[Print This Datasheet] Promentum MPCBL0050 Dual Core Xeon processor module FEATURE SUMMARY The RadiSys® MPCBL0050 single board computer (SBC) features the Dual-Core Intel® Xeon® processor LV 5138 and it combines Intel® 64 Technology+ (Intel® 64) with dual-core, dual processing � High performance capabilities for a total of four processor cores on a single platform, providing performance boost, AdvancedTCA® blade based on superior subsystem scalability and density. This fifth-generation design achieves significant the Dual-Core Intel Xeon performance improvements for compute-intensive and database-access applications including IP LV5138 processor that provides Multimedia Subsystems (IMS), wireless control plane, and IPTV. 4 processor cores on a single module The MPCBL0050 SBC is optimized to support first-generation AdvancedTCA chassis that limit front- board power to less than 200W. It also interoperates with AdvancedTCA products from RadiSys and � RTM support SAS Hard drive, with third-party building blocks meeting the PICMG* 3.0 specification. fibre channel and 4xGbE connector providing flexibility for PRODUCT BENEFITS storage options. � High performance Intel® based AdvancedTCA® blade based on the Dual-Core Intel Xeon LV5218 � Supports Solaris 10 process that provides 4 processor cores on a single moduleSupport Mid size AMC for I/O � Superior subsystem scalability � RTM support SAS Hard drive, fibre channel and 4xGbE connectors providing flexibility for storage and density options. � Supports Solaris 10 – in certification testing at SUN � Superior subsystem scalability and density (subscribers/transactions per board), supporting the maximum number of network elements in an AdvancedTCA* chassis � Support both the Radisys MPRTM0040 and MPRTM0050 which provides a choice of cost effective storage & limited connectivity, vs a full featured RTM with fibre channel and 4xGbE connectors Dual-Core Intel® Xeon® Processor LV 5138 � Enables performance improvement greater than five times that of the first-generation MPCBL0001 single board computer1 � Intel 64 supports 64-bit instructions and provides flexibility for 64-bit and 32-bit applications and operating systems � Power-optimized 1066 MT/s front-side bus (FSB) and 4 MB shared L2 cache per physical processor allow dynamic allocation between cores, based on application load AdvancedMC Compliant with the revised AMC.0 specification (AMC.0 R2.0), the MPCBL0050 SBC provides one AdvancedMC* site to support the next-generation mezzanine card standard optimized for AdvancedTCA. The increased board area and power envelope support high-density I/O mezzanines while PCI Express* and Gigabit Ethernet interfaces provide maximum throughput. AdvancedMC can help reduce time-to-market by providing an easy-to-use expansion slot. These cards provide full hot swap support and allow management via an onboard IPMB. Features Benefits Intel® 5000P chipset with 1066 MT/s • Optimized support for intensive computing demands of FSB high-performance applications • Rapid data transfer to and from applications • Reduced I/O bottlenecks and improved network performance by freeing CPU for other processing tasks AdvancedMC* mezzanine site • Module hot-add and hot-swap, easy expandability, and higher throughput bandwidth than PMCs • Compliant with revised AMC.0 specification (AMC.0 R2.0) Optional Intel NetStructure® Rear • Support for fibre channel, one Serial Attached SCSI Transition Module (RTM) (SAS)-based hard disk drive, expansion external SAS ports, four Ethernet ports • Convenient rear-access cable configuration Power and thermal <200W • Meets power limits of first-generation AdvancedTCA chassis Intelligent Platform Management • Carrier-grade system reliability and manageability Controller (IPMC) • Controls board power and monitors onboard sensors using dual Intelligent Platform Management Bus (IPMB) connections Redundant BIOS images, IPMC • Redundancy on key items enables high reliability for field firmware images, and dual 256 MB deployments flash drives Dual Star Gigabit Ethernet base and • Redundant backplane features support high I/O four fabric backplane ports requirements and access to high-speed storage systems Promentum MPCBL0050 Specifications FEATURE FUNCTION DESCRIPTION Physical Dimensions 8U, 14 in (35.56 cm) x 1.2 in. (3.048 cm) x 11.02 in (28 cm) Compliance AdvancedTCA - PICMG 3.0 r2.0 with ECN 002 AdvancedMC- AMC.0 R2.0 AMC.1, AMC.2 IPMI – IPMI v2.0 Processor Type Dual-Core Intel® Xeon® processor LV 5138∆  at 2.13 GHz   Front Side Bus 1066 MT/s Memory Cache Memory 4 MB L2 cache per processor   Maximum Memory Capacity 16 GB using four 4 GB Fully Buffered DIMMs   DIMM Slots Four Chipset Memory Controller Hub Intel® 5000P chipset   I/O Controller Hub Intel® 6321ESB I/O Controller Hub Operating System Linux* Validated with MontaVista Linux Carrier Grade Edition (CGE)* 4.0; Validated with RHEL 4u4 and RHEL 5 Validation in progress with Solaris 10 Connectors, Ext FC Links One USB 2.0 port Front Panel One serial port (RJ45) One AdvancedMC* single-width, mid-size (x4/x8 PCI Express, x1 SAS, dual Gb Ethernet) Two 10/100/1000 Ethernet ports LEDs for hot swap, out-of-service, health, hard drive activity, and Ethernet ports Connectors,   x3 SAS Rear Transition Module Ports   x4 PCI Express   Four 10/100/1000 Ethernet ports   One serial port (RJ45), one USB port Connectors, Backplane   Dual Gigabit Ethernet (AdvancedTCA* base interface) Quad Gigabit Ethernet (AdvancedTCA fabric interface; PICMG 3.0 R2.0, PICMG 3.1, option 2) Dual IPMB connections (Zone 1) Support for RTM (Zone 3) Power Supported Voltage (normal) -38VDC to -72VDC   Maximum Power Draw < 198W with 20W AMC, MPRTM0050 with Fiber Channel SFPs, 146GB SFF SAS HDD, Fouur 4 GByte FB-DIMMs under load Environment Ambient Operating 5° C to 40° C (board intake temperature) Temperature (normal) Operating (short term) -5° C to 55° C Storage -40° C to 70° C Airflow Operating 30 CFM minimum Humidity Operating 15% to 90% non-condensing at 55° C Storage 5% to 95% non-condensing at 40° C Vibration Operating 5 to 100 Hz: 1G @ 0.25 octave/minute Shock Non-Operating 50 G, 170 inches/second trapezoidal Regulatory Compliance NEBS Demonstrated NEBS Level-3 compliance GR-1089, GR-63 Safety UL/cUL 60950-1 Safety for Information   EN/IEC 60950-1 Safety for Information Technology Equipment (CB Report and Certificate) Emissions CISPR22:1997 and 2003/EN55022:1998 and EN55022 A1:2000 and A2:2003 Class A     EN 300 386 V1.3.2:2003     FCC Rules CFR 47:2003 Part 15B Class A ICES-003, Issue 4 (CISPR 22:1997 and A2:2002) Class A   Hazardous Substances Content meets requirements of EU RoHS directive relying on exemptions for lead in solders for network infrastructure equipment for switching, signaling, transmission and network management for telecommunications (telecom). Also meets requirements for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages (flip chip). Products using telecom exemption ONLY comply with the RoHS directive if used in exempted applications. Products using flip chip exemption may be labeled as Pb-free second-level interconnect. Ordering Information Order information to come. © 2010 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Promentum MPCBL0050 DATA SHEET | © 2010 RadiSys Corporation * All other trademarks are the properties of their respective owners.