SEMTECH SC630

SC630 Fixed 3.3V High Output Charge Pump Buck/Boost Regulator POWER MANAGEMENT Features Description  Input voltage range — 2.9V to 5.5V The SC630 is a high-current voltage regulator using  V tolerance — 3.3V ±3% Semtech’s proprietary low-noise charge pump technol- OUT  V regulation (line + load) ±2% ogy. Performance is optimized for use in single Li-Ion OUT  Continuous output current — 400mA battery cell applications. The regulator provides the per-  Peak output current — 500mA formance of a linear, low drop-out (LDO) voltage regulator  Three charge pump modes — x, .5x and 2x when the battery is greater than 3.3V. Unlike an LDO,  Output ripple ≤ 20mVpp for I ≤ 400mA drop-out is avoided when the battery is less than 3.3V. OUT  Short circuit, over-voltage, and over-temperature Instead, a charge pump is activated to provide voltage protection boost — the head-room needed for voltage regulation.  Soft-start functionality Only two 2.2µF bucket capacitors are required to deliver  Shutdown current — 0.µA, typical the full output current. The charge pump provides a low  Ultra thin package — 2 x 2 x 0.6 (mm) EMI solution compared to inductive buck/boost  Fully WEEE and RoHS compliant regulators. Applications The SC630’s charge pump has three modes of operation:  Mobile phones 2x, .5x, and x modes. The 2x and .5x modes deliver  MP3 players current to the load in each of two phases. The x mode  Multi-LED backlit LCDs turns off the charge pump, delivering current through an  Compact flash/CF+ products LDO. When active, the charge pump provides low-ripple  PMPs operation at 200kHz, which is typically less than 20mVpp  Digital video cameras at the output. The SC630 is capable of delivering 400mA  Digital still cameras continuous current, with peak current to 500mA. A 22µF  PDAs output capacitor of is used for decoupling the load and for smoothing mode transitions. Hysteresis is provided to prevent chatter between charge pump modes. The micro lead-frame package is both small and thermally efficient, measuring 2 x 2 x 0.6 (mm). Typical Application Circuit V = 3.3V @ 400mA OUT IN OUT C C IN OUT V BAT 22µF 22µF SC630 Chip C1+ EN C 1 enable C1- 2.2µF C2+ C 2 GND 2.2µF C2- US Patent: 7,808,220 Revision 4.0 © 20 Semtech Corporation  SC630 Pin Configuration Ordering Information Device Package ()(2) SC630ULTRT MLPD-UT-8 2x2 SC630EVB Evaluation Board Notes: () Available in tape and reel only. A reel contains 3,000 devices. GND C2- 1 8 (2) Lead-free package only. Device is WEEE and RoHS compliant. TOP VIEW C1+ 2 7 C2+ Device Options C1- 3 6 OUT T Device Features IN 5 EN 4 SC630A MHz, 3.3V, smaller C and C IN OUT SC632A MHz, 5.0V, smaller C and C IN OUT SC632 200kHz, 5.0V MLPD-UT-8; 2x2, 8 LEAD θ = 68°C/W JA Marking Information 630 yw yw = Datecode 2 SC630 Absolute Maximum Ratings Recommended Operating Conditions IN, OUT (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0 Ambient Temperature Range (°C) . . . . . . . . -40 < T < +85 A C+, C2+ (V) . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3 to (V + 0.3) IN (V) ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.9 < V < 5.5 OUT IN Pin Voltage - All Other Pins (V) . . . . . . . . . . . -0.3 to (V + 0.3) IN OUT Short Circuit Duration . . . . . . . . . . . . . . . . . Continuous Thermal Information () ESD Protection Level (kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 (2) Thermal Resistance, Junction to Ambient (°C/W) . . . . . 68 Maximum Junction Temperature (°C) . . . . . . . . . . . . . . +50 Storage Temperature Range (°C) . . . . . . . . . . . . -65 to +50 Peak IR Reflow Temperature (0s to 30s) (°C) . . . . . . . +260 Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended. NOTES () Tested according to JEDEC standard JESD22-A4-B. (2) Calculated from package in still air, mounted to 3 x 4.5 (in), 4 layer FR4 PCB with thermal vias under the exposed pad per JESD5 standards. Electrical Characteristics Unless otherwise specified: T = +25°C for Typ, -40°C to +85°C for Min and Max; C = C = 2.2µF (ESR < 0.03Ω); C = C = 22µF; V = 2.9V to 5.5V A  2 IN OUT IN Parameter Symbol Condition Min Typ Max Units Input Supply Voltage V 2.9 5.5 V IN Output Voltage V V = 4.2V, I = mA 3.2 3.3 3.4 V OUT IN OUT Output Voltage Ripple V I ≤ 400mA 20 mV PP OUT () Peak Load - thermally limited , 500 mA T <50°C, 2.85V ≤ V ≤ 5.5V J IN Maximum Output Current I OUT Continuous Load, 3.V ≤ V ≤ 5.5V, x or .5x mode 400 mA IN Shutdown Current I Shutdown (EN = GND), V = 3.6V 0. 2 µA SD IN EN high, x mode, I = mA, V = 4.2V .5 2.0 mA OUT IN Total Quiescent Current I Q EN high, .5x or 2x mode, I = mA, V = 3.3V .5 2.5 mA OUT IN Charge Pump Frequency f V = 3.2V 40 200 260 kHz PUMP IN (EN transitions from low to high), Start-Up Time t 400 µs SU 3.2V ≤ V ≤ 3.4V, No load OUT Line Regulation ΔV I = mA, 2.85V ≤ V ≤ 4.2V 2 mV LINE OUT IN Load Regulation ΔV V Fixed, mA ≤ I ≤ 500mA 25 mV LOAD IN OUT 3 SC630 Electrical Characteristics (continued) Parameter Symbol Condition Min Typ Max Units EN Input High Threshold V V = 5.5V .6 V IH IN EN Input Low Threshold V V = 2.7V 0.4 V IL IN EN Input High Current I V = 5.5V 2 µA IH IN EN Input Low Current I V = 5.5V 2 µA IL IN x mode 0.3 Ω Open-Loop Output Resistance R .5x mode, V = 3.5V 3 Ω OUT IN 2x mode, V = 2.93V 2.4 Ω IN V I = 300mA 3.3 V TRANS X OUT (2) Mode Transition Voltage V I = 300mA 2.93 V TRANS .5X OUT Fault Protection Short-Circuit Current I V = 0V, I = I 300 600 980 mA SC OUT OUT IN x mode 0.6 .2 2.0 A Input Current Limit I .5x and 2x modes .2 2.0 2.8 A LIMIT V ≤ 2V, I = I 700 mA OUT OUT IN T Rising Threshold 65 °C OTP (3) Over Temperature T Hysteresis 20 °C HYS Notes: () Thermal limitation is dependent upon the thermal performance of the printed circuit board in support of the package standard of 68° C/W. (2) Voltage at the IN pin where a mode transition takes place in the charge pump with V falling. IN (3) Guaranteed by design - not tested in production. 4 SC630 Typical Characteristics Line Regulation Load Regulation V = 3.3V, V = 3.6V OUT IN V = 3.3V, I = 1mA OUT OUT 25 20 15 20 85°C 10 25°C 3.6V, 0mV T =85°C A 5 15 -40°C 0 TA=25°C 10 -5 -10 T =-40°C A 5 -15 -20 0 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 0 90 180 270 360 450 Output Current (mA) Input Voltage (V) Efficiency versus Load Current PSRR — 1x Mode V = 3.3V OUT V = 4.2V, V = 3.3V, I = 50mA IN OUT OUT 100 0 C =C =22µF (0805) V = 3.4V IN IN OUT -10 C =C =2.2µF (0603)  2 V = 3.6V IN 90 -20 V = 3.8V IN -30 V = 4.0V IN 80 -40 -50 70 -60 -70 60 -80 -90 50 -100 0 90 180 270 360 450 10 100 10000 1000 Frequency (Hz) Load Current (mA) PSRR — 1.5x Mode V = 3.2V, V = 3.3V, I = 50mA IN OUT OUT 0 C =C =22µF (0805) IN OUT -10 C =C =2.2µF (0603)  2 -20 -30 -40 -50 -60 -70 -80 -90 -100 10 100 1000 10000 Frequency (Hz) 5 Output Voltage Variation —ΔVLOAD (mV) Gain (dB) Efficiency (%) Gain (dB) Output Voltage Variation —ΔV (mV) LINE SC630 Typical Characteristics (continued) Efficiency — 10mA Efficiency — 50mA V = 3.3V, I = 10mA OUT OUT V = 3.3V, I = 50mA OUT OUT 100 100 90 90 1x Mode 1x Mode 80 80 Mode Mode Transition Transition Hysteresis 70 Hysteresis 70 1.5x Mode 1.5x Mode 60 60 50 50 4.2 3.0 4.2 3.9 3.6 3.3 3.9 3.6 3.3 2.7 3.0 2.7 Input Voltage (V) Input Voltage (V) Efficiency — 100mA Efficiency — 200mA V = 3.3V, I = 100mA OUT OUT VOUT = 3.3V, IOUT = 200mA 100 100 90 90 1x Mode 1x Mode 80 80 Mode Transition Mode Hysteresis Transition 70 70 Hysteresis 1.5x Mode 1.5x Mode 60 60 2x Mode 50 50 4.2 3.9 3.6 3.3 3.0 2.7 4.2 3.9 3.6 3.3 3.0 2.7 Input Voltage (V) Input Voltage (V) Efficiency — 300mA Efficiency — 400mA V = 3.3V, I = 300mA V = 3.3V, I = 400mA OUT OUT OUT OUT 100 100 1x Mode 1x Mode 88 88 76 76 Mode 1.5x Mode Transition 1.5x Mode Hysteresis 64 64 Mode Transition Hysteresis 52 52 2x Mode 2x Mode 40 40 4.2 3.6 2.7 4.2 3.9 3.6 3.3 3.0 2.7 3.9 3.3 3.0 Input Voltage (V) Input Voltage (V) 6 Efficiency(%) Efficiency(%) Efficiency(%) Efficiency(%) Efficiency(%) Efficiency(%) SC630 Typical Characteristics (continued) Ripple — 1.5x Mode Ripple — 1x Mode V =3.6V, V =3.3V, I =400mA V =3.2V, V =3.3V, I =400mA IN OUT OUT IN OUT OUT V (20mV/div) IN -PP V (00mV/div) IN -PP V (20mV/div) OUT -PP V (50mV/div) OUT -PP 400mA 400mA I (200mA/div) OUT I (200mA/div) OUT C =C =22µF (0805) IN OUT C =C =22µF (0805) IN OUT C =C =2.2µF (0603) 0mA  2 0mA C =C =2.2µF (0603)  2 Time (10µs/div) Time (10µs/div) Ripple — 2x Mode Startup (No Load) V =2.85V, V =3.3V, I =400mA IN OUT OUT V =3.6V, I =0mA IN OUT V (50mV/div) IN -PP V (2V/div)– EN 0V— V (50mV/div) OUT -PP V (2V/div)– OUT 400mA I (200mA/div) OUT 0V— C =C =22µF (0805) IN OUT C =C =2.2µF (0603) I (200mA/div)–  2 OUT C =C =22µF (0805) IN OUT 0V— C =C =2.2µF (0603) 0mA  2 Time (200µs/div) Time (10µs/div) Quiescent Current Startup (400mA) V =3.6V, I =400mA V = 3.3V, I = 1mA OUT OUT IN OUT 2.25 2.00 V (2V/div)– EN 1.75 0V — 1.50 V (2V/div)– OUT 25°C 85°C 0V— 1.25 -45°C I (200mA/div)– OUT C =C =22µF (0805) 1.00 IN OUT 0V— C =C =2.2µF (0603)  2 0.75 2.90 Time (200µs/div) 5.50 4.98 4.46 3.94 3.42 VIN (V) 7 I (mA) Q SC630 Pin Descriptions Pin Pin Name Pin Function  GND Ground — connect to ground plane with multiple vias 2 C+ Positive terminal of bucket capacitor  3 C- Negative terminal of bucket capacitor  4 IN Input supply voltage 5 EN Chip enable — active-high 6 OUT Output 7 C2+ Positive terminal of bucket capacitor 2 8 C2- Negative terminal of bucket capacitor 2 This pad is for heat sinking and is not connected internally. It must be connected to a ground plane using T Thermal Pad multiple vias. 8 SC630 Block Diagram IN 4 LDO 2 C1+ 200kHz 3 C1- 7 C2+ Logic EN 5 8 Control C2- CHARGE PUMP 6 OUT Reference Voltage Generator 1 GND 9 SC630 Applications Information page 6 to determine if 2x mode is required by the appli- General Description cation. The data provided in the following derating curve The SC630 is a 3.3V output charge pump regulator for 2x mode is based on the peak power dissipation that designed to support up to 400mA (T ≤ 85°C, 3.5V ≤ V ≤ A IN could occur while in 2x mode. x and .5x modes do not 5.5V) of continuous current. It is used for powering Micro require derating. HDDs (Hard Disk Drives) and other 3.3V devices in porta- ble handheld equipment including Compact Flash and 450 CF+ products. 400 Derating for applications The SC630 has three operating modes — x, .5x, and 2x. requiring only 1x and 1.5x 350 modes The x mode is a linear series regulation mode with a low output resistance of only 300mΩ. The x mode functions 300 as a low noise series linear regulator. The .5x and 2x Derating for applications 250 modes are a low noise constant frequency, constant duty requiring 2x mode cycle switch mode, using two bucket capacitors. One 200 bucket supports the full output current while the other bucket charges from the input. The two buckets exchange 150 roles in the next phase, supplying continuous output 100 current in both phases and reducing the need for a large 35 45 55 65 75 85 95 105 Ambient Temperature (°C) output decoupling capacitor. The constant frequency, constant duty cycle operation also produces predictable Maximum Continuous Output constant frequency harmonics. Protection Circuitry Mode Transition Hysteresis The SC630 also provides protection circuitry that pre- Hysteresis is provided to prevent chatter between charge vents the device from operating in an unspecified state. pump modes for input steps of up to 20mV. Decouple These functions include: the input to prevent steps greater than 20mV, for optimum transient performance, when the input voltage • Over-Current Protection (OCP) reaches the mode transition thresholds. • Short-Circuit Current Protection (SCCP) • Over-Temperature Protection (OTP) Thermal Resistance The SC630 package is thermally efficient when the circuit Over-Current Protection board layout connects the thermal pad through multiple Over-current protection is provided to limit the output vias to the ground plane. The thermal resistance is depen- current. When V is greater than 2V, OCP limits the OUT dent upon the connection between the thermal pad and output to A typical. The threshold at 2V allows the device the ground plane. A layout that is done correctly should to recover from excessive voltage droop during an over keep the junction temperature below the over-tempera- current. ture limit while operating the SC630 within the specified electrical conditions. A poor layout may allow the junc- Short-Circuit Current Protection tion temperature to reach the over temperature limit, so Short-circuit current protection is provided to limit the it is important to maintain adequate ground plane around current that can be sourced when the output is shorted the device to maximize heat transfer to the PCB. to ground. When a short circuit forces V to drop below OUT 2V, the SCCP detects the condition and limits the output Temperature Derating current to 600mA (typical). The load current and battery voltage range of the applica- tion should be compared with the efficiency plots on 0 I (mA) OUT SC630 Applications Information (continued) Over-Temperature Protection The following capacitors are recommended for best per- The over-temperature circuit helps prevent the device formance. Use only X5R ceramic with a voltage rating of from overheating and experiencing a catastrophic failure. 6.3V or higher. When the junction temperature exceeds 65°C the device Table 1 — Recommended Capacitors is disabled. It remains disabled until the junction tempera- ture drops below this threshold. Hysteresis is included Value Case that prevents the device from re-enabling until the junc- Capacitor Notes μF Size tion temperature is reduced by 20°C. Typical output V ≤ 20mV in all PP charge pump modes Capacitor Selection C , C 22 0805 IN OUT The SC630 is designed to use low-ESR ceramic capacitors Typical input ripple ≤ 00mV in all for the input and output bypass capacitors as well as the charge pump modes charge pump bucket capacitors. Ideal performance is Typical performance is similar to achieved when the bucket capacitors are exactly equal. the 22uF if 0805 capacitor size is The value of input and output decoupling capacitors will C , C 0 0805 IN OUT used, due to the weaker DC volt- vary with system requirements. C and C are normally IN OUT age coefficient of the 22uF 0805. 22µF and the bucket capacitors C and C are 2.2µF. For  2 low profile designs, two parallel 0µF capacitors may be Typical output V as high as PP used in place of each 22µF. 75mV in boosting charge pump modes For applications with load currents below 00 mA, the Typical input ripple as high as bucket capacitors may be reduced to µF and the input 75mV in boosting charge pump and output capacitors may be reduced to 0µF. The fol- modes C , C 0 0603 IN OUT lowing table lists recommended capacitor values. Note For a lower profile design, two that the smallest available capacitor packages have very 0uF 0603’s may be substituted poor DC voltage characteristics. 0402 and 0603 size in place of one 0uF or 22uF capacitors may be as low as 50% of rated value 0805. Two are needed, due to the at 3.3V. weaker DC voltage coefficient of the 0603 package size. The highest capacitance values in the smallest package Required for the full rated output C 2.2 0603 BUCKET sizes tend to have poor DC voltage characteristics. The current highest value 0402 size capacitor retains as little as 35% of Useful for load current up to C 2.2 0402 its rated value at 5VDC. The same value chosen in the next BUCKET 300mA larger package size (0603) retains about 60% of its rated Useful for load current up to value at 5VDC. C .0 0402 BUCKET 00mA NOTE: Use only X5R type capacitors, with a 6.3V rating or higher  SC630 Applications Information (continued) 2. Place the input and output decoupling capacitors PCB Layout Considerations as close as possible to the device and connect these Poor layout can degrade the performance of the regula- capacitors’ ground pads together to the ground plane tor and can be a contributory factor in EMI problems, using multiple vias through a short wide copper ground bounce, thermal issues, and resistive voltage area. losses. Poor regulation and instability can result. 3. Connect pin  directly to the copper area under the The following design rules are recommended: thermal pad. 4. The thermal pad at the center of the device is not . Place the bucket capacitors as close to the device as electrically connected. Connect this pad to the possible and on the same side of the board. Use short ground plane using multiple vias. wide copper areas between the capacitor pins and 5. Use a ground plane to further reduce noise the device pins. interference on sensitive circuit nodes. SC630 C 2 GND C2- C2+ C1+ C 1 GND C1- OUT EN IN C OUT C IN EN 2 SC630 Outline Drawing — MLPD-UT-8 2x2 B D A DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX - - E A .020 .024 0.50 0.60 PIN 1 - - A1 .000 .002 0.00 0.05 INDICATOR A2 (.006) (0.1524) (LASER MARK) b .007 .010 .012 0.18 0.25 0.30 D .075 .079 .083 1.90 2.00 2.10 D1 .061 .067 .071 1.55 1.70 1.80 E .075 .079 .083 1.90 2.00 2.10 E1 .026 .031 .035 0.65 0.80 0.90 e .020 BSC 0.50 BSC A SEATING L .012 .014 .016 0.30 0.35 0.40 PLANE aaa C N 8 8 aaa .003 0.08 A1 A2 C bbb .004 0.10 D1 1 2 LxN E/2 E1 N bxN e bbb C A B e/2 D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 3 SC630 Land Pattern — MLPD-UT-8 2x2 H DIMENSIONS R DIM INCHES MILLIMETERS (.077) (1.95) C G .047 1.20 H .067 1.70 Z (C) K G K .031 0.80 P .020 0.50 R .006 0.15 Y X .012 0.30 Y .030 0.75 Z .106 2.70 P X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. 2. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. 4 SC630 © Semtech 20 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. 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