ON SEMICONDUCTOR MC10H102L

MC10H102 Quad 2−Input NOR Gate Description The MC10H102 is a quad 2−input NOR gate. The MC10H102 provides one gate with OR/NOR outputs. This MECL 10H™ part is a functional/pinout duplication of the standard MECL 10K™ family http://onsemi.com part, with 100% improvement in propagation delay, and no increases in power− supply current. MARKING DIAGRAMS* Features • Propagation Delay, 1.0 ns Typical 16 • Power Dissipation 25 mW/Gate (same as MECL 10K) MC10H102L • Improved Noise Margin 150 mV (Over Operating Voltage and AWLYYWW Temperature Range) 1 • Voltage Compensated CDIP−16 • MECL 10K Compatible L SUFFIX CASE 620A • Pb−Free Packages are Available* 16 MC10H102P 16 AWLYYWWG 1 1 PDIP−16 P SUFFIX CASE 648 10H102 ALYWG SOEIAJ−16 CASE 966 120 10H102G 20 1 AWLYYWW PLLC−20 FN SUFFIX CASE 775 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G= Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. *For additional information on our Pb−Free strategy and soldering details, please ORDERING INFORMATION download the ON Semiconductor Soldering and Mounting Techniques See detailed ordering and shipping information in the package Reference Manual, SOLDERRM/D. dimensions section on page 3 of this data sheet. © Semiconductor Components Industries, LLC, 2006 1 Publication Order Number: February, 2006 − Rev. 7 MC10H102/D MC10H102 V 1 16 V CC1 CC2 4 2 A D 2 15 5 out out 6 B C 3 14 out out 3 7 D A 4 13 in in 10 14 D A 5 12 IN in 11 B C 12 6 11 15 in in 13 9 B C 7 10 in in V = Pin 1 CC1 D V 8 9 EE out V = Pin 16 CC2 V = Pin 8 EE Pin assignment is for Dual−in−Line Package. Figure 1. Logic Diagram Figure 2. Pin Assignment Table 1. MAXIMUM RATINGS Symbol Characteristic Rating Unit V Power Supply (V = 0) −8.0 to 0 Vdc EE CC V Input Voltage (V = 0) 0 to V Vdc I CC EE I Output Current Continuous 50 mA out Surge 100 T Operating Temperature Range 0 to +75 °C A T Storage Temperature Range Plastic −55 to +150 °C stg Ceramic −55 to +165 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (V = −5.2 V ±5%) (Note 1) EE 0° 25° 75° Symbol Characteristic Min Max Min Max Min Max Unit I Power Supply Current − 29 − 26 − 29 mA E I Input Current High − 425 − 265 − 265 �A inH I Input Current Low 0.5 − 0.5 − 0.3 − �A inL V High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc OH V Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc OL V High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc IH V Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc IL 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 � resistor to −2.0 V. http://onsemi.com 2 MC10H102 Table 3. AC CHARACTERISTICS 0° 25° 75° Symbol Characteristic Min Max Min Max Min Max Unit t Propagation Delay 0.4 1.25 0.4 1.25 0.4 1.4 ns pd t Rise Time 0.5 1.5 0.5 1.6 0.55 1.7 ns r t Fall Time 0.5 1.5 0.5 1.6 0.55 1.7 ns f NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. ORDERING INFORMATION † Device Package Shipping MC10H102M SOEIAJ−16 50 Unit / Rail MC10H102MG SOEIAJ−16 50 Unit / Rail (Pb−Free) MC10H102MEL SOEIAJ−16 2000 / Tape & Reel MC10H102MELG SOEIAJ−16 2000 / Tape & Reel (Pb−Free) MC10H102FN PLLC−20 46 Units / Rail PLLC−20 (Pb−Free) MC10H102FNG 46 Units / Rail MC10H102FNR2 PLLC−20 500 / Tape & Reel PLLC−20 MC10H102FNR2G (Pb−Free) 500 / Tape & Reel MC10H102L CDIP−16 25 Unit / Rail MC10H102P PDIP−16 25 Unit / Rail MC10H102PG PDIP−16 25 Unit / Rail (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC10H102 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E M S S 0.007 (0.180) T L−M N B Y BRK −N− M S S 0.007 (0.180) T L−M N U D −L− −M− Z W D 20 1 S S S 0.010 (0.250) T L−M N G1 X V VIEW D−D M S S A 0.007 (0.180) T L−M N Z M S S 0.007 (0.180) T L−M N R M S S H 0.007 (0.180) T L−M N C K1 E 0.004 (0.100) K G −T− SEATING J PLANE M S S F 0.007 (0.180) T L−M N VIEW S G1 VIEW S S S S 0.010 (0.250) T L−M N NOTES: INCHES MILLIMETERS 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, DIM MIN MAX MIN MAX 1982. A 0.385 0.395 9.78 10.03 2. DIMENSIONS IN INCHES. B 0.385 0.395 9.78 10.03 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP C 0.165 0.180 4.20 4.57 OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. E 0.090 0.110 2.29 2.79 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT F 0.013 0.019 0.33 0.48 DATUM −T−, SEATING PLANE. G 0.050 BSC 1.27 BSC 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. H 0.026 0.032 0.66 0.81 ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. J 0.020 −−− 0.51 −−− 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER K 0.025 −−− 0.64 −−− THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). R 0.350 0.356 8.89 9.04 DIMENSIONS R AND U ARE DETERMINED AT THE U 0.350 0.356 8.89 9.04 OUTERMOST EXTREMES OF THE PLASTIC BODY V 0.042 0.048 1.07 1.21 EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE W 0.042 0.048 1.07 1.21 BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY X 0.042 0.056 1.07 1.42 MISMATCH BETWEEN THE TOP AND BOTTOM OF THE Y −−− 0.020 −−− 0.50 PLASTIC BODY. Z 2 10 2 10 7. DIMENSION H DOES NOT INCLUDE DAMBAR �� �� G1 0.310 0.330 7.88 8.38 PROTRUSION OR INTRUSION. THE DAMBAR K1 0.040 −−− 1.02 −−− PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 MC10H102 PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD 16 9 L FLASH OR PROTRUSIONS AND ARE MEASURED E AT THE PARTING LINE. MOLD FLASH OR Q 1 PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. E H M � 4. TERMINAL NUMBERS ARE SHOWN FOR E REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE 1 8 L DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DETAIL P Z DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE D BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). VIEW P e MILLIMETERS INCHES A DIM MIN MAX MIN MAX c A −−− 2.05 −−− 0.081 A 1 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 b c 0.10 0.20 0.007 0.011 D 9.90 10.50 0.390 0.413 A 1 b E 5.10 5.45 0.201 0.215 e 1.27 BSC 0.050 BSC M 0.10 (0.004) H 0.13 (0.005) 7.40 8.20 0.291 0.323 E L 0.50 0.85 0.020 0.033 L 1.10 1.50 0.043 0.059 E M 0 10 0 10 � � � � Q 0.70 0.90 0.028 0.035 1 −−− 0.78 −−− 0.031 Z CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ISSUE O ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. B 3. DIMENSION L TO CENTER OF LEAD WHEN A A FORMED PARALLEL. M 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC 16 9 BODY. 5 THIS DRAWING REPLACES OBSOLETE B L CASE OUTLINE 620−10. INCHES MILLIMETERS 1 8 DIM MIN MAX MIN MAX A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 16X J C −−− 0.200 −−− 5.08 D 0.015 0.020 0.39 0.50 M 0.25 (0.010) T B E E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC F H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 �� �� C N 0.020 0.040 0.51 1.01 K SEATING T PLANE N G 16X D M 0.25 (0.010) T A http://onsemi.com 5 MC10H102 PACKAGE DIMENSIONS PDIP−16 P SUFFIX PLASTIC DIP PACKAGE NOTES: CASE 648−08 −A− 1. DIMENSIONING AND TOLERANCING PER ANSI ISSUE R Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 16 9 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. B 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. 18 INCHES MILLIMETERS DIM MIN MAX MIN MAX F A 0.740 0.770 18.80 19.55 C L B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 S D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 SEATING −T− PLANE G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC K M J 0.008 0.015 0.21 0.38 H J K 0.110 0.130 2.80 3.30 G L 0.295 0.305 7.50 7.74 D 16 PL M 0 � 10 � 0 � 10 � S 0.020 0.040 0.51 1.01 M M 0.25 (0.010) T A MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: http://onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada Order Literature: http://www.onsemi.com/litorder P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Japan: ON Semiconductor, Japan Customer Focus Center Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada For additional information, please contact your 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada local Sales Representative. Phone: 81−3−5773−3850 Email: orderlit@onsemi.com MC10H102/D http://onsemi.com 6