Product 108-51087 Specification PRE: 13 Sep 2011 Rev D Lee Yuen Mei DCR No. D20110912220240_811139 APP: Leong See Fan HPI CONNECTOR, 2.0mm PITCH, LOCKING TYPE 1. SCOPE This specification covers the requirements for product performance, test methods and quality assurance provisions for High Performance Interconnect (HPI) Connectors, 2.0mm Pitch, Locking Type. The applicable product descriptions and part numbers are as follows: Part Number Part Description HPI 2.0 Receptacle Housing, 1735447 with lock, 3~16 Position HPI 2.0 Receptacle Housing, 2041423 with lock, Low profile, 3~16 Position 2mm Pitch HPI Post Header, Vertical, 1735446 with lock, 3~16 Position 2. APPLICABLE DOCUMENTS The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1 TYCO Specifications A. 109-1 Test Specification, General Requirements for Test Methods B. 109 series Test Specification C. 501-51084 Qualification Test Report ©2011 Tyco Electronics Corporation, * Trademark 1 of 8 a TE Connectivity Ltd. Company | Indicates change All Rights Reserved TE logo is a trademark. Other products, logos, and company names might be trademarks of their respective owners. LOC. DY 108-51087 3. REQUIREMENTS 3.1. Design and Construction Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2 Materials A. Housing Material : Thermoplastics, Natural Flame Class Rating : UL 94V-0 B. Contact Material : Copper Alloy Finish : Bright Tin Plated Over Nickel Under-plate All Over 3.3 Ratings Voltage :3A, 100 VAC/DC 1A, 250 VAC/DC Operating Temperature :-25°C to +85°C Current : AWG #24 – 3.0A AWG #26 – 2.0A AWG #28 – 1.5A AWG #30 – 1.0A 3.3.1 Applicable wires 2 2 A. Wire size: AWG #30 -- #24 (0.05mm – 0.22mm ) B. Insulation diameter: 0.9mm – 1.5mm Note: The compatibility of wires for termination must be evaluated accordingly by the category from each manufacturer, brand, tradenames and product catalogue numbers 3.3.2 Applicable Printed Circuit Board A. Board thickness: 1.0mm – 1.6mm B. Hole diameter: 0.8mm – 0.9mm Rev D 2 of 8 108-51087 3.4 Performance Requirements and Test Descriptions The product is designed to meet the electrical, mechanical and environmental performance requirements as specified in Figure 1. All tests are performed at ambient environmental conditions per Tyco specification 109-1 unless otherwise specified. 3.5 Test Requirements and Procedure Summary Para Test Items Requirements Procedure 3.5.1 Conformity of Shall conform to the Visually inspected per applicable quality product physical Product Drawing and inspection plan requirements Application Specification Electrical Requirements 3.5.2.1 Contact 10 m
Max. (Initial) Subject mated contacts assembled in housing Resistance 20 m
Max. (Final) to 20mV Max open circuit at 10mA Max 3.5.2.2 Dielectric Connector must Measure by applying test potential between Strength withstand test potential adjacent contacts, and between the contacts of 1000 VAC for 1 and ground in the mated connector assembly. minute. Current leakage: 5.0mA max. 3.5.2.3 Insulation 1000 M
Min.(Initial) Measure by applying test potential between Resistance 500 M
Min.(Final) adjacent contacts, and between the contacts and ground in the mated connector assembly. Mechanical Requirements 3.5.3.1 Connector Subject terminated connector and header to Mating/Un- See Figure 2 mating and un-mating (to measure the force mating Force required to engage and disengage) at a rate of 25mm/min. 3.5.3.2 Individual Pin Insertion Extraction Subject terminated contact and pin to mate Insertion/ Force Force and un-mate to measure the force required to Extraction Force engage and disengage at the rate of 0.7kgf 0.10kgf MIN 25mm/min. MAX (Initial) 0.08kgf MIN (Final) Rev D 3 of 8 108-51087 Para Test Items Requirements Procedure 3.5.3.3 Tensile Strength AWG #24 – 3.0kgf min. Apply an axial pull-off load to terminated wire of of Wire contact at a rate of 100mm/min in the axial AWG #26 – 2.0kgf min. Termination direction AWG #28 – 1.0kgf min. AWG #30 – 0.8kgf min. 3.5.3.4 Contact 1.5 kgf min. per contact Apply axial load to terminated contact at a rate Retention Force of 100mm/min. 3.5.3.5 Post Retention 1.0kgf min. per contact Apply axial pull-off load to post contact mounted Force on housing and measure the force required to dislodge post from housing 3.5.3.6 Durability Termination resistance Subject connector assembly to 50 cycles of (repeated (low level) shall be met repeated mating/un-mating at a rate of mating/un- 10cyles/min mating) 3.5.3.7 Vibration No electrical Subject mated connectors to 10-55-10Hz Sinusoidal Low discontinuity greater than traverse in 1 minute at 1.52mm amplitude; 2 hrs Frequency 1μs. Termination in each of the 3 mutually perpendicular planes. resistance (low level) MIL-STD-202, Method 201, Condition A shall be met 3.5.3.8 Solderability The contact solder tails Subject contacts to solderability testing, as should be covered by a specified solder transfer at 245±5°C for 3±0.5s continuous new solder MIL-STD-202, Method 208 coating for minimum 95% of affected area 3.5.3.9 Latch Retention The mated connector Subject mated connectors to axial load at un- Force should withstand a force mating direction at the rate of 25mm/min. of 3kgf MIN and should not be unmated, break off or damage. Rev D 4 of 8 108-51087 Para Test Items Requirements Procedure Environmental Requirements 3.5.4.1 Resistance to No physical damage Subject product mounted on printed circuit Wave Soldering shall occur board to solder bath at 260±5°C for 3±1s Heat MIL-STD-202, Method 210 except as indicated above when testing by manual soldering iron, apply it as 350±10°C for 1-2 without forcing pressure to affect the time contact 3.5.4.2 Thermal Shock Contact resistance (low Subject mated connector assembly to 25 cycle level) shall be met. Must at -55±3°C for 30min; +85±2°C for 30min meet requirement of MIL-STD-202, Method 107, Condition A 3.5.2.2 & 3.5.2.3 3.5.4.3 Humidity- Insulation resistance Subject mated connectors to steady state Temperature (final) 500 MΩ Min. humidity at 40°C and 90-95%RH for 240hrs cycle Termination resistance MIL-STD-202, Method 103, Condition B (low level) shall be met. Dielectric strength shall be met 3.5.4.4 Temperature Termination resistance Subject mated connector assemblies to Life (Heat Aging) (low level) shall be met temperature life at 85±2°C for 240hrs 3.5.4.5 Salt Spray Termination resistance Subject mated/unmated connectors to 5±1% (low level) shall be met salt concentration for 48hrs. MIL-STD-202, Method 101, Condition B Figure 1 Rev D 5 of 8 108-51087 Figure 2 Initial & 50th cycle Mating/Unmating Force th Initial & 50 cycle Circuit Mating Un-mating Force (kgf min) Position Force Without Latch (kgf max) Initial Final 2 2.5 0.8 0.6 3 3.0 0.8 0.6 4 3.5 1.0 0.8 5 4.0 1.0 0.8 6 4.5 1.2 1.0 7 5.0 1.2 1.0 8 5.5 1.4 1.2 9 6.0 1.4 1.2 10 6.5 1.6 1.4 11 7.0 1.6 1.4 12 7.5 1.8 1.6 13 8.0 1.8 1.6 14 8.5 2.0 1.8 15 9.0 2.0 1.8 16 9.5 2.0 1.8 Figure 2 Rev D 6 of 8 108-51087 3.6. Product Qualification and Re-qualification test Test Group Test or Examination A B C D E F G H I J Test Sequence(a) Examination of Product 1, 7 1, 9 1, 5 1, 5 1, 5 1, 5 1, 5 1, 3 1, 3 1,3 Contact Resistance 2, 8 2, 4 2, 4 2, 4 2, 4 2, 4 Dielectric withstanding Voltage 3, 6 Insulation Resistance 2, 5 Mating Force 3, 7 Unmating Force 4, 6 Durability 5 Vibration 3 Solderability 2 Latch Retention Force 2 Resistance to Soldering Heat 2 Thermal Shock 3 Humidity Temperature Cycling 4 3 Temperature Life 3 Salt Spray 3 Figure 3 NOTE：(a）Numbers indicate sequence in which tests are performed. (b）Discontinuities shall not take place in this test group, during tests. Rev D 7 of 8 108-51087 4.0 QUALITY ASSURANCE PROVISIONS 4.1 Qualification Testing A. Test Specimens The test specimens to be used for testing shall be conforming to the requirements of the applicable product drawings. Unless otherwise specified, no samples shall be re-used. B. Test Condition Unless otherwise specified, all tests shall be performed under any combination of the following test conditions: Temperature: 15 - 30°C Relative Humidity: 45 – 75% Atmospheric Pressure: 650-800mmHg 4.2 Re-Qualification Testing If changes significantly affecting form, fit or function are made to the product or manufacturing process, product quality assurance shall co-ordinate re-qualification testing, consisting of all or part of the original testing sequence as determined by development/ product, quality and reliability engineers. 4.3 Acceptance Acceptance is based upon verification that product meets requirements of Figure 1. Failures attributed to equipment, test set-up or operator deficiencies shall not disqualify product. When product failure occurs, corrective action shall be taken and samples re-submitted for qualification. Testing to confirm corrective action is required before re-submittal. 4.4 Quality Conformance Inspection Applicable Tyco quality inspection plan will specify sampling acceptable quality level to be used. Dimensional and functional requirements shall be accordance with applicable product drawing and specification. Rev D 8 of 8