® ICES 300 Intel Socket P, Core™ 2 Duo Family CPU COM Express Module Main Features ® Œ Intel Socket P, Core™ 2 Duo Family Processors Œ Type 2 COM Express Module Support up to 21 Express lanes, 32 ® Œ Intel GME965 Chipset bit PCI Interface, One IDE and Gigabit LAN Œ 2 x DDR2 DIMM Socket Support Un-buffered Non-ECC DDR2 Product Overview ® ® The ICES 300 is a Type 2 COM Express Module featuring Intel GME965 and ICH8M chipset, switch supports Intel Core™ 2 Duo Merom/Core™ 2 Duo Merom LV processors with 667/800 MHz FSB and 2 x DDR2 memories with 533/677 MHz up to 4 GB. The ICES 300 supports 1 x PCI Express x16 for superb graphic display through the carried board; it also supports other display types include LFP, LVDS, and wide screen up to 1920 x 1200. The high performance ICES 300 COM Express Module supports 3 x SATA, 8 x USB 2.0 and 5 x PCIe x1 Lanes through the carried board; and it is compatible with ICEB 8050 carried board. The ICES 300 offers the high processing power and vivid graphic display solution for advanced embedded applications. SpeciŢ cations CPU Support Display ® ® ® Œ Supports Intel Socket P, Core™ 2 Duo Family Processors Œ Intel GME965 integrated graphics solution w/ Intel Extreme Graphics 2 technology Œ Supports 800 FSB CPU Œ Up to 64 MB of dynamic video memory allocation Main Memory Œ One PCI Express x 16 Lane down to the carried board Œ Drive a standard progressive scan analog monitor with resolution up to Œ 2 x DIMM, Dual channel DDR2 533/667 MHz up to 4 GB 2048 x 1536 @ 60Hz Œ Supports LFP (local fl at panel) LVDS interface resolution up to 1366 x 768 Chipset ® Œ Single- or dual-pixel LVDS panel support up to UXGA panel resolution Œ Intel GME965 (1600 x 1200) Œ ICH8M I/O Controller Hub Œ Supports Single channel for 24 bit/Dual channel for 24 bit Œ Supports UXDA 1600 x 1200 @ 75HZ (4:3) BIOS Œ Supports WUXDA 1920 x 1200 (Wide Screen) Œ Award System BIOS Œ Plug & Play support Audio Œ 8M bits fl ash ROM Œ HD Audio Interface LAN COM Express Connectors ® Œ Intel 82573L LAN Chip Œ AB Œ Supports PXE LAN boot function VGA/LVDS/8 x USB 2.0/HD Audio/3 x SATA/LAN/GPIO/LPC bus/ 2 1 x PCIe x4/1 x PCIe x1/SMBus (I C)/SPI BIOS Œ Supports Wake on LAN Œ CD PCIe x16/IDE/PCI COM Express www.nexcom.com Block Diagram System Monitor Ordering Information Œ Derived from HW monitor Œ Monitoring of 4 voltages, 2 temperatures and 1 fan Speed Œ ICES 300-SKT (PN:10K00030000X0) Œ 4 voltage (For +3.3 V, +5 V, +12 V, Vcore) Type 2 COM Express Extended Module GME965 for advanced application Œ 2 Temperatures (CPU and one external Temperature Sensor) Power Requirements Œ + 12 V, + 5 VSB, + 3.3 V RTC Dimensions Œ COM Express Extended Module Type 2 155mm (L) x 110mm (W) (6.1" x 4.3") Environment Œ Board Level Operating temperatures: 0°C to 60°C Œ Storage temperatures: -20°C to 80°C Œ Relative humidity: 10% to 90% (operating, non-condensing) 5% to 95% (non-operating, non-condensing) Certifi cations Œ CE approval Œ FCC Class A COM Express We reserve the right to change specifi cations and product descriptions at any time without prior notice. Last update: 05/25/2010