www.intel.com Boards and Platforms 41 FEATURES BENEFITS Standards-based, open architecture Boards can be interoperable between multiple vendors’ systems, giving customers more choice ţexibility EfŢcient and economical integration ConŢgurable to custom conŢgurations Faster Time-to-Market—using standards-based modules rather than custom components, customers can focus on their core competence of building their next-generation application set Continuous IA roadmap provides future security High Density Demand for ţoor space is at an all time high. Intel’s high-density SBCs can reduce the overall cost of equipment space and minimize system volume Low power/thermals Intel’s Processor boards make use of innovative designs to minimize power consumption and provide superior thermal characteristics Serviceability These modular boards are active FRUs, which can easily be replaced in the Ţeld in under 5 minutes; without disrupting the other pieces of the system High Availability Intel’s High Availability Single Board Computers support 99.999 percent uptime, which is becoming increasingly important to customers. This is provided by redundant power supplies, CPUs, hard drives, etc. The RSS capabilities, which allow hot-swappable boards with minimal impact on applications or calls on other boards, also help provide this redundancy IPMI Management Allows operators to remotely monitor system health, individual sensor data, FRU data and exert power-up/down control. Enables full management of all IPMI-based SBCs and peripherals in a platform PROCESSOR BOARD COMPARISON PRODUCT NAME ZT 5502A-1B ZT 5503 ZT 5541 ZT 5550 ZT 5523 ZT 5504 Board Size 6U 6U 6U 6U 6U 6U Board Type System Master System Master Peripheral Master RSS High Availability System Master System Master # Skus 122223 # CPUs 111121 ® ® ® ® CPU Intel Pentium III, LP 500 MHz Intel Pentium III, 850 MHz Intel Pentium , LP 500 MHz Intel Pentium III, LP 500 MHz Intel Pentium III, 733 MHz (1A) Intel Pentium III, 850 MHz (1B) or Intel Pentium III, or Intel Pentium III, 866 MHz LP 700 MHz (1D) (1B) CPU Type Low-Power BGA2 BGA2 Low-Power BGA2 Mobile Module FC-BGA BGA2 PICMG 2.16 Compatible No No No No No Yes FSB 100 MHz 100 MHz 100 MHz 100MHz 133 MHz 100 MHz CompactPCI Bus Interface 64-bit/33 MHz 64-bit/33 MHz 64-bit/33 MHz 64-bit/33 MHz 64-bit/33 MHz (1B) or 64-bit/33 MHz 64-bit/66 MHz (1A) Memory 256MB ECC SDRAM 512MB or 1GB ECC SDRAM 256MB ECC SDRAM 256MB ECC SDRAM 1GB ECC SDRAM 512MB or 1GB ECC SDRAM Flash 4 Mbytes, On-board 4 Mbytes, On-board 4 Mbytes, On-board 4 Mbytes, On-board 4 Mbytes On-board 4 Mbytes, On-board Hard Drive 10GB 10GB 10GB 10GB 10GB 10GB PMC Slots 1111 (1F) None 1 Video On-board (CHPS69000) On-board (CHPS69000) On-board (CHPS69000) AGP Mezzanine On-board (CHPS69000) On-board (CHPS69000) Chipset 440BX 440GX 440BX 440BX ServerWorks Serverset III LE 440GX Management Controller No No No No No IPMI-Based BMC Front Panel I/O Serial Ports 111221 USB Ports 121212 PS/2 101110 Ethernet 121222 VGA 1 1 1 Mezzanine 1 1 Companion RPIO ZT 4805 ZT 4804/ZT 4806 ZT 4805 ZT 4802/ZT 4804 / ZT 4806 ZT 4804/ZT 4806 ZT 4807 Chassis Compatibility ZT 5082C Yes Yes Yes No Yes (1B Only) No ZT 5083 No No Yes Yes No No ZT 5084 No No Yes Yes No No ZT 5087 No Yes Yes No Yes (1B Only) No ZT 5090 No No No No No Yes Extended OS Support Red Hat Linux* Yes Yes Yes Yes Yes Yes VX Works* Yes Yes Yes Yes Yes Yes Windows* 2000 Yes Yes Yes Yes Yes Yes Windows NT* Yes No Yes Yes No No 42 Boards and Platforms www.intel.com ® The Embedded Intel Architecture Divison Chassis Family ntel anticipates customer needs with modular, standards-based building block platforms featuring high availability, hot Iswap, and computer telephony capabilities, and NEBS-compliant designs. Intel’s chassis are designed to support appropriate processor board applications thus ensuring more rapid time-to-market for customers. High Availability Chassis—ZT 5083 and ZT 5084 ntel’s ZT 5083 and ZT 5084 high availability (HA) CompactPCI platforms provide a carrier-grade computing system for Idemanding mission-critical applications. They support Ţve-nines (99.999 percent) availability with built-in redundancy for active system components including system-slot CPU boards, power supplies, and alarming. All components are hot- swappable. Intel’s HA platforms are ideal for telecom applications requiring high system availability such as enhanced services, media gateway and broadband access servers, or any critical computing platform destined for the central ofŢce. General-Purpose Chassis—ZT 5082 and ZT 5087 he ZT 5082 and ZT 5087 are both ideal development platforms for Telecom applications that need high slot counts Tand integrated cooling solutions. The ZT 5082 is a 10U chassis with 425W of power and an integrated cooling system. The ZT 5087 is a 4U chassis with 600 total Watts of power in an N+1 redundant conŢguration supporting an H.110 cPCI backplane. Both products can meet the needs of telecom equipment providers that need a platform to support high- performance processors in products such as media servers and gateways, softswitches, cellular base station controllers, broadband access controllers, cable modem headends, and DSL access multiplexers. Packet Switch Backplane Chassis (PICMG 2.16 Compliant)—ZT 5090 he newest addition to the CompactPCI speciŢcation, PICMG 2.16, blends the beneŢts of CompactPCI with the broad Tacceptance of Ethernet to provide an economical, scalable path to the next-generation Internet and voice communications network. Backplane interconnect speeds are user-deŢnable and scalable from 10 Mbps to 2000 Mbps per node slot, allowing customers to start with a lower-cost, lower-speed set of components and upgrade as needed. The ZT 5090 4U General Purpose Packet Switch Platform is one of several telecom building blocks from Intel, providing OEM equipment designers with standards-based development solutions built on the PICMG 2.16 speciŢcation. This high-density CompactPCI platform features seven compute board slots and an eighth slot reserved for an integrated layer 2/3 Ethernet switch, transversely mounted in a 4U enclosure, making it ideal for carrier-grade telecom and Internet applications. www.intel.com Boards and Platforms 43 PLATFORM/CHASSIS COMPARISON PRODUCT NAME ZT 5082C ZT 5083 ZT 5084 ZT 5087 ZT 5090 Chassis Height 10U 15U 10U 4U 4U Platform Type CompactPCI Development HA, Redundant System Slot HA, Redundant System Slot CompactPCI Production Platform PICMG 2.16 Development Platform Development Platform Production Platform Platform Chassis Dimensions 160mm X 80mm 160mm X 80mm 160mm X 80mm 160mm X 80mm 160mm X 80mm Total Slots 8 14 14 8 8 SBC Slots 8 12 Peripheral slots, 2 RSS 12 Peripheral slots, 2 RSS 7 8 (1 switch) PICMG 2.16 Compatible No No No No Yes NEBS LEVEL* Meets or exceeds GR-63-CORE Meets or exceeds GR-63-CORE Designed to Meet GR-63-CORE Designed to Meet GR-63-CORE Designed to Meet GR-63-CORE and GR-1089-CORE and GR-1089-CORE and GR-1089-CORE and GR-1089-CORE and GR-1089-CORE Bus Segmentation [8] 33MHz, 64-bit [7,7]-RSS 33MHz, 64-bit [7,7]-RSS 33MHz, 64-bit [7] 33MHz, 64-bit [4,4] 66MHz, 64-bit H.110 YES YES YES YES YES System Management No SMBus-based System Alarm SMBus-based System Alarm SMBus-based Alarming via the IPMI-based Chassis Management via System Master Boards via System Master Boards Media Carrier Alarm Board Module Total Power 425W 450W 450W 400W 750W AC/DC Input AC AC/DC AC/DC AC/DC AC/DC Power/SBC Slot 45W 25W for Peripheral Boards 25W for Peripheral Boards 40W 45W Airţow Front to Rear Front to Rear Front to Rear Side to Rear Side to Rear Components Power One 425W ATX Supply N+1, N=3 (150W each) N+1, N=3 (150W each) N+1, N=2 (200W each) N+1, N=2 (250W each) Cooling 1 tray, 2 fans N+1, N=3 Fans Card Cage: N+N , N=2 1 tray, 2 fans 1 tray, 2 fans Power Supplies: 1 Chassis Mgmt Modules No 2 RSS System Master Boards 2 RSS System Master Boards 1 Media Carrier Alarm Board 1 CMM Ethernet Switches00001 Power Inputs 1 IEC-320 AC input 2 IEC-320 AC inputs, 1 DC terminal block or 1 DC terminal block or 2 DC Terminal Blocks 1 IEC-320 AC input 1 IEC-320 AC input Media Bay CD-ROM, Floppy Drive, HDD 2 CD-ROMs 2 slimlime CD-ROMs CD-ROM, HDD No * The platform meets or exceeds the following Network Equipment Building System (NEBS) Level 3 requirements: GR-1089-CORE EMC Section 2 and 3, Electromagnetic Compatibility GR-63-CORE, Physical Protection, section 4.1, 4.3, 4.4 (Earthquake Zone 4, Equipment Handling, Temperature, Humidity, Altitude) 44 Boards and Platforms www.intel.com ® The Embedded Intel Architecture Division Component Family ntel is pleased to provide a complete family of packet switched backplane (PICMG 2.16 speciŢcation-compliant) building Iblocks including a general-purpose platform, system master processor board, PICMG 2.9 speciŢcation-compliant chassis management module, rear-panel transition boards and 10/100 Ethernet switch. These building blocks support management and switching and can be augmented by EID’s selection of off-the-shelf backplanes, rear-panel transition boards, and power supplies which can further promote customer design goals. PRODUCT NAME ZT 4802A ZT 4804B ZT 4805A ZT 4806A ZT 4807A Production Release Date Shipping Now Shipping Now Shipping Now Shipping Now Shipping Now Board Size 6U 6U 6U 6U 6U PICMG 2.16 Compatible No No No No Yes Interfaces Ethernet 02222 Serial Ports 02222 PS/2 02121 VGA 10101 USB 00102 Parallel Port 0 0 1 (internal) 0 0 Floppy Drive Connector 0 1 (internal) 1 (internal) 1 (internal) 1 (internal) IDE Connector 0 1 (internal) 2 (internal) 1 (internal) 1 (internal) PC Speaker Interface 0 0 1 (internal) 0 1 (internal) Power Connector for external 0 1 0 1 interfaces CompactFlash Connector 0 0 1 (internal) 0 1 (internal) SMBus interface for alarm 0 2 x 8-bit registers 0 0 0 control ® Intel Communications and Media Building Block Products Source Book May 2002 United States and Canada Intel Corporation Robert Noyce Building 2200 Mission College Boulevard P.O. Box 58119 Santa Clara, CA 95052-8119 USA Phone: (408) 765-8080 Europe Intel Corporation (UK) Ltd. Pipers Way Swindon Wiltshire SN3 1RJ UK May 2002 Phone: England (44) 1793 403 000 Germany (49) 89 99143 0 France (33) 1 4694 7171 Italy (39) 02 575 441 Israel (972) 2 589 7111 Netherlands (31) 20 659 1800 Asia Pacific Intel Semiconductor Ltd. 32/F Two Pacific Place 88 Queensway, Central Hong Kong SAR Phone: (852) 2844-4555 Japan Intel Kabushiki Kaisha P.O. Box 300-8603 Tsukuba-gakuen 5-6 Tokodai, Tsukuba-shi Ibaraki-ken 300-2635 Japan Phone: (81) 298-47-8511 South America Intel Semicondutores do Brazil Av. Dr. Chucri Zaidan, 940, 10th floor Sao Paulo Brazil Phone: (55) 11 3365 5500 Copyright © 2002 Intel Corporation Intel, and the Intel logo are registered trademarks of Intel Corporation. * Other brands and names are the property of the respective owners. Printed in USA/2002/15K/MD/HP Order No. 250277-001