INDUSTRIAL MEMORY SOLUTIONS NAND FLASH PRODUCTS & DRAM MODULES Why chooSe SWiSSbit Swissbit is the largest independent DRAM module and Flash storage manu- facturer in Europe. This enables Swissbit to be a global leader in technology supplying High Quality Memory solutions to the several key market areas which include Industrial, Embedded, Communications & Networking, Military & Aerospace, Automotive, Casino Gaming and Medical Equipment. Swissbit was created from a management buy-out from Siemens Memory Products in 2001 and has over 20 years of experience in the memory industry. Swissbit’s commitment to high quality, reliability, exceptional customer service and competitive pricing is what enables our customers and partners to enjoy a constant source of supply and product commitment for their past, current and future requirements. In more detail Swissbit offers to our customers the following areas of service: Product dePth cuStomization comPliance to - Complete line of DRAM modules - Custom DRAM module and - JEDEC, SDA, CFA, USB-IF, SATA-IO and NAND Flash Solid State Drives Flash designs - RoHS, REACH, WEEE with different interfaces and - Security features - UL form factors - Individual Labeling - FCC, CE - Both leading edge technology - Design In support and legacy product offerings Quality Standard - Extended and Industrial oem ServiceS - ISO 9001:2008 temperature grade products - Controlled Bill of Materials (BOM) - Unique Chip-On-Board (COB) - Serialization and Lot Code Tracking aSSociationS technology - Support of long life cycles - Member of CompactFlash - Small form factor removable - Stringent PCN and ECN process Association (CFA) NAND flash cards - Member of JEDEC - Memory In Package Solutions teSt for reliability - Member of Memory - Advantest, King Tiger Technology Implementers Forum SaleS Service and and Tanisys Technology test - Member of SATA-IO engineering SuPPort equipment - Member of SecureDigital - Fast, effective and competent - World Class Application Testing Association (SDA) sales staff on hand to serve - System Level Test During Burn-In - Member of USB your needs (TDBI) Implementer Forum - Our expert technical staff is - Extended and Industrial - Member of Small Form available for quick response Temperature Testing Factor Special Interest - Joint product qualification service - Environmental Testing Group SFF-SIG - In-House Manufacturing in Germany - Worlds only COB DRAM memory module manufacturer 2 nand flaSh ProductS SD & MMC Cards ...................... 5 CompactFlash™ Cards ................ 7 PATA / IDE SSD ......................... 7 CFast™ Cards ...........................9 SATA SSD ................................9 USB Flash Drives / Modules .........11 dram moduleS Unbuffered DIMM .................... 13 SODIMM ................................ 13 Micro DIMM ........................... 13 Registered DIMM ..................... 15 Mini RDIMM ........................... 15 SORDIMM .............................. 15 chiP on board (cob) Info ..................................... 16 Features ............................... 17 Part numberS NAND Flash Part Numbers ..........18 DRAM Module Part Numbers ...... 19 3 flaSh management mechaniSm - Optimized Error Correction Code - Efficient Algorithms for Bad Block Management - Real Life Time Monitoring - Intelligent Wear Leveling - Power Fail Robustness Sd & mmc card Swissbit’s INDUSTRIAL product lines of SecureDigital (SD) & Multimedia cards are specifically designed, manufactured and tested to withstand extreme environmental conditions. The use of SLC (Single Level Cell) Flash combined with a 32bit RISC controller provides a number of enhanced product features such as built-in error correction, bad block manage- ment, advanced wear leveling algorithms, power loss protection and power saving modes. Special attention is dedicated to the mechanical stability and enhanced ESD protection. A high reliability housing with special connector support provides resistance against bending and torque. Furthermore, the gold plated SD connectors will last a minimum of 10,000 insertions. 4 nand flaSh ProductS microSd Securedigital Securedigital multimedia card (Sd) high caPacity (Sdhc) Series S-200µ S-200 S-220 M-100 Interface Compliance SDA 2.0 SDA 2.0 SDA 2.0, SDHC class 10 MMC 3.31, 4.1 & 4.2 Connector microSD SD SD MMC Physical Form 15.0 x 11.0 x (0.7) 1 mm 32.0 x 24.0 x 2.1 mm 32.0 x 24.0 x 2.1 mm 32.0 x 24.0 x 1.4 mm Flash Type SLC SLC SLC SLC Density 512 MB - 2 GB 512 MB - 2 GB 4 GB - 8 GB 128 MB Extended: -25°C to +85°C Extended: -25°C to +85°C Extended: -25°C to +85°C Extended: -25°C to +90°C Operating Temperature Industrial: -40°C to +85°C Industrial: -40°C to +85°C Industrial: -40°C to +85°C Industrial: -40°C to +90°C Storage Temperature -40°C to +100°C -40°C to +100°C -40°C to +100°C -40°C to +100°C Shock 1,000 G 1,000 G 1,000 G 1,000 G Vibration 15 G 15 G 15 G 15 G Humidity 85 % RH 85°C, 1000 hrs 85 % RH 85°C, 1000 hrs 85 % RH 85°C, 1000 hrs 85 % RH 85°C, 1000 hrs Data Transfer Mode 1 or 4 bit SD, SPI 1 or 4 bit SD, SPI 1 or 4 bit SD, SPI 1 bit MMC, SPI Burst Rate up to 25 MB/s Burst Rate up to 25 MB/s Burst Rate up to 25 MB/s Burst Rate up to 6.5 MB/s Read Seq. up to 24 MB/s Read Seq. up to 24 MB/s Read Seq. up to 22 MB/s Read Seq. up to 5.7 MB/s Performance Write Seq. up to 13 MB/s Write Seq. up to 21 MB/s Write Seq. up to 20 MB/s Write Seq. up to 5.9 MB/s (512 MB-13 MB/s) 2.7 - 3.6 V Normal 2.7 - 3.6 V Normal 2.7 - 3.6 V Normal 2.7 - 3.6 V Normal Voltage 2.0 - 3.6 V Basic Communication 2.0 - 3.6 V Basic Communication 2.0 - 3.6 V Basic Communication 2.0 - 3.6 V Basic Communication RW typ. 35 mA / max. 50 mA RW typ. 35 mA / max. 50 mA Read typ. 80 mA RW typ. 8 mA / max. 15 mA Power Consumption Sleep 0.3 mA (max) Sleep 0.3 mA (max) Write typ. 50 mA Sleep 0.3 mA (max.) Sleep 0.3 mA (max) Swissbit, Part Number, Swissbit, Density, CE, Pb free, Swissbit, Density, CE, Pb free, Swissbit, Density, CE, Pb free, Marking Lot Code, Mfg. Date Part Number, Lot Code, Part Number, Lot Code, Part Number, Lot Code, Mfg. Date Mfg. Date Mfg. Date Target Application Industrial Embedded Systems, Medical Solutions, Point-of-Sales, Gaming Industry, Automation Solutions, etc. Life Time Monitoring over MMC Tools Life Time Monitoring over SD command set command set Part Number SFSDxxxxNxBNxxx-x-xx-1x1-STD SFSDxxxxLxBNxxx-x-xx-1x1-STD SFSDxxxxLxBNxxx-x-xx-1x1-STD SFMMxxxxOxBNxxx-x-xx-1x1-STD - Compliant with SDA2.0 Specifi cation - Compliant with MMC - Optimized Wear Leveling Specifi cation - Life Time Monitoring over extended command set - Optimized Wear Leveling - Intelligent Power Fail Protection & Recovery - Life Time Monitoring over - ESD Protection up to 15kV extended command set - Intelligent Power Fail Protection & Recovery nand flaSh ProductS 5 Pata / ide & comPactflaSh™ card Solid State Drives (SSD) are drop-in replacements for traditional 2.5” hard disk drives (HDD). Swissbit offers the Parallel ATA (PATA) interface SSD with 44-pin IDE connector and CompactFlash™ cards with up to 32GB of flash me- mory. Because SSD’s have no moving parts, vibration and shock tolerance is extended significantly, making them a perfect choice for mobile applications where durability and reliability are crucial. No moving parts also remove the mechanical latencies found in traditional hard disk drives. This directly translates into faster start-up times and extremely low read and write latency times. Temperature ranges are extended and mean time between failure (MTBF) is improved many times compared with traditional HDDs, resulting in a longer operational life of the drive. Offered in standard or industrial temperature ranges, the Swissbit 2.5” SSD is ideal for a wide range of applications in both commercial and industrial markets. At Swissbit we are committed to providing new, evolving and high-performance solid state drive designs based on the ATA interface in combination with SLC NAND flash. c-300 c-320 P-120 Power Fail Protection ++ ++ ++ Power Fail Recovery ++ ++ ++ Industrial Temperature Grade -40°C to 85°C ++ ++ ++ SLC NAND Flash ++ ++ ++ Controlled BOM / PCN Process ++ ++ ++ SBLifeTimeMonitoring (LTM) ++ ++ ++ Standard S.M.A.R.T. Support + ++ ++ SBLTM API/Library + ++ ++ SBLTM Application (Windows) + ++ ++ SBZoneProtection - + + SBZoneProtection Application (Windows) - + + Security Erase / Security Feature Set - + + ++ default implemented; - not available; + on request feature comPariSon SbzoneProtection Security eraSe Sblifetimemonitoring (ltm) Security feature Set The device allows configuring Security Erase is part of the stand- The Swissbit Life Time Monitoring multiple zones with either no pro- ard security feature set. It allows feature allows the device to report tection, write protection or access trigger ing a quick erase of all user its detailed Life Time status, which protected. Each zone is protected data by a software command. allows users to predict imminent with a separate password. A Win- The security feature set also includes failure to avoid data loss. dows tool or a programming library a password system that restricts This feature uses and extends the are available. With this library, the access to user data stored on a device. standard S.M.A.R.T. (Self-Monitoring, functionality can easily be inte- That could be controlled by BIOS. Analysis and Reporting Technology) grated in applications built by the interface or vendor command set customer. with Flash specific information. 6 nand flaSh ProductS comPactflaSh™ comPactflaSh™ Pata SSd 2.5" card card Solid State drive Series C-300 C-320 P-120 Interface Compliance CFA4.1 / CFA3.0 CFA4.1 / CFA3.0, IDE / ATA 133 ATA 44 pin, 2 mm pitch Connector CFC Type I CFC Type I Master/Slave Physical Form 36.4 x 42.8 x 3.3 mm 36.4 x 42.8 x 3.3 mm 100.2 x 69.85 x 9.0 mm Flash Type SLC SLC SLC Density 128 MB to 8 GB 2 GB to 32 GB 2 GB to 32 GB Commercial: 0°C to +70°C Commercial: 0°C to +70°C Commercial: 0°C to +70°C Operating Temperature Industrial: -40°C to +85°C Industrial: -40°C to +85°C Industrial: -40°C to +85°C Storage Temperature -50°C to +100°C -50°C to +100°C -50°C to +100°C Shock 1,500 G 1,500 G 1,500 G Vibration 20 G 20 G 20 G Humidity 85 % RH 85°C, 1000 hrs 85 % RH 85°C, 1000 hrs 85 % RH 85°C, 1000 hrs Data Transfer Mode up to PIO6, MDMA4, UDMA4 up to PIO6, MDMA4, UDMA4 up to PIO4, MDMA2, UDMA4 Burst Rate up to 66 MB/s Burst Rate up to 66 MB/s Burst Rate up to 66 MB/s Read Seq. 1ch up to 24 MB/s Read Seq. up to 45 MB/s Read Seq. up to 45 MB/s Performance 2ch up to 37 MB/s Write Seq. up to 35 MB/s Write Seq. up to 35 MB/s Write Seq. 1ch up to 10 MB/s 2ch up to 20 MB/s Voltage 3.3 V +/- 10 %, 5 V +/- 10 % 3.3 V +/- 10 %, 5 V +/- 10 % 5 V +/- 10 % PIO typ. 50 mA @ 3.3 V PIO typ. 60 mA @ 3.3 V PIO typ. 55 mA @ 5 V Power Consumption DMA typ. 70 mA @ 3.3 V DMA typ. 90 mA @ 3.3 V DMA typ. 135 mA @ 5 V DMA typ. 110 mA @ 5 V DMA typ. 130 mA @ 5 V Swissbit, Density, CE, Pbfree, Part WEEE, Swissbit, Density, CE, Part WEEE, Swissbit, Density, CE, Part Marking Number, Lot Code, Mfg. Date, Number, Lot Code, RoHS Number, Lot Code, RoHS Pin Mode Industrial Embedded Systems, Medical Solutions, Point-of-Sales, Gaming Industry, Target Application Automation Solutions, etc. Tools Windows Freeware Application, API/DLL for extended S.M.A.R.T. option SFCFxxxxHxBK1xx-x-xx-5x3-SMA 1ch Part Number SFCFxxxxHxBOxxx-x-xx-5x3-SMA SFPAxxxxQxBOxxx-x-xx-2x3-STD SFCFxxxxHxBKxxx-x-xx-5x3-SMA 2ch - Compliant with CFA 4.1 / CFA 3.0 Specifi cation - ATA 133 compliant - Optimized Wear Leveling - Optimized Wear Leveling - S.M.A.R.T. support with extended command set - S.M.A.R.T. support with - Intelligent Power Fail Protection & Recovery extended command set - Security Features available - Intelligent Power Fail Protection & Recovery - Security Features available nand flaSh ProductS 7 Sata SSd & cfaSt™ card The CFast™ card combines the original CompactFlash™ (CF) card form factor with a Serial ATA (SATA) interface. With this melting of two industry standards, the CFast™ card specifi cation was created to allow new applications in the embedded and industrial markets. Often in these markets performance, speed, system downtime and flexibility are important design considerations. Swissbit’s CFast™ addresses these challenges while maintaining a small package size and providing high- speed data transfer. The use of the SATA interface on CFast™ cards allows for a vast improvement over slower parallel data transfer methods by offering a bandwidth up to 300 MB/s. For engineers and designers CFast™ off ers the small size, flexibility and features of a CF card while providing the simplicity and speed of a SATA communication interface. The CFast™ card can be opera- ted using a single 3.3 V (+/-5 %) low power source and supports three SATA power management states: Active, Partial and Slumber. The CFast™ is a perfect choice for both fixed and removable applications where low to medium storage densities are required and the physi- cal size of conventional mechanical or solid state hard drives are impractical. The migration effort to CFast™ is further simplified because it electrically complies with the Serial ATA International Organization standard and utilizes the same SATA command set. Also available is the SATA 2.5” SSD form factor for less space relevant applications. hard disk drive Solid State drive hdd SSd advantages advantages - Cheaper price - Faster system boot time - Higher densities - Lighter weight – No R/W Limitation - Low power consumption - Long life time disadvantage chance - Louder noise - Industrial standard compliance - Shock sensitive - Industrial like design and robustness - Lower MTBF values - Real S.M.A.R.T. values are possible drive technology comPariSon 8 nand flaSh ProductS cfaSt™ card Sata SSd 2.5" Solid State drive Series F-100 X-200 Interface Compliance CFast™ - SATA II - 3 GBit/s SATA II - 3 GBit/s Connector CFast™ Type I 15 + 7 pin Serial ATA Physical Form 36.4 x 42.8 x 3.6 mm 100.2 x 69.85 x 9.0 mm Flash Type SLC SLC Density 4 GB - 32 GB 4 GB - 64 GB Commercial: 0°C to +70°C Commercial: 0°C to +70°C Operating Temperature Industrial: -40°C to +85°C Industrial: -40°C to +85°C Storage Temperature -50°C to +100°C -50°C to +100°C Shock 1,500 G 1,500 G Vibration 20 G 20 G Humidity 85 % RH 85°C, 1000 hrs 85 % RH 85°C, 1000 hrs Data Transfer Mode up to PIO4, MDMA2, UDMA6 PIO, MDMA, UDMA6 Burst Rate up to 300 MB/s Burst Rate up to 300 MB/s Performance Read Seq. up to 105 MB/s Read Seq. up to 120 MB/s Write Seq. up to 90 MB/s Write Seq. up to 100 MB/s Voltage 3.3 V +/- 5 % 5 V +/- 10 % UDMA6 typ. 300mA, max. 420mA UDMA6 typ. 260mA, max. 320mA Power Consumption Idle 220mA Idle 140mA WEEE, Swissbit, Density, CE, Part Swissbit, Density, CE, Pb free, Part Marking Number, Lot Code, Mfg. Date, RoHS Number, Lot Code, Mfg. Date, RoHS Industrial Embedded Systems, Medical Solutions, Point-of-Sales, Target Application Gaming Industry, Automation Solutions, etc. Windows Freeware Application, API/ Windows Freeware Application, API/ DLL for extended S.M.A.R.T. option DLL for extended S.M.A.R.T. option Tools Evaluation kit with 2.5” SATA adapter board available Part Number SFCAxxxxHxBRxxx-x-xx-2x6-STD SFSAxxxxQxBRxxx-x-xx-2x6-STD - Alternative for Expensive SATA SSD - Ideal Replacement for 2.5“ - Replacement for CFC by SATA SATA HDDs Chipset - Low Power Consumption - Compliant with CFast™ Rev. 1.0 - No Noise or Temperature Issues Specifi cation - Long Useful Life - SATA II Interface Compliant - S.M.A.R.T. support - S.M.A.R.T. support - Advanced Wear Leveling & Block - Advanced Wear Leveling & Block Management Management - Power Fail Protection - Power Fail Protection - Security Features available - Security Features available nand flaSh ProductS 9 univerSal Serial buS - uSb flaSh drive Universal Serial Bus (USB) interface is very well established and has completely overtaken other forms of serial or parallel interfaces for computer peripherals and memory storage devices. Advantages of USB are its flexibility, reasonably fast serial data transfer rate and its ability to obtain power through the connector. Almost every computer or embedded system supports devices with the standard USB-A-Plug and several internal on-board con nectors. Swissbit is offering both in different form factors and in commercial and industrial operating temperature ranges. State of the art NAND Flash handling, stringent component selection and control qualify Swissbit’s USB Flash Devices (UFDs) not only for commercial but also and especially for embedded and industrial markets. Security features and Life Time Monitoring Tools are supported and already designed into many customer applications. Slc mlc High Density + Low Cost Per Bit + Reliability & Durability + Industrial Temperature + Low-Power Consumption + Write Performance + Partial Program + Low ECC Requirement + Data Retention + Longevity + nand flaSh technology comPariSion 10 nand flaSh ProductS uSb SticK uSb SticK u uS Sb b f fl la aS Sh h m mo od du ul le e Series miniTWIST/CAP unitedCONTRAST II U-110 Interface Compliance USB 2.0 high speed, USB1.1 compliant Standard: 2.54 mm - 10 Pin Connector USB 2.0 A-Plug USB 2.0 A-Plug Low Profi le: 2.00 mm - 10 Pin Physical Form 55.0 mm x 16.0 mm x 7.0-8.0 mm 68.0 mm x 18.0 mm x 8.0 mm 36.8mm x 26.65 mm Flash Type SLC SLC SLC Density 128 MB to 4 GB 512 MB to 8 GB 1 GB to 8 GB Commercial: 0°C to +70°C Commercial: 0°C to +70°C Operating Temperature Commercial: 0°C to +70°C Extended: -25°C to +85°C Extended: -25°C to +85°C Storage Temperature -50°C to +100°C -50°C to +100°C -50°C to +100°C Shock 50 G 50 G 50 G Vibration 15 G 15 G 15 G Humidity 85 % RH 85°C, 1000 hrs 85 % RH 85°C, 1000 hrs 85 % RH 85°C, 1000 hrs Data Transfer Mode full / high speed full / high speed full / high speed 480 Mbit/s USB 2.0 high speed 480 Mbit/s USB 2.0 high speed 480 Mbit/s USB 2.0 high speed Performance Read Seq. up to 18 MB/s Read Seq. up to 32 MB/s Read Seq. up to 32 MB/s Write Seq. up to 12 MB/s Write Seq. up to 23 MB/s Write Seq. up to 23 MB/s Voltage 5 V +/-10 % 5 V +/-10 % 5 V +/-10 % Full Speed max. 80 mA Full Speed typ. 90 mA Full Speed typ. 90 mA Power Consumption High Speed max. 100 mA High Speed typ. 100 mA High Speed typ. 100 mA WEEE, Swissbit, Density, CE, FCC, Marking WEEE, Swissbit WEEE, Swissbit, Density Part Number, Lot Code Industrial Embedded Systems, Medical Solutions, Point-of-Sales, Gaming Industry, Target Application Automation Solutions, etc. Tools Windows SpareBlock read out Windows SpareBlock read out Windows SpareBlock read out SFUIxxxxJxBPxxx-x-xx-2x1-STD Part Number SFU2xxxxDxBPxxx-x-xx-1x1-STD SFU2xxxxExBPxxx-x-xx-1x1-STD SFUIxxxxKxBPxxx-x-xx-2x1-STD - Low Power Consumption - Approved USB Host Solution - Bootable USB Drive - Small Form Factor - Hot Pluggable / Plug & Play - Compliant with USB - Optimized Wear Leveling - Optimized Wear Leveling Specifi cation 2.0 - Rotating Clip or Cap Option - Custom Print Option - Support latest OS as Fixed Drive - Password Manager available - Security Features - Connector Pitch Variations - Password Manager available - Robust Design and Shock Vibration Resistant nand flaSh ProductS 11 DRAM MODULES Swissbit commits to offer highest quality, JEDEC standard and customized DRAM modules for industrial applications. As a DRAM module manufacturer Swissbit uses strategic dual sources of DRAM suppliers to offer our customers a reliable, long term supply of leading edge and legacy memory module products. Special focus is put into working with suppliers that offer extended availability of DRAM die revisions, avoiding frequent requalification efforts with our customers. Swissbit’s quality focus starts with sourcing the highest quality grade DRAMs and where defined, utilizing fully compliant JEDEC module raw cards either as in-house PCB design or from top quality design partners. For all modules the passives and other active components selected are of the highest quality grade. Using Surface Mount Technology (SMT) and Chip-On-Board (COB) processes in production on fully certified facilities in Germany allows Swissbit to sustain a quality focus during the entire assembly process. Traceability is guaranteed through the complete manufacturing and testing flow. A means to ensure the highest quality level for our customer is Swissbit’s world class application testing. Swissbit uses internally developed application software which tests 100 % of all modules under real world conditions with diverse pattern and stress methods and covers the complete memory array including ECC components by constantly adapting to newest memory controller features. For industrial temperature grade modules the application tests are performed at -40°C and 85°C TAMBIENT. Accompanied by stringent internal product qualification, fast customer return processing and the dedication to be an always improving company, Swissbit constantly works on providing to our customers the best DRAM modules available on the market at a competitive price. Swissbit is able and committed to design, manufacture and test customer specific module solutions. With broad experience from COB technology Swissbit can offer PCB design and layout services, development of individual test solutions, thermal simulations, DRAM component sourcing, controlled manufacturing and special coating options. With Swissbit DRAM modules you can keep the total system cost at a minimum. 12 DRAM MODULES UnbUFFERED DiMM pRODUctS L LO On ng g U UD DiiM MM M // S St tA An nD DA AR RD D h hE Eiig gh ht t // W Wiit th h A An nD D W Wiit th hO OU Ut t E Ec cc c Data Rate / CL Density Org Height Voltage Pins Partnumber Package DDR3-UDiMM 1333 / CL9 1 GB - 4 GB x64 1.18“ (29.97 mm) 1.50 V 240 SGUxxx64xxxxxxx-ssR BGA DDR3-UDiMM Ecc 1333 / CL9 1 GB - 4 GB x72 1.18“ (29.97 mm) 1.50 V 240 SGUxxx72xxxxxxx-ssRT BGA DDR2-UDiMM 800 / CL6 512 MB - 2 GB x64 1.18“ (29.97 mm) 1.80 V 240 SEUxxx64xxxxxxx-ssR BGA DDR2-UDiMM Ecc 800 / CL6 1 GB - 2 GB x72 1.18“ (29.97 mm) 1.80 V 240 SEUxxx72xxxxxxx-ssR BGA DDR1-UDiMM 400 / CL3 512 MB - 1 GB x64 1.25“ (31.75 mm) 2.50 V 184 SDUxxx64xxxxxxx-ssR TSOP DDR1-UDiMM 400 / CL3 512 MB - 1 GB x64 1.00“ (25.40 mm) 2.50 V 184 SDUxxx64xxxxxxx-ssR COB DDR1-UDiMM Ecc 400 / CL3 512 MB - 1 GB x72 1.25“ (31.75 mm) 2.50 V 184 SDUxxx72xxxxxxx-ssR TSOP DDR1-UDiMM Ecc 400 / CL3 512 MB - 1 GB x72 1.00“ (25.40 mm) 2.50 V 184 SDUxxx72xxxxxxx-ssR COB SDR-UDiMM 133 / CL3 256 MB - 512 MB x64 1.15“ (29.21 mm) 3.30 V 168 SSUxxx64xxxxxxx-ssR TSOP SDR-UDiMM Ecc 133 / CL3 256 MB - 512 MB x72 1.15“ (29.21 mm) 3.30 V 168 SSUxxx72xxxxxxx-ssR TSOP SODiMM - SO-UDiMM / StAnDARD AnD REDUcED hEight / With AnD WithOUt Ecc Data Rate / CL Density Org Height Voltage Pins Partnumber Package DDR3-SODiMM 1333 / CL9 1 GB - 4 GB x64 1.18“ (29.97 mm) 1.50 V 204 SGNxxx64xxxxxxx-ssRT BGA DDR3-SO-UDiMM 1333 / CL9 1 GB - 4 GB x72 1.18“ (29.97 mm) 1.50 V 204 SGNxxx72xxxxxxx-ssRT BGA DDR2-SODiMM 800 / CL6 512 MB - 2 GB x64 1.18“ (29.97 mm) 1.80 V 200 SENxxx64xxxxxxx-ssR BGA DDR2-SODiMM 800 / CL6 1 GB - 2 GB x64 0.94“ / 1.18“ 1.80 V 200 SENxxx64xxxxxxx-ssR COB DDR1-SODiMM 400 / CL3 256 MB - 1 GB x64 1.25“ (31.75 mm) 2.50 V 200 SDNxxx64xxxxxxx-ssR BGA DDR1-SODiMM 400 / CL3 256 MB - 2 GB x64 1.00“ (25.40 mm) 2.50 V 200 SDNxxx64xxxxxxx-ssR BGA / COB DDR1-SODiMM Ecc 400 / CL3 256 MB - 1 GB x72 1.00“ (25.40 mm) 2.50 V 200 SDNxxx72xxxxxxx-ssR COB SDR-SODiMM 133 / CL3 128 MB - 1 GB x64 1.00“ (25.40 mm) 3.30 V 144 SSNxxx64xxxxxxx-ssR COB SDR-SODiMM Ecc 133 / CL3 128 MB - 1 GB x72 1.00“ (25.40 mm) 3.30 V 144 SSNxxx72xxxxxxx-ssR COB MicRODiMM / 100pin-DiMM Data Rate / CL Density Org Height Voltage Pins Partnumber Package DDR2-MicroDiMM 667 / CL5 1 GB x64 1.18“ (29.97 mm) 1.80 V 214 SEMxxx64xxxxxxx-ssR BGA DDR1-100pin-DiMM 333 / CL2.5 128 MB - 512 MB x32 1.10“ (27.94 mm) 2.50 V 100 SDUxxx32xxxxxxx-ssR TSOP DRAM MODULES 13 inDUStRiAL tEMpERAtURE RAngE DDR2 REgiStERED DiMM SELEctiOn MAtRix Besides modules for commercial Swissbit offers different JEDEC temperature range 0°C to 70°C, RDIMM form factors from standard Swissbit also offers products for an height RDIMM to VLP Mini RDIMM extended temperature range of 0°C or SO-RDIMM. Each product has to 85°C TAMBIENT as well as full industrial special benefits regarding space temperature range -40°C to requirements, cooling, electrical 85°C TAMBIENT. With intensive application performance and price per socket. testing of each individual module at The following list will make it easier low and high temperature, Swissbit for you to choose the right form factor. ensures the highest quality and reli- ability of their products.  Orientation Board space Height Electrical Max DIMM Cooling Price per GB requirement Performance Capacity + socket StD RDiMM Top (std) 0 -- ++ ++ 0 ++ StD RDiMM 25° - 0 ++ ++ - + StD RDiMM 22.5° - 0 ++ ++ - + VLp RDiMM Top (std) 0 0 ++ + + + VLp Mini Top (std) + 0 ++ 0 + 0 RDiMM VLp Mini 25° 0 + ++ 0 - - RDiMM VLp Mini 90° - + ++ 0 -- - RDiMM SO-RDiMM Top ++ -- + 0 ++ - SO-RDiMM 90° (std) -- ++ + 0 -- 0 REgiStERED DiMM cOMpARiSOn ++ optimal solution; + good; o neutral; - some limitations; -- higher restrictions for design 14 DRAM MODULES REgiStERED DiMM pRODUctS LOng RDiMM / StAnDARD hEight / With Ecc AnD c/A pARitY Data Rate / CL Density Org Height Voltage Pins Partnumber Package DDR3-RDiMM 1333 / CL9 1 GB - 4 GB x72 1.18“ (29.97 mm) 1.50 V 240 SGPxxx72xxxxxxx-ssRT BGA Ecc+pARitY DDR2-RDiMM 800 / CL6 1 GB - 4 GB x72 1.18“ (29.97 mm) 1.80 V 240 SEPxxx72xxxxxxx-ssR BGA Ecc+pARitY DDR1-RDiMM 400 / CL3 512 MB - 2 GB x72 1.20“ (30.48 mm) 2.50 V 184 SDRxxx72xxxxxxx-ssR TSOP / BGA Ecc SDR-RDiMM 133 / CL3 256 MB - 512 MB x72 1.20“ (30.48 mm) 3.30 V 168 SSRxxx72xxxxxxx-ssR TSOP Ecc LOW pROFiLE LOng RDiMM, UDiMM / With Ecc Data Rate / CL Density Org Height Voltage Pins Partnumber Package DDR3-RDiMM 1333 / CL9 2 GB - 4 GB x72 0.70“ (17.78 mm) 1.50 V 240 SGPxxx72xxxxxxx-ssR BGA Ecc+pARitY DDR3-UDiMM 1333 / CL9 2 GB - 4 GB x72 0.70“ (17.78 mm) 1.50 V 240 SGUxxx72xxxxxxx-ssR BGA Ecc DDR2-RDiMM 800 / CL6 1 GB - 2 GB x72 0.72“ (18.29 mm) 1.80 V 240 SEPxxx72xxxxxxx-ssR BGA Ecc+pARitY VLp MiniRDiMM With Ecc, REgiStERED SO-RDiMM With Ecc Data Rate / CL Density Org Height Voltage Pins Partnumber Package DDR2-MiniRDiMM 667 / CL5 1 GB x72 0.72“ (18.29 mm) 1.80 V 244 SEHxxx72xxxxxxx-ssR BGA DDR2-SO-RDiMM 667 / CL5 1 GB - 2 GB x72 1.18“ (29.97 mm) 1.80 V 200 SEGxxx72xxxxxxx-ssR BGA DRAM MODULES 15 chip On bOARD (cOb) Swissbit is the world’s only manufacturer utilizing Chip- On-Board (COB) technology to produce a robust line of DRAM memory modules that lend themselves to deman- Bilddaten kommen ding Industrial and Embedded applications. With over vom Kunden 20 years of experience and success in the assembly of COB memory modules, Swissbit enables its customers to take advantage of COB features not found in Surface Mount Technology (SMT) memory modules. cOb DEScRiptiOn Chip-On-board (COB) technology involves mounting Bilddaten kommen DRAM or Flash semiconductor dies directly on a substrate vom Kunden without the need of a packaged component. Eliminating the FBGA or TSOP component package reduces the required substrate area and assembly weight. The saving in area can be as much as 20% in some cases. Using conventional printed circuit boards (PCBs) and standard wire bonding technology, COB technology can yield up to a factor of 5 in weight and volume reduction. COB technology also reduces the number of interconnects between an active die and the substrate (i.e. the package pins) which improves the overall circuit speed, leads to higher clock rates, better electrical performance and improved signal quality and increases the overall reliability of the module. A coating of an Epoxy encapsulent (or Glob Top) is applied that hermetically seals and protects the die and the wire bonded interconnections. The Glob Top also acts like a heat spreader between dies, improves heat emission, adds low coefficients of thermal expansion (CTEs) and provides a hermetically sealed module assembly. The die is glued directly to the PCB to provide increased heat dissipation from the die through the PCB. Swissbit encap- sulates the semiconductor die onto the PCB as a total module package, the complete assembly is extensively temperature tested as a unit, not separate components prior to SMT assembly. This also enables Swissbit to offer iit ts s lliin ne e o of f C CO OB B m mo od du ulle es s iin n f fo ou ur r t te em mp pe er ra at tu ur re e g gr ra ad de e lle ev ve ells s. . 16 cOb bgA Thermal Simulations done by thERMAL cOMpARiSOn FEAtURES A COB memory module as offered by Swissbit provides customers with the following advantages: - Typically Swissbit SODIMMS are 1.00” (25.4 mm) high, low profile format. Typical SMT modules are 1.25” or 1.18“. This enables Swissbit modules to be used in more applications and allows better airflow. - COB modules are 3.0mm thin; typical SMT modules are max. 3.8 mm thick. A thinner design allows for better airflow around the installed module in most applications resulting in cooler operation. (see diagram) - The thermal properties of Swissbit modules are superior to typical SMT modules. COB modules dissipate heat more efficiently and will run lower die junction temperatures in demanding convective cooling conditions. A cooler operating module runs faster and lasts longer. - Our COB module has less lead frame connections then the typical SMT modules, which results in better signal integrity and higher reliability. - Swissbit COB modules are available in commercial temperature grade (0°C to +70°C) and three extended temperature grades up to industrial grade (-40°C to +85°C). - COB modules accept conformal coating better than the typical SMT modules do to their low profile and Glob Top encapsulation. - Swissbit COB modules are inherently ruggedized for shock and vibration due to the COB technology and the Glob Top encapsulation process; typical SMT modules are not ruggedized. - Swissbit COB modules are burned in and 100 % tested at the module level as finished product, not at the IC level before assembly. - All Swissbit COB modules are RoHS compliant. chip On bOARD (cOb) 17 FLASh pARt nUMbER DEcODER - - - - S F cF 2048 h 4 b K 2 SA i Q t * * 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Swissbit Memory (1) Design Option (15) configuration (14) Memory type (2) F: Flash Products pin Mode (13) 0: Normal nCE & R/nB product type (3) 1: Dual nCE & R/nB U2: USB 2.0 Drive 2: Quad nCE & R/nB CA: CFast™ A: LGA 1 nCE & R/nB CF: CompactFlash™ B: LGA 2 nCE & R/nB UI: UFD internal / Module C: LGA 4 nCE & R/nB SD: SecureDigital M: TSOP 1 nCE & R/nB MM: Multimedia Card S: TSOP 2 nCE & R/nB PA: PATA/IDE T: TSOP 4 nCE & R/nB SA: SATA DiE classification (12) Density (4) M: SLC MONO (single die package) D: SLC DDP (dual die package) 0016: 16 MByte 2048: 2 GByte Q: SLC QDP (quad die package) 0032: 32 MByte 4096: 4 GByte N: SLC ODP (octal die package) 0064: 64 MByte 8192: 8 GByte G: MLC MONO (single die package) 0128: 128 MByte 016G: 16 GByte L: MLC DDP (dual die package) 0256: 256 MByte 032G: 32 GByte H: MLC QDP (quad die package) 0512: 512 MByte 064G: 64 GByte O: MLC ODP (octal die package) 1024: 1 GByte 128G: 128 GByte product Dimension (5) TemperaTure raTing (11) I: Industrial Temp. (-40°C - + 85°C) product generation (6) E: Extended Temp. (-25°C - + 85°C) C: Commercial Temp. (0°C - + 70°C) Memory Organization (7) Flash Supplier (10) technology (8) SA: Samsung MT: Micron Technologies HY: Hynix IT: Intel TO: Toshiba NX: Numonyx channels / chips (9) 18 pARt nUMbERS DRAM pARt nUMbER DEcODER g n 02g 64 E1 b F 2 SA - bb R t S * 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Swissbit thermal Sensor / Memory (1) heat Spreader (14) Rohs/ Lead Free (13) product group (2) temperature Rating (12) S: SDRAM SDR D: SDRAM DDR C: (or blank) (0°C to +70°C) E: SDRAM DDR2 E: Ext. Temp.(0°C to +85°C) G: SDRAM DDR3 I: Ext. Temp.(-25°C to +85°C) W: Ind. Temp.(-40°C to +85°C) Module type (3) Speed (11) SDR U: 168 Pin UDIMM 3.3 V DDR3 AA: DDR3-800 CL5 AB: DDR3-800 CL6 R: 168 Pin RDIMM 3.3 V BA: DDR3-1066 CL6 BB: DDR3-1066 CL7 N: 144 Pin SODIMM 3.3 V CA: DDR3-1333 CL7 CB: DDR3-1333 CL8 DDR U: 184 Pin UDIMM 2.5 V CC: DDR3-1333 CL9 R: 184 Pin RDIMM 2.5 V DA: DDR3-1600 CL9 DB: DDR3-1600 CL10 N: 200 Pin SODIMM 2.5 V DC: DDR3-1600 CL11 M: 172 Pin Micro-DIMM 2.5 V DDR2 50: DDR2-400 CL3 37: DDR2-533 CL4 DDR2 U: 240 Pin UDIMM 1.8 V 30: DDR2-667 CL5 3A: DDR2-667 CL4 R: 240 Pin RDIMM 1.8 V, w/o Parity 25: DDR2-800 CL6 2A: DDR2-800 CL5 P: 240 Pin RDIMM 1.8 V, w/ Parity BB: DDR2-1066 CL7 F: 240 Pin FBDIMM DDR 08: DDR-200 CL2 5: DDR-266B CL2.5 N: 200 Pin SODIMM 1.8 V 70: DDR-266A CL2 7A: DDR-266A CL2 G: 200 Pin SO-RDIMM 1.8 V 60: DDR-333B CL2.5 6A: DDR-333A CL2 H: 244 Pin Mini RDIMM 1.8 V, w/ Parity 50: DDR-400B CL3 5A: DDR-400A CL2.5 M: 214 Pin MicroDIMM 1.8 V SDR 10: PC-100 CL3 08: PC-100 CL2 DDR3 U: 240 Pin UDIMM 1.5 V 75: PC-133 CL3 70: PC-133 CL2 P: 240 Pin RDIMM 1.5 V N: 204 Pin SODIMM/SOUDIMM 1.5 V DRAM Manufacturer (10) M: 214 Pin MicroDIMM 1.5 V MT: Micron Technology EP: Elpida Data Depth (4) QI: Qimonda 008: 64 MB 256: 2 GB SA: Samsung 016: 128 MB 512: 4 GB HY: Hynix 032: 256 MB 01G: 1 GB WI: Winbond 064: 512 MB 02G: 2 GB Module Ranks (9) 128: 1 GB 04G: 4 GB 1: 1 Rank Module Data Width (5) 2: 2 Rank Module 32: w/o Parity DRAM Revision (8) 36: w/ Parity 64: w/o ECC DRAM Organization (7) 72: w/ ECC A: x4 E: x8 TSOP Stack printed circuit board with Revision (6) D: x4 TSOP Stack C: x16 B: x8 G: x4 BGA Stack pARt nUMbERS 19 SWiSSbit SALES LOcAtiOnS WORLDWiDE EMEA / APAC North & South America Japan Swissbit AG Swissbit NA Swissbit Japan Inc. Industriestrasse 4 1202 E Winding Creek 4F, 2-40-16 Umesato CH-9552 Bronschhofen Eagle, Idaho 83616 Suginami-ku, Tokyo 166-0011 Switzerland USA Japan Tel. +41 71 913 03 03 Tel. +1 208 938 4525 Tel. +81 3 33 17 12 11 Fax +41 71 913 03 15 Fax +1 914 935 9865 Fax +81 3 33 17 12 22 industrial@swissbit.com sales@swissbitna.com industrial@swissbit.co.jp hEADQUARtER pRODUctiOn pLAnt Swissbit AG Swissbit Germany AG Industriestrasse 4 Wolfener-Strasse 36 CH-9552 Bronschhofen D-12681 Berlin Switzerland Germany Tel. +41 71 913 03 03 Tel. +49 30 936 954 0 Fax +41 71 913 03 15 Fax +49 30 936 954 55 info@swissbit.com WWW.SWiSSbit.cOM 20