SEMTECH SC2604

SC2604 Simple PWM Boost Controller with Input Disconnect FET Drive POWER MANAGEMENT Features Description „ Input Voltage Range: 4.5V to 16V The SC2604 is a versatile, low-cost, voltage-mode PWM „ 1% Voltage Reference Accuracy controller designed for boost DC/DC power supply „ Up to 95% Efficiency applications. It features input disconnect FET driver „ Input Disconnect FET Drive allowing power source and load separation at shutdown „ In-rush Current Control mode, which eliminates possible leakage current from „ Internal Compensation source to load. Also, it prevents catastrophic failure when „ Programmable Current Limit output is shorted during operation. „ Programmable Soft Start „ 800mA Typical PWM Gate Drive The SC2604 also includes temperature compensated „ 400kHz Switching Frequency voltage reference, internal ramp, current limit comparator, „ Under Voltage Lockout internally compensated error amplifier, and floating driver „ <200uA Shutdown Current with charge pump. Programmable soft start controls o o „ -40 C to +85 C Temperature Range in-rush current and reduces output voltage overshoot. „ MSOP-8 MSOP-8 and MLPD-UT8 Package, Pb Free, Hiccup mode over-current protection allows system auto- Halogen Free and WEEE/RoHS Compliant retry and ease of trouble shooting. 5 4 3 2 1 Applications Internally compensated feedback loop makes power supply design simple, and eliminates the need for external „ Portable Devices compensation network. „ Flat Panel TV „ TV Set Top Box The SC2604 is available in low profile MLPD-UT and „ Auxiliary Supplies o MSOP-8 package with rated temperature range of -40 C „ Peripheral Card Supplies o D D to +85 C. „ Industrial Power Supply „ High Density DC/DC Conversion Typical Application Circuit R Rs s D D1 1 Vo Vin s se en ns siin ng g re res siis stto or r Q Q1 1 L L1 1 1 2 ++ ++ C C1 1 C C4 4 C C7 7 R Rc cc c U U1 1 1 8 CS DRV C C R R3 3 Q Q2 2 2 3 VIN GATE 5 6 SS/VREF FB 7 4 OCP/EN GND R R5 5 C C1 11 1 C C1 13 3 C C1 14 4 S SC C2604 2604 Figure 1. 12V to 25V/1A Boost Converter with Over Current Protection December 31, 2010 www.semtech.com 1 B B A A SEMTECH CORPORATION T T Tiiitl tl tle e e S S SC C C2 2 26 6 60 0 04 4 4 E E EV V VB B B S S Sc c ch h he e em m ma a ati ti tic c c S S Siiiz z ze e e D D Doc oc ocum um ument N ent N ent Num um umber ber ber R R Rev ev ev A A A A A A 1 1 12 2 2V V V IIIn n np p pu u ut t t,,, 1 1 16 6 6V V V///3 3 30 0 00 0 0m m mA A A O O Ou u ut t tp p pu u ut t t,,, 4 4 40 0 00 0 0k k kH H Hz z z D D Date: ate: ate: F F Fr r riiiday day day, O , O , Oc c ctober tober tober 19, 2007 19, 2007 19, 2007 S S Sheet heet heet 1 1 1 of of of 1 1 1 5 4 3 2 1 SC2604 5 4 3 2 1 Pin Configuration, MSOP-8 Pin Configuration, MLPD-UT8 D D CS DRV 1 8 C CS 1 8 DRV C VIN OCP/EN 2 7 2 7 OCP/EN VIN GATE FB 3 3 6 GATE 6 FB GND 4 5 SS/VRF GND SS/VREF 4 5 B B 2mm x 3mm x 0.6mm MLPD-UT8 A A Marking Information, MSOP-8 Marking Information, MLPD-UT8 5 4 3 2 1 Bottom Mark Top Mark nnnn=Part Number Code (Example AS00)- Reference Part No. Code for MSOP nnn=Part Number (Example FSA) - Reference Part No. Code for small MLP yyww=Date Code (Example: 0752) yw =Datecode (Reference Package Marking Design Guide lines, Appendix A) xxxx = Semtech Lot No. (Example: E901) xxx = Semtech Lot No. (Example: 901) xxxx = Semtech Lot No. (Example: 01-1) Ordering Information Notes: Device Package (1) Available in tape and reel only. A reel contains 2,500 devices. (2) Available in lead-free package only. Device is Pb Free, Halogen (1)(2) SC2604MSTRT MSOP-8 Free, and WEEE/RoHS compliant. (1)(2) SC2604ULTRT 2mm x 3mm x 0.6mm MLPD-UT8 SC2604EVB-1 Evaluation Board, MSOP-8 SC2604EVB-2 Evaluation Board, MLPD-8 www.semtech.com 2 © 2010 Semtech Corp. SC2604 Absolute Maximum Ratings Thermal Information (1) Thermal Resistance, Junction to Ambient V Supply Voltage ……………………………… -0.3 to 20V IN MSOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 °C/W CS Pin Voltage………………………………………-0.3 to 20V MLPD-UT8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 °C/W GATE Pin Voltage……………………………………-0.3 to 20V Maximum Junction Temperature . . . . . . . . . . . . . . . . . 15 0°C Storage Temperature Range . . . . . . . . . . . . . . .-45 to +150 °C DRV Pin Voltage ……………………………………-0.3 to 25V Lead Temperature (Soldering) 10 sec . . . . . . . . . . . . . . . . . . 300 °C OCP/EN Pin Voltage …………………………………-0.3 to 7V SS/VREF Pin Voltage …………………………………-0.3 to 7V Recommended Operating Conditions FB Pin Voltage ………………………………………-0.3 to 7V Input Voltage Range …………………………… 4.5V to 16V Peak IR Reflow Temperature …………………………. 260°C (2) ESD Protection Level ………………………………… 2000V Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended. NOTES- (1) Calculated from package in still air, mounted to 3” x 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. (2) Tested according to JEDEC standard JESD22-A114-B. Electrical Characteristics Unless otherwise noted, V = 12V, V = 25V, -40°C < T = T < 125°C. IN O A J Parameter Conditions Min Typ Max Units Input Supply V Supply Voltage 4.5 16 V IN V Start Voltage V Rising 4.2 4.5 V IN IN V Start Hysteresis 400 mV IN V Supply Current Switching, GATE pin floating 6.0 9.0 mA IN V Shutdown Current OCP/EN = Low 200 µA IN Error Amplifier Feedback Voltage I = 100mA 1.225 1.250 1.275 V O Feedback Bias Current V = 12V, V = V 0.5 1.0 µA IN FB SS/VREF (1) Error Amplifier Gain 90 V/V Oscillator Oscillator Frequency 320 400 480 kHz Maximum Duty Cycle 86 90 % (2) Internal Ramp Peak 1.4 V (2) Internal Ramp Valley 0.4 V Regulation Load Regulation I = 0.1A to 1A 0.5 % O V = 5V to 16V, I = 0.1A 0.125 IN O Line Regulation %/V V = 5V to 16V, I = 0.1A, T = 25°C 0.065 IN O J www.semtech.com 3 © 2010 Semtech Corp. SC2604 Electrical Characteristics (Cont.) Unless otherwise noted, V = 12V, V = 25V, -40°C < T = T < 125°C. IN O A J Parameter Conditions Min Typ Max Units PWM Switch Gate Drive Gate Source Current V = 12V, C = 10nF 0.5 0.8 A IN GATE Gate Sink Current V = 12V, C = 10nF 0.5 0.8 A IN GATE PWM Switch Soft Start Soft Start Charge Current 55 µA Pull down below this level to SS/VREF Threshold to Shutdown Switch 100 mV disable PWM Switch gate Pull above this level to SS/VREF Threshold to Turn-on Switch 310 mV enable PWM Switch gate Disconnect Switch Gate Drive DRV Source Current V = 12V, V = 15.5V 45 µA IN DRV DRV Sink Current V = 12V, V = 8V 45 µA IN DRV V = 5V 2.15 V IN Charge Pump Voltage V = 12V 4.3 5.8 V IN Over Current Protection Current Limit Threshold V - CS 61 72 83 mV IN Pull down below this level to OCP/EN Threshold 520 590 660 mV disable Disconnect FET gate OCP/EN Charge Current 37 µA OCP/EN Discharge Current 1.0 µA CS Input Current 0.2 µA Note: (1). Guaranteed by Characterization (2). Guaranteed by design www.semtech.com 4 © 2010 Semtech Corp. SC2604 Pin Descriptions Pin Pin Name Pin Function 1 CS Current sense input (negative) 2 VIN Device supply voltage (also positive current sense input) 3 GATE PWM gate driver output for boost converter. This pin swings from 0V to V . IN 4 GND Device ground 5 SS/VREF Soft start and reference voltage pin 6 FB Error amplifier inverted input When a capacitor is tied to this pin, the maximum inrush current is controlled during start-up. The capacitor value 7 OCP/EN also determines the off-time after the device has entered hiccup mode. Pulling this pin low can disable the linear and the switcher to turn off the circuit. 8 DRV Gate drive of input disconnect FET limiting system input current Thermal Pad Pad for heatsinking purposes. Connect to ground plane using multiple vias. Not connected internally. www.semtech.com 5 © 2010 Semtech Corp. SC2604 Block Diagram Fig 2. Block diagram OSCILLATOR VIN Gate PWM FB Q Error S Amplifier 25K Gm=3.6mA/V 1.25V VIN 55uA SS/VREF 0.4V 4.2V üüüüü VIN 6.25K CS VIN 0.625V HICCUP OSCILLATOR CHARGE PUMP 1.25V DRV LOW CURRENT SHUTDOWN 1uA 1.5V GND 0 – 120mV 38uA OCP/EN 1uA Figure 2. SC2604 Function Diagram www.semtech.com 6 © 2010 Semtech Corp. SC2604 SC2604 SC2604 Typical Characteristics Load Characteristic (V =12V, V =25V) Efficiency (VIN=12V, VO=25V) IN O 100 30 95 25 90 20 85 80 15 75 10 70 5 65 0 60 0.00 0.50 1.00 1.50 2.00 2.50 0.00 0.50 1.00 1.50 Output Current (A) Output Current (A) SC2604 SC2604 Line Regulation (V =25V, I =1.5A) Error Amplifier: Gain and Phase O O 25.250 40 180 35 25.125 30 135 25 25.000 20 90 24.875 15 10 45 Gain 24.750 Phase 5 0 0 24.625 -5 -10 -45 24.500 8 10 12 14 16 1.E+02 1.E+04 1.E+06 1.E+08 Input Voltage (V) Frequency (Hz) Simulation www.semtech.com 7 © 2010 Semtech Corp. Output Voltage (V) Efficiency (%) Gain (dB) Output Voltage (V) Phase (deg) SC2604 SC2604 Typical Characteristics (Cont.) SC2604 Current Limit Threshold vs Temperature Feedback Voltage vs Temperature 85 1.260 V = 12V IN 80 1.250 75 V = 5V IN 1.240 70 1.230 65 60 1.220 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 o o Temperature ( C) Temperature ( C) SC2604 SC2604 Floating Driving Voltage (V -V ) DRV IN Oscillator Frequency vs Temperature of DRV Pin vs V IN 6.0 420 o T = 125 C A 5.5 410 5.0 400 4.5 o T = 25 C A 4.0 390 3.5 o 380 3.0 T = -40 C A 2.5 370 2.0 360 1.5 -50 -25 0 25 50 75 100 125 4 5 6 7 8 9 10 11 12 13 14 15 16 o Input Voltage (V) Temperature ( C) www.semtech.com 8 © 2010 Semtech Corp. Current Limit Threshold (mV) Oscillator Frequency (kHz) Feedback Voltage (V) Voltage (V) Fig 3. Soft start timing SC2604 Applications Information PWM Control Loop allow a complete shutdown of the output. Pulling the SS/ VREF pin below 0.1V only shuts the boost FET (Q in Figure 2 The SC2604 is a voltage-mode PWM controller with a fixed 1) off and the output voltage will be (V -V ). IN d switching frequency of 400kHz for use in high efficiency, boosted voltage, DC/DC power supplies. 4.2V As shown in Figure 2, the PWM control loop of the SC2604 Enable Hiccup consists of a 400kHz oscillator, a PWM comparator, 1.25V+ V IN a voltage error amplifier, and a FET driver. The boost 0.625V converter output voltage is fed back to FB (error amplifier V +V IN GS OCP/EN negative) and is regulated to the reference voltage at SS/VREF pin. The error amplifier output is compared 1.25V DRV 0.5V with the 400kHz ramp to generate a PWM wave, which SS/VREF is amplified and used to drive the boost FET (Q in Figure 2 1) for the converter. The PWM controller works with soft GATE start and fault monitoring circuitry to meet application requirements. V -V IN d T 2 V T O 1 UVLO, Start-up, and Shutdown Note: T =C *0.625V / 37µA 1 OCP/EN T =C üüüüü µA 2 SS/VREF To initiate the SC2604, a supply voltage is applied to V . IN The DRV and GATE are held low. When V voltage exceeds IN UVLO (Under Voltage Lockout) threshold, typically 4.2V, Figure 3. Start-up Timing Diagram an internal current source (37µA) begins to charge the OCP/EN pin capacitor. The OCP/EN voltage ramps from near ground to over 1.25V but the voltage between Hiccup Mode Short Circuit Protection 0.625V and 1.25V provides the linear soft-start range for the disconnect FET (Q ). When the OCP/EN voltage is Hiccup mode over-current protection is utilized in the 1 over 1.25V, the OCP hiccup is enabled, and SS/VREF pin is SC2604. When an increasing load causes a voltage of released. At this moment, another internal current source 72mv to occur from V to CS then a current limit hiccup IN (55µA) begins to charge the SS/VREF pin capacitor. When sequence is started. The sequence starts by pulling DRV the SS/VREF pin voltage reaches 0.5V, the error amplifier low and discharging the OCP/EN pin with a 1µA current output will rise to 0.4V, then the PWM comparator begins source. When the OCP/EN pin falls below 1.25V, the SS/ to switch. The switching regulator output is slowly VREF pin is forced to ground (similar to the UVLO shutdown ramping up for a soft turn-on. The details of SC2604 start- described in the last setion). up timing is shown in Figure 3. When the voltage on the OCP/EN pin falls to near zero If the supply voltage at V pin falls below UVLO threshold volt, the 1µA discharge current becomes a 37µA charging IN (3.8V typically) during a normal operation, the DRV pin current and the OCP/EN pin starts to charge and DRV is is pulled low to cut off the supply power of the boost enabled. When the OCP/EN voltage rises from 0.625V converter, while the OCP/EN pin capacitor is discharged to 1.25V, the current in the disconnect FET is allowed to with a 1µA internal current source. When the OCP/EN pin increase from zero to a maximum of 72mV/(Current Sense falls below 1.25V, the SS/VREF pin is forced to ground. This Resistor Value). If the over-current condition still exists completely shuts down the boost conveter. when OCP/EN crosses 1.25V then the hiccup sequence will re-start. If there is no over-current as OCP/EN crosses Directly pulling the OCP/EN pin below 0.52V can also 1.25V then the SS/VREF pin is released to rise and allow a www.semtech.com 9 © 2010 Semtech Corp. SC2604 Applications Information (Cont.) soft-start of the switching boost regulator. Capacitor at OCP/EN Pin - C OCP/EN The DRV pin of the SC2604 is meant to drive an N-Channel As the current at start-up may hit its current limit threshold, V 1 FET thaV t can disconnect the input supply in the event of an the ramp rate of the current must be slow enough to allow 1 OUT OUT = = over-current condition. The OCP/EN capacitor becomes the output capacitor to be fully charged to a voltage one V 1−D V 1−D IN MAX IN MAX part of a hiccup oscillator that is charged with 37µA and diode drop V less than input voltage V . To guarantee a d IN discharged with 1µA to provide a low duty cycle for the successful start-up at no load, the value of the capacitor at FET Q . the OCP/EN pin has to satisfy the following formula: 1 C (V −V)R It should be underst C ood (V tha −Vt )sufficien R tly fast ramp rates OUT IN d CS OUT IN d CS C > C > OCP/EN OCP/EN on the OCP/EN pin and the SS/VREF pin can trigger a 0.625 750 0.625 750 hiccup event because of the charging current demanded by the boost regulator output capacitor. Disconnect FET Selection 72mV 72mV Setting the Output Voltage R = R = CS CS I I The floating drP iving EAK voltage of DRV pin drops slightly as PEAK In Figure 1, an external resistive divider R and R with its the supply voltage V is below 7.5V (Typical Characteristics 3 5 IN center tap tied to the FB pin sets the output voltage. on page 8), where a FET with low gate threshold voltage (V ) has to be used for the disconnect FET. In a 5V input GS(TH) V   V   OUT OUT R = R  −1 R = R −1 application, a FET with V =2V, such as FDD6672A from   3 5 3 5 GS(TH) 1.25V 1.25V     Fairchild, is needed. In some applications, a RC branch (R , C in the Typical Layout Guidelines 6 12 Schematic on page 12) will be needed for loop stability. Careful attentions to layout requirements are necessary Maximum Duty Cycle for successful implementation of the SC2604 PWM controller. High currents switching at 400kHz are present The maximum duty cycle, D defines the upper limit of in the application and their effect on ground plane voltage max V 1 OUT power conversion ratio differentials must be understood and minimized. = V 1−D IN MAX V 1 OUT 1) The high power parts of the circuit should be laid out = V 1−D IN MAX first. A ground plane should be used, the number and position of ground plane interruptions should be such as Calculating Current Sense Resistor to not unnecessarily compromise ground plane integrity. C (V −V)R OUT IN d CS Isolated or semi-isolated areas of the ground plane may C > OCP/EN 0.625 750 Current sense resistor is placed at the input to sense be deliberately introduced to constrain ground currents C (V −V)R OUT IN d CS inductor peak current of the boost regulator. The value of to particular areas, for example the input capacitor and C > OCP/EN 0.625 750 the resistor can be calculated by bottom Schottky ground. 72mV R = 2) The loop formed by the output Capacitor(s) (C ), the CS OUT I PEAK FET (Q ), the current sensing resistor, and the Schottky 1 72mV R = where I is the allowed boost inductor peak current. (D ) must be kept as small as possible, as shown on the CS PEAK 1 I PEAK layout diagram in Figure 4. This loop contains all the high In many applications, a noise filter circuit (R =200, C =10nF current, fast transition switching. Connections should V   1 10 OUT R = R −1   3 5 in the Typical Schematic on page 12) may be needed for be as wide and as short as possible to minimize loop 1.25V   the input current sensing. inductance. Minimizing this loop area will reduce EMI,  V  OUT R = R  −1 3 5 1.25V   www.semtech.com 10 © 2010 Semtech Corp. SC2604 Applications Information (Cont.) lower ground injection currents, resulting in electrically 5) The SC2604 is best placed over an isolated ground “cleaner” grounds for the rest of the system and minimize plane area. The soft-start capacitor and the Vin decoupling source ringing, resulting in more reliable gate switching capacitor should also connected to this ground pad signals. area. This isolated ground area should be connected to the main ground by a trace that runs from the GND pin 3) The connection between the junction of Q , D and the to the ground side of the output capacitor. If this is not 1 1 output capacitor should be a wide trace or copper region. possible, the GND pin may be connected to the ground It should be as short as practical. Since this connection path between the Output Capacitor and the C , Q , D IN 1 1 has fast voltage transitions, keeping this connection short loop. Under no circumstances should GND be returned to will minimize EMI. a ground inside the C , Q , D loop. IN 1 1 4) The Output Capacitor(s) (C ) should be located as 6) Input voltage of the SC2604 should be supplied from OUT close to the load as possible, fast transient load currents the power rail through a 1Ω resistor, the Vin pin should are supplied by C only, and connections between C be decoupled directly to GND by a 0.1µF~1µF ceramic OUT OUT and the load must be short, wide copper areas to minimize capacitor, trace lengths should be as short as possible. Fig 4. Layout di induc agr tanc am e and resistance. Vout VIN Ra D1 Rcs 4.7uH Cin 1 + SC2604 Cout Rb 2 6 FB VIN 5 8 GATE SS/VREF 7 1uF 1 0.1uF CS OCP/EN 3 4 DRV GND 0.1uF Note: Heavy lines indicate the critical loop carrying high pulsating current. The inductance of the loop needs to be minimized. Figure 4. SC2604 Layout Diagram www.semtech.com 11 © 2010 Semtech Corp. 5 4 3 2 1 SC2604 D D Applications Information (Cont.) Typical application schematic with 12V input and 25V/1.5A output R Rs s Q Q1 1 L1( L1(C CD D1- 1-150) 150) D D1 1 25V/1.5A OUTPUT 12V INPUT 10m 10m, S , Sen. R en. Res es.. IIR RF F7821 7821 1 2 A C C C4 4 15uH 15uH C CM MS SH H2- 2-40L 40L C C6 6 ++ C C1 1 C C3 3 1uF 1uF 4.7uF 4.7uF ++ C C7 7 220uF 220uF 1uF 1uF R Rc cc c R R1 1 Q Q2 2 220uF 220uF 1R 1R0 0 200 200 A AO O4412 4412 C C U U1 1 C C10 10 1 8 CS DRV 10nF 10nF R R3 3 2 7 VIN OCP/EN D Da a 499k 499k C C11 11 3 6 GATE FB 1uF 1uF C C12 12 R R6 6 M MA A729 729 R R5 5 4 5 GND SS/VREF 26.3k 26.3k 1.43k 1.43k 0.33uF 0.33uF C C13 13 C C14 14 S SC C2 26 60 04 4 0.33uF 0.33uF 0.1uF 0.1uF B B Note: A small Schottky diode (Da) may be required in some applications to clamp negative spike at the GATE pin. Bill of materials Item Quantity Reference Part (P/N of Vender) Vendor 1 1 C1 220uF/10V Rubycon, ZL 2 3 C3,C4,C11 1uF/16V Vishay 3 1 C6 4.7uF/50V Murata 4 1 C7 220uF/35V/160m Rubycon, YXF 5 1 C10 10nF Vishay A A 6 1 C12 0.33uF Vishay SEMTECH CORPORATION 7 1 C13 0.33uF Vishay T T Tiiitl tl tle e e 8 1 C14 0.1uF Vishay S S SC C C2 2 26 6 60 0 04 4 4 (M (M (MS S SO O OP P P-8 -8 -8) ) ) E E EV V VB B B S S Sc c ch h he e em m ma a ati ti tic c c 9 1 D1 CMSH2-40L (Schottky diode) Central Semi S S Siiiz z ze e e D D Doc oc ocum um ument N ent N ent Num um umber ber ber R R Rev ev ev A A A A A A 1 1 12 2 2V V V IIIn n np p pu u ut t t,,, 2 2 25 5 5V V V///1 1 1...5 5 5A A A O O Ou u ut t tp p pu u ut t t,,, 4 4 40 0 00 0 0k k kH H Hz z z 10 1 Da MA729 (Schottky diode) Panasonic 11 1 L1 15uH/3.5A (CD1-150) Coiltronics D D Date: ate: ate: T T Tues ues uesday day day, O , O , Oc c ctober tober tober 23, 2007 23, 2007 23, 2007 S S Sheet heet heet 1 1 1 of of of 1 1 1 5 4 3 2 1 12 1 Q1 IRF7821 IR 13 1 Q2 AO4412 Alpha & Omega Semi. 14 1 Rs 15m(Sensing Res.) Vishay 15 1 R1 200 Vishay 16 1 Rcc 1R0 Vishay 17 1 R3 499k Vishay 18 1 R5 26.1k Vishay 19 1 R6 1.43k Vishay 20 1 U1 SC2604 Semtech www.semtech.com 12 © 2010 Semtech Corp. SC2604 12V Input (5V/DIV) Applications Information (Cont.) Start up 12V Input (5V/DIV) 25V output (10V/DIV) SS/VREF (1V/DIV) OCP/EN (1V/DIV) X=5ms/DIV Inductor current and DRV pin voltage at OCP 25V Output (1V/DIV) OCP/EN (1V/DIV) Inductor Current (5A/DIV) DRV Voltage (5V/DIV) X=10ms/DIV www.semtech.com 13 © 2010 Semtech Corp. SC2604 MSOP-8 Outline Outline Drawing - MSOP-8 DIMENSIONS ü INCHES üüüüü DIM MIN NOM MAX MIN NOM MAX A A - - .043 - - 1.10 D - - A1 .000 .006 0.00 0.15 N - - A2 .030 .037 0.75 0.95 - - b .009 .015 0.22 0.38 c - - .003 .009 0.08 0.23 2X E/2 D .114 .118 .122 2.90 3.00 3.10 .118 2.90 3.00 3.10 E1 .114 .122 E1 E E .193 BSC 4.90 BSC PIN 1 e .026 BSC 0.65 BSC INDICATOR L .016 .024 .032 0.40 0.60 0.80 (.037) (.95) L1 N 8 8 ü C 1 2 - - 01 0° 8° 0° 8° 2X N/2 TIPS e aaa .004 0.10 bbb .005 0.13 B ccc .010 0.25 D H ü C A2 A c GAGE SEATING PLANE PLANE A1 C ü 0.25 L 01 ü C A-B D (L1) DETAIL A SEE DETAIL A SIDE VIEW MSOP-8 Landing Pattern NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE ü 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-187, VARIATION AA. Land Pattern - MSOP-8 X DIMENSIONS DIM INCHES üüüüü (.161) (4.10) C G .098 2.50 ü G Z P .026 0.65 X .016 0.40 Y .063 1.60 Z .224 5.70 Y P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. www.semtech.com 14 © 2010 Semtech Corp. SC2604 Outline Drawing - 2x3 MLPD-UT8 B A D DIMENSIONS INCHES üüüüü DIM MIN NOM MAX MIN NOM MAX - - A .020 .024 0.50 0.60 E - - A1 .000 .002 0.00 0.05 PIN 1 (.006) (0.1524) A2 INDICATOR b .007 .010 .012 0.18 0.25 0.30 (LASER MARK) D .075 .079 .083 1.90 2.00 2.10 D1 .059 .065 .069 1.50 1.65 1.75 E .114 .118 .122 2.90 3.00 3.10 E1 .065 .071 .075 1.65 1.80 1.90 e .020 BSC 0.50 BSC L .012 .016 .020 0.30 0.40 0.50 A N 8 8 SEATING aaa .003 0.08 ü C PLANE bbb .003 0.08 A1 A2 C D1 1 2 ü ü E1 N ü e ü C A B ü ü NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - 2x3 MLPD-UT8 K DIMENSIONS DIM INCHES üüüüü C (.116) (2.95) ü Z .087 2.20 G H G H .071 1.80 K .069 1.75 P .020 0.50 X .012 0.30 Y .030 0.75 Y Z .146 3.70 X P NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. www.semtech.com 15 © 2010 Semtech Corp. SC2604 © Semtech 2010 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. 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