register directs the internal state
playback to the baseband data path, the state machine increments/
machine by defining the RAM address range occupied by the
decrements the RAM address at the baseband data rate (the
data and the RAM playback mode. It also defines the playback
address step rate must be set to 1).
Rev. C | Page 28 of 64
ADDRESS
DATA
SERIAL I/O PORT
06384-020
ADDRESS
DATA
SERIAL I/O PORT
06384-021
Data Sheet AD9957
RT RAM Ramp-Up Mode
3
RAM MODE
16
ADDRESS STEP RATE RAM
In ramp-up mode, upon assertion of an I/O update or a state
SEGMENT
10
START ADDRESS
REGISTERS
change on the RT pin, the RAM begins playback operation
10
END ADDRESS
using the parameters programmed into the selected RAM seg-
DDS CLOCK
BASEBAND DATA CLOCK
ment register. Data is extracted from RAM over the specified
address range contained in the start address and end address of
CLK SDIO
U/D the active RAM segment register. The data is delivered at the
32 32
10
SDO
STATE
Q RAM
MACHINE
SCLK appropriate rate and to the destination as specified by the RAM
I/O_RESET
playback destination bit.
UP/DOWN COUNTER CS
I
16
I CHANNEL
IS
The playback rate is governed by the timer internal to the RAM
(MSBs)
state machine and its period (Δt) is determined by the state of the
Q
Q CHANNEL 16
QS
RAM playback destination bit as detailed in the RAM playback
(LSBs)
operation section.
NOTES
1. NONESSENTIAL FUNCTIONAL COMPONENTS ARE RENDERED IN GRAY.
The internal state machine begins extracting data from the
Figure 42. RAM Playback to Baseband Data Path
RAM at the start address and continues to extract data until it
OVERVIEW OF RAM PLAYBACK MODES reaches the end address. Upon reaching this address, the state
machine halts.
The RAM is operational in any one of four different
playback modes.
A graphic representation of the ramp-up mode appears in
• Ramp-up Figure 43. The upper trace shows the progression of the RAM
address from the start address to the end address for the active
• Bidirectional ramp
RAM segment register. The address value advances by one with
• Continuous bidirectional ramp
each timeout of the timer internal to the state machine. The circled
• Continuous recirculate
numbers indicate specific events, explained as follows:
RAM playback is only functional when the AD9957 is pro-
grammed for either the QDUC or interpolating DAC mode. Event 1—an I/O update or state transition on the RT pin. This
event initializes the state machine to the start address of the active
The RAM playback mode is selected via the 3-bit RAM play-
RAM segment register.
back mode word located in each of the RAM segment registers.
Thus, the RAM playback mode is segment dependent. The Event 2—the state machine reaches the end address of the active
RAM playback mode bits are detailed in Table 5. RAM segment register and halts.
Table 5. RAM Playback Modes
1 PDCLK CYCLE
OR
RAM Playback Mode
M DDS CLOCK CYCLES
Bits<2:0> RAM Playback Mode
001 Ramp-up
010 Bidirectional ramp
Δt
011 Continuous bidirectional END ADDRESS
ramp
RAM
100 Continuous recirculate
ADDRESS
1
000, 101, 110, 111 Not Valid
START ADDRESS
The continuous bidirectional ramp and continuous recirculate
I/O_UPDATE OR
RT TRANSITION
modes are not available when the baseband scaling multipliers
1 2
serve as the destination of RAM playback.
Figure 43. Ramp-Up Timing Diagram
Rev. C | Page 29 of 64
ADDRESS
DATA
SERIAL I/O PORT
06384-022
06384-023
AD9957 Data Sheet
A Logic 1 to Logic 0 transition on the RT pin instructs the state
RAM Bidirectional Ramp Mode
machine to switch to RAM Segment Register 1 and to decrement
This mode is unique in that the RAM segment playback mode
through the address range starting with the end address. As
word of both RAM segment registers must be programmed for
long as the RT pin remains Logic 0, the state machine continues
RAM bidirectional ramp mode.
to play back the RAM data until it reaches the start address, at
which point the state machine halts.
In bidirectional ramp mode, upon assertion of an I/O update,
the RAM readies for playback operation using the parameters
It is important to note that RAM Segment Register 1 is played
programmed into RAM Segment Register 0. The data is deliv-
back in reverse order for bidirectional ramp mode. This must
ered at the appropriate rate and to the destination as specified
be kept in mind when the RAM contents are loaded via the
by the RAM playback destination bit.
serial I/O port when bidirectional ramp mode is the intended
playback mode.
The playback rate is governed by the timer that is internal to the
RAM state machine, and its period (Δt) is determined by the
A graphic representation of the bidirectional ramp mode
state of the RAM playback destination bit as detailed in the
appears in Figure 44. It demonstrates the action of the state
RAM Playback Operation section.
machine in response to the RT pin. If the RT pin changes states
before the state machine reaches the programmed start or end
Playback begins upon a 0 to 1 logic transition on the RT pin.
address, the internal timer is restarted and the direction of the
This instructs the state machine to increment through the
address counter reversed.
address range specified in RAM Segment Register 0 starting
with the start address. As long as the RT pin remains Logic 1,
the state machine continues to play back the RAM data until it
reaches the end address, at which point the state machine halts.
0 1 0 1 0
RAM SEGMENT
1 PDCLK CYCLE
OR
M DDS CLOCK CYCLES
END ADDRESS
Δt
NUMBER 0
RAM
ADDRESS
1
Δt Δt
START ADDRESS NUMBER 0
END ADDRESS NUMBER 1
RAM
ADDRESS
Δt Δt
START ADDRESS NUMBER 1
RT
PIN
I/O_UPDATE
1 2 3 4 5 6 7 8
Figure 44. Bidirectional Ramp Timing Diagram
Rev. C | Page 30 of 64
06384-024
Data Sheet AD9957
The circled numbers in Figure 44 indicate specific events, Event 5—the RT pin switches to Logic 1. The state machine
explained as follows: initializes to the start address of RAM Segment Register 0,
resets the internal timer, and begins incrementing the RAM
Event 1—an I/O update or profile change activates the RAM
address counter.
bidirectional ramp mode.
Event 6—the RT pin switches to Logic 0. The state machine
Event 2—the RT pin switches to Logic 1. The state machine
initializes to the end address of RAM Segment Register 1, resets
initializes to the start address of RAM Segment Register 0 and
the internal timer, and begins decrementing the RAM address
begins incrementing the RAM address counter.
counter.
Event 3—the RT pin remained at Logic 1 long enough for the
Event 7—the RT pin remained at Logic 0 long enough for the
state machine to reach the end address of RAM Segment
state machine to reach the start address of RAM Segment
Register 0, at which point the address counter is halted.
Register 1, at which point the address counter is halted.
Event 4—the RT pin switches to Logic 0. The state machine
Event 8—the RT pin switches to Logic 1. The state machine
initializes to the end address of RAM Segment Register 1, resets
initializes to the start address of RAM Segment Register 0,
the internal timer, and begins decrementing the RAM address
resets the internal timer, and begins incrementing the RAM
counter.
address counter.
Rev. C | Page 31 of 64
AD9957 Data Sheet
1 PDCLK CYCLE
OR
M DDS CLOCK CYCLES
Δt
END ADDRESS
RAM
ADDRESS
1
Δt
START ADDRESS
I/O_UPDATE OR
RT TRANSITION
1 2 3
Figure 45. Continuous Bidirectional Ramp Timing Diagram
RAM Continuous Bidirectional Ramp Mode
Note that a change in state of the RT pin aborts the current
waveform and the newly selected RAM segment register is used
In continuous bidirectional ramp mode, upon assertion of an
to initiate a new waveform.
I/O update or a state change on the RT pin, the RAM begins
playback operation using the parameters programmed into the
A graphic representation of the continuous bidirectional ramp
selected RAM segment register. Data is extracted from RAM
mode is shown in Figure 45. The circled numbers in Figure 45
over the specified address range contained in the start address
indicate specific events, explained as follows:
and end address. The data is delivered at the appropriate rate
and to the destination as specified by the RAM playback
Event 1—an I/O update or state change on the RT pin has
destination bit.
activated the RAM continuous bidirectional ramp mode. The
state machine initializes to the start address of the active RAM
The playback rate is governed by the timer internal to the RAM
segment register. The state machine begins incrementing
state machine and its period (Δt) is determined by the state of
through the specified address range.
the RAM playback destination bit as detailed in the RAM
Playback Operation section.
Event 2—the state machine reaches the end address of the active
RAM segment register.
After initialization, the internal state machine begins extracting
data from the RAM at the start address of the active RAM segment
Event 3—the state machine reaches the start address of the
register and increments the address counter until it reaches the
active RAM segment register.
end address, at which point the state machine reverses the direc-
The continuous bidirectional ramp continues indefinitely until
tion of the address counter and begins decrementing through
the next I/O update or state change on the RT pin.
the address range. Whenever one of the terminal addresses is
reached, the state machine reverses the address counter; the
process continues indefinitely.
Rev. C | Page 32 of 64
06384-025
Data Sheet AD9957
1 PDCLK CYCLE
OR
M DDS CLOCK CYCLES
Δt
END ADDRESS
RAM ADRESS
1
START ADDRESS
I/O_UPDATE OR
RT TRANSITION
1 2 3 4 5
Figure 46. Continuous Recirculate Timing Diagram
active RAM segment register and causes the state machine to
RAM Continuous Recirculate Mode
begin incrementing the address counter at the appropriate rate.
The continuous recirculate mode mimics ramp-up mode,
except that when the state machine reaches the end address of
Event 2—the state machine reaches the end address of the active
the active RAM segment register, it does not halt. Instead, the
RAM segment register.
next timeout of the internal timer causes the state machine to
Event 3—the state machine switches to the start address of the
jump to the start address of the active RAM segment register.
active RAM segment register. The state machine continues to
This process continues indefinitely until an I/O update or state
increment the address counter.
change on the RT pin. A state change on the RT pin aborts the
current waveform and the newly selected RAM segment register
Event 4—the state machine again reaches the end address of the
initiates a new waveform.
active RAM segment register.
A graphic representation of the continuous recirculate mode is
Event 5—the state machine switches to the start address of the
shown in Figure 46.
active RAM segment register. The state machine continues to
increment the address counter.
The circled numbers in Figure 46 indicate specific events, which
are explained as follows:
Event 4 and Event 5 repeat until an I/O update or state change
occurs on the RT pin.
Event 1—an I/O update or state change on the RT pin occurs.
This initializes the state machine to the start address of the
Rev. C | Page 33 of 64
06384-026
AD9957 Data Sheet
CLOCK INPUT (REF_CLK)
REFCLK OVERVIEW
Table 6. REFCLK_OUT Buffer Control
The AD9957 supports a number of options for producing the
CFR3<29:28> REFCLK_OUT Buffer
internal SYSCLK signal (that is, the DAC sample clock) via the
00 Disabled
REF_CLK
REF_CLK/ input pins. The REF_CLK input can be
01 Low output current
driven directly from a differential or single-ended source, or it 10 Medium output current
can accept a crystal connected across the two input pins. There
11 High output current
is also an internal phase-locked loop (PLL) multiplier that can
be independently enabled. A block diagram of the REF_CLK
CRYSTAL DRIVEN REF_CLK
functionality is shown in Figure 47. The various input configu-
When using a crystal at the REF_CLK input, the resonant
rations are controlled by means of the XTAL_SEL pin and
frequency should be approximately 25 MHz. Figure 48 shows
control bits in the CFR3 register. Figure 47 also shows how the
the recommended circuit configuration.
CFR3 control bits are associated with specific functional blocks.
XTAL_SEL PLL_LOOP_FILTER
90 REF_CLK
95 2
DRV0
CFR3
XTAL
<29:28>
2
91
PLL ENABLE REF_CLK
94
REFCLK_OUT
CFR3
39pF 39pF
REFCLK
<8>
INPUT
SELECT
LOGIC
Figure 48. Crystal Connection Diagram
ENABLE PLL_LOOP_FILTER
1
IN OUT 1
PLL
0
DIRECT DRIVEN REF_CLK
0
CHARGE VCO
SYSCLK
90
REF_CLK
PUMP DIVIDE SELECT
REF_CLK
When driving the REF_CLK/ inputs directly from a
2 7 3
91 signal source, either single-ended or differential signals can be
REF_CLK
I N VCO SEL
CP
used. With a differential signal source, the REF_CLK/REF_CLK
CFR3 CFR3
CFR3
<7:1> <26:24>
<21:19>
1
pins are driven with complementary signals and ac-coupled
0
÷2
with 0.1 µF capacitors. With a single-ended signal source, either a
single-ended-to-differential conversion can be employed or the
REFCLK INPUT REFCLK INPUT
REF_CLK input can be driven single-ended directly. In either case,
DIVIDER RESETB DIVIDER BYPASS
CFR3<14> CFR3<15>
REF_CLK
0.1 µF capacitors are used to ac couple both REF_CLK/
Figure 47. REF_CLK Block Diagram
pins to avoid disturbing the internal dc bias voltage of ~1.35 V.
See Figure 49 for more details.
The PLL enable bit is used to choose between the PLL path or
the direct input path. When the direct input path is selected, the
The REF_CLK/REF_CLK input resistance is ~2.5 kΩ differential
REF_CLK/REF_CLK pins must be driven by an external signal
(~1.2 kΩ single-ended). Most signal sources have relatively low
source. Input frequencies up to 2 GHz are supported. For input
output impedances. The REF_CLK/REF_CLK input resistance is
frequencies greater than 1 GHz, the input divider must be
relatively high; therefore, its effect on the termination impedance
enabled for proper operation of the device.
is negligible and can usually be chosen to be the same as the output
impedance of the signal source. The bottom two examples in
When the PLL is enabled, a buffered clock signal is available at
Figure 49 assume a signal source with a 50 Ω output impedance.
the REFCLK_OUT pin. This clock signal is the same frequency
as the REF_CLK input. This is especially useful when a crystal
is connected, because it gives the user a replica of the crystal
clock for driving other external devices. The REFCLK_OUT
buffer is controlled by two bits as listed in Table 6.
Rev. C | Page 34 of 64
06384-028
06384-027
Data Sheet AD9957
0.1µF
Figure 51 shows the boundaries of the VCO frequency ranges
90 REF_CLK
PECL,
over the full range of temperature and supply voltage variation
LVPECL,
DIFFERENTIAL SOURCE,
OR
TERMINATION
DIFFERENTIAL INPUT.
for an individual device selected from the population. Figure 51
LVDS
DRIVER
shows that the VCO frequency ranges for a single device always
91
REF_CLK
0.1µF
overlap when operated over the full range of conditions.
In conclusion, if a user wants to retain a single default value for
0.1µF
BALUN
(1:1)
90 CFR3<26:24>, a frequency that falls into one of the ranges
REF_CLK
found in Figure 50 should be selected. Additionally, for any
SINGLE-ENDED SOURCE,
50Ω
DIFFERENTIAL INPUT.
given individual device, the VCO frequency ranges overlap,
91
REF_CLK
meaning that any given device exhibits no gaps in its frequency
0.1µF
coverage across VCO ranges over the full range of conditions.
0.1µF
90 FLOW = 920
REF_CLK VCO5
FHIGH = 1030
SINGLE-ENDED SOURCE,
50Ω
SINGLE-ENDED INPUT.
FLOW = 760
VCO4
FHIGH = 875
91
REF_CLK
0.1µF
FLOW = 650
VCO3
FHIGH = 790
Figure 49. Direct Connection Diagram
FLOW = 530
VCO2
FHIGH = 615
PHASE-LOCKED LOOP (PLL) MULTIPLIER
FLOW = 455
VCO1
FHIGH = 530
An internal phase-locked loop (PLL) provides users of the
AD9957 the option to use a reference clock frequency that is
FLOW = 400
VCO0
FHIGH = 460
significantly lower than the system clock frequency. The PLL
supports a wide range of programmable frequency multiplica- 395 495 595 695 795 895 995
(MHz)
tion factors (12× to 127×) as well as a programmable charge
Figure 50. VCO Ranges Including Atypical Wafer Process Skew
pump current and external loop filter components (connected
via the PLL_LOOP_FILTER pin). These features add an extra
FLOW = 810
layer of flexibility to the PLL, allowing optimization of phase
VCO5
FHIGH = 1180
noise performance and flexibility in frequency plan develop-
FLOW = 646
ment. The PLL is also equipped with a PLL_LOCK pin.
VCO4 FHIGH = 966
FLOW = 574
The PLL output frequency range (fSYSCLK) is constrained to the
VCO3 FHIGH = 904
range of 420 MHz ≤ f ≤ 1 GHz by the internal VCO. In
SYSCLK
FLOW = 469
addition, the user must program the VCO to one of six operating
VCO2
FHIGH = 709
ranges such that f falls within the specified range. Figure 50
SYSCLK
FLOW = 402
and Figure 51 summarize these VCO ranges.
FHIGH = 602
VCO1
Figure 50 shows the boundaries of the VCO frequency ranges
FLOW = 342
VCO0
FHIGH = 522
over the full range of temperature and supply voltage variation
335 435 535 635 735 835 935 1035 1135
for all devices from the available population. The implication is
(MHz)
that multiple devices chosen at random from the population and
Figure 51. Typical VCO Ranges
operated under widely varying conditions may require different
values to be programmed into CFR3<26:24> to operate at the
Table 7. VCO Range Bit Settings
same frequency. For example, Part A chosen randomly from the
VCO SEL Bits
population, operating in an ambient temperature of −10°C with
(CFR3<26:24>) VCO Range
a system clock frequency of 900 MHz may require CFR3<26:24>
000 VCO0
to be set to 100b. Whereas Part B chosen randomly from the
001 VCO1
population, operating in an ambient temperature of 90°C with a
010 VCO2
system clock frequency of 900 MHz may require CFR3<26:24>
011 VCO3
to be set to 101b. If a frequency plan is chosen such that the
100 VCO4
system clock frequency operates within one set of boundaries
101 VCO5
(as shown in Figure 51), the required value in CFR3<26:24> is
110 PLL Bypassed
consistent from part to part.
111 PLL Bypassed
Rev. C | Page 35 of 64
06384-029
06384-056 06384-057
AD9957 Data Sheet
PLL CHARGE PUMP
In the prevailing literature, this configuration yields a third-
order, Type II PLL. To calculate the loop filter component
The charge pump current (ICP) is programmable to provide the
values, begin with the feedback divider value (N), the gain of
user with additional flexibility to optimize the PLL performance.
Table 8 lists the bit settings vs. the nominal charge pump the phase detector (KD), and the gain of the VCO (KV) based on
current. the programmed VCO SEL bit settings (see Table 1 for KV). The
loop filter component values depend on the desired open-loop
Table 8. PLL Charge Pump Current bandwidth (fOL) and phase margin (φ), as follows:
I (CFR3<21:19>) Charge Pump Current, I (μA)
CP CP
πNf 1
OL
R1= 1+ (7)
000 212
K K sin(φ)
D V
001 237
010 262
K K tan(φ)
D V
C1= (8)
011 287 2
2N(πf )
OL
100 312
101 337 K K 1− sin(φ)
D V
C2= (9)
2
110 363
N(2πf ) cos(φ)
OL
111 387
where:
K equals the programmed value of I .
D CP
EXTERNAL PLL LOOP FILTER COMPONENTS
K is taken from Table 1.
V
The PLL_LOOP_FILTER pin provides a connection interface to
attach the external loop filter components. The ability to use
Ensure that proper units are used for the variables in Equation 7
custom loop filter components gives the user more flexibility to
through Equation 9. ICP must be in amps, not μA as appears in
optimize the PLL performance. The PLL and external loop filter
Table 8; KV must be in Hz/V, not MHz/V as listed in Table 1; the
components are shown in Figure 52.
loop bandwidth (fOL) must be in Hz; the phase margin (φ) must
AVDD be in radians.
For example, suppose the PLL is programmed such that
C1
I = 287 μA, K = 625 MHz/V, and N = 25. If the desired loop
CP V
C2
R1
bandwidth and phase margin are 50 kHz and 45°, respectively,
the loop filter component values are R1 = 52.85 Ω, C1 = 145.4 nF,
and C2 = 30.11 nF.
PLL_LOOP_FILTER
2
PLL LOCK INDICATION
REFCLK PLL
When the PLL is in use, the PLL_LOCK pin provides an active
PLL IN
PFD CP VCO PLL OUT
high indication that the PLL has locked to the REFCLK input
signal. When the PLL is bypassed, the PLL_LOCK pin defaults
÷N
to Logic 0.
Figure 52. REFCLK PLL External Loop Filter
Rev. C | Page 36 of 64
06384-030
Data Sheet AD9957
ADDITIONAL FEATURES
OUTPUT SHIFT KEYING (OSK)
• The maximum amplitude scale factor
• The amplitude step size
The OSK function (Figure 53) is only available in single tone
mode. It allows the user to control the output signal amplitude
• The time interval between steps
of the DDS. Both manual and automatic modes are available.
The amplitude ramp parameters reside in the 32-bit ASF
OSK
register and are programmed via the serial I/O port. The
60
amplitude step interval is set using the 16-bit amplitude ramp
rate portion of the ASF register (Bits<31:16>). The maximum
OSK ENABLE
amplitude scale factor is set using the 14-bit amplitude scale
AUTO OSK ENABLE
factor in the ASF register (Bits<15:2>). The amplitude step size
MANUAL OSK EXTERNAL
is set using the 2-bit amplitude step size portion of the ASF
LOAD ARR AT I/O_UPDATE
14 TO DDS
register (Bits<1:0>). The direction of the ramp (positive or
OSK
16 AMPLITUDE
AMPLITUDE RAMP RATE
CONTROLLER
CONTROL
(ASF<31:16>) negative slope) is controlled by the external OSK pin. When
PARAMETER
the OSK pin is a Logic 1, the slope is positive; otherwise, it is
14
AMPLITUDE SCALE FACTOR
(ASF<15:2>)
negative.
2
AMPLITUDE STEP SIZE
The step interval is controlled by a 16-bit programmable timer
(ASF<1:0>)
that is clocked at a rate of ¼ f
SYSCLK. The timer period sets the
interval between amplitude steps. The step time interval (Δt)
DDS CLOCK
is given by
Figure 53. OSK Block Diagram
4M
∆t=
The operation of the OSK function is governed by four control f
SYSCLK
register bits, the external OSK pin, and the entire 32 bits of the
where M is the 16-bit number stored in the amplitude ramp rate
ASF register. The primary control for the OSK block is the OSK
portion of the ASF register. For example, if f = 750 MHz
SYSCLK
enable bit. When this bit is set, the OSK function is enabled;
and M = 23,218 (0x5AB2), then Δt ≈ 123.8293 μs.
otherwise, the OSK function is disabled. When disabled, the
other OSK input controls are ignored and the internal clocks are
The output of the OSK function is a 14-bit unsigned data bus
shut down to conserve power.
that controls the amplitude of the DDS output (as long as the
OSK enable bit is Logic 1). When the OSK pin is Logic 1, the
When the OSK function is enabled, automatic and manual
OSK output value starts at 0 and increments by the programmed
operation is selected via the Select Auto-OSK bit. When this bit
amplitude step size until it reaches the programmed maximum
is set, the automatic mode is active; otherwise, the manual
amplitude value. When the OSK pin is Logic 0, the OSK output
mode is active.
starts at its present value and decrements by the programmed
Manual OSK
amplitude step size until it reaches 0.
In manual mode, output amplitude is varied by successive write
The OSK output does not necessarily attain the maximum
operations to the amplitude scale factor portion of the ASF
amplitude—the OSK pin may switch to Logic 0 before attaining
register. The rate at which amplitude changes can be applied to
the maximum value.
the output signal is limited by the speed of the serial I/O port.
In manual mode, the OSK pin functionality depends on the
The OSK output does not necessarily reach a value of zero—the
state of the manual OSK external control bit. It is either inoperative
OSK pin may switch to Logic 1 before attaining the zero value.
or used to switch the output amplitude between the programmed
amplitude scale factor value and zero. When operational, a Logic 0 The OSK output is initialized to 0 at power-up. It is also set to 0
on the OSK pin forces the output amplitude to zero whereas a when the OSK enable bit is Logic 0 or when the OSK enable bit
is Logic 1, but the Select Auto-OSK bit is Logic 0.
Logic 1 on the OSK pin causes the output amplitude to be scaled
by the amplitude scale factor value.
The amplitude step size of the OSK output is set by the ampli-
Automatic OSK
tude step size bits in the ASF register according to the values
listed in Table 9. The step size refers to the LSB weight of the
In automatic mode, the OSK function automatically generates
14-bit OSK output.
a linear amplitude vs. time profile (or amplitude ramp). The
amplitude ramp is controlled via three parameters, as follows:
The OSK output cannot exceed the maximum amplitude value
programmed into the ASF register.
Rev. C | Page 37 of 64
06384-031
AD9957 Data Sheet
Table 9. OSK Amplitude Step Size
I/O_UPDATE PIN
ASF<1:0> Amplitude Step Size
By default, the I/O_UPDATE pin is an input that serves as a
00 1
strobe signal to allow synchronous update of the device operating
01 2
parameters. For example, frequency, phase, and amplitude con-
10 4
trol words for the DDS can be programmed using the serial I/O
11 8
port. However, the serial I/O port is an asynchronous interface;
consequently, programming of the device operating parameters
As mentioned earlier, the step interval is controlled by a 16-bit
using the I/O port is not synchronized with the internal timing.
programmable timer. Normally, this timer is loaded with the
Using the pin, I/O_UPDATE, the user can synchronize the
programmed timing value whenever the timer expires, thus
application of certain programmed operating parameters with
initiating a new timing cycle. However, three events cause the
external circuitry when new parameters are programmed into
timer to have its timing value reloaded prior to the timer expiring.
the I/O registers. A rising edge on I/O_UPDATE initiates transfer
One such event is when the Select Auto-OSK bit is transitioned
of the register contents to the internal workings of the device.
from a Logic 0 state to a Logic 1 state followed by an I/O update. A
The transfer of programmed data from the programming
second such event is a change of state in the OSK pin. The third
registers to the internal hardware is also accomplished by
event is dependent on the status of the Load ARR @ I/O Update
changing the state of the profile pins.
bit. If this bit is Logic 0, no action occurs; otherwise, when the
I/O_UPDATE pin is asserted (or a profile change occurs), the
AUTOMATIC I/O UPDATE
timer resets to its initial starting point.
The AD9957 offers an option whereby the I/O update function
PROFILES
is asserted automatically rather than relying on an external
signal supplied by the user. This feature is enabled by setting the
Each of the three operating modes of the AD9957 support the
Internal I/O Update Active bit in CFR2.
use of profiles, which consist of a group of registers containing
pertinent operating parameters for a particular operating mode.
When this feature is active, the I/O_UPDATE pin becomes an
Profiles enable rapid switching between parameter sets. Profile
output pin. It generates an active high pulse each time an inter-
parameters are programmed via the serial I/O port. Once pro-
nal I/O update occurs. The duration of the pulse is approximately
grammed, a specific profile is activated by means of three
12 cycles of SYSCLK. This I/O update strobe can be used to
external pins (PROFILE<2:0>). A particular profile is activated
notify an external controller that the device has generated an
by providing the appropriate logic levels to the profile control
I/O update internally.
pins per the settings listed in Table 10.
The repetition rate of the internal I/O update is programmed
Table 10. Profile Control Pins
via the serial I/O port. Two parameters control the repetition
PROFILE<2:0> Active Profile
rate. The first parameter consists of the two I/O update rate
000 0
control bits in CFR2. The second parameter is the 32-bit word
001 1
in the I/O update rate register that sets the range of an internal
010 2
counter.
011 3
The I/O update rate control bits establish a divide by 1, 2, 4, or 8
100 4
of a clock signal that runs at ¼ fSYSCLK. The output of the divider
101 5
clocks the aforementioned 32-bit internal counter. The repetition
110 6
rate of the I/O update is given by
111 7
f
SYSCLK
f
Consider an application of basic two-tone frequency shift
I /O _UPDATE A
2 B
keying (FSK) where binary data is transmitted by selecting
between two different frequencies: a mark frequency (Logic 1)
where:
and a space frequency (Logic 0). To accommodate FSK, the
A is the value of the 2-bit word comprising the I/O update rate
Profile 0 register is programmed with the appropriate frequency
control bits.
tuning word for a space, and the Profile 1 register is programmed
B is the value of the 32-bit word stored in the I/O update rate
with the appropriate frequency tuning word for a mark. Then,
register.
with the PROFILE1 and PROFILE2 pins tied to Logic 0, the
If B is programmed to 0x0003 or less, the I/O_UPDATE pin no
PROFILE0 pin is used to transmit the data bits. The logic state
longer pulses, but assumes a static Logic 1 state.
of the PROFILE0 pin causes the appropriate mark and space
frequencies to be generated.
Rev. C | Page 38 of 64
Data Sheet AD9957
POWER-DOWN CONTROL
Each of these 16 pins is assigned a unique bit in both the 16-bit
The AD9957 offers the ability to independently power down four
GPIO configuration register and the 16-bit GPIO data register.
specific sections of the device. Power-down functionality applies
The status of each bit in the GPIO configuration register assigns
to the digital core, DAC, auxiliary DAC, and REFCLK input.
the associated pin as either a GPIO input or output (0 = input,
A power-down of the digital core disables the ability to update 1 = output) based on the data listed in Table 11.
the serial I/O port. However, the digital power-down bit can
When a GPIO pin is programmed as an output, the logic state
still be cleared via the serial port to prevent the possibility of a
written to the associated bit of the GPIO data register (via the
nonrecoverable state.
serial I/O port) appears at the GPIO pin. When a GPIO pin is
programmed as an input, the logic state of the GPIO pin can be
Software power-down is controlled through four independent
read (via the serial I/O port) in the associated bit position in the
power-down bits in CFR1. Software control requires forcing the
GPIO data register. Note that the GPIO data register does not
EXT_PWR_DWN pin to a Logic 0 state. In this case, setting the
desired power-down bits (via the serial I/O port) powers down require an I/O update.
the associated functional block; clearing the bits restores the
function. Table 11. GPIO Pins vs. Configuration and Data Register Bits
Pin Label Configuration Bit Data Bit
Alternatively, all four functions can be simultaneously powered
D17 15 15
down via external hardware control through the EXT_PWR_DWN
D16 14 14
pin. Forcing this pin to Logic 1 powers down all four circuit
D15 13 13
blocks, regardless of the state of the power-down bits. That is,
D14 12 12
the independent power-down bits in CFR1 are ignored and
D13 11 11
overridden when EXT_PWR_DWN is Logic 1.
D12 10 10
D11 9 9
Based on the state of the external power-down control bit, the
D10 8 8
EXT_PWR_DWN pin produces either a full power-down or a
D9 7 7
fast recovery power-down. The fast recovery power-down mode
D8 6 6
maintains power to the DAC bias circuitry and the PLL, VCO,
D7 5 5
and input section of the REFCLK circuitry. Although the fast
D6 4 4
recovery power-down does not conserve as much power as the
D3 3 3
full power-down, it allows the device to very quickly awaken
D2 2 2
from the power-down state.
D1 1 1
GENERAL-PURPOSE I/O (GPIO) PORT
D0 0 0
The GPIO function is only available when the AD9957 is pro-
grammed for QDUC mode and the Blackfin interface mode is
active. Because the Blackfin serial interface uses only two of
the 18 parallel data port pins (D<5:4>), the remaining 16 pins
(D<17:6> and D<3:0>) are available as a GPIO port.
Rev. C | Page 39 of 64
AD9957 Data Sheet
SYNCHRONIZATION OF MULTIPLE DEVICES
OVERVIEW The synchronization mechanism relies on the premise that the
The internal clocks of the AD9957 provide the timing for the
REFCLK signal appearing at each device is edge aligned with all
propagation of data along the baseband signal processing path.
others resulting from the external REFCLK distribution system
These internal clocks are derived from the internal system clock
(see Figure 59).
(SYSCLK) and are all submultiples of the SYSCLK frequency.
CLOCK GENERATOR
The logic state of all of these clocks in aggregate during any
given SYSCLK cycle defines a unique clock state. The clock state The clock generator provides the necessary timing for the inter-
advances with each cycle of SYSCLK, but the sequence of clock nal workings of the AD9957. The goal of the synchronization
states is periodic. By definition, multiple devices are synchro- mechanism is to force the clock generator to a known state
nized when their clock states match and they transition between coincident with an external synchronization signal. The clock
states simultaneously. Clock synchronization allows the user to generator consists of three separate clock trees (see Figure 55).
asynchronously program multiple devices, but synchronously The first is a common clock generator that is active for all
programmed modes of operation (single tone, QDUC, or
activate the programming by applying a coincident I/O update
to all devices. It also allows multiple devices to operate in unison interpolating DAC). The common clock generates the
when the parallel port is in use with either the QDUC or inter- SYNC_CLK signal that appears at Pin 55. The second clock
polating DAC mode (see Figure 59) or when the dual serial port generator is active when the device is programmed for the
(BlackFin interface) is in use. interpolating DAC mode or quadrature modulation mode using
the parallel data port. It uses the SYSCLK/2 output of the common
The function of the synchronization logic in the AD9957 is to
clock as its primary timing source. The third clock generator is
force the internal clock generator to a predefined state coincident
active when the device is programmed for quadrature modulation
with an external synchronization signal applied to the SYNC_IN
mode using the BlackFin interface.
pins. Forcing multiple devices to the same clock state coincident
COMMON CLOCK
with the same external signal is, by definition, synchronization.
GENERATOR
Figure 54 is a block diagram of the synchronization function. SYNC
PULSE
The synchronization logic consists of two independent blocks, a
SYSCLK ÷2 ÷2 SYNC_CLK
sync generator and a sync receiver, both of which use the local
CLOCK GENERATOR FOR INTERPOLATING
SYSCLK signal for internal timing.
DAC MODE OR QUADRATURE MODULATION
MODE WITH THE PARALLEL DATA PORT
REF_CLK 90
÷R ÷2
PDCLK
INPUT
SYSCLK REF_CLK
CIRCUITRY
91
6
CLOCK GENERATOR FOR
QUADRATURE MODULATION MODE
WITH THE BLACKFIN INTERFACE
5
÷R ÷2 ÷2 ÷2 ÷2
9
SYNC
SYNC_OUT
GENERATOR
10 SYNC STATE 6
PRESET VALUE
SYNC
SYNC Figure 55. Clock Generator
RECEIVER
RECEIVER
DELAY
ENABLE
5
SYNC GENERATOR
The sync generator block is shown in Figure 56. It is activated
7
INPUT DELAY
SYNC_IN
AND EDGE
via the Sync Generator Enable bit. It allows for one AD9957 in a
8
DETECTION
INTERNAL SYNC
group to function as a master timing source with the remaining
CLOCKS RECEIVER
devices slaved to the master.
12
SETUP AND
SYNC_SMP_ERR
HOLD VALIDATION
6
4
SYNC STATE SYNC SYNC
PRESET VALUE VALIDATION TIMING
DELAY VALIDATION
DISABLE
Figure 54. Synchronization Circuit Block Diagram
Rev. C | Page 40 of 64
CLOCK
GENERATOR
SYNC
GENERATOR
ENABLE
SYNC
POLARITY
SYNC
GENERATOR
DELAY
06384-032
06384-065
Data Sheet AD9957
SYNC RECEIVER
9
PROGAMMABLE
D Q SYNC_OUT
SYSCLK
DELAY
÷16 ÷2R
10
The sync receiver block (shown in Figure 57) is activated via the
LVDS
5 DRIVER
Sync Receiver Enable bit. The sync receiver consists of three
0
R
SYNC
1 subsections: the input delay and edge detection block, the
GENERATOR
DELAY
internal clock generator block, and the setup-and-hold valida-
SYNC
POLARITY
SYNC
tion block.
GENERATOR
ENABLE
The clock generator block remains operational even when the
sync receiver is not enabled.
Figure 56. Sync Generator
The sync receiver accepts an LVDS-compatible signal at the
The sync generator produces an LVDS-compatible clock signal
SYNC_IN pins. Typically, the signal applied to the SYNC_IN
with a 50% duty cycle that appears at the SYNC_OUT pins. The
pins originates from the SYNC_OUT of another AD9957
frequency of the SYNC_OUT signal can be one of two possible
functioning as a master timing unit. The sync receiver expects a
rates. With the AD9957 programmed for any of the following
periodic synchronization pulse that meets certain frequency
modes:
requirements based on the operating mode of the AD9957.
• Single tone mode
When programmed for single tone mode, the frequency of
• Quadrature modulation mode with the CCI filter bypassed
SYNC_IN must satisfy
(that is, interpolation factor is 1)
f
SYSCLK
f =
• Interpolating DAC mode with the CCI filter bypassed (that
SYNC _ IN
4M
is, interpolation factor is 1)
where M is any integer greater than zero. When programmed
The frequency of SYNC_OUT is given by:
for quadrature modulation mode (using the parallel data port)
or interpolating DAC mode, the frequency of SYNC_IN must
f
SYSCLK
f =
SYNC _ OUT
satisfy
16
f
SYSCLK
With the AD9957 programmed for the QDUC or interpolating
f =
SYNC _ IN
16(R+ M)
DAC mode and with the CCI filter not bypassed (that is, R>1)
the frequency of SYNC_OUT is given by
where R is the programmed CCI interpolation factor and M is
f any integer greater than or equal to zero. When programmed
SYSCLK
f =
SYNC _ OUT
for quadrature modulation mode using the BlackFin interface,
32R
the frequency of SYNC_IN must satisfy
where R is the programmed interpolation factor of the CCI filter.
f
SYSCLK
f =
SYNC _ IN
The signal at the SYNC_OUT pins is edge aligned with either
32(R+ M)
the rising or falling edge of the internal SYSCLK signal as deter-
mined by the Sync Polarity bit. Because the SYNC_OUT signal is where R is the programmed CCI interpolation factor and M is
any integer greater than or equal to zero.
synchronized with the internal SYSCLK of the master device, the
master device SYSCLK serves as the reference timing source for
all slave devices.
The user can adjust the output delay of the SYNC_OUT signal
in steps of ~75 ps by programming the 5-bit sync generator
delay word via the serial I/O port. The programmable output
delay facilitates added edge timing flexibility to the overall
synchronization mechanism.
Rev. C | Page 41 of 64
06384-033
AD9957 Data Sheet
CLOCK
SYNC STATE
STATE
PRESET VALUE
SYNC
DELAYED SYNC-IN SIGNAL
RECEIVER
6
ENABLE
SYNC P Q
0
RECEIVER R
. .
DELAY E INTERNAL
. .
S CLOCKS
LVDS
5 . .
E
RECEIVER
RISING EDGE
T
Q
N
DETECTOR
SYNC_IN+
7
PROGAMMABLE
AND
LOAD
DELAY
SYNC_IN– 8 STROBE
GENERATOR
CLOCK
GENERATOR
SETUP AND HOLD
SYNC_SMP_ERR 12
VALIDATION
SYSCLK
4
SYNC
SYNC SYNC PULSE
TIMING
VALIDATION
VALIDATION
DELAY
DISABLE
Figure 57. Sync Receiver
to each device in a group. This flexibility is limited, however,
When a device other than another AD9957 provides the
because the sync state preset value must adhere to certain
SYNC_IN signal it must be LVDS compatible. Furthermore,
bounds to satisfy internal timing requirements. Regardless of
although SYNC_IN is typically considered to be a periodic
the programmed sync state preset value, the preset value is
clock signal, it is not an absolute requirement. It is feasible to
internally constrained to the range, 2 to R, where R is the CCI
drive the SYNC_IN pins with a single synchronization pulse as
filter interpolation factor. A programmed value of 0 or 1 is forced
long as its edge transition meets the setup/hold timing required
to 2, whereas a programmed value greater than R is forced to R.
for the internally generated sync pulse (as detailed later in this
section). However, using a periodic SYNC_IN signal has the
SETUP/HOLD VALIDATION
distinct advantage that should any of the devices arbitrarily lose
Synchronization of the AD9957 internal clock generator with
synchronization it automatically resynchronizes with the arrival
other external devices relies on the ability of the sync receiver’s
of the next SYNC_IN edge.
edge detection circuit to generate a valid sync pulse. This
requires proper sampling of the rising edge of the delayed
The 5-bit sync receiver delay word in the multichip sync register
SYNC_IN signal with the rising edge of the local SYSCLK. If the
delays the SYNC_IN signal in steps of ~75 ps. This provides the
edge timing of these signals fails to meet the setup or hold time
ability to time align the arrival of the SYNC_IN signal to
requirements of the internal latches in the edge detection
multiple devices by compensating for unequal propagation times.
circuitry, the proper generation of a sync pulse is in jeopardy.
The edge detection logic in the sync receiver generates a
The setup-and-hold validation block (see Figure 58) gives the
synchronization pulse (sync pulse) having a duration of one
user a means to validate that proper edge timing exists between
SYSCLK cycle with a repetition rate equal to that of the signal
the two signals. The Sync Timing Validation Disable bit in
applied to the SYNC_IN pins. To produce the sync pulse, the
Control Function Register 2 controls whether or not the setup-
strobe generator samples the delayed rising edge of the SYNC_IN
and-hold validation block is active.
signal with the rising edge of the local SYSCLK. The generation
The validation block makes use of a specified time window
of this sync pulse is crucial to the operation of the synchroniza-
(programmable in increments of ~75 ps via the 4-bit sync
tion mechanism, because it performs the task of placing the
clock generator into a known state. The sync pulse presets the validation delay word in the multichip sync register). The setup
R-divider stage of the internal clock generator, which behaves as validation and hold validation circuits use latches identical to
a presettable downcounter (see Figure 55). The programmable those in both the rising edge detector and strobe generator. The
programmable time window skews the timing between the local
6-bit sync state preset value word in the multichip sync register
SYSCLK signal and the delayed sync-in signal. If the hold valida-
establishes the preset state. The preset state is only active for a
tion and setup validation circuits fail to produce the same logic
single SYSCLK period, after which the clock generator is free to
states, it is an indication of a possible setup or hold violation.
cycle through its state sequence until the next sync pulse arrives
(see Figure 55). In addition to presetting the R-divider, the sync The check logic of Figure 58 monitors the state of the setup and
pulse also synchronously presets the other dividers to a proper hold validation latches. If they are not equal (that is, a potential
state in order to preserve the cadence of the clock tree. setup/hold violation exists), a Logic 1 is stored in an internal
validation result latch; otherwise, a Logic 0 is stored. The state
The ability to program the clock state preset value provides the
of validation result latch appears at the SYNC_SMP_ERR pin.
flexibility to synchronize devices, but with specific relative clock
state offsets by assigning a different sync state preset value word
Rev. C | Page 42 of 64
06384-034
Data Sheet AD9957
The validation result latch is in a reset state whenever the sync Because the programmed value of the sync validation delay
receiver is disabled, which forces the SYNC_SMP_ERR pin to a establishes the time window for a setup/hold measurement,
Logic 0 state. To reset the validation result latch when the sync the amount of delay is an important consideration for proper
operation of the validation block. The value chosen should
receiver is active, however, requires the use of the Sync Timing
Validation Disable bit in the multichip sync register. To make a represent a small fraction of the SYSCLK period. For example,
setup/hold validation measurement is a two-step process. First, if the SYSCLK frequency is 1 GHz (1000 ps period), then a
write a Logic 1 to the sync timing validation disable bit. Then, reasonable sync validation delay value is 4 (~300 ps). This
to make a measurement, write a Logic 0. The first action resets allows the validation block to ensure that the local SYSCLK
the validation result latch and holds it in a reset state; the and the delayed SYNC_IN edges exhibit at least 300 ps of
second action releases the reset state and enables the validation timing separation. Choosing too large a value can cause the
result latch to capture a setup/hold validation measurement. validation block to indicate a setup/hold violation when one
Each time a new setup/hold validation check is desired, this does not exist. Choosing too small a value can cause the
two-step procedure must be performed. validation block to miss a setup/hold violation when one
actually exists.
SYNC RECEIVER
RISING EDGE
FROM
DETECTOR
SYNC
AND STROBE
RECEIVER
GENERATOR
DELAY
TO
LOGIC
CLOCK
GENERATION
SYNC
D Q
LOGIC
PULSE
SETUP AND HOLD VALIDATION
SETUP
VALIDATION
DELAY
D Q
4
12 SYNC_SMP_ERR
4
SYNC VALIDATION
DELAY
4
D Q
SYSCLK
DELAY
HOLD
VALIDATION
SYNC TIMING VALIDATION DISABLE
Figure 58. Sync Timing Validation Block
Rev. C | Page 43 of 64
CHECK LOGIC
06384-036
AD9957 Data Sheet
generator is coordinated with the others. This is the role of the
SYNCHRONIZATION EXAMPLE
synchronization and delay equalization block. This block accepts
To accomplish the synchronization of multiple devices provide
the SYNC_OUT signal generated by the master device and
each AD9957 with a SYNC_IN signal that is edge aligned across
redistributes it to the SYNC_IN input of the slave units (as well
all the devices. If the SYNC_IN signal is edge aligned at all devices,
as feeding it back to the master). The goal of the redistributed
and all devices have the same sync receiver delay and sync state
SYNC_OUT signal from the master device is to deliver an edge-
preset value, then they all have matching clock states (that is,
aligned SYNC_IN signal to all of the sync receivers.
they are synchronized). Figure 59 shows this concept with three
AD9957s in synchronization. One device operates as a master Assuming that all devices share the same REFCLK edge timing
timing unit with the others synchronized to the master. (due to the clock distribution and delay equalization block) and
that all devices share the same SYNC_IN edge timing (due to
The master device must have its SYNC_IN pins included as part
the synchronization and delay equalization block), then all
of the synchronization distribution and delay equalization mecha-
devices should be generating an internal sync pulse in unison
nism. This ensures that the master maintains synchronous timing
(assuming all have the same value for the sync receiver delay).
with the other units.
With the further stipulation that all devices have the same sync
state preset value, then the synchronized sync pulses cause all of
The synchronization mechanism begins with the clock distribu-
the devices to assume the same predefined clock state simultane-
tion and delay equalization block, which ensures that all devices
ously. That is, all devices have their internal clocks fully
receive an edge-aligned REFCLK signal. However, even though
synchronized.
the REFCLK signal is edge aligned among all devices, this alone
does not guarantee that the clock state of each internal clock
CLOCK DISTRIBUTION
AND
CLOCK
DELAY EQUALIZATION
SOURCE
EDGE (FOR EXAMPLE, AD951x)
ALIGNED
AT REF_CLK
INPUTS
REF_CLK
DATA
AD9957
FPGA
MASTER DEVICE
NUMBER 1
SYNC SYNC
IN OUT
EDGE
ALIGNED
AT SYNC_IN
REF_CLK
DATA
INPUTS.
AD9957
FPGA NUMBER 2
SYNC SYNC
IN OUT
SYNCHRONIZATION
DISTRIBUTION AND
DELAY EQUALIZATION
(FOR EXAMPLE AD951x)
REF_CLK
DATA
AD9957
FPGA
NUMBER 3
SYNC SYNC
IN OUT
Figure 59. Multichip Synchronization Example
Rev. C | Page 44 of 64
PDCLK PDCLK PDCLK
06384-035
Data Sheet AD9957
signal process path by updating a parallel register at the proper
I/Q PATH LATENCY
time. The data is transferred from the parallel register to the
The I/Q latency through the AD9957 is easiest to describe in
signal processing chain and all timing has been verified regard-
terms of system clock (SYSCLK) cycles and is a function of the
less of the phase relationship between the updating of the parallel
AD9957 configuration (that is, which mode and which optional
register and the signal processing clock.
features are engaged). The I/Q latency is primarily affected by
the programmable CCI rate. Example
Quadrature modulation mode = 18-bit parallel data
The values in Table 12 should be considered estimates because
Reference clock multiplier = bypassed
observed latency may be data dependent. The latency was
Input scale multiplier = off
calculated using the linear delay model for FIR filters. N = CCI
Inverse CCI = off
rate (programmable interpolation rate, 2 to 63, 1 if bypassed).
CCI rate = 20
Inverse SINC = on
In BFI mode, the latency through the AD9957 may not be con-
Output scale = off
stant for multiple transmissions. This is due to the relationship
between the phase of the clock that drives the first half-band
Latency = (16 × 20) + (4 × 20) + (4 × 20) + (69 × 20) +
filter and the frame sync signal coming from the Blackfin,
(4 × 20 + 8) + 22 + 8 + 2 + 8 = 1988 SYSCLKs
which is unknown and denoted as x in Table 12. The design
successfully transfers data from the data assembler logic to the
Table 12.
Stage Quadrature Modulation Mode—Parallel Quadrature Modulation Mode—BFI Interpolation DAC Mode
Input Demuxplexer 16N (16 + x)N 28N
where x = 0 to 15
Input Scale Multiplier Active: 8N Not available in BFI mode Active: 8N
Bypassed: 4N Bypassed: 4N
Inverse CCI Filter Active: 8N Active: 8N Active: 8N
Bypassed: 4N Bypassed: 4N Bypassed: 4N
Half-Band Filters 69N 345N 69N
CCI Filter Active: 4N + 8 Active: 4N + 8 Active: 4N + 8
Bypass: 2N + 4 Bypass: 2N + 4 Bypass: 2N + 4
Modulator 22 22 0
Inverse Sinc Filter Active: 8 Active: 8 Active: 8
Bypass: 2 Bypass: 2 Bypass: 2
Output Scale Multiplier Active: 12 Active: 12 Active: 12
Bypass: 2 Bypass: 2 Bypass: 2
DAC Interface 8 8 8
Rev. C | Page 45 of 64
AD9957 Data Sheet
POWER SUPPLY PARTITIONING
The AD9957 features multiple power supplies, and their power 1.8 V SUPPLIES
consumption varies with its configuration. This section covers
DVDD (Pin 17, Pin 23, Pin 30, Pin 47, Pin 57, Pin 64)
which power supplies can be grouped together and how the
These pins can be grouped together. Their current consumption
power consumption of each block varies with frequency.
increases linearly with the system clock frequency. A system
clock of 1 GHz produces a typically current consumption of
The values quoted in this section are for comparison only. Refer
610 mA in QDUC mode. There is also a slight (~5%) increase
to Table 1 for exact values. With each group, bypass capacitors of
as fOUT increases from 50 MHz to 400 MHz.
1 μF in parallel with a 10 μF capacitor should be used.
AVDD (Pin 3)
The recommendations here are for typical applications, for
which there are four groups of power supplies: 3.3 V digital, This 1.8 V supply powers the REFCLK multiplier (PLL) and
3.3 V analog, 1.8 V digital, and 1.8 V analog. consumes about 7 mA. For applications demanding the highest
performance with the PLL enabled, this supply should be
Applications demanding the highest performance may require
isolated from other 1.8 V AVDD supplies with a separate
additional power supply isolation.
regulator. For less demanding applications this supply can be
run off the same regulator as Pin 89, Pin 92 with a ferrite bead
3.3 V SUPPLIES
to isolate Pin 3 from Pin 89, and Pin 89.
DVDD_I/O (Pin 11, Pin 15, Pin 21, Pin 28, Pin 45, Pin 56,
Pin 66)
The loop filter for the PLL should directly connect to Pin 3. If
These 3.3 V supplies can be grouped together. The power the PLL is bypassed, pin 3 should still be powered, but isolation
is not critical.
consumption on these pins varies dynamically with serial port
activity.
AVDD (Pin 6)
AVDD (Pin 74 to Pin 77 and Pin 83)
This pin can be grouped together with the DVDD 1.8V supply
pins. For the highest performance, a ferrite bead should be used
These are 3.3 V DAC power supplies that typically consume
for isolation, with a separate regulator being ideal.
about 28 mA. At a minimum, a ferrite bead should be used to
isolate these from other 3.3 V supplies, with a separate regulator
AVDD (Pin 89 and Pin 92)
being ideal. The current consumption of these supplies consist
This 1.8 V supply for the REFCLK input consumes about
mainly of biasing current and do not vary with frequency.
15 mA. The supply can be run off the same as Pin 3 with a
ferrite bead to isolate Pin 3 from Pin 89 and Pin 92. At a
minimum, a ferrite bead should be used to isolate these from
other 1.8 V supplies. However, for applications demanding the
highest performance, a separate regulator is recommended.
Rev. C | Page 46 of 64
Data Sheet AD9957
SERIAL PROGRAMMING
For a read cycle, Phase 2 is the same as the write cycle with the
CONTROL INTERFACE—SERIAL I/O
following differences: Data is read from the active registers, not
The AD9957 serial port is a flexible, synchronous serial commu-
the serial port buffer, and data is driven out on the falling edge
nications port allowing easy interface to many industry-standard
of SCLK.
microcontrollers and microprocessors.
Note that to read back any profile register (0x0E to 0x15), the
The interface allows read/write access to all registers that configure
three external profile pins must be used. For example, if the
the AD9957. MSB-first or LSB-first transfer formats are sup-
profile register is Profile 5 (0x13) then PROFILE<0:2> pins
ported. In addition, the serial interface port can be configured
must equal 101.This is not required to write to profile registers.
as a single pin input/output (SDIO) allowing a two-wire interface,
or it can be configured as two unidirectional pins for input/output
INSTRUCTION BYTE
(SDIO/SDO), enabling a 3-wire interface. Two optional pins
The instruction byte contains the following information as
CS
(I/O_RESET and ) enable greater flexibility for designing
shown in the instruction byte bit map.
systems with the AD9957.
Instruction Byte Information Bit Map
GENERAL SERIAL I/O OPERATION
MSB LSB
There are two phases to a serial communications cycle. The first
D7 D6 D5 D4 D3 D2 D1 D0
is the instruction phase to write the instruction byte into the
R/W X X A4 A3 A2 A1 A0
AD9957. The instruction byte contains the address of the regis-
W
ter to be accessed (see the Register Map and Bit Descriptions R/ —Bit 7 of the instruction byte determines whether a read
section) and defines whether the upcoming data transfer is a or write data transfer occurs after the instruction byte write.
write or read operation. Logic 1 indicates a read operation. Cleared indicates a write
operation.
For a write cycle, Phase 2 represents the data transfer between
the serial port controller to the serial port buffer. The number
X, X—Bit 6 and Bit 5 of the instruction byte are don’t cares.
of bytes transferred is a function of the register being accessed.
A4, A3, A2, A1, A0—Bit 4, Bit 3, Bit 2, Bit 1, and Bit 0 of the
For example, when accessing the Control Function Register 2
instruction byte determine which register is accessed during the
(Address 0x01), Phase 2 requires that four bytes be transferred.
data transfer portion of the communications cycle.
Each bit of data is registered on each corresponding rising edge
of SCLK. The serial port controller expects that all bytes of the
SERIAL I/O PORT PIN DESCRIPTIONS
register be accessed; otherwise, the serial port controller is put
SCLK—Serial Clock
out of sequence for the next communication cycle. However,
The serial clock pin is used to synchronize data to and from the
one way to write fewer bytes than required is to use the I/O_RESET
AD9957 and to run the internal state machines.
pin feature. The I/O_RESET pin function can be used to abort
an I/O operation and reset the pointer of the serial port con-
CS—Chip Select Bar
troller. After an I/O reset, the next byte is the instruction byte.
An active low input that allows more than one device on the
Note that every completed byte written prior to an I/O reset is
same serial communications line. The SDO and SDIO pins go
preserved in the serial port buffer. Partial bytes written are not
to a high impedance state when this input is high. If driven high
preserved. At the completion of any communication cycle, the
during any communications cycle, that cycle is suspended until
AD9957 serial port controller expects the next eight rising
CS CS
is reactivated low. Chip select ( ) can be tied low in
SCLK edges to be the instruction byte for the next communi-
systems that maintain control of SCLK.
cation cycle.
SDIO—Serial Data Input/Output
After a write cycle, the programmed data resides in the serial
port buffer and is inactive. I/O_UPDATE transfers data from Data is always written into the AD9957 on this pin. However,
the serial port buffer to active registers. The I/O update can this pin can be used as a bidirectional data line. Bit 1 of CFR1,
either be sent after each communication cycle or when all serial Register Address 0x00, controls the configuration of this pin.
operations are complete. In addition, a change in profile pins The default is cleared, which configures the SDIO pin as
can initiate an I/O update.
bidirectional.
Rev. C | Page 47 of 64
AD9957 Data Sheet
SDO—Serial Data Out
SERIAL I/O TIMING DIAGRAMS
Data is read from this pin for protocols that use separate lines
Figure 60 through Figure 63 provide basic examples of the tim-
for transmitting and receiving data. In the case where the
ing relationships between the various control signals of the serial
AD9957 operates in a single bidirectional I/O mode, this pin
I/O port. Most of the bits in the register map are not transferred
does not output data and is set to a high impedance state.
to their internal destinations until assertion of an I/O update,
which is not included in the timing diagrams that follow.
I/O_RESET—Input/Output Reset
I/O_RESET synchronizes the I/O port state machines without MSB/LSB TRANSFERS
affecting the addressable registers contents. An active high
The AD9957 serial port can support both most significant bit
input on the I/O_RESET pin causes the current communication
(MSB) first or least significant bit (LSB) first data formats. This
cycle to abort. After I/O_RESET returns low (Logic 0), another
functionality is controlled by Bit 0 in Control Function Register 1
communication cycle can begin, starting with the instruction
(0x00). The default format is MSB first. If LSB first is active,
byte write.
all data, including the instruction byte, must follow LSB-first
convention. Note that the highest number found in the bit range
I/O_UPDATE—Input/Output Update
column for each register is the MSB and the lowest number is
The I/O_UPDATE initiates the transfer of written data from
the LSB for that register (see the Register Map and Bit
the I/O port buffer to active registers. I/O_UPDATE is active
Descriptions section and Table 13).
on the rising edge and its pulse width must be greater than one
SYNC_CLK period. It is either an input or output pin depending
on the programming of the Internal I/O Update Active bit.
INSTRUCTION CYCLE DATA TRANSFER CYCLE
CS
SCLK
I I I I I I I I D D D D D D D D
SDIO 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
Figure 60. Serial Port Write Timing—Clock Stall Low
INSTRUCTION CYCLE DATA TRANSFER CYCLE
CS
SCLK
SDIO I I I I I I I I DON'T CARE
7 6 5 4 3 2 1 0
D D D D D D D D
SDO O7 O6 O5 O4 O3 O2 O1 O0
Figure 61. 3-Wire Serial Port Read Timing—Clock Stall Low
INSTRUCTION CYCLE DATA TRANSFER CYCLE
CS
SCLK
SDIO I I I I I I I I D D D D D D D D
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
Figure 62. Serial Port Write Timing—Clock Stall High
INSTRUCTION CYCLE DATA TRANSFER CYCLE
CS
SCLK
SDIO I I I I I I I I D D D D D D D D
7 6 5 4 3 2 1 0 O7 O6 O5 O4 O3 O2 O1 O0
Figure 63. 2-Wire Serial Port Read Timing—Clock Stall High
Rev. C | Page 48 of 64
06384-039
06384-040 06384-037
06384-038
Data Sheet AD9957
For example, if repetitive changes to phase offset via the SPI
I/O_UPDATE, SYNC_CLK, AND SYSTEM CLOCK
port is desired, the latency of those changes to the DAC output
RELATIONSHIPS
is constant; otherwise, a time uncertainty of one SYNC_CLK
The I/O_UPDATE pin is used to transfer data from the serial
period is present.
I/O buffer to the active registers in the device. Data in the buffer
is inactive. By default, the I/O_UPDATE pin is an input that serves as a
strobe signal to allow synchronous update of the device oper-
SYNC_CLK is a rising edge active signal. It is derived from the
ating parameters. A rising edge on I/O_UPDATE initiates
system clock and a divide-by-4 frequency divider. SYNC_CLK,
transfer of the register contents to the internal workings of
which is externally provided, can be used to synchronize
the device. Alternatively, the transfer of programmed data from
external hardware to the AD9957 internal clocks.
the programming registers to the internal hardware can be
accomplished by changing the state of the PROFILE[2:0] pins.
I/O_UPDATE initiates the start of a buffer transfer. It can
be sent synchronously or asynchronously relative to the
The timing diagram shown in Figure 64 depicts when the data
SYNC_CLK. If the setup time between these signals is met,
in the buffer is transferred to the active registers.
then constant latency (pipeline) to the DAC output exists.
SYSCLK
A B
SYNC_CLK
I/O_UPDATE
DATA IN
N – 1 N N + 1
REGISTERS
DATA IN
N
N + 1 N + 2
I/O BUFFERS
THE DEVICE REGISTERS AN I/O UPDATE AT POINT A. THE DATA IS TRANSFERRED FROM THE ASYNCHRONOUSLY LOADED I/O BUFFERS AT POINT B.
Figure 64. I/O_UPDATE Transferring Data from I/O Buffer to Active Registers
Rev. C | Page 49 of 64
06384-161
AD9957 Data Sheet
REGISTER MAP AND BIT DESCRIPTIONS
REGISTER MAP
Note that the highest number found in the Bit Range column for each register in the following tables is the MSB and the lowest number is
the LSB for that register.
Table 13. Control Registers
Register Bit
Name Range
(Serial (Internal
Bit 7 Bit 0 Default
Address) Address) (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 (LSB) Value
Control <31:24> RAM Open RAM Open Operating Mode 0x00
Function Enable Playback
Register 1 Destination
CFR1
<23:16> Manual Inverse Clear CCI Open Select 0x00
(0x00)
OSK Sinc Filter DDS
External Enable Sine
Control Output
<15:8> Open Autoclear Open Clear Phase Load ARR @ OSK Select 0x00
Phase Accumulator I/O Update Enable Auto-
Accumulator OSK
<7:0> Digital DAC Power- REFCLK Input Aux DAC External Auto SDIO LSB First 0x00
Power- Down Power-Down Power-Down Power-Down Power-Down Input
Down Control Enable Only
Control <31:24> Blackfin Blackfin Bit Blackfin Open Enable 0x00
Function Interface Order Early Frame Profile
Register 2 Mode Sync Enable Registers
CFR2 Active as ASF
(0x01) Source
<23:16> Internal SYNC_CLK Open Read 0x40
Enable
I/O Effective
Update FTW
Active
<15:8> I/O Update Rate Control PDCLK Rate Data Format PDCLK PDCLK TxEnable Q-First 0x08
Control Enable Invert Invert Data
Pairing
<7:0> Open Data Sync Timing Open 0x20
Assembler Validation
Hold Last Disable
Value
Control <31:24> Open DRV0<1:0> Open VCO SEL<2:0> 0x1F
Function
<23:16> Open I <2:0> Open 0x3F
CP
Register 3
<15:8> REFCLK REFCLK Open PLL 0x40
CFR3
Input Input Enable
(0x02)
Divider Divider
Bypass ResetB
<7:0> N<6:0> Open 0x00
Auxiliary <31:24> Open 0x00
DAC
<23:16> Open 0x00
Control
<15:8> Open 0x7F
Register
<7:0> FSC<7:0> 0x7F
(0x03)
I/O Update <31:24> I/O Update Rate<31:24> 0xFF
Rate
<23:16> I/O Update Rate<23:16> 0xFF
Register
<15:8> I/O Update Rate<15:8> 0xFF
(0x04)
<7:0> I/O Update Rate<7:0> 0xFF
Rev. C | Page 50 of 64
Data Sheet AD9957
Table 14. RAM, ASF, Multichip Sync, and Profile 0 Registers
Bit Range
Register Name (Internal Bit 7 Bit Bit 0 Default
(Serial Address) Address) (MSB) Bit 6 Bit5 4 Bit 3 Bit 2 Bit 1 (LSB) Value
RAM Segment <47:40> RAM Address Step Rate 0<15:8>
Register 0 (0x05)
<39:32> RAM Address Step Rate 0<7:0>
<31:24> RAM End Address 0<9:2>
<23:16> RAM End Open
Address 0<1:0>
<15:8> RAM Start Address 0<9:2>
<7:0> RAM Start Open RAM Playback Mode 0<2:0>
Address 0<1:0>
RAM Segment <47:40> RAM Address Step Rate 1<15:8>
Register 1 (0x06)
<39:32> RAM Address Step Rate 1<7:0>
<31:24> RAM End Address 1<9:2>
<23:16> RAM End Open
Address 1<1:0>
<15:8> RAM Start Address 1<9:2>
<7:0> RAM Start Open RAM Playback Mode 1<2:0>
Address 1<1:0>
Amplitude Scale <31:24> Amplitude Ramp Rate<15:8> 0x00
Factor (ASF)
<23:16> Amplitude Ramp Rate<7:0> 0x00
Register
<15:8> Amplitude Scale Factor<13:6> 0x00
(0x09)
<7:0> Amplitude Scale Factor<5:0> Amplitude Step Size<1:0> 0x00
Multichip Sync <31:24> Sync Validation Delay<3:0> Sync Sync Sync Open 0x00
Register (0x0A) Receiver Generator Generator
Enable Enable Polarity
<23:16> Sync State Preset Value<5:0> Open 0x00
<15:8> Sync Generator Delay<4:0> Open 0x00
<7:0> Sync Receiver Delay<4:0> Open 0x00
Profile 0 <63:56> Open Amplitude Scale Factor<13:8> 0x08
Register—Single
<55:48> Amplitude Scale Factor<7:0> 0xB5
Tone (0x0E)
<47:40> Phase Offset Word<15:8> 0x00
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 0 <63:56> CCI Interpolation Rate<7:2> Spectral Invert Inverse 0x00
Register—QDUC CCI Bypass
(0x0E)
<55:48> Output Scale Factor 0x00
<47:40> Phase Offset Word<15:8> 0x00
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Rev. C | Page 51 of 64
AD9957 Data Sheet
Table 15. Profile 1, Profile 2, and Profile 3 Registers
Register
Name Bit Range
Bit 7 Bit 0
(Serial (Internal Default
Address) Address) (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 (LSB) Value
Profile 1 <63:56> Open Amplitude Scale Factor<13:8> 0x00
Register—
<55:48> Amplitude Scale Factor<7:0> 0x00
Single Tone
<47:40> Phase Offset Word<15:8> 0x00
(0x0F)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 1 <63:56> CCI Interpolation Rate<7:2> Spectral Inverse CCI 0x00
Register— Invert Bypass
QDUC (0x0F)
<55:48> Output Scale Factor<7:0> 0x00
<47:40> Phase Offset Word<15:8> 0x00
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 2 <63:56> Open Amplitude Scale Factor<13:8> 0x00
Register—
<55:48> Amplitude Scale Factor<7:0> 0x00
Single Tone
<47:40> Phase Offset Word<15:8> 0x00
(0x10)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 2 <63:56> CCI Interpolation Rate<7:2> Spectral Inverse CCI 0x00
Register— Invert Bypass
QDUC (0x10)
<55:48> Output Scale Factor<7:0> 0x00
<47:40> Phase Offset Word<15:8> 0x00
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 3 <63:56> Open Amplitude Scale Factor<13:8> 0x00
Register—
<55:48> Amplitude Scale Factor<7:0> 0x00
Single Tone
<47:40> Phase Offset Word<15:8> 0x00
(0x11)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 3 <63:56> CCI Interpolation Rate<7:2> Spectral Inverse CCI 0x00
Register— Invert Bypass
QDUC
<55:48> Output Scale Factor<7:0> 0x00
(0x11)
<47:40> Phase Offset Word<15:8> 0x00
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Rev. C | Page 52 of 64
Data Sheet AD9957
Table 16. Profile 4, Profile 5, and Profile 6 Registers
Register Bit
Name Range
(Serial (Internal Default
Address) Address) Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB) Value
Profile 4 <63:56> Open Amplitude Scale Factor<13:8> 0x00
Register—
<55:48> Amplitude Scale Factor<7:0> 0x00
Single Tone
<47:40> Phase Offset Word<15:8> 0x00
(0x12)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 4 <63:56> CCI Interpolation Rate<7:2> Spectral Invert Inverse CCI Bypass 0x00
Register—
<55:48> Output Scale Factor<7:0> 0x00
QDUC
<47:40> Phase Offset Word<15:8> 0x00
(0x12)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 5 <63:56> Open Amplitude Scale Factor<13:8> 0x00
Register—
<55:48> Amplitude Scale Factor<7:0> 0x00
Single Tone
<47:40> Phase Offset Word<15:8> 0x00
(0x13)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 5 <63:56> CCI Interpolation Rate<7:2> Spectral Invert Inverse CCI Bypass 0x00
Register—
<55:48> Output Scale Factor<7:0> 0x00
QDUC
<47:40> Phase Offset Word<15:8> 0x00
(0x13)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 6 <63:56> Open Amplitude Scale Factor<13:8> 0x00
Register—
<55:48> Amplitude Scale Factor<7:0> 0x00
Single Tone
<47:40> Phase Offset Word<15:8> 0x00
(0x14)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 6 <63:56> CCI Interpolation Rate<7:2> Spectral Invert Inverse CCI Bypass 0x00
Register—
<55:48> Output Scale Factor<7:0> 0x00
QDUC
<47:40> Phase Offset Word<15:8> 0x00
(0x14)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Rev. C | Page 53 of 64
AD9957 Data Sheet
Table 17. Profile 7, RAM, GPIO Configuration, and GPIO Data Registers
Bit Range
Register Name (Internal Bit 7 Bit 0 Default
(Serial Address) Address) (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 (LSB) Value
Profile 7 <63:56> Open Amplitude Scale Factor<13:8> 0x00
Register—
<55:48> Amplitude Scale Factor<7:0> 0x00
Single Tone
<47:40> Phase Offset Word<15:8> 0x00
(0x15)
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
Profile 7 <63:56> CCI Interpolation Rate<7:2> Spectral Inverse CCI 0x00
Register— Invert Bypass
QDUC (0x15)
<55:48> Output Scale Factor<7:0> 0x00
<47:40> Phase Offset Word<15:8> 0x00
<39:32> Phase Offset Word<7:0> 0x00
<31:24> Frequency Tuning Word<31:24> 0x00
<23:16> Frequency Tuning Word<23:16> 0x00
<15:8> Frequency Tuning Word<15:8> 0x00
<7:0> Frequency Tuning Word<7:0> 0x00
RAM Register <31:0> RAM Word<31:0>
(0x16)
GPIO <15:0> GPIO Configuration<15:0> 0x00
Configuration
Register (0x18)
GPIO Data <15:0> GPIO Data<15:0> 0x00
Register (0x19)
Rev. C | Page 54 of 64
Data Sheet AD9957
The following section provides a detailed description of each bit
REGISTER BIT DESCRIPTIONS
in the AD9957 register map. For cases in which a group of bits
The serial I/O port registers span an address range of 0 to 25
serve a specific function, the entire group is considered as a
(0x00 to 0x19 in hexadecimal notation). This represents a total
binary word and described in aggregate.
of 26 registers. However, six of these registers are unused, yielding
a total of 20 available registers. The unused registers are 7, 8, 11
This section is organized in sequential order of the serial
to 13, and 23 (0x07 to 0x08, 0x0B to 0x0D, and 0x17).
addresses of the registers. Following each subheading are the
individual bit descriptions for that particular register. The
The number of bytes assigned to the registers varies. That is, the
location of the bit(s) in the register are indicated by or
registers are not of uniform depth; each contains the number
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