PC3H7J00000F Series Mini-flat Half Pitch Package, PC3H7J00000F General Purpose Photocoupler Series ∗ 4-channel package type is also available. (model No. PC3Q67J0000F) ■ Description ■ Agency approvals/Compliance PC3H7J00000F Series contains an IRED optically 1. Recognized by UL1577 (Double protection isolation), coupled to a phototransistor. file No. E64380 (as model No. PC3H7) (∗) It is packaged in a 4-pin Mini-flat package, Half ptich 2. Approved by VDE, DIN EN60747-5-2 (as an type. option), file No. 40009162 (as model No. PC3H7) Input-output isolation voltage(rms) is 2.5kV. 3. Package resin : UL flammability grade (94V-0) Collector-emitter voltage is 80V and CTR is 20% to (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884 400% at input current of 1mA. ■ Features ■ Applications 1. 4-pin Mini-flat Half pitch package (Lead pitch : 1. Programmable controllers 1.27mm) 2. Double transfer mold package (Ideal for Flow Soldering) 3. High collector-emitter voltage (V : 80V) CEO 4. Current transfer ratio (CTR : MIN. 20% at I =1mA, F V =5V) CE 5. Several CTR ranks available 6. Isolation voltage between input and output (V : iso(rms) 2.5kV) 7. Lead-free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: D2-A01902EN 1 Date Jun. 30. 2005 © SHARP Corporation PC3H7J00000F Series ■ Internal Connection Diagram 1 Anode 1 4 2 Cathode 3 Emitter 2 3 4 Collector (Unit : mm) ■ Outline Dimensions VDE option SHARP mark "S" SHARP mark "S" Anode mark Date code Anode mark Date code 1 4 1 4 3H7 3H74 2 3 2 3 ±0.2 ±0.2 4.4 4.4 VDE Indenfication mark ±0.3 ±0.3 5.3 5.3 Epoxy resin Epoxy resin (1.7) (1.7) +0.4 +0.4 0.5 0.5 −0.2 −0.2 +0.2 +0.2 7.0 7.0 −0.7 −0.7 *( ) : Reference Dimensions *( ) : Reference Dimensions Product mass : approx. 0.05g Product mass : approx. 0.05g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A01902EN 2 ±0.3 2.6 ±0.25 1.27 ±0.05 0.2 ±0.1 0.4 ±0.1 ±0.2 0.1 2.0 ±0.3 2.6 ±0.25 1.27 ±0.05 0.2 ±0.1 0.4 ±0.1 ±0.2 0.1 2.0 PC3H7J00000F Series Date code (2 digit) 1st digit 2nd digit Year of production Month of production A.D. Mark A.D Mark Month Mark 1990 2002 P January 1 A 1991 B 2003 R February 2 1992 C 2004 S March 3 1993 D 2005 T April 4 1994 E 2006 U May 5 1995 F 2007 V June 6 1996 H 2008 W July 7 1997 J 2009 X August 8 1998 K 2010 A September 9 1999 L 2011 B October O 2000 M 2012 C November N · · · · 2001 N December D · · repeats in a 20 year cycle Country of origin Japan Rank mark Refer to the Model Line-up table Sheet No.: D2-A01902EN 3 PC3H7J00000F Series ■ Absolute Maximum Ratings (T =25˚C) a Parameter Symbol Rating Unit Forward current I 50 mA F *1 Peak forward current I 1 A FM Reverse voltage V 6 V R Power dissipation P 70 mW Collector-emitter voltage V 80 V CEO Emitter-collector voltage V 6 V ECO Collector current I 50 mA C Collector power dissipation P 150 mW C Total power dissipation P 170 mW tot Operating temperature T −30 to +100 ˚C opr Storage temperature T −40 to +125 ˚C stg *2 Isolation voltage V 2.5 kV iso (rms) *3 Soldering temperature T 260 ˚C sol *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s ■ Electro-optical Characteristics (T =25˚C) a Parameter Symbol Conditions MIN. TYP. MAX. Unit Forward voltage V I =20mA − 1.2 1.4 V F F Input Reverse Current I V =4V − − 10 µA R R Terminal capacitance C V=0, f=1kHz − 30 250 pF t Collector dark current I V =50V, I =0 − − 100 nA CEO CE F Output Collector-emitter breakdown voltage BV I =0.1mA, I =0 80 − − V CEO C F Emitter-collector breakdown voltage BV I =10µA, I =0 6 − − V ECO E F Collector current I I =1mA, V =5V 0.2 − 4.0 mA C F CE Collector-emitter saturation voltage V I =20mA, I =1mA − 0.1 0.2 V CE (sat) F C Transfer 10 11 Isolation resistance R DC500V, 40 to 60%RH 5×10 1×10 − Ω ISO charac- Floating capacitance C V=0, f=1MHz − 0.6 1.0 pF f teristics Rise time t − 4 18 µs r Response time V =2V, I =2mA, R =100Ω CE C L Fall time t − 3 18 µs f Sheet No.: D2-A01902EN 4 Output Input PC3H7J00000F Series ■ Model Line-up Taping Package I [mA] C 3 000pcs/reel Rank mark (I =1mA, V =5V, T =25˚C) F CE a DIN EN60747-5-2 - Approved PC3H7J00000F PC3H7YJ0000F with or without 0.2 to 4.0 PC3H7AJ0000F PC3H7Y1J000F A 0.35 to 0.7 PC3H7BJ0000F PC3H7Y2J000F B 0.5 to 1.0 PC3H7CJ0000F PC3H7Y3J000F C 0.8 to 1.6 PC3H7DJ0000F PC3H7Y4J000F D 1.2 to 2.4 Model No. PC3H7ABJ000F PC3H7Y5J000F A or B 0.35 to 1.0 PC3H7BCJ000F PC3H7Y6J000F B or C 0.5 to 1.6 PC3H7CDJ000F PC3H7Y7J000F C or D 0.8 to 2.4 PC3H7ACJ000F PC3H7Y8J000F A, B or C 0.35 to 1.6 PC3H7BDJ000F PC3H7Y9J000F B, C or D 0.5 to 2.4 PC3H7ADJ000F PC3H7Y0J000F A, B, C or D 0.35 to 2.4 Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A01902EN 5 PC3H7J00000F Series Fig.1 Forward Current vs. Ambient Fig.2 Diode Power Dissipation vs. Ambient Temperature Temperature 100 50 80 40 70 60 30 40 20 20 10 0 0 −30 0 25 5055 75 100 125 −30 0 25 5055 75 100 125 Ambient temperature T (˚C) Ambient temperature T (˚C) a a Fig.3 Collector Power Dissipation vs. Fig.4 Total Power Dissipation vs. Ambient Ambient Temperature Temperature 250 250 200 200 170 150 150 100 100 50 50 0 0 −30 0 25 50 75 100 125 −30 0 25 50 75 100 125 Ambient temperature T (˚C) Ambient temperature T (˚C) a a Fig.5 Peak Forward Current vs. Duty Ratio Fig.6 Forward Current vs. Forward Voltage 10 000 100 Pulse width≤100µs T =25˚C a 50˚C 25˚C 75˚C 0˚C 1 000 100˚C 10 −30˚C 100 1 10 0.1 −3 −2 −1 10 10 10 1 0 0.5 1 1.5 2 Duty ratio Forward voltage V (V) F Sheet No.: D2-A01902EN 6 Collector power dissipation P (mW) Forward current I (mA) C F Peak forward current I (mA) FM Forward current I (mA) Diode power dissipation P (mW) F Total power dissipation P (mW) tot PC3H7J00000F Series Fig.7 Current Transfer Ratio vs. Forward Fig.8 Collector Current vs. Collector-emitter Current Voltage 500 P (max) T =25˚C C a V =5V CE 50 I =30mA F T =25˚C a 20mA 400 10mA 40 300 30 5mA 200 20 100 10 1mA 0 0 02468 10 0.1 1 10 100 Collector-emitter voltage V (V) Forward current I (mA) CE F Fig.9 Relative Current Transfer Ratio vs. Fig.10 Collector - emitter Saturation Voltage Ambient Temperature vs. Ambient Temperature 150 0.16 I =20mA F I =1mA,V =5V I =1mA F CE C 0.14 I =5mA,V =5V F CE 0.12 100 0.1 0.08 0.06 50 0.04 0.02 0 0 −20 0 20 40 60 −40 80 100 −30 0 20 40 60 80 100 Ambient temperature T (˚C) a Ambient temperature T (˚C) a Fig.11 Collector Dark Current vs. Ambient Fig.12 Response Time vs. Load Resistance Temperature −5 1 000 10 V =2V V =50V CE CE I =2mA C −6 10 T =25˚C a 100 −7 10 t r −8 10 10 t f t d −9 10 t s 1 −10 10 −11 10 0.1 −30 0 20 40 60 80 100 0.01 0.1 1 10 100 Ambient temperature T (˚C) Load resistance R (kΩ) a L Sheet No.: D2-A01902EN 7 Collector dark current I (A) Current transfer ratio CTR (%) CEO Relative current transfer ratio (%) Collector-emitter saturation voltage Response time (µs) V (sat) (V) Collector current I (mA) CE C PC3H7J00000F Series Fig.13 Test Circuit for Response Time Fig.14 Collector-emitter Saturation Voltage vs. Forward Current V T =25˚C a CC 10 R R D L Input Output I =0.5mA C 8 Input Output 10% 1mA V CE 3mA 90% 6 t t s d 5mA t t r f 7mA 4 Please refer to the conditions in Fig.12 2 0 02468 10 Forward current I (mA) F Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A01902EN 8 Collector-emitter saturation voltage V (sat) (V) CE PC3H7J00000F Series ■ ■ Design Considerations Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ● Recommended Foot Print (reference) 6.3 1.5 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A01902EN 9 1.27 0.8 PC3H7J00000F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 100 150 to 180˚C, 120s or less 0 0 12 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A01902EN 10 PC3H7J00000F Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A01902EN 11 PC3H7J00000F Series ■ Package specification ● Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F G D J E I L K Dimensions List (Unit : mm) A B C D E F G +0.1 ±0.3 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 12.0 5.5 1.75 8.0 2.0 4.0 φ1.5 −0 H I J K L +0.1 ±0.1 ±0.05 ±0.1 ±0.1 7.5 0.3 2.3 3.1 φ1.6 −0 Reel structure and Dimensions e d g Dimensions List (Unit : mm) a b c d ±1.5 ±1.0 ±0.5 330 13.5 100 13 e f g f ±1.0 ±0.5 ±0.5 a 23 2.0 2.0 b Direction of product insertion Pull-out direction [Packing : 3 000pcs/reel] Sheet No.: D2-A01902EN 12 c H B C A H MAX. 5˚ PC3H7J00000F Series ■ Important Notices · The circuit application examples in this publication are with equipment that requires higher reliability such as: provided to explain representative applications of --- Transportation control and safety equipment (i.e., SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.) circuit design or license any intellectual property rights. --- Traffic signals SHARP takes no responsibility for any problems rela- --- Gas leakage sensor breakers ted to any intellectual property right of a third party re- --- Alarm equipment sulting from the use of SHARP's devices. --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connec- · Contact SHARP in order to obtain the latest device tion with equipment that requires an extremely high lev- specification sheets before using any SHARP device. el of reliability and safety such as: SHARP reserves the right to make changes in the spec- --- Space applications ifications, characteristics, data, materials, structure, --- Telecommunication equipment [trunk lines] and other contents described herein at any time without --- Nuclear power control equipment notice in order to improve design or reliability. Manufac- --- Medical and other life support equipment (e.g., turing locations are also subject to change without no- scuba). tice. · If the SHARP devices listed in this publication fall with- · Observe the following points when using any devices in the scope of strategic products described in the For- in this publication. SHARP takes no responsibility for eign Exchange and Foreign Trade Law of Japan, it is damage caused by improper use of the devices which necessary to obtain approval to export such SHARP de- does not meet the conditions and absolute maximum vices. ratings to be used specified in the relevant specification sheet nor meet the following conditions: · This publication is the proprietary product of SHARP (i) The devices in this publication are designed for use and is copyrighted, with all rights reserved. Under the in general electronic equipment designs such as: copyright laws, no part of this publication may be repro- --- Personal computers duced or transmitted in any form or by any means, elec- --- Office automation equipment tronic or mechanical, for any purpose, in whole or in --- Telecommunication equipment [terminal] part, without the express written permission of SHARP. --- Test and measurement equipment Express written permission is also required before any --- Industrial control use of this publication may be made by a third party. --- Audio visual equipment --- Consumer electronics · Contact and consult with a SHARP representative if (ii) Measures such as fail-safe function and redundant there are any questions about the contents of this pub- design should be taken to ensure reliability and safety lication. when SHARP devices are used for or in connection [E183] Sheet No.: D2-A01902EN 13