PANASONIC SEMICONDUCTOR 2SD25490P

Description
TRANS NPN LF 80VCEO 3A TO-220D
Part Number
2SD25490P
Price
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Manufacturer
PANASONIC SEMICONDUCTOR
Lead Time
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Category
PRODUCTS - 2
Datasheet
Extracted Text
Power Transistors 2SD2549 Silicon NPN triple diffusion planar type For power amplification Unit: mm 4.6±0.2 9.9±0.3 2.9±0.2 ■ Features φ 3.2±0.1 • High forward current transfer ratio h which has satisfactory lin- FE earity • Low collector-emitter saturation voltage V CE(sat) • Full-pack package which can be installed to the heat sink with one screw 1.4±0.2 2.6±0.1 1.6±0.2 ■ Absolute Maximum Ratings T = 25°C C 0.8±0.1 0.55±0.15 Parameter Symbol Rating Unit Collector-base voltage (Emitter open) V 80 V CBO 2.54±0.30 5.08±0.50 Collector-emitter voltage (Base open) V 80 V CEO 12 3 1: Base Emitter-base voltage (Collector open) V 6V EBO 2: Collector 3: Emitter Collector current I 3A C TO-220D-A1 Package Peak collector current I 5A CP P 20 W Collector power C dissipation T = 25°C 2.0 a Junction temperature T 150 °C j Storage temperature T −55 to +150 °C stg ■ Electrical Characteristics T = 25°C ± 3°C C Parameter Symbol Conditions Min Typ Max Unit Collector-emitter voltage (Base open) V I = 30 mA, I = 080 V CEO C B Base-emitter voltage V V = 4 V, I = 3 A 1.8 V BE CE C Collector-emitter cutoff current (E-B short) I V = 70 V, V = 0 100 µA CES CE BE Collector-emitter cutoff current (Base open) I V = 70 V, I = 0 100 µA CEO CE B Emitter-base cutoff current (Collector open) I V = 6 V, I = 01 mA EBO EB C * Forward current transfer ratio h V = 4 V, I = 1 A 70 250 FE1 CE C h V = 4 V, I = 3 A 10 FE2 CE C Collector-emitter saturation voltage V I = 3 A, I = 0.375 A 0.7 V CE(sat) C B Transition frequency f V = 10 V, I = 0.5 A, f = 10 MHz 30 MHz T CE C Turn-on time t 0.5 µs I = 1 A, I = 0.1 A, I = − 0.1 A on C B1 B2 Storage time t V = 50 V 4.5 µs stg CC Fall time t 0.5 µs f Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. : Rank classification * Rank Q P h 70 to 150 120 to 250 FE1 Publication date: April 2003 SJD00276BED 1 13.7±0.2 15.0±0.5 4.2±0.2 Solder Dip 3.0±0.5 2SD2549 P T I V I V C a C CE C BE 30 8 8 (1)T =Ta C TC=25˚C Ta=25˚C (2)With a 100×100×2mm Al heat sink 25 (3)Without heat sink (PC=2W) 6 6 (1) 20 90mA 15 4 80mA 4 IB=100mA 70mA 60mA 50mA 40mA 10 (2) 30mA 2 2 20mA 5 10mA (3) 0 0 0 0 40 80 120 16001 21 48 602 0 0.2 0.4 0.6 0.8 1.0 1.2 Ambient temperature T (°C) Collector-emitter voltage V (V) Base-emitter voltage V (V) a CE BE V I h I Safe operation area CE(sat) C FE C 3 10 10 Ta=25˚C Ta=25˚C Non repetitive pulse T =25˚C C 10 1 I CP 2 10 IC t=1ms −1 10 t=10ms 1 t=1s 1 10 −2 10 0.1 −3 10 1 −2 −1 −2 −1 10 10 110 10 10 110 1 10 100 Collector current I (A) Collector current I (A) Collector-emitter voltage V (V) C C CE R t th 2 10 (1) (2) 10 1 Note: Rth was measured at Ta=25˚C and under natural convection. (1)PT=10V×0.2A(2W) and without heat sink (2)P =10V×0.8A(8W) and with a 100×100×2mm Al heat sink T −1 2 3 10 1 10 10 10 Time t (s) 2 SJD00276BED Thermal resistance R (°C/W) th Collector-emitter saturation voltage V (V) Collector power dissipation P (W) CE(sat) C Forward current transfer ratio h Collector current I (A) FE C Collector current I (A) Collector current I (A) C C Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteris- tics and applied circuits examples of the products. It neither warrants non-infringement of intellec- tual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other- wise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL
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