DiskOnChip 2000 DIP From 16MByte to 1GByte Data Sheet, March 2006 Highlights DiskOnChip 2000 DIP is a member of M-Systems’ family of DiskOnChip flash disk products. It is available in densities of 16MByte to 1GByte. DiskOnChip 2000 DIP features: � Single-chip plug-n-play flash disk TrueFFS Software � Low power, single 3.3V or 5V power � Full hard-disk read/write emulation for supply transparent file system management � 16MByte (MB) to 1GByte (GB) density � Identical software for all DiskOnChip � Simple, easy-to-integrate interface capacities � 8KB sized memory window � Patented methods to extend flash lifetime, � Boot OS capability including: ® � Dynamic virtual mapping � Proprietary TrueFFS technology for full � Dynamic and static wear-leveling hard-disk emulation, high data reliability and maximum flash lifetime � Support for all major OSs, including: VxWorks, Windows CE/.NET, Linux, � Software tools for programming, Windows NT/XP, QNX and others. duplicating, testing, and debugging � Operates with TrueFFS Software Reliability Development Kit (SDK) in OS-less � On-the-fly Reed-Solomon Error Detection environment. Code/Error Correction Code (EDC/ECC) RoHS Support � Guaranteed data integrity, even after power � RoHS version available (16MB-96MB) failure � Transparent bad-block management � Dynamic and static wear-leveling 1 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP Hardware Compatibility � 32-pin DIP, JEDEC standard, EEPROM-compatible pinout � Compatible with all major CPUs, including: � x86 � StrongARM � XScale ® � Geode SCxxxx � PowerPC™ MPC8xx � MediaGX � 68K � MIPS � SuperH™ SH-x � 8-bit, 16-bit and 32-bit bus architecture support Applications � Embedded systems � Internet access devices � Internet set-top boxes/ITV, Web browsers � WBT, thin clients, network computers � Routers, networking � Web phones, car PCs, DVD, HPC � Point of sale, industrial PCs � Telecom, medical Densities � Low profile: 16, 32, 48, 64, 96, 128, 192, 256, 384MB � High profile: 576, 768, 1024MB � Commercial (0°C to 70°C) and extended temperature range (-40°C to +85°C) for all densities 2 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP TABLE OF CONTENTS 1. Introduction ............................................................................................................................... 3 2. Product Overview...................................................................................................................... 4 2.1 Product Description ............................................................................................................4 2.2 I/O Operation...................................................................................................................... 5 2.3 Pin Diagram........................................................................................................................ 5 2.4 Signal Descriptions.............................................................................................................6 3. Theory of Operation .................................................................................................................. 7 3.1 Overview............................................................................................................................. 7 3.2 System Interface................................................................................................................. 7 3.3 Boot Block .......................................................................................................................... 8 3.4 Error Detection Code/Error Correction Code (EDC/ECC) .................................................. 8 3.5 Flash Control ...................................................................................................................... 8 4. Operating Modes ....................................................................................................................... 9 5. TrueFFS Technology............................................................................................................... 10 5.1 General Description.......................................................................................................... 10 5.1.1 Built-In Operating System Support..................................................................................... 11 5.1.2 TrueFFS Software Development Kit (SDK)........................................................................ 11 5.1.3 File Management................................................................................................................ 11 5.1.4 Bad-Block Management..................................................................................................... 11 5.1.5 Wear-Leveling .................................................................................................................... 11 5.2 Power Failure Management ............................................................................................. 12 5.2.1 Error Detection/Correction.................................................................................................. 12 5.2.2 Special Features through I/O Control (IOCTL) Mechanism ............................................... 13 5.2.3 Compatibility....................................................................................................................... 13 5.3 8KB Memory Window....................................................................................................... 14 6. Booting from DiskOnChip 2000 ............................................................................................. 15 6.1 Introduction....................................................................................................................... 15 6.2 Boot Procedure in PC-Compatible Platforms ................................................................... 15 7. Design Considerations ...........................................................................................................17 7.1 Design Environment ......................................................................................................... 17 7.2 System Interface...............................................................................................................17 7.3 Connecting Signals........................................................................................................... 18 1 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 7.4 Platform-Specific Issues................................................................................................... 18 7.4.1 Wait State........................................................................................................................... 18 7.4.2 Big and Little Endian Systems............................................................................................ 18 7.4.3 Working with 8/16/32-Bit Systems...................................................................................... 19 8. Product Specifications ........................................................................................................... 20 8.1 Environmental Specifications ........................................................................................... 20 8.1.1 Temperature Ranges ......................................................................................................... 20 8.1.2 DiskOnChip Assembly........................................................................................................ 20 8.1.3 Humidity.............................................................................................................................. 20 8.1.4 Shock and Vibration ........................................................................................................... 20 8.2 Electrical Specifications.................................................................................................... 20 8.2.1 Absolute Maximum Ratings................................................................................................ 20 8.2.2 Capacitance........................................................................................................................ 21 8.2.3 DC Electrical Characteristics over Operating Range ......................................................... 21 8.2.4 AC Operating Conditions.................................................................................................... 22 8.3 Timing Specifications........................................................................................................ 23 8.3.1 Read Cycle Timing ............................................................................................................. 23 8.3.2 Write Cycle Timing ............................................................................................................. 24 8.4 Mechanical Dimensions.................................................................................................... 25 9. Ordering Information............................................................................................................... 26 How to Contact Us ........................................................................................................................ 27 2 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 1. INTRODUCTION This data sheet includes the following sections: Section 1: Overview of data sheet contents Section 2: Product overview, including brief product description, a pin diagram and signal descriptions Section 3: Theory of operation for the major building blocks Section 4: Modes of operation Section 5: Description of TrueFFS technology Section 6: Using DiskOnChip 2000 DIP as a boot device Section 7: Design considerations for implementing popular applications and for maximizing built-in flexibility features Section 8: Environmental, mechanical, electrical and production specifications To contact M-Systems’ worldwide offices for general information and technical support, please see the listing on the back page, or visit M-Systems’ website (www.m-systems.com). 3 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 2. PRODUCT OVERVIEW 2.1 Product Description The DiskOnChip 2000 product line is the second-generation of M-Systems’ DiskOnChip series of products. The DiskOnChip 2000 series provides a small, single-chip, solid-state flash disk in a standard 32-pin DIP package. Combining a disk controller with flash memory on a single chip, DiskOnChip 2000 is the solution where minimal weight, space, and power consumption are essential. DiskOnChip 2000 is used in a wide range of products, such as information appliances, set-top boxes, thin clients, thin servers, network computers, and embedded, portable computers. By placing DiskOnChip 2000 in a standard socket, physical space requirements are reduced. Unlike standard IDE drives, no cables or extra space are required. DiskOnChip 2000 has no moving parts, resulting in significantly decreased power consumption and increased reliability. It is easy to use and reduces integration overhead. DiskOnChip 2000 is therefore a very attractive alternative to conventional hard and floppy disk drives. Using TrueFFS technology, DiskOnChip 2000 delivers full hard disk emulation. As such, the design and integration stages can be considerably reduced, thereby enabling very fast time-to- market and ease of production. Combined with its very attractive cost structure, DiskOnChip 2000 is a superior alternative to resident flash array (RFA). DiskOnChip 2000 products are available in capacities ranging from 16MB to 1GB. DiskOnChip technology provides broad support for all major operating systems and processors in the market, enabling it to be readily integrated with any architecture. DiskOnChip 2000 is shipped as a plug-and-play device that is fully tested and formatted, and programmed with a DOS driver. Future driver, software or content upgrades, or formatting, can be made on-board or off-board using DiskOnChip utilities and accessories provided by M-Systems. 4 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 2.2 I/O Operation See Figure 1 for a simplified I/O diagram. A[12:0] D[7:0] DiskOnChip 2000 OE# WE# CE# Figure 1: Simplified I/O Diagram 2.3 Pin Diagram NC 1 VCC 32 NC 2 WE# 31 NC 3 30 NC A12 4 NC 29 5 A7 28 NC A6 6 A8 27 A5 7 A9 26 A4 8 A11 25 DiskOnChip 2000 DIP A3 9 OE# 24 A2 10 A10 23 A1 11 CE# 22 A0 12 D7 21 D0 13 D6 20 D1 14 D5 19 D2 15 D4 18 VSS 16 D3 17 Figure 2: Package Description and Pinout 5 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 2.4 Signal Descriptions Table 1: DiskOnChip 2000 Signal Descriptions Signal Pin Input Description Signal Number Type Type System Interface A[12:0] 4 to 12, 23, ST Address signals Input 25 to 27 D[7:0] 13 to 15, IN Data signals Input/ 17 to 21 Output CE# 22 ST Chip Enable, active low Input OE# 24 ST Output Enable, active low Input WE# 31 ST Write Enable, active low Input Power VCC 32 - Device supply Supply VSS 16 - Ground Supply Other NC 1, 2, 3, 28, - Not Connected. These pins should be left floating. Absolute 29, 30 maximum ratings must be observed. The following abbreviations are used: 1. IN: Standard (non-Schmidt) input 2. ST: Schmidt Trigger input 6 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 3. THEORY OF OPERATION 3.1 Overview DiskOnChip 2000 consists of the following major functional blocks, as shown in Figure 3: • System Interface for host interface. • Boot Block that contains IPL ROM required for recognition during BIOS expansion search in PC architectures. • Reed-Solomon-based Error Detection and Error Correction Code (EDC/ECC) for on-the- fly error handling. • Flash Control block that contains registers responsible for transferring the address, data and control information between the TrueFFS driver and the flash media. CE# WE# Flash System OE# Interface Control Flash D[0:7] A[0:12] Boot Block EDC/ECC (IPL ROM) Figure 3: DiskOnChip 2000 Simplified Block Diagram 3.2 System Interface The system interface block provides an easy-to-integrate SRAM-like (also EEPROM-like) interface to DiskOnChip 2000, enabling it to interface with various CPU interfaces, such as a local bus, ISA bus, SRAM interface, EEPROM interface or any other compatible interface. A 13-bit wide address bus enables access to the DiskOnChip 8KB memory window (as shown in Figure 5). The Chip Enable (CE#), Write Enable (WE#) and Output Enable (OE#) signals trigger read and write cycles. A write cycle occurs while both the CE# and the WE# inputs are asserted. Similarly, a read cycle occurs while both the CE# and OE# inputs are asserted. Note that DiskOnChip 2000 does not require a clock signal. The CE#, WE# and OE# signals trigger the controller (e.g., system interface block, bus control and data pipeline) and flash access. 7 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 3.3 Boot Block The boot block is responsible for answering the BIOS expansion search in PC architectures. After the BIOS identifies DiskOnChip 2000 as a valid BIOS expansion device, it executes the code stored in the boot block. The BIOS then loads the TrueFFS software from the flash memory into the host memory, delivering full disk capabilities to the operating system. This code is identical for all DiskOnChip 2000 capacities, since TrueFFS automatically detects the memory density of DiskOnChip 2000. 3.4 Error Detection Code/Error Correction Code (EDC/ECC) NAND flash, being an imperfect memory, requires error handling. DiskOnChip 2000 implements Reed-Solomon Error Detection Code (EDC). A hardware-generated, 6-byte error detection signature is computed each time a page (512 bytes) is written to or read from DiskOnChip 2000. The TrueFFS driver implements complementary Error Correction Code (ECC). Unlike error detection, which is required on every cycle, error correction is relatively seldom required, hence implemented in software. The combination of DiskOnChip’s built-in EDC mechanism and the TrueFFS driver ensures highly reliable error detection and correction, while providing maximum performance. The following detection and correction capability is provided for each 512 bytes: • Corrects up to two 10-bit symbols, including two random bit errors. • Corrects single bursts up to 11 bits. • Detects single bursts up to 31 bits and double bursts up to 11 bits. • Detects up to 4 random bit errors. 3.5 Flash Control The Flash Control block contains registers responsible for transferring the address, data and control information between the DiskOnChip TrueFFS driver and the flash media. Additional registers are used to monitor the status of the flash media (ready/busy) and of the DiskOnChip controller. 8 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 4. OPERATING MODES DiskOnChip 2000 can operate in two modes: • Normal: The device responds to every valid hardware cycle. While in this mode, all sections respond to valid read and write cycles. • Reset: The device ignores all write cycles (except for the “leave Reset mode” sequence), and returns predetermined values for all read cycles. Mode changes can occur due to any of the following events: o A valid write sequence to the Control register o Triggering the Boot Detector circuit, which enables automatic driver loading in a PC environment. 9 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 5. TRUEFFS TECHNOLOGY 5.1 General Description M-Systems’ patented TrueFFS technology was designed to maximize the benefits of flash memory while overcoming inherent flash limitations that would otherwise reduce its performance, reliability and lifetime. TrueFFS emulates a hard disk, making it completely transparent to the OS. In addition, since it operates under the OS file system layer (see Figure 4), it is completely transparent to the application. Application OS File System TrueFFS DiskOnChip Figure 4: TrueFFS Location in System Hierarchy TrueFFS technology support includes: • Binary driver support for all major OSs • TrueFFS Software Development Kit (SDK) • Boot Software Development Kit (BDK) • Support for all major CPUs, including 8-, 16- and 32-bit bus architectures TrueFFS technology features: • Block device API • Flash file system management • Bad-block management • Dynamic virtual mapping • Dynamic and static wear-leveling • Power failure management • Implementation of Reed-Solomon EDC/ECC • Performance optimization • Compatible with all DiskOnChip products 10 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 5.1.1 Built-In Operating System Support The TrueFFS driver is integrated into all major OSs, including: Windows CE/NT/NT Embedded/XP, Linux (various kernels), VxWorks, Nucleus, QNX, DOS, Symbian, and others. For a complete listing of all available drivers, please refer to M-Systems’ website www.m-systems.com. It is advised to use the latest driver versions that can be downloaded from the DiskOnChip 2000 web page on the M-Systems site. 5.1.2 TrueFFS Software Development Kit (SDK) The basic TrueFFS Software Development Kit (SDK) provides the source code of the TrueFFS driver. It can be used in an OS-less environment or when special customization of the driver is required for proprietary OSs. 5.1.3 File Management TrueFFS accesses the flash memory within DiskOnChip 2000 through an 8KB window in the CPU memory space. It provides block device API, by using standard file system calls, identical to those used by a mechanical hard disk, to enable reading from and writing to any sector on DiskOnChip 2000. This makes it compatible with any file system and file system utilities such as diagnostic tools and applications. When using the File Allocation Table (FAT) file system, the data stored on DiskOnChip 2000 uses FAT-16. Note: DiskOnChip 2000 is shipped formatted, and contains the FAT file system. 5.1.4 Bad-Block Management NAND flash, being an imperfect storage media, contains some bad blocks that cannot be used for storage because of their high error rates. TrueFFS automatically detects and maps bad blocks upon system initialization, ensuring that they are not used for storage. This management process is completely transparent to the user, who remains unaware of the existence and location of bad blocks, while remaining confident of the integrity of data stored. The Bad Block Table in DiskOnChip 2000 DIP is stored in a protected area for ensured reliability. 5.1.5 Wear-Leveling Flash memory can be erased a limited number of times. This number is called the erase cycle limit or write endurance limit and is defined by the flash array vendor. The erase cycle limit applies to each individual erase block in the flash device. After reaching the cycle limit, as given by the flash vendor, the erase block begins to make storage errors at a rate significantly higher than the error rate that is typical to the flash. In a typical application and especially if a file system is used, a specific page or pages are constantly updated (e.g., the page/s that contain the FAT, registry etc.). Without any special handling, these pages would wear out more rapidly than other pages, reducing the lifetime of the entire flash. To overcome this inherent deficiency, TrueFFS uses M-Systems’ patented wear-leveling algorithm. The wear-leveling algorithm ensures that consecutive writes of a specific sector are not written physically to the same page in the flash. This spreads flash media usage evenly across all pages, thereby maximizing flash lifetime. TrueFFS wear-leveling extends the flash lifetime 10 to 15 years beyond the lifetime of a typical application. 11 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP Dynamic Wear-Leveling TrueFFS uses statistical allocation to perform dynamic wear-leveling on newly written data. This not only minimizes the number of erase cycles per block, it also minimizes the total number of erase cycles. Because a block erase is the most time-consuming operation, dynamic wear-leveling has a major impact on overall performance. This impact cannot be noticed during the first write to flash (since there is no need to erase blocks beforehand), but it is more and more noticeable as the flash media becomes full. Static Wear-Leveling Areas on the flash media may contain static files, characterized by blocks of data that remain unchanged for very long periods of time, or even for the whole device lifetime. If wear-leveling were only applied on newly written pages, static areas would never be cycled. This limited application of wear-leveling would lower life expectancy significantly in cases where flash memory contains large static areas. To overcome this problem, TrueFFS forces data transfer in static areas as well as in dynamic areas, thereby applying wear-leveling to the entire media. 5.2 Power Failure Management TrueFFS uses algorithms based on “erase after write” instead of "erase before write" to ensure data integrity during normal operation and in the event of a power failure. Used areas are reclaimed for erasing and writing the flash management information into them only after an operation is complete. This procedure serves as a check on data integrity. The “erase after write” algorithm is also used to update and store mapping information on the flash memory. This keeps the mapping information coherent even during power failures. The only mapping information held in RAM is a table pointing to the location of the actual mapping information. This table is reconstructed during power-up or after reset from the information stored in the flash memory. To prevent data from being lost or corrupted, TrueFFS uses the following mechanisms: • When writing, copying, or erasing the flash device, the data format remains valid at all intermediate stages. Previous data is never erased until the operation has been completed and the new data has been verified. • A data sector cannot exist in a partially written state. Either the operation is successfully completed, in which case the new sector contents are valid, or the operation has not yet been completed or has failed, in which case the old sector contents remain valid. 5.2.1 Error Detection/Correction TrueFFS implements a Reed-Solomon Error Correction Code (ECC) algorithm to ensure data reliability. Refer to Section 3.4 for further information on the EDC/ECC mechanism. 12 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 5.2.2 Special Features through I/O Control (IOCTL) Mechanism In addition to standard storage device functionality, the TrueFFS driver provides extended functionality. This functionality goes beyond simple data storage capabilities to include features such as: format the media, binary partition(s) access, flash defragmentation, and other options. This unique functionality is available in all TrueFFS-based drivers through the standard I/O control command of the native file system. For further information, please refer to application note AP-DOC-046, Extended Functions of the TrueFFS Driver for DiskOnChip. 5.2.3 Compatibility The TrueFFS driver supports all released DiskOnChip products. Upgrading from one product to another requires no additional software integration. When using different drivers (e.g. TrueFFS SDK, BDK, BIOS extension firmware, etc.) to access DiskOnChip, the user must verify that all software is based on the same code base version. It is also important to use only tools (e.g. DFORMAT, DINFO, GETIMAGE, etc.) derived from the same version as the firmware version and the TrueFFS drivers used in the application. Failure to do so may lead to unexpected results, such as lost or corrupted data. The driver and firmware version can be verified by the sign-on messages displayed, or by the version information stored in the driver or tool. 13 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 5.3 8KB Memory Window The DiskOnChip 2000 memory map occupies a total address space of 8KB. This space consists of four 2KB sections, as shown in Figure 5and described below. • Section 0: Boot Block This section includes data that is typically used for booting code from the CPU. The available size is 64 bytes, aliased 32 times in the 2KB section. The second half of the boot block is located in Section 2. • Section 1: Boot Block This section includes the second 64 bytes of the Boot Block. The first 64 bytes can be found in Section 0, aliased 32 times. • Section 2: Control Registers Used to control the behavior of DiskOnChip 2000 and the flash media. • Section 3: Flash Area Window Used as a window to the flash media for data to be written or read. Reset Mode Normal Mode 000H Boot Boot Section 0 Block Block 800H Boot Boot Block Section 1 Block 1000H Control 00H Section 2 Registers 1800H Flash Area 00H Section 3 Window Figure 5: DiskOnChip 2000 Memory Map 14 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 6. BOOTING FROM DISKONCHIP 2000 6.1 Introduction DiskOnChip 2000 can operate as the OS boot device. The DiskOnChip default firmware contains drivers to enable it to perform as the OS boot device under DOS. For other OSs, please refer to the TrueFFS driver readme file. 6.2 Boot Procedure in PC-Compatible Platforms When used in PC-compatible platforms, DiskOnChip 2000 is connected to an 8KB memory window in the BIOS expansion memory range, typically located between 0C8000H to 0EFFFFH. During the boot process, the BIOS loads the TrueFFS firmware into the PC memory and installs DiskOnChip 2000 as a disk drive in the system. When the operating system is loaded, DiskOnChip 2000 is recognized as a standard disk. No external software is required to boot from DiskOnChip 2000. Figure 6 illustrates the location of the DiskOnChip 2000 memory window in the PC memory map. Extended Memory 1M 0FFFFFH BIOS 0F0000H DiskOnChip 8k 0C8000H Display 640k 0B0000H RAM 0 Figure 6: DiskOnChip 2000 Memory Window in the PC Memory Map After reset, the BIOS code first executes the Power On Self-Test (POST) and then searches for all expansion ROM devices. When DiskOnChip 2000 is found, the BIOS code executes from it the IPL (Initial Program Loader) code, located in the boot block. This code loads the TrueFFS driver into system memory, installs DiskOnChip 2000 as a disk in the system, and then returns control to the BIOS code. The operating system subsequently identifies DiskOnChip 2000 as an available disk. TrueFFS responds by emulating a hard disk. From this point onward, DiskOnChip 2000 appears as a standard disk drive. It is assigned a drive letter and can be used by any application, without any modifications to either the BIOS set-up or the autoexec.bat/config.sys files. DiskOnChip 2000 can be used as the only disk in the system, with or without a floppy drive, and with or without hard disks. The drive letter assigned depends on how DiskOnChip 2000 is used in the system, as follows: 15 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP • If DiskOnChip 2000 is used as the only disk in the system, the system boots directly from it and assigns it drive C. • If DiskOnChip 2000 is used with other disks in the system: o DiskOnChip 2000 can be configured as the last drive (the default configuration). The system assigns drive C to the hard disk and drive D to DiskOnChip 2000. o Alternatively, DiskOnChip 2000 can be configured as the system’s first drive. The system assigns drive D to the hard disk and drive C to DiskOnChip 2000. • If DiskOnChip 2000 is used as the OS boot device when configured as drive C, it must be formatted as a bootable device by copying the OS files onto it. This is done by using the SYS command when running DOS. 16 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 7. DESIGN CONSIDERATIONS 7.1 Design Environment DiskOnChip 2000 provides a complete design environment consisting of: • Evaluation Boards (EVBs) for enabling software integration and development with DiskOnChip 2000, even before the target platform is available. An EVB with an ISA standard connector and a PCI standard connector for immediate plug and play usage are available. • Programming solutions: o GANG programmer o Programming house o On-board programming • TrueFFS Software Development Kit (SDK) and BDK • DOS utilities: • DFORMAT • GETIMG/PUTIMG • DINFO • Documentation: o Data sheet o Application notes o Technical notes o Articles o White papers Please visit M-Systems’ website (www.m-systems.com) for the most updated documentation, utilities and drivers. 7.2 System Interface DiskOnChip 2000 uses an SRAM-like interface that can easily be connected to any microprocessor bus. With a standard interface, it requires 13 address lines, 8 data lines and basic memory control signals (CE#, OE#, WE#), as shown in Figure 7 below. Typically, DiskOnChip 2000 can be mapped to any free 8KB memory space. In a PC-compatible platform, it is usually mapped into the BIOS expansion area. If the allocated memory window is larger than 8KB, an automatic anti- aliasing mechanism prevents the firmware from being loaded more than once during the ROM expansion search. 17 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 3.3V or 5V 0.1 uF 10 nF VCC Address A[12:0] Data D[7:0] DiskOnChip 2000 Output Enable OE# Write Enable WE# Chip Enable CE# VSS Figure 7: DiskOnChip 2000 System Interface Notes: 1. The 0.1 µF and the 10 nF low-inductance high-frequency capacitors must be attached to each of the device’s VCC and VSS pins. 2. DiskOnChip 2000 is an edge-sensitive device. CE#, OE# and WE# should be properly terminated (according to board layout, serial parallel, or both terminations) to avoid signal ringing. 7.3 Connecting Signals DiskOnChip 2000 uses standard SRAM-like control signals, which should be connected as follows: • Address (A[12:0]) – Connect these signals to the host address bus. • Data (D[7:0]) – Connect these signals to the host data bus. • Write (WE#) and Output Enable (OE#) – Connect these signals to the host WR# and RD# signals, respectively. • Chip Enable (CE#) – Connect this signal to the memory address decoder. 7.4 Platform-Specific Issues The following section describes hardware design issues. 7.4.1 Wait State Wait states can be implemented only when DiskOnChip 2000 is designed in a bus that supports a Wait state insertion, and supplies a WAIT signal. 7.4.2 Big and Little Endian Systems PowerPC, ARM, and other RISC processors can use either Big or Little Endian systems. DiskOnChip 2000 uses the Little Endian system. Therefore, byte D[7:0] is its Least Significant Byte (LSB); bit D0 is the least significant bit within that byte. When connecting DiskOnChip 2000 to a 18 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP device that supports Big Endian systems, make sure to that the bytes of the CPU and DiskOnChip 2000 match. Note: Processors, such as the PowerPC, also change the bit ordering within the bytes. Failing to follow these rules results in improper connection of DiskOnChip 2000, and prevents the TrueFFS driver from identifying DiskOnChip 2000. 7.4.3 Working with 8/16/32-Bit Systems The TrueFFS driver supports 8-bit, 16-bit, and 32-bit bus architectures. Support for the 16-bit and 32-bit bus architectures, typically used in RISC processors, can be achieved by using the LSB of the data bus as follows: • For 16-bit address boundary shifts, shift the address lines by one, so that the host address line A1 connects to DiskOnChip 2000 address line A0, the host address line A2 connects to DiskOnChip 2000 line A1, and so on. • For 32-bit address boundary shifts, shift the address lines by two, so that the host address line A2 connects to DiskOnChip 2000 address line A0, the host address line A3 connects to DiskOnChip 2000 line A1, and so on. 19 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 8. PRODUCT SPECIFICATIONS 8.1 Environmental Specifications 8.1.1 Temperature Ranges • Commercial operating temperature: 0ºC to +70ºC • Extended operating temperature: -40ºC to +85ºC • Storage temperature: -50ºC to +85ºC 8.1.2 DiskOnChip Assembly The DiskOnChip 2000 DIP device is not hermetically sealed. Therefore, it must be assembled after the PCB goes through its final rinse. Assembling DiskOnChip 2000 prior to the rinse phase may cause it to absorb moisture. Failure to adhere to the above assembly instruction can lead to device failures not covered by M-Systems' warranty. Note: DiskOnChip 2000 DIP requires a DIP socket on the target platform. Due to its plastic shell and molding material, it cannot be soldered directly to the platform. 8.1.3 Humidity 10% - 90% relative, non-condensing 8.1.4 Shock and Vibration Table 2: Reliability Tests Reliability Test Test Conditions Reference Standard Vibration 100 ~ 2000 Hz, 15 G peak, 3 cycles per axis (1hr.), 3 STD-202F, Method 204D axes Mechanical Shock Half-sine shock 50 G, 11 msec, ±3 shocks per axis, 3 STD-202F, Method 213B axes 8.2 Electrical Specifications 8.2.1 Absolute Maximum Ratings Table 3: Maximum Ratings 1 1 Parameter Symbol 3.3V Model Rating 5V Model Rating Units Notes DC supply voltage V -0.5 to 4.6 -0.3 to 6.0 V CCS 2 Input pin voltage V -0.5 to V + 0.3 -0.3 to V + 0.3 V IN CC CC Input pin current I Not Specified -10 to 10 mA +25°C IN Power Dissipation PD 1.3 2.0 Watt 1. The voltage on any pin may undershoot to -2.0V or overshoot to Vcc+2.0V for periods <20 ns. 2. The unit shall be supplied from limited power source, which meets the requirements, detailed in clause 2.5 of UL 60950-1. 3. Permanent device damage may occur if absolute maximum ratings are exceeded. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 20 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP In order to protect DiskOnChip 2000 when it is exposed to overcurrent, a fuse may be added, or modifications to the power supply’s overcurrent protection mechanism may be considered. Figure 8 illustrates the suggested overcurrent protection for DiskOnChip 2000. Figure 8: Protecting DiskOnChip 2000 from Overcurrent 8.2.2 Capacitance Table 4: Input/Output Capacitance Symbol Parameter Conditions 3.3V Model Rating 5V Model Rating Unit MD2200/2, V = 0V 12 15 pF Input/Output IN C I/O Capacitance MD2203, V = 0V 36 45 pF IN Note: Capacitance is not 100% tested. 8.2.3 DC Electrical Characteristics over Operating Range Table 5: Vcc = 5V Characteristics Symbol Parameter Conditions Min Typ Max Unit 1 V System Supply Voltage 4.5 5.0 5.5 V CCS V High-level Input Voltage 2.0 V ih V Low-level Input Voltage 0.8 V il V High-level Output Voltage I = -16 mA 2.4 V oh OH V Low-level Output Voltage I = 16 mA 0.4 V OL OL MD2200, MD2202 µA ±10 I Input Leakage Current IL MD2203 µA ±30 MD2200, MD2202 ±10 µA I Output Leakage Current OZ MD2203 ±30 µA I Supply Current 200 ns Cycle Time, outputs open 40 60 mA vcc MD2200, MD2202 60 400 µA I Standby Current stdby MD2203 240 1200 µA Note: The supply voltage of the extended temperature products listed below is Vcc = 5V ± 0.25V: MD2202-D192-X, MD2202-D256-X, MD2202-D384-X, MD2203-D576-X, MD2203-D768-X, MD2203- D1024-X 21 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP Table 6: Vcc = 3.3V Characteristics Symbol Parameter Conditions Min Typ Max Unit 1 V System Supply Voltage 3.0 3.3 3.6 V CCS V High-level Input Voltage 2.7 V ih V Low-level Input Voltage 0.6 V il V Input Voltage Hysteresis 1.1 1.5 V HYS I = -18 mA 2.4 V OH High-level Output V oh Voltage I = 0 mA Vcc-0.1 V OH I = 18 mA 0.4 V OL V Low-level Output Voltage OL I = 0 mA 0.1 V OL MD2200, MD2202 ±10 µA I Input Leakage Current IL MD2203 ±30 µA MD2200, MD2202 µA ±10 I Output Leakage Current OZ MD2203 µA ±30 150 ns Cycle Time, outputs I Supply Current 30 60 mA vcc open MD2200, MD2202 70 400 µA I Standby Current stdby MD2203 300 1350 µA Note: The supply voltage of the extended temperature products listed below is Vcc = 3. 3V ± 0.15V: MD2202-D192-V3-X, MD2202-D256-V3-X, MD2202-D384-V3-X, MD2203-D576-V3-X, MD2203-D768-V3- X, MD2203-D1024-V3-X 8.2.4 AC Operating Conditions Timing specifications are based on the following conditions: Table 7: AC Operating Conditions Parameter 3.3V Model 5V Model 1,2 Supply Voltage V = 3.3V ±0.3V V = 5V ±0.5V CC CC Input Pulse Levels 0.2V to 2.9V 0.4V to 2.6V Input Rise and Fall Times 1 ns 5 ns Input and Output Timing Levels 1.5V 0.8V and 2.0V Output Load 100 pF 50 pF Notes: 1. The supply voltage of the extended temperature products listed below is Vcc = 3. 3V ± 0.15V: MD2202-D192-V3-X, MD2202-D256-V3-X, MD2202-D384-V3-X, MD2203- D576-V3-X, MD2203-D768-V3-X, MD2203-D1024-V3-X 2. The supply voltage of the extended temperature products listed below is Vcc = 5V ± 0.25V: MD2202-D192-X, MD2202-D256-X, MD2202-D384-X, MD2203-D576-X, MD2203-D768-X, MD2203-D1024-X 22 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 8.3 Timing Specifications 8.3.1 Read Cycle Timing T (A) SU A[0..12] CE# T (CE1) T (CE1) T (CE0) SU HO SU T (CE0) HO OE# T T REC ACC WE# T (D) T (D) DIS EN D[0..7] Figure 9: Read Cycle Table 8: Read Cycle Timing 3.3V 5V Symbol Description Notes Min (ns) Max (ns) Min (ns) Max (ns) T (A) Address to OE# � setup 2 10 SU T (A) OE#� to Address hold 35 56 HO T (CE0) CE# � to OE# � setup 0 0 1 SU T (CE0) OE#� to CE# = 0 hold 0 0 2 HO T (CE1) OE# or WE#� to CE# = 1 hold 8 42 HO T (CE1) CE#� to WE# or OE#� setup time 8 42 SU T OE#� to start of next cycle 20 59 REC T Read access time 110 130 acc T (D) OE#� to D active delay 15 75 7 91 en T (D) OE#� to D Hi-Z delay 13 44 dis 1. CE# may be asserted any time before or after OE# is asserted. If CE# is asserted after OE#, all timing relative to OE# asserted will be referenced instead to the time CE# was asserted. 2. CE# may be negated any time before or after OE# is negated. If CE# is negated before OE#, all timing relative to OE# negated will be referenced instead to the time CE# was negated. 23 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 8.3.2 Write Cycle Timing T (A) T (A) SU HO A[0..12] T (CE1) HO CE# T (CE1) SU T (CE0) HO T (CE0) HO OE# T (WE) T W REC WE# T (D) T (D) HO SU D[0..7] Figure 10: Write Cycle Table 9: Write Cycle Timing Symbol Description 3.3V 5V Notes Min (ns) Max (ns) Min (ns) Max (ns) T (A) Address to WE#� setup time 0 10 SU T (A) WE#� to Address hold time 35 56 HO T (WE) WE# asserted width 62 98 W T (CE0) 0 0 1 CE#� to WE#� setup time SU T (CE0) WE#� to CE# = 0 hold time 0 0 2 HO T (CE1) OE# or WE#� to CE# = 1 hold time 8 42 HO T (CE1) CE#� to WE# or OE#� setup time 8 42 SU T WE#� to start of next cycle 22 59 REC T (D) D to WE#� setup time 50 48 SU T (D) WE#� to D hold time 0 40 HO 1. CE# may be asserted any time before or after WE# is asserted. If CE# is asserted after WE#, all timing relative to WE# asserted will be referenced instead to the time CE# was asserted. 2. CE# may be negated any time before or after WE# is negated. If CE# is negated before WE#, all timing relative to WE# negated will be referenced instead to the time CE# was negated. 24 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 8.4 Mechanical Dimensions Figure 11: MD220x Mechanical Dimensions Table 10: Low-Profile MD2200 MD2202 Millimeters (max.) Millimeters (max.) A 41.9 43.95 B 18.05 18.3 C 2.54 2.54 D 15.24 15.24 E 5.7 6.0 F 4.0 4.0 G 0.51 0.51 H 38.2 38.2 Table 11: High-Profile MD2203 Millimeters (max.) A 45.6 B 18.8 C 2.54 D 15.24 E 13.5 F 4.0 G 0.51 H 38.2 Note: The above dimensions are maximum values. 25 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP 9. ORDERING INFORMATION MD2202-DCCC-V-T-P (Low-Profile) CCC: Density (MB) 16, 32, 48, 64, 96, 128, 192, 256, 384 V: Supply Voltage Blank 5V V3 3.3V T: Temperature Range Blank Commercial: 0°C to +70°C (optional) X Extended: -40°C to +85°C P: RoHS Compliance Blank Pb (Optional) P RoHS compliance (available only in 16, 32, 48, 64, and 96MB) MD2203-DCCC-V-T (High-Profile) CCC: Density (MB) 576, 768, 1024 V: Supply Voltage Blank 5V V3 3.3V T: Temperature Range Blank Commercial: 0°C to +70°C (optional) X Extended: -40°C to +85°C 26 Data Sheet, Rev. 3.9 91-SR-002-42-8L DiskOnChip 2000 DIP HOW TO CONTACT US USA China M-Systems Inc. M-Systems China Ltd. 8371 Central Ave, Suite A Room 121-122 Newark CA 94560 Bldg. 2, International Commerce & Exhibition Ctr. Phone: +1-510-494-2090 Hong Hua Rd. Fax: +1-510-494-5545 Futian Free Trade Zone Shenzhen, China Phone: +86-755-8348-5218 Fax: +86-755-8348-5418 Japan Europe M-Systems Japan Inc. M-Systems Ltd. Asahi Seimei Gotanda Bldg., 3F 7 Atir Yeda St. 5-25-16 Higashi-Gotanda Kfar Saba 44425, Israel Shinagawa-ku Tokyo, 141-0022 Tel: +972-9-764-5000 Phone: +81-3-5423-8101 Fax: +972-3-548-8666 Fax: +81-3-5423-8102 Taiwan Internet M-Systems Asia Ltd. www.m-systems.com 14 F, No. 6, Sec. 3 Minquan East Road General Information Taipei, Taiwan, 104 info@m-sys.com Tel: +886-2-2515-2522 Sales and Technical Information Fax: +886-2-2515-2295 techsupport@m-sys.com This document is for information use only and is subject to change without prior notice. M-Systems Flash Disk Pioneers Ltd. assumes no responsibility for any errors that may appear in this document. No part of this document may be reproduced, transmitted, transcribed, stored in a retrievable manner or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without prior written consent of M-Systems. M-Systems products are not warranted to operate without failure. Accordingly, in any use of the Product in life support systems or other applications where failure could cause injury or loss of life, the Product should only be incorporated in systems designed with appropriate and sufficient redundancy or backup features. Contact your local M-Systems sales office or distributor, or visit our website at www.m-systems.com to obtain the latest specifications before placing your order. © 2004 M-Systems Flash Disk Pioneers Ltd. All rights reserved. M-Systems, DiskOnChip, DiskOnChip Millennium, DiskOnKey, DiskOnKey MyKey, FFD, Fly-By, iDiskOnChip, iDOC, mDiskOnChip, mDOC, Mobile DiskOnChip, Smart DiskOnKey, SmartCaps, SuperMAP, TrueFFS, uDiskOnChip, uDOC, and Xkey are trademarks or registered trademarks of M-Systems Flash Disk Pioneers, Ltd. Other product names or service marks mentioned herein may be trademarks or registered trademarks of their respective owners and are hereby acknowledged. All specifications are subject to change without prior notice. 27 Data Sheet, Rev. 3.9 91-SR-002-42-8L