COMe-bPC2 Document Revision 140 www.kontron.com » Table of Contents « 1 User Information..................................................................................6 1.1 About This Document.................................................................................................................... 6 1.2 Copyright Notice.......................................................................................................................... 6 1.3 Trademarks................................................................................................................................. 6 1.4 Standards................................................................................................................................... 6 1.5 Warranty.................................................................................................................................... 7 1.6 Technical Support......................................................................................................................... 7 2 Introduction........................................................................................8 2.1 Product Description...................................................................................................................... 8 2.2 Naming clarification..................................................................................................................... 8 2.3 Understanding COM Express® Functionality.......................................................................................9 2.4 COM Express® Documentation....................................................................................................... 10 2.5 COM Express® Benefits................................................................................................................ 10 3 Product Specification...........................................................................11 3.1 Modules & Accessories................................................................................................................. 11 3.2 Functional Specification............................................................................................................... 13 3.3 Block Diagram............................................................................................................................ 18 3.4 Electrical Specification................................................................................................................ 19 3.4.1 Supply Voltage........................................................................................................................... 19 3.4.2 Power Supply Rise Time................................................................................................................ 19 3.4.3 Supply Voltage Ripple.................................................................................................................. 19 3.4.4 Power Consumption..................................................................................................................... 19 3.4.5 ATX Mode.................................................................................................................................. 20 3.4.6 Single Supply Mode..................................................................................................................... 20 3.5 Power Control............................................................................................................................ 21 3.6 Environmental Specification......................................................................................................... 22 3.6.1 Temperature Specification............................................................................................................ 22 3.6.2 Humidity................................................................................................................................... 22 3.7 Standards and Certifications......................................................................................................... 23 3.8 MTBF........................................................................................................................................ 25 3.9 Mechanical Specification.............................................................................................................. 26 3.10 Module Dimensions..................................................................................................................... 26 3.10.1 38008-XXXX-XX-X........................................................................................................................ 26 3.10.2 38009-XXXX-XX-X........................................................................................................................ 27 3.11 Thermal Management.................................................................................................................. 28 3.12 Heatspreader............................................................................................................................. 28 3.13 Onboard Fan Connector................................................................................................................ 29 3.13.1 BIOS Settings for Fan Control........................................................................................................ 30 3.13.2 Electrical Characteristics.............................................................................................................. 30 4 Features and Interfaces.......................................................................31 www.kontron.com COMe-bPC2 / 4.1 S5 Eco Mode.............................................................................................................................. 31 4.2 LPC.......................................................................................................................................... 32 4.3 LPC boot................................................................................................................................... 33 4.4 M.A.R.S.................................................................................................................................... 34 4.5 Fast I2C.................................................................................................................................... 35 4.6 JIDA16 and JIDA32..................................................................................................................... 36 4.7 K-Station 1................................................................................................................................ 37 4.8 K-Station & API Resources............................................................................................................ 38 4.8.1 I2C.......................................................................................................................................... 38 4.8.2 Storage.................................................................................................................................... 38 4.8.3 GPIO........................................................................................................................................ 38 4.8.4 Hardware Monitor....................................................................................................................... 38 4.9 GPIO - General Purpose Input and Output.........................................................................................39 4.10 Watchdog Timer.......................................................................................................................... 40 4.11 Flash Backup Feature................................................................................................................... 41 4.12 Speedstep Technology................................................................................................................. 43 4.13 C-States.................................................................................................................................... 44 4.14 Dynamic FSB Frequency Switching..................................................................................................45 4.15 VID-x....................................................................................................................................... 46 4.16 Enhanced Intel Dynamic Acceleration Technology..............................................................................47 4.17 Usage of Different Graphic Interfaces..............................................................................................48 4.18 Alternative Pin-out of HDMI.......................................................................................................... 49 4.19 Alternative Pin-out of Display Port.................................................................................................. 49 4.20 Display Configurations................................................................................................................. 50 4.21 Hybrid Graphics / Multi-monitor.................................................................................................... 52 4.22 Intel® vPro™ technology.............................................................................................................. 54 4.23 ACPI Suspend Modes and Resume Events..........................................................................................55 5 System Ressources..............................................................................56 5.1 Interrupt Request (IRQ) Lines........................................................................................................ 56 5.1.1 In 8259 PIC Mode........................................................................................................................ 56 5.1.2 In APIC mode............................................................................................................................. 57 5.2 Direct Memory Access (DMA) Channels.............................................................................................58 5.3 Memory Area............................................................................................................................. 58 5.4 I/O Address Map......................................................................................................................... 58 5.5 External Inter-IC (I2C) Bus............................................................................................................ 58 5.6 System Management (SM) Bus....................................................................................................... 58 5.7 JILI I2C Bus............................................................................................................................... 58 5.8 SDVO I2C Bus............................................................................................................................. 58 5.9 CRT I2C Bus............................................................................................................................... 58 6 Connectors........................................................................................59 6.1 Connector Location..................................................................................................................... 59 7 Pinout List.........................................................................................60 7.1 General Signal Description............................................................................................................ 60 4 COMe-bPC2 / 7.2 Connector X1A Row A................................................................................................................... 61 7.3 Connector X1A Row B................................................................................................................... 63 7.4 Connector X1B Row C................................................................................................................... 65 7.5 Connector X1B Row D................................................................................................................... 67 8 BIOS Operation...................................................................................69 8.1 Determining the BIOS Version....................................................................................................... 69 8.2 BIOS Update.............................................................................................................................. 69 8.3 Setup Guide............................................................................................................................... 70 8.3.1 Start AMI® BIOS Setup Utility....................................................................................................... 70 8.4 BIOS Setup................................................................................................................................ 72 8.4.1 Main Menu................................................................................................................................. 72 8.4.2 Module Info............................................................................................................................... 73 8.4.3 Advanced Menu.......................................................................................................................... 76 8.4.4 PCIPnP Menu............................................................................................................................ 104 8.4.5 Boot....................................................................................................................................... 105 8.4.6 Security.................................................................................................................................. 107 8.4.7 Chipset................................................................................................................................... 108 8.4.8 Exit Menu................................................................................................................................ 114 5 COMe-bPC2 / User Information 1 User Information 1.1 About This Document This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice. For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned. 1.2 Copyright Notice Copyright © 2003-2012 Kontron Europe GmbH All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH. DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG. 1.3 Trademarks The following lists the trademarks of components used in this board. » IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp. » Microsoft is a registered trademark of Microsoft Corp. » Intel is a registered trademark of Intel Corp. » All other products and trademarks mentioned in this manual are trademarks of their respective owners. 1.4 Standards Kontron Europe GmbH is certified to ISO 9000 standards. 6 COMe-bPC2 / User Information 1.5 Warranty This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or replace defective products. Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed. The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper installation or maintenance. Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product. 1.6 Technical Support Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to making our product easy to use and will help you use our products in your systems. Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support. 7 COMe-bPC2 / Introduction 2 Introduction 2.1 Product Description The COMe-bPC2 module unifies the 45 nm generations of Intel® Core™ 2 Duo processors with the new SSE4 instruction set and the chipset Intel® GS45, GM45 and GL40. This combination really sets new standards in many terms: more performance than ever on COM Express® form factor, outstanding performance-power-ratio, fast DDR3 SO-DIMM memory up to 8 GB and L2 cache up to 6 MB, the module really opens up new application fields. COMe-bPC2 is available with Intel® small form factor package: for instance, the ICH9M was shrunk from 961 mm² to 256 mm². Thus, valuable space for further features is gained: among others two stacked SO-DIMM sockets for dual channel memory. On top of that, Intel® small form factor package processors allow operations in ultra low voltage for best energy-efficiency. The bigger Intel® Performance Package offer high performance for bargain pricing. Especially, its 4 Serial ATA ports and the native RAID support establishes the COMe-bPC2 perfectly for heavy data sensitive applications. On top of all that, DirectX® 10 supports Windows® perfectly. Like all KontronCOM Express® modules, it is strictly compliant to the COM Express® standard. Therefore, upgrading existing carrier boards gets so easy and minimizes redesign efforts. 2.2 Naming clarification COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer, packaged as a super component. » COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm), formerly known as ETXexpress® » COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known as microETXexpress® » COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as nanoETXexpress The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and the pin-out type (#) followed by the CPU Name. 8 COMe-bPC2 / Introduction 2.3 Understanding COM Express® Functionality All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the following maximum amount of interfaces according to the PICMG module Pin-out type: Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6 1x 1x 1x 1x HD Audio Gbit Ethernet 1x 1x 1x 1x Serial ATA 4x 4x 4x 4x - - 1x - Parallel ATA PCI - - 1x - 6x 6x 6x 8x PCI Express x1 PCI Express x16 (PEG) - - 1x 1x USB Client 1x 1x - - 8x 8x 8x 8x USB 2.0 USB 3.0 - 2x - 4x 1x - 1x 1x VGA LVDS Dual Channel Single Channel Dual Channel Dual Channel DP++ (SDVO/DP/HDMI/DVI) 1x optional 1x 3x shared with PEG 3x 1x 1x 1x 1x LPC External SMB 1x 1x 1x 1x 1x 1x 1x 1x External I2C GPIO 8x 8x 8x 8x SDIO 1x optional 1x optional - - - 2x - 2x UART (2-wire COM) FAN PWM out - 1x - 1x 9 COMe-bPC2 / Introduction 2.4 COM Express® Documentation This product manual serves as one of three principal references for a COM Express® design. It documents the specifications and features of COMe-bPC2. Additional references are are available from your Kontron Support or from PICMG®: » The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document is available from the PIGMG website by filling out the order form. » The COM Express® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum flexibility to accommodate a wide range of COM Express® modules. Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable. 2.5 COM Express® Benefits COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules. The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging. A single baseboard design can use a range of COM Express® modules with different size and pin-out. This flexibility can differentiate products at various price/performance points, or to design future proof systems that have a built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence as computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules. A COM Express® baseboard design has many advantages of a custom, computer-board design but delivers better obsolescence protection, greatly reduced engineering effort, and faster time to market. 10 COMe-bPC2 / Product Specification 3 Product Specification 3.1 Modules & Accessories The COM Express® basic sized Computer-on-Module COMe-bPC2 (Internal project code CNTG / CNT2 / CNTX) follows pin-out Type 2 and is compatible to PICMG specification COM.0 Rev 1.0. The COMe-bPC2, based on Intel's Montevina platform is available in different variants to cover the demand of different performance, price and power: Commercial grade modules (0°C to 60°C operating) Product Number Product Name Processor Socket GMCH IOH 38009-0000-25-2 COMe-bPC2 T9400 Intel® Core™2 Duo T9400 BGA479 GM45 ICH9EM 38009-0000-23-2 COMe-bPC2 P8400 Intel® Core™2 Duo P8400 BGA479 GM45 ICH9EM 38009-0000-19-0 COMe-bPC2 T3100 Intel® Core™2 Duo T3100 PGA478 GL40 ICH9M 38009-0000-20-0 COMe-bPC2 CM575 Intel® Celeron® 575 PGA478 GL40 ICH9M 38008-0000-23-2 COMe-bPC2 SP9300 Intel® Core™2 Duo SP9300 BGA956 GS45 ICH9M-SFF 38008-0000-19-2 COMe-bPC2 SL9400 Intel® Core™2 Duo SL9400 BGA956 GS45 ICH9M-SFF 38008-0000-12-2 COMe-bPC2 SU9300 Intel® Core™2 Duo SU9300 BGA956 GS45 ICH9M-SFF 38008-0000-12-3 COMe-bPC2 CM723 Intel® Celeron®M ULV 723 BGA956 GS45 ICH9M-SFF 38008-0000-12-1 COMe-bPC2 CM722 Intel® Celeron®M ULV 722 BGA956 GS45 ICH9M-SFF Extended temperature modules (E1, -25°C to 75°C operating) Product Number Product Name Processor Socket GMCH IOH 38008-0000-19-2EXT COMe-bPC2 SL9400 E1 Intel® Core™2 Duo SL9400 BGA956 GS45 ICH9M-SFF Industrial grade modules (E2, -40°C to 85°C operating) Product Number Product Name Processor Socket GMCH IOH 38011-0000-19-2 COMe-bPC2 SL9400 XT Intel® Core™2 Duo SL9400 BGA956 GS45 ICH9M-SFF 38011-0000-12-2 COMe-bPC2 SU9300 XT Intel® Core™2 Duo SU9300 BGA956 GS45 ICH9M-SFF 38011-0000-12-1 COMe-bPC2 CM722 XT Intel® Celeron®M ULV 722 BGA956 GS45 ICH9M-SFF 11 COMe-bPC2 / Product Specification Accessories Product Number Carrier Boards 38102-0000-00-1 COM Express® Reference Carrier Type 2 (8mm COMe connector) 38104-0000-00-0 COM Express® Eval Carrier Type 2 (Niles Canyon, 5mm COMe connector) 38104-0000-00-1 COM Express® Eval Carrier Type 2 (Topanga Canyon, 5mm COMe connector) Product Number Memory 97015-1024-10-0 DDR3-1066 SODIMM 1GB 97015-2048-10-0 DDR3-1066 SODIMM 2GB 97015-4096-10-0 DDR3-1066 SODIMM 4GB 97015-1024-10-2 DDR3-1066 SODIMM 1GB E2 97015-2048-10-2 DDR3-1066 SODIMM 2GB E2 97015-4096-10-2 DDR3-1066 SODIMM 4GB E2 Product Number Cooling & Mounting 38009-0000-99-0 HSP COMe-bPC2 GM45 thread 38009-0000-99-1 HSP COMe-bPC2 GM45 through 38009-0000-99-2 HSP COMe-bPC2 GL40 thread 38009-0000-99-3 HSP COMe-bPC2 GL40 through 38009-0000-99-0C05 HSK COMe-bPC2 GM45 act. setscrew thread 38009-0000-99-0C06 HSK COMe-bPC2 GM45 pas. setscrew thread 38008-0000-99-0 HSP COMe-bPC2 GS45 thread 38008-0000-99-1 HSP COMe-bPC2 GS45 through 38008-0000-99-0C05 HSK COMe-bPC2 GS45 act. setscrew thread 38008-0000-99-0C06 HSK COMe-bPC2 GS45 pas. setscrew thread 36099-0000-99-0 COMe Active Uni Cooler (for CPUs up to 20W TDP) 36099-0000-99-1 COMe Passive Uni Cooler (for CPUs up to 10W TDP) 38017-0000-00-0 COMe Mount KIT 8mm 1set 38017-0000-00-5 COMe Mount KIT 5mm 1set 38017-0100-00-5 COMe Mount KIT 5mm 100sets 38017-0100-00-0 COMe Mount Kit 8mm 100sets Product Number Adapter & Cables 9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter) 9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter) 96006-0000-00-7 ADA-Type2-DP3 (Adapter Card Type 2 module to 3x DisplayPort) 96006-0000-00-8 ADA-DP-LVDS (DP to LVDS adapter) 96082-0000-00-0 KAB-ADAPT-DP-DVI (DP to DVI adapter cable) 96083-0000-00-0 KAB-ADAPT-DP-VGA (DP to VGA adapter cable) 96084-0000-00-0 KAB-ADAPT-DP-HDMI (DP to HDMI adapter cable) 96079-0000-00-0 KAB-HSP 200mm (Cable adapter to connect FAN to module) 96079-0000-00-2 KAB-HSP 40mm (Cable adapter to connect FAN to module) 12 COMe-bPC2 / Product Specification 3.2 Functional Specification Processor The Intel® Core™2 Duo / Celeron® (Penryn) CPU family supports: » Intel® Dynamic Acceleration (Turbo Mode) » Intel® Virtualization Technology (VT-x) » Intel® Trusted Execution Technology (TXT) » Intel® 64 » Idle States » Enhanced Intel SpeedStep® Technology » Execute Disable Bit » Intel® Dynamic FSB Frequency Switching (SuperLFM) » Thermal Monitoring Technologies CPU specifications Processor Cores Core CPU Clock Turbo L2 Cache C-States FSB Speed VT-x TXT Intel® 64 EIST Intel® Celeron® M722 1 45nm 1200MHz - 1MB C0 - C3 800 MHz No No Yes No Intel® Celeron® M723 1 45nm 1200MHz - 1MB C0 - C3 800 MHz No No Yes No Intel® Core™2 Duo SU9300 2 45nm 1200MHz 1400MHz 3MB C0 - C6 800 MHz Yes Yes Yes Yes Intel® Core™2 Duo SL9400 2 45nm 1866MHz 2000MHz 6MB C0 - C6 1066 MHz Yes Yes Yes Yes Intel® Core™2 Duo SP9300 2 45nm 2266MHZ 2400MHz 6MB C0 - C6 1066 MHz Yes Yes Yes Yes Intel® Celeron® 575 1 65nm 2000MHz - 1MB C0 - C3 667 MHz No No Yes No Intel® Celeron® T3100 2 45nm 1900MHz - 1MB C0 - C4 800 MHz No No Yes No Intel® Core™2 Duo P8400 2 45nm 2266MHz 2400MHz 3MB C0 - C6 1066 MHz Yes Yes Yes Yes Intel® Core™2 Duo T9400 2 45nm 2400MHz 2533MHz 6MB C0 - C6 1066 MHz Yes Yes Yes Yes 45nm: Penryn Core, 65nm: Merom Core 13 COMe-bPC2 / Product Specification Chipset The Intel Gen4 Graphics and Memory Controller Hub Cantiga supports: » PCI Express Revision 1.1 » Intel® Virtualization Technology for Directed I/O (VT-d) » Intel® Trusted Execution Technology » Intel® Active Management Technology 4.0 » Intel® ICH9 family IO Controller GMCH and IOH specifications Feature GS45/ICH9M-SFF GM45/ICH9EM GL40/ICH9M TDP 12W + 2.5W 12W + 2.5W 12W + 2.5W Max Memory 8GB 8GB 4GB Memory Type DDR3-1066 DDR3-1066 DDR3-800 FSB 800/1066MHz 667/800/1066MHz 667MHz PCIe x16 (PEG) YES YES NO VT-d YES YES NO AMT YES YES NO iTPM YES YES NO SATA RAID 0,1 0,1,Matrix - The Intel® Trusted Execution Technology (TXT) and Active Management Technology (AMT) are not supported by default on COMe-bPC2. Please contact your local sales or support. Memory 2x DDR3 SO-DIMM Sockets Memory Type DDR3-667/800/1066 Maximum Size 8GB (GL40: 4GB) Dual Channel Technology Only use non-ECC DDR3 memory modules. Kontron Part.No: 97015-xxxx-xx-x. If only one RAM module is used, it must be plugged into the lower socket if it is a board with GS45. On modules with GM45 or GL40 chipset a single RAM module must be plugged in the upper RAM socket. Otherwise there might be issues with the management engine, which lead to several problems. 14 COMe-bPC2 / Product Specification Graphics Core The integrated Intel® GMA X4500MHD (Gen5.5) supports: Graphics Core Render Clock GS45: 533/320MHz, GM45: 533MHz GL40: 400MHz Execution Units / Pixel Pipelines 10 Max Graphics Memory 1720MB GFX Memory Bandwidth (GB/s) GS45/GM45: 17, GL40: 12.8 DVMT 5.0 GFX Memory Technology API (DirectX/OpenGL) 10 / 2.1 Shader Model 4.0 Hardware accelerated Video MPEG2, VC-1, AVC, Blu-Ray Independent/Simultaneous Displays 2 YES Display Port HDCP support HDCP 1.2 (Keys optional) Monitor output CRT max Resolution 2048x1536 YES TV out: LVDS LVDS Bits/Pixel 1x18 / 2x18 LVDS Bits/Pixel with dithering 1x24 / 2x24 LVDS max Resolution: 1600x1200 PWM Backlight Control: YES JILI2/JILI3/EDID/DID Supported Panel Data: Display Interfaces Discrete Graphics 1x PEG 1.0 (not with GL40) Digital Display Interface DDI1 DP++/SDVOB DP++/SDVOC Digital Display Interface DDI2 Digital Display Interface DDI3 DP++ 2560x1600 Maximum Resolution on DDI The discrete PEG graphics port and the digitial display interfaces are multiplexed and cannot be used simultaneously. Display Port plus plus (DP++) allows usage as DisplayPort, HDMI or DVI PEG Configuration The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers. The COMe-bPC2 supports following PEG Port configuration when used as PCI Express Interface: » 1×16 » 1×1 15 COMe-bPC2 / Product Specification Storage onboard SSD - SD Card support - IDE Interface ETXe-PC: JM20335 USB2IDE / ETXe-PC-XT: JMD330 SATA2PATA 4x SATA 3Gb/s Serial-ATA SATA AHCI NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier SATA RAID 0, 1, MATRIX (ICH9M: no RAID) Connectivity USB 8x USB 2.0 - USB Client PCI PCI Rev 2.3 (33MHz/3.3V) 4 PCI External Masters PCI Express 5x PCIe x1 Gen1 Max PCI Express 6x PCIe x1 without LAN YES (external HW strap otion) PCI Express x2/x4 configuration Ethernet 10/100/1000 Mbit Intel® 82567 (Boazman) Ethernet controller It is also possible to run the 1st 4 x1 lanes as 1 x4 lane. For that please pull-up the signal A33 and A29 to 3.3V on the baseboard. Express Card hotplug functionality is only available, when in BIOS setup the PCIexpress lane is switched from [AUTO] which is default setting to [ENABLED] Ethernet The Intel® 82567 (Boazman) ethernet supports: » Jumbo Frames » MACsec IEEE 802.1 AE » WOL (Wake On LAN) » PXE (Preboot eXecution Environment) Misc Interfaces and Features HD Audio Audio Onboard Hardware Monitor ON Semi ADT7475 Trusted Platform Module iTPM 1.2 (int. in ICH9M-SFF/M-E) - Miscellaneous Baseboards with AC'97 codec only are not supported. Kontron Features Fast I2C External I2C Bus M.A.R.S. support YES JIDA16 / JIDA32 / PICMG EAPI Embedded API Custom BIOS Settings / Flash Backup YES Watchdog support Single Staged 16 COMe-bPC2 / Product Specification Power Features Singly Supply Support YES Supply Voltage 8.5V - 18V ACPI ACPI 3.0 S0, S3, S4, S5 S-States S5 Eco Mode YES Misc Power Management DPST 4.0 Power Consumption and Performance Full Load Power Consumption 13 - 50W 2942 - 6347 Kontron Performance Index Kontron Performance/Watt 124 - 225 Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics and Memory performance are available in Application Note KEMAP054 at EMD Customer Section. Supported Operating Systems The COMe-bPC2 supports: » Microsoft Windows XP x86/x64 » Microsoft Windows Vista x86/x64 » Microsoft Windows 7 x86/x64 » Microsoft Windows CE 6.0 » Microsoft Windows XP embedded » Linux » WindRiver VxWorks » QNX Neutrino 6.5 17 COMe-bPC2 / Product Specification 3.3 Block Diagram 18 COMe-bPC2 / Product Specification 3.4 Electrical Specification 3.4.1 Supply Voltage Following supply voltage is specified at the COM Express® connector: VCC: 8.5V - 18V Standby: 5V DC +/- 5% 2.5V - 3.3V RTC: - 5V Standby voltage is not mandatory for operation. - Extended Temperature (E1) variants are validated for 12V supply only 3.4.2 Power Supply Rise Time » The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms. » There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point following the ATX specification 3.4.3 Supply Voltage Ripple » Maximum 100 mV peak to peak 0 – 20 MHz 3.4.4 Power Consumption The maximum Power Consumption of the different COMe-bPC2 variants is 13 - 50W (100% CPU load on all cores; 90°C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on EMD Customer Section. Information there is available after registration. 19 COMe-bPC2 / Product Specification 3.4.5 ATX Mode By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion. VCC can be 8.5V - 18V in ATX Mode. On Computer-on-Modules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB). State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC G3 x x 0V x 0V S5 high low 5V high 0V S5 → S0 PWRBTN Event low → high 5V high → low 0 V→ VCC S0 high high 5V low VCC 3.4.6 Single Supply Mode In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in this mode and VCC can be 8.5V - 18V. To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not supported in Single Supply Mode. State PWRBTN# PWR_OK V5_StdBy VCC G3 x x x 0 G3 → S0 high open / high x connecting VCC S5 high open / high x VCC S5 → S0 PWRBTN Event open / high x reconnecting VCC Signals marked with “x” are not important for the specific power state. There is no difference if connected or open. All ground pins have to be tied to the ground plane of the carrier board. 20 COMe-bPC2 / Product Specification 3.5 Power Control Power Supply The COMe-bPC2 supports a power input from 8.5V - 18V. The supply voltage is applied through the VCC pins (VCC) of the module connector. Power Button (PWRBTN#) The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event). Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override). Power Good (PWR_OK) The COMe-bPC2 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on the module. Reset Button (SYS_RESET#) The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”. Modules with Intel® Chipset and active Management Engine does not allow to hold the module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will reboot the module automatically SM-Bus Alert (SMB_ALERT#) With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if BIOS switch “After Power Fail” is set to “Stay Off”. 21 COMe-bPC2 / Product Specification 3.6 Environmental Specification 3.6.1 Temperature Specification General Specification Operating Non-operating Commercial grade 0°C to +60°C -30°C to +85°C Extended (E1) -25°C to +75°C -30°C to +85°C Industrial grade (E2) -40°C to +85°C -40°C to +85°C Standard modules are available for commercial grade temperature range. Please see chapter Product Specification for available variants for extended or industrial temperate grade With Kontron heatspreader plate assembly The operating temperature defines two requirements: » the maximum ambient temperature with ambient being the air surrounding the module. » the maximum measurable temperature on any spot on the heatspreader's surface Without Kontron heatspreader plate assembly The operating temperature is the maximum measurable temperature on any spot on the module's surface. 3.6.2 Humidity » Operating: 10% to 90% (non condensing) » Non operating: 5% to 95% (non condensing) 22 COMe-bPC2 / Product Specification 3.7 Standards and Certifications RoHS The COMe-bPC2 is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment. CE marking The COMe-bPC2 is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950 Component Recognition UL 60950-1 The COM Express® basic form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc. Representative samples of this component have been evaluated by UL and meet applicable UL requirements. UL Listings: » NWGQ2.E304278 » NWGQ8.E304278 WEEE Directive WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules. Conformal Coating Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details. 23 COMe-bPC2 / Product Specification Shock & Vibration The COM Express® basic form factor Computer-on-Modules successfully passed shock and vibration tests according to » IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g) » IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g) EMC Validated in Kontron reference housing for EMC the COMe-bPC2 follows the requirements for electromagnetic compatibility standards » EN55022 » EN55011 » EN55024 » FCC15 24 COMe-bPC2 / Product Specification 3.8 MTBF The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts. The calculation methode used is “Telcordia Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in. Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values. System MTBF (hours): GS45 variant: 166409 @ 40°C GM45 variant: 166443 @ 40°C XT variant: 184428 @ 40°C Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered for separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths. 25 COMe-bPC2 / Product Specification 3.9 Mechanical Specification Dimension » 95.0 mm x 125.0 mm » Hight approx. 12mm (0.4”) CAD drawings are available at EMD CustomerSection 3.10 Module Dimensions 3.10.1 38008-XXXX-XX-X 26 COMe-bPC2 / Product Specification 3.10.2 38009-XXXX-XX-X 27 COMe-bPC2 / Product Specification 3.11 Thermal Management A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-bPC2. The heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or other cooling device. External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst- case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or less. The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces between the heatspreader plate and the major heat-generating components on the COMe-bPC2. About 80 percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution. You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Please see the COM Express® Design Guide for further information on thermal management. 3.12 Heatspreader Documentation and CAD drawings of COMe-bPC2 heatspreader and cooling solutions is provided at http://emdcustomersection.kontron.com. 28 COMe-bPC2 / Product Specification 3.13 Onboard Fan Connector Location and Pinout of Fan Connector The onboard fan connector (J1) can be found near the CPU at the shorter edge of the module. Use adaptor KAB-HSP (96079-0000-00-0) to connect a standard FAN. Connector J1 has following specification: » Part number (Molex) J8: 53261-0390 » Mates with: 51021-0300 » Crimp terminals: 50079-8100 The Pin assignement is: » Pin1: Tacho » Pin2: VCC » Pin3: GND 29 COMe-bPC2 / Product Specification 3.13.1 BIOS Settings for Fan Control The fan can be controlled via the BIOS Settings “Advanced → Hardware Health → Module Hardware Health” In general 4 modes are possible » Auto Fan Mode: Temperature Values can be selected to control the Fan » Fan Always On Full: Fan is always full on » Fan Disable Mode: Fan is disabled » Fan Manually Mode: A fixed PWM value (0…255) can be entered to run the fan at a selected speed The used hardware monitor onboard is an ADT7475. For additional information please refer to the regarding datasheet. 3.13.2 Electrical Characteristics Starting with revision 2.0 there are 2 version of onboard fan control possible. Our standard modules have the simple version populated. For custom projects it is possible to populate a more sophisticated one. The differences are: Features Premium Fan Base Fan Input Voltage Range 8.5V - 18V 8.5V - 18V Output Voltage 5V / 12V Only 12V (switch in BIOS without function) 1A 0.3A Max. output current The premium fan option is only available on moldules with GS45 MCH. The fan voltage is in both versions VCC of the board and limited to 12V max. The Fan out voltage output is not short circuit proof. If necessary the user has to ensure that the circuit is protected externally, for example by a fuse on the backplane. With premium fan solution it is recommended to select the correct fan voltage first in BIOS setup and then connect the fan. To connect a standard FAN with 3pin connector to the module please use adaptor cable KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2) 30 COMe-bPC2 / Features and Interfaces 4 Features and Interfaces 4.1 S5 Eco Mode Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA compared to the regular S5 state this means a reduction by at least factor 200! In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode reduces the current tremendously. The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature. Following prerequesites and consequences occur when S5 Eco Mode is enabled » The power button must be pressed at least for 200ms to switch on. » Wake via Powerbutton only. » “Power On After Power Fail”/“State after G3”: only “stay off” is possible 31 COMe-bPC2 / Features and Interfaces 4.2 LPC The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express® Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please refer to the official PICMG documentation for additional information. The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations. All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P: 83627HF/G Phoenix BIOS AMI CORE8 AMI Aptio PS/2 YES YES YES COM1/COM2 YES YES YES LPT YES YES YES HWM YES YES NO Floppy NO NO NO GPIO NO NO NO 83627DHG-P Phoenix BIOS AMI CORE8 AMI Aptio PS/2 YES YES YES COM1/COM2 YES YES YES LPT YES YES YES HWM NO NO NO Floppy NO NO NO GPIO NO NO NO Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details. 32 COMe-bPC2 / Features and Interfaces 4.3 LPC boot The COMe-bPC2 supports boot from an external Firmwarehub on LPC bus (LPC FWH). The external LPC FWH can be activated with signal A34 “BIOS_DISABLE#” or according newer specifications “BIOS_DIS0#” in following configuration: BIOS_DIS0# BIOS_DIS1# Function open open Boot on-module BIOS GND open Boot baseboard LPC FWH open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2 GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1 Using an external LPC Firmware Hub To program an external LPC FWH follow these steps: » Connect a 1MB LPC FWH to the module's LPC interface » Open pin A34 to boot from the module BIOS » Boot the module to DOS with access to the BIOS image and Firmware Update Utility aufdos.exe / batch file provided on EMD Customer Section » Connect pin A43 (BIOS_DIS0#) to ground to enable the external LPC FWH » Execute Flash.bat to flash the BIOS image to the external LPC FWH » reboot Your module will now boot from the external LPC FWH when BIOS_DIS0# is grounded. To create a BIOS with custom defaults: » Change your BIOS settings » Save as custom defaults to RTC/Flash and Exit (module will now always start with these settings) » Extract the BIOS including custom defaults with afudos.exe biosname.rom /O in DOS or kflash.exe backup biosname.rom in Windows Flash Backup should show “Enter new Password” first time saving custom defaults. If it is not possible to set a new password or entering a password shows an error message, please clean up CMOS data with DOS command: jidacmos rtc /clean (jidacmos utility is available at Kontron’s Customer Section) You can download all AMI CORE8 update utilities at AMI.com: http://www.ami.com/support/downloads/amiflash.zip 33 COMe-bPC2 / Features and Interfaces 4.4 M.A.R.S. The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g. Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery information to the Operating System. Reserved SM-Bus addresses for Smart Battery Solutions on the carrier: 8-bit Address 7-bit Address Device 12h 0x09 SMART_CHARGER 14h 0x0A SMART_SELECTOR 16h 0x0B SMART_BATTERY 34 COMe-bPC2 / Features and Interfaces 4.5 Fast I2C The COMe-bPC2 supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup Specification for external I2C: » Speed up to 400kHz » Compatible to Philips I2C bus standard » Multi-Master capable » Clock stretching support and wait state generation » Interrupt or bit-polling driven byte-by-byte data-transfers » Arbitration lost interrupt with automatic transfer cancellation » Start/Stop signal generation/detection » Bus busy detection » 7bit and 10bit addressing 35 COMe-bPC2 / Features and Interfaces 4.6 JIDA16 and JIDA32 JIDA16 (JUMPtec® Intelligent Device Architecture) is a BIOS interface which allows programs running in Real Mode operating systems (i.e. MS DOS) to call certain functions implemented in the BIOS. These functions can be used to get module information, make settings and access the I2C Bus and the Watchdog unit. JIDA16 functions are INT 15h BIOS calls which are only available in 16 Bit Real Mode operating systems. For 32bit operating systems (i.e. WindowsXP, Windows 7, Windows CE, VxWorks, Linux) a different JIDA implementation called JIDA32 is implemented. The same common driver for all JIDA32 capable modules talks to the JIDA32 part in the BIOS, which is hardware dependent to interact with the hardware. Please refer to EMD Customer Section for detailed documentation, JIDA utilities and Libraries for DOS, Windows, Linux, VxWorks or QNX. Usage of JIDA16 and JIDA32 36 COMe-bPC2 / Features and Interfaces 4.7 K-Station 1 Based on the JIDA32 interface users can implement advanced board functionality in their application. As an example utility Kontron provides K-Station for most 32bit Windows Operating Systems. K-Station 1 is a summary of command line utilities (Shell Tools) for easy access to JIDA32 BIOS implementations. Second part of K-Station is a JAVA based example GUI which gives a view an all available features using the Shell Tools. Following K-Station Shell Tools are available: » KSystemSummary.exe (System Information) » KGenInfo.exe (Module Information) » KCPUPerf.exe (CPU Throttling control) » KHWMon.exe (Hardware Monitoring) » KI2CBus.exe (I2C and SMBus access) » KIOPort.exe (GPIO control) » KStorage.exe (JIDA EEPROM access to user bytes) » KVGATool.exe (LVDS Backlight control) » KWDog.exe (Watchdog control) » KAMIMod.exe (AMICore8 BIOS Modification with Bootlogo or Usercode …) » KFlash.exe (AMICore8 BIOS Update) The full K-Station package, the stand-alone Shell Tools with drivers, example batch files and documentation is available on EMD Customer Section for free. 37 COMe-bPC2 / Features and Interfaces 4.8 K-Station & API Resources 4.8.1 I2C BUS Function I2C 0 Internal / JIDA I2C I2C 1 SM-Bus I2C 2 external I2C I2C 3 internal watchdog I2C 4 SDVO DDC I2C 5 CRT DDC I2C 6 JILI DDC 4.8.2 Storage Device Function EEPROM 0 JIDA EEPROM Area1 with 32 Bytes (free to use) 4.8.3 GPIO Port Function IO-Port 0 GPI 0 IO-Port 1 GPI 1 IO-Port 2 GPI 2 IO-Port 3 GPI 3 IO-Port 4 GPO 0 IO-Port 5 GPO 1 IO-Port 6 GPO 2 IO-Port 7 GPO 3 4.8.4 Hardware Monitor Sensor Function Temp 0 CPU ACPI Temperature Temp 1 Internal HWM Temperature (inside ADT7476) Temp 2 Chipset Temperature (Intel® 4 series chipset) Temp 3 External SIO Winbond 83627 Temp Sensor 0 Temp 3 External SIO Winbond 83627 Temp Sensor 1 Temp 5 External SIO Winbond 83627 Temp Sensor 2 FAN 0 CPU fan controlled by ADT7476 FAN 1 External SIO Winbond 83627 FAN Sensor 0 FAN 2 External SIO Winbond 83627 FAN Sensor 1 FAN 3 External SIO Winbond 83627 FAN Sensor 2 Voltage 0 Internal ADT7476 Battery Voltage: VBAT Voltage 1 Internal ADT7476 Supply Voltage: VCC Voltage 2 External SIO Winbond 83627 CPU Core Voltage Sensor: VCoreA Voltage 3 External SIO Winbond 83627 CPU Core Voltage Sensor: VCoreB Voltage 4 External SIO Winbond 83627 Battery Voltage Sensor: VBAT Voltage 5 External SIO Winbond 83627 Voltage Sensor 3: +3.3V Voltage 6 External SIO Winbond 83627 Voltage Sensor 4: +5V Voltage 7 External SIO Winbond 83627 Voltage Sensor 5: +5VSB Voltage 8 External SIO Winbond 83627 Voltage Sensor 6: +12V Voltage 9 External SIO Winbond 83627 Voltage Sensor 7: -5V Voltage 10 External SIO Winbond 83627 Voltage Sensor 8: -12V Ressources based on BIOS revision CNTGR415 38 COMe-bPC2 / Features and Interfaces 4.9 GPIO - General Purpose Input and Output The COMe-bPC2 offers 4 General Purpose Input (GPI) pins and 4 General Purpose Output (GPO) pins. On a 3.3V level digital in- and outputs are available. Signal Pin Description GPI0 A54 General Purpose Input 0 GPI1 A63 General Purpose Input 1 GPI2 A67 General Purpose Input 2 GPI3 A85 General Purpose Input 3 GPO0 A93 General Purpose Output 0 GPO1 B54 General Purpose Output 1 GPO2 B57 General Purpose Output 2 GPO3 B63 General Purpose Output 3 Configuration The GPI and GPO pins can be configured via JIDA32/K-Station. Please refer to the JIDA32/K-Station manual in the driver download packet on our customer section. 39 COMe-bPC2 / Features and Interfaces 4.10 Watchdog Timer You can configure the Watchdog Timer (WDT) in BIOS setup to start after a set amount of time after power-on boot. The WDT can also be controlled by the JIDA32 Library API. The application software should strobe the WDT to prevent its timeout. Upon timeout, the WDT resets and restarts the system. This provides a way to recover from program crashes or lockups. Configuration You can program the timeout period for the watchdog timer in two ranges: » 1-second increments from 1 to 255 seconds » 1-minute increments from 1 to 255 minutes Contact Kontron Embedded Modules technical support for information on programming and operating the WDT. 40 COMe-bPC2 / Features and Interfaces 4.11 Flash Backup Feature The COMe-bPC2 supports a new functionality called “Flash Backup”. This new feature allows saving custom defaults directly into the Flash. With invalid EEPROM data or without a CMOS EEPROM, the module will start up with these custom defaults. It’s possible to save this BIOS with changed defaults to an image and flash it on other modules. To create a BIOS with custom defaults: » Change your BIOS settings » Save as custom defaults to RTC/Flash and Exit (module will now always start with these settings) Flash Backup should show “Enter new Password” first time saving custom defaults. If it is not possible to set a new password or entering a password shows an error message, please clean up CMOS data with DOS command: jidacmos rtc /clean (jidacmos utility is available at Kontron’s Customer Section) » Extract the BIOS including custom defaults with afudos or kflash utility for windows Tool Command AFUDOS c:\>afudos.exe biosname.rom /O KFLASH c:\>kflash.exe backup biosname.rom 41 COMe-bPC2 / Features and Interfaces Flash your BIOS with custom defaults: To flash a BIOS with customized defaults extracted like described above, use following options Operating System Command Windows OS c:\>kflash.exe flash biosname.rom /bncr DOS c:\>afudos.exe biosname.rom /p /b /n /c c:\>jidacmos.exe eep /clean kflash.exe is a shell tool included in Kontron K-Station System Utility Package. jidacmos utility is included in the BIOS download packages at Kontron's customer section. 42 COMe-bPC2 / Features and Interfaces 4.12 Speedstep Technology The Intel® processors offers the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum performance mode and battery-optimized mode, depending on the needs of the application being run. It let you customize high performance computing on your applications. When powered by a battery or running in idle mode, the processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize performance. In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology. By disabling the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States. 43 COMe-bPC2 / Features and Interfaces 4.13 C-States New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode. Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or switching of parts of the CPU Core, the Core Clocks or the CPU Cache. Following C-States are defined: C-State Description Function C0 Operating CPU fully turned on C1 Halt State Stops CPU main internal clocks via software C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage C2 Stop Grant Stops CPU internal and external clocks via hardware C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage C3 Deep Sleep Stops all CPU internal and external clocks C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage C4 Deeper Sleep Reduces CPU voltage C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns off the memory cache C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched off C-States are usually enabled by default for low power consumption, but active C-States my influence performance sensitive applications or real-time systems. » Active C6-State may influence data transfer on external Serial Ports » Active C7-State may cause lower CPU and Graphics performance It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur. 44 COMe-bPC2 / Features and Interfaces 4.14 Dynamic FSB Frequency Switching Dynamic FSB frequency switching effectively reduces the internal bus clock frequency in half to further decrease the minimum processor operating frequency from the Enhanced Intel SpeedStep Technology performance states and achieve the Super Low Frequency Mode (Super LFM). This feature is supported at FSB frequencies of 1066 MHz, 800 MHz and 667 MHz and does not entail a change in the external bus signal (BCLK) frequency. Instead, both the processor and GMCH internally lower their BCLK reference frequency to 50% of the externally visible frequency. Both the processor and GMCH maintain a virtual BCLK signal (VBCLK) that is aligned to the external BCLK but at half the frequency. After a downward shift, it would appear externally as if the bus is running with a 133-MHz base clock in all aspects, except that the actual external BCLK remains at 266 MHz. See Figure 3 for details. The transition into Super LFM, a “down-shift,” is done following a handshake between the processor and GMCH. A similar handshake is used to indicate an “up-shift,” a change back to normal operating mode. Please ensure this feature is enabled and supported in the BIOS. 45 COMe-bPC2 / Features and Interfaces 4.15 VID-x The processor implements the VID-x feature for improved control of core voltage levels when the processor enters a reduced power consumption state. VID-x applies only when the processor is in the Intel Dynamic Acceleration Technology performance state and one or more cores are in low-power state (i.e., CC3/CC4/CC6). VID-x provides the ability for the processor to request core voltage level reductions greater than one VID tick. The amount of VID tick reduction is fixed and only occurs while the processor is in Intel Dynamic Acceleration Technology mode. This improved voltage regulator efficiency during periods of reduced power consumption allows for leakage current reduction which results in platform power savings and extended battery life. When in Intel Dynamic Acceleration Technology mode, it is possible for both cores to be active under certain internal conditions. In such a scenario the processor may draw a Instantaneous current (ICC_CORE_INST) for a short duration of tINST; however, the average ICC current will be lesser than or equal to ICCDES current specification. 46 COMe-bPC2 / Features and Interfaces 4.16 Enhanced Intel Dynamic Acceleration Technology The processor supports Intel Dynamic Acceleration Technology mode. The Intel Dynamic Acceleration Technology feature allows one core of the processor to operate at a higher frequency point when the other core is inactive and the operating system requests increased performance. This higher frequency is called the opportunistic frequency and the maximum rated operating frequency is the ensured frequency. The processor includes a hysteresis mechanism that improves overall Intel Dynamic Acceleration Technology performance by decreasing unnecessary transitions of the cores in and out of Intel Dynamic Acceleration Technology mode. Normally, the processor would exit Intel Dynamic Acceleration Technology as soon as two cores are active. This can become an issue if the idle core is frequently awakened for a short periods (i.e., high timer tick rates). The hysteresis mechanism allows two cores to be active for a limited time before it transitions out of Intel Dynamic Acceleration Technology mode. Intel Dynamic Acceleration Technology mode enabling requires: » Exposure, via BIOS, of the opportunistic frequency as the highest ACPI P state » Enhanced Multi-Threaded Thermal Management (EMTTM) » Intel Dynamic Acceleration Technology mode and EMTTM MSR configuration via BIOS 47 COMe-bPC2 / Features and Interfaces 4.17 Usage of Different Graphic Interfaces The COMe-bPC2 offers VGA, PCIexpress Graphics, LVDS, HDMI, SDVO and Displayport interfaces to connect graphical user interfaces. The usage of VGA, PCIexpress and SDVO complies with the current COM Express® Specification. The principle of using them is shown in the next drawing. VGA and LVDS interface is always available and can be used. The pins of PCIexpress Graphics either are used as PCIexpress Graphics or as HDMI/SDVO/DP, which is controlled by switch1. Switch1 is the SDVO_SDA# line (C73). When this signal is high (2.5V) the SDVO/HDMI/DP output is enabled. Otherwise the lines can be used as PCIexpressGraphic. The switch 2 to select HDMI, SDVO or Displayport consists of the devices detected on the regarding sense circuits. When there is an SDVO 2 TV/LVDS/DVI converter found on the SDVO_DATA and _CLK lines (C73; D73) then the output is switched to SDVO. When there is Displayport device found on the Displayport AUX lines (C71; C72) then it is Display port and in any other case the output is switched to HDMI. 48 COMe-bPC2 / Features and Interfaces 4.18 Alternative Pin-out of HDMI Pin Nr. Pin Name PCIexpress Pin Name HDMI HDMI Pin Description D61 PCIexpress Graphics Transmit + 3 TMDS_B_CLK HDMI Port B Clock D62 PCIexpress Graphics Transmit - 3 TMDS_B_CLK# HDMI port B Clock complement D58 PCIexpress Graphics Transmit + 2 TMDS_B_DATA0 HDMI port B Data0 D59 PCIexpress Graphics Transmit - 2 TMDS_B_DATA0# HDMI port B Data0 complement D55 PCIexpress Graphics Transmit + 1 TMDS_B_DATA1 HDMI port B Data1 D56 PCIexpress Graphics Transmit - 1 TMDS_B_DATA1# HDMI port B Data1 complement D52 PCIexpress Graphics Transmit + 0 TMDS_B_DATA2 HDMI port B Data2 D53 PCIexpress Graphics Transmit - 0 TMDS_B_DATA2# HDMI port B Data2 complement C61 PCIexpress Graphics Receive + 3 TMDS_B_HPD# HDMI port B Hot-plug detect D74 PCIexpress Graphics Transmit + 7 TMDS_C_CLK HDMI port C Clock D75 PCIexpress Graphics Transmit – 7 TMDS_C_CLK# HDMI port C Clock complement D71 PCIexpress Graphics Transmit + 6 TMDS_C_DATA0 HDMI port C Data0 D72 PCIexpress Graphics Transmit – 6 TMDS_C_DATA0# HDMI port C Data0 complement D68 PCIexpress Graphics Transmit + 5 TMDS_C_DATA1 HDMI port C Data1 D69 PCIexpress Graphics Transmit – 5 TMDS_C_DATA1# HDMI port C Data1 complement D65 PCIexpress Graphics Transmit + 4 TMDS_C_DATA2 HDMI port C Data2 D66 PCIexpress Graphics Transmit – 4 TMDS_C_DATA2# HDMI port C Data2 complement C74 PCIexpress Graphics Receive + 7 TMDS_C_HDP# HDMI port C Hot-plug detect 4.19 Alternative Pin-out of Display Port Pin Nr. Pin Name PCIexpress Pin Name HDMI HDMI Pin Description D61 PCIexpress Graphics Transmit + 3 DPB_LANE3 Displayport B Lane3 D62 PCIexpress Graphics Transmit – 3 DPB_LANE3# Displayport B Lane3 complement D58 PCIexpress Graphics Transmit + 2 DPB_LANE2 Displayport B Lane2 D59 PCIexpress Graphics Transmit – 2 DPB_LANE2# Displayport B Lane2 complement D55 PCIexpress Graphics Transmit + 1 DPB_LANE1 Displayport B Lane1 D56 PCIexpress Graphics Transmit - 1 DPB_LANE1# Displayport B Lane1 complement D52 PCIexpress Graphics Transmit + 0 DPB_LANE0 Displayport B Lane0 D53 PCIexpress Graphics Transmit – 0 DPB_LANE0# Displayport B Lane0 complement C61 PCIexpress Graphics Receive + 3 DPB_HPD# Displayport B Hot-plug detect C58 PCIexpress Graphics Receive + 2 DPB_AUX Displayport B Aux C59 PCIexpress Graphics Receive – 2 DPB_AUX# Displayport B Aux complement D74 PCIexpress Graphics Transmit + 7 DPC_LANE3 Displayport C Lane3 D75 PCIexpress Graphics Transmit – 7 DPC_LANE3# Displayport C Lane3 complement D71 PCIexpress Graphics Transmit + 6 DPC_LANE2 Displayport C Lane2 D72 PCIexpress Graphics Transmit – 6 DPC_LANE2# Displayport C Lane2 complement D68 PCIexpress Graphics Transmit + 5 DPC_LANE1 Displayport C Lane1 D69 PCIexpress Graphics Transmit – 5 DPC_LANE1# Displayport C Lane1 complement D65 PCIexpress Graphics Transmit + 4 DPC_LANE0 Displayport C Lane0 D66 PCIexpress Graphics Transmit – 4 DPC_LANE0# Displayport C Lane0 complement C74 PCIexpress Graphics Receive + 7 DPC_HPD# Displayport C Hot-plug detect C71 PCIexpress Graphics Receive + 6 DPC_AUX Displayport C Aux C72 PCIexpress Graphics Receive – 6 DPC_AUX# Displayport C Aus complement D88 PCIexpress Graphics Transmit + 11 DPD_LANE3 Displayport D Lane3 D89 PCIexpress Graphics Transmit – 11 DPD_LANE3# Displayport D Lane3 complement D85 PCIexpress Graphics Transmit + 10 DPD_LANE2 Displayport D Lane2 D86 PCIexpress Graphics Transmit – 10 DPD_LANE2# Displayport D Lane2 complement D81 PCIexpress Graphics Transmit + 9 DPD_LANE1 Displayport D Lane1 D82 PCIexpress Graphics Transmit – 9 DPD_LANE1# Displayport D Lane1 complement D78 PCIexpress Graphics Transmit + 8 DPD_LANE0 Displayport D Lane0 D77 PCIexpress Graphics Transmit – 8 DPD_LANE0# Displayport D Lane0 complement C88 PCIexpress Graphics Receive + 11 DPD_HPD# Displayport D Hot-plug detect C85 PCIexpress Graphics Receive + 10 DPD_AUX Displayport D Aux C86 PCIexpress Graphics Receive – 10 DPD_AUX# Displayport D Aus complement 49 COMe-bPC2 / Features and Interfaces 4.20 Display Configurations The chapter describes possible display configurations and supported features for the integrated Intel® GMA X4500MHD (Gen5.5) graphics. Display N/A CRT LVDS fixed LVDS DID LVDS2DVI DP DP2DVI DP2HDMI DP2CRT - S S S S S S S S N/A CRT S - A A A A A A A LVDS fixed S A - - - A A A A S A - - - A A A A LVDS DID LVDS2DVI S A - - - A A A A S A A A A A A A A DP DP2DVI S A A A A A A A A DP2HDMI S A A A A A A A A S A A A A A A A tbd DP2CRT » S = Single Display » A = All Modes (Single Display, Clone Mode, Extended Desktop) » - = Not supported » N/A = Display not attached Tested in Windows 7 with Intel GMA HD 15.15.6.1892, BIOS CNTGR414 50 COMe-bPC2 / Features and Interfaces Digital Display Interface Features The integrated Intel® GMA X4500MHD (Gen5.5) graphics supports: » One stream high-bandwidth Digital Content Protection (HDCP) on HDMI or DisplayPort (requires optional available HDCP Key) » One active Protected Audio and Video Path (PAVP) session on HDMI or DisplayPort » HDMI Audio if activated in BIOS and O/S » DP/HDMI/DVI Hot-plug (low-active) DDI Design Consideration » For sufficient signal quality baseboard designs with long signal lanes or impedance leaps may require an Equalicer or Redriver for the digital display interfaces » Monitor Hot-plug detection is usually high-active. On COMe-bPC2 the hot-plug is low active and requires conversion on the baseboard Supported Audio Formats on HDMI » AC-3 Dolby Digital » Dolby Digital Plus » DTS-HD » LPCM, 192kHz/24bit, 8 channel » Dolby True HD, DTS HD Master Audio 51 COMe-bPC2 / Features and Interfaces 4.21 Hybrid Graphics / Multi-monitor The COMe-bPC2 supports Hybrid Multi-monitor function which is one form of Intel's Hybrid Graphics where integrated graphics (in Chipset or CPU) is available to operate simultaneously with external PEG; PCIe or PCI graphics. This feature enables concurrent function of Intel's integrated Graphics Processing Unit (GPU/iGFX) along with a discrete GPU solution, allowing for operability of greater than two independently-driven displays. The O/S will handle control of the multiple GPU display adapters appropriately. For example, WindowsXP supports The Microsoft Windows XP Display Driver Model (XPDM) which allows loading and support of multiple graphics drivers. Windows 7 continues that legacy XPDM support but also adds WDDM v1.1 which, like XPDM, allows for simultaneous multiple graphics drivers (Windows Vista WDDM v1.0 did not allow this capability). Operating system applications will be adapter-unaware through use of the O/S GUI APIs and will utilize the adapter associated with the primary display, regardless of which display the image is located on. Some applications may be adapter-aware, e.g., full-screen applications and system applications like the compositor. A number of software tools designed to assist multi- monitor use are available from third parties. One example is the UltraMon* utility for multi- monitor systems, which helps with the position of applications, assists desktop wallpapers and screen savers in multi-monitor configurations. Hybrid Multi-monitor mode is recommended to be accomplished using a discrete third-party PCI Express graphics card either into the PEG slot of the platform or into an available PCI Express slot routed off of the I/O subsection of the chipset. Requirements » Baseboard supporting PEG (alternatively PCIe or PCI) » Module BIOS which allows switching between iGFX and discrete GPU (iGFX must be set to primary boot display) » O/S supporting heterogeneous display adapters (Linux / WindowsXP / Windows 7) Setup a Multi-monitor system » Start without the discrete GPU seated in the system » Select IGD as Primary Boot Display in BIOS Setup » Boot into O/S and install drivers requested for the integrated GPU » Shut down the system and insert the discrete GPU » Boot into O/S and install drivers requested for the discrete GPU (if necessary in Safe mode) » Set the Windows Display properties as referenced below (example: WindowsXP) 52 COMe-bPC2 / Features and Interfaces In most cases the graphical user interfaces (e.g. ATI Catalyst Control Center) for both GPUs may not run properly. It's recommended to use O/S implemented Display Properties like in screenshot above Detailed documentation is available in Intel Paper 323214 53 COMe-bPC2 / Features and Interfaces 4.22 Intel® vPro™ technology Kontron and Intel® are addressing the security and manageability challenges facing embedded systems today with the implementation of Intel® vPro™ technology to enable: » System integrity » Secure isolation » Remote systems management First, system integrity is the ability to identify whether the system hardware or system software has been modified without authorization. When a system’s integrity is known, the system can be thought of as a trusted system. Second, secure isolation is the ability to use platform hardware to separate processes, resources, and data on the system such that they cannot interact with each other in unintended ways. By providing hardware-assisted isolation, there are limitless security, privacy, and cost savings that can be realized through consolidation and workload isolation. Finally, remote systems management is the ability to troubleshoot, perform power management or system verification through secure channels. Significant cost savings and efficiencies can be realized through remote management allowing for increased system up time and the ability to manage or diagnose a system, even when powered down. Intel® vPro™ technology itself is special functionality designed into the both the processor and the chipset. The three technologies that comprise Intel® vPro™ technology are: Intel Virtualization Technology (Intel® VT), Intel Trusted Execution Technology (Intel® TXT) and Intel Active Management Technology (Intel® AMT). Intel® VT provides hardware-based assists making secure isolation more efficient and decreases the virtualization footprint, lowering the effective attack surface of a solution. This hardware-based technology can help to protect applications and information by running multiple operating systems (OSs) in isolation on the same physical system. A virtual guest OS can be created in an entirely separate space on the physical system to run specialized or critical applications. Virtual environments leverage Intel® VT for memory, CPU, and Directed I/O virtualization. Intel® TXT provides the ability to use hardware-based mechanisms to verify system integrity during the boot process. It also provides system memory scrubbing that protects against soft reset attacks. Virtualized environments take advantage of Intel® TXT launch environment verification to establish a dynamic root of trust providing added security to hypervisor or virtual machine monitor (VMM). Mechanisms employed by Intel® AMT include domain authentication, session keys, persistent data storage in the Intel® AMT hardware, and access control lists. Only firmware images that are digitally signed by Intel are permitted to load and execute. This set of hardware-based features is targeted for businesses and allows remote access to the system, whether wired or wireless, for management and security tasks. Because of the special hardware capabilities provided by Intel® AMT, out of band access is available even when the OS is not functional or system power is off. Intel® TXT and Intel® AMT are disabled by default. Please contact your local sales or support for BIOS versions with full vPro™ support 54 COMe-bPC2 / Features and Interfaces 4.23 ACPI Suspend Modes and Resume Events The COMe-bPC2 supports the S3 state (=Save to Ram). S4 (=Save to Disk) is not supported by the BIOS (S4_BIOS) but S4_OS is supported by the following operating systems: » Windows XP » Windows Vista » Windows 7 The following events resume the system from S3: » USB Keyboard (1) » USB Mouse (1) » Power Button » WakeOnLan (2) The following events resume the system from S4: » Power Button » WakeOnLan (2) The following events resume the system from S5: » Power Button » WakeOnLan (2) (1) OS must support wake up via USB devices and baseboard must power the USB Port with StBy-Voltage (2) WakeOnLan must be enabled in BIOS setup and driver options 55 COMe-bPC2 / System Ressources 5 System Ressources 5.1 Interrupt Request (IRQ) Lines Please be aware that an ACPI OS decides itself on resource usage. The tables below show only an example distribution. 5.1.1 In 8259 PIC Mode IRQ# Used For Available Comment 0 Timer 0 No - 1 Keyboard No Note (4) 2 Slave 8259 No - 3 - Yes - 4 - Yes - 5 - Yes - 6 - Yes - 7 - Yes - 8 RTC No - 9 SCI No Note (3) 10 - Yes - 11 - Yes - 12 PS/2 Mouse No Note (5) 13 FPU No - 14 IDE0 No Note (1)(2) 15 IDE1 No Note (1)(2) 1 If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices. 2 if sata controller is operating in legacy mode 3 Unavailable in Advanced Configuration and Power Interface (ACPI) mode. Used as System Control Interrupt (SCI) in ACPI mode. Currently not free in Non-ACPI mode. 4 used by legacy keyboard controller when available on carrier board. 5 used by legacy ps/2 mouse controller when available on carrier board. 56 COMe-bPC2 / System Ressources 5.1.2 In APIC mode IRQ# Used For Available Comment 0 Timer 0 No - 1 Keyboard No - 2 Slave 8259 No - 3 - Yes Note (4) 4 - Yes Note (4) 5 - Yes Note (4) 6 - Yes Note (4) 7 - Yes Note (4) 8 RTC No - 9 SCI No Note (2) 10 - Yes Note (4) 11 - Yes Note (4) 12 - Yes Note (4) 13 FPU No - 14 IDE0 No Note (1)(3) 15 IDE1 No Note (1)(3) 16 PIRQ[A] For PCI PCI IRQ line 1 + Graphics controller + HD Audio Controller + secondary IDE Note (4) 17 PIRQ[B] For PCI PCI IRQ line 2 + HD Audio controller Note (4) 18 PIRQ[C] For PCI PCI IRQ line 3 + USB UCHI controller #3 + SATA (native mode) Note (4) 19 PIRQ[D] For PCI PCI IRQ line 4 + USB UCHI controller #2 + IDE (native mode) Note (4) 20 PIRQ[E] No Lan Controller Note (4) 21 PIRQ[F] No Note (4) 22 PIRQ[G] No Note (4) 23 PIRQ[H] No USB EHCI controller, USB UCHI controller #1 Note (4) 1 If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices. 2 Unavailable in Advanced Configuration and Power Interface (ACPI) mode. Used as System Control Interrupt (SCI) in ACPI mode. Currently not free in Non-ACPI mode. 3 IRQs are available if IDE controller is either disabled in setup or if in Native IDE mode. 4 ACPI Operating System decides on particular IRQ usage. 57 COMe-bPC2 / System Ressources 5.2 Direct Memory Access (DMA) Channels DMA# Used For Available Comment 0 - No - 1 - No - 2 - No - 3 - No - 4 Cascade No - 5 - No - 6 - No - 7 - No - 5.3 Memory Area Upper Memory Used For Available Comment C0000h-CFFFFh VGA BIOS No - D0000h-DFFFFh - Yes LPC Bus or Shadow RAM E0000h-EFFFFh System BIOS No - 5.4 I/O Address Map Upper Memory Used For Available Comment 400h-41Fh Chipset No Always used by chipset 4D0h-4D1h Interrupt Controller No - 500h-53Fh Chipset No Always used by chipset 800h-87Fh Chipset No Always used by chipset 1000h> PCI No - 5.5 External Inter-IC (I2C) Bus I2C Address Used For Available Comment JIDA Bus Nr. - - - - 2 5.6 System Management (SM) Bus SMB Address Used For Available Comment JIDA Bus Nr. 10h SMB Host No EEPROM for CMOS Data 1 12h SMART_Charger No Only be used by a SMB Charger 1 14h SMART_Selector No Only be used by a SMB Selector 1 or Manager 16h SMART_Battery No Only be used by a SMB Battery 1 A0h SPD No DDR3 channel A 1 A4h SPD No DDR3 channel B 1 5Ch HW-Monitor No - 1 D2h Clockgenerator No - 1 5.7 JILI I2C Bus I2C Address Used For Available Comment JIDA Bus Nr. A0h DDC No Display Data 6 62h MAX6253 No DAC for Backlight brightness 6 5.8 SDVO I2C Bus I2C Address Used For Available Comment JIDA Bus Nr. A0h DDC No Display Data 4 5.9 CRT I2C Bus I2C Address Used For Available Comment JIDA Bus Nr. A0h DDC No Display Data 5 JIDA Bus Nr. 0 and Bus Nr. 3 are for internal use only. 58 COMe-bPC2 / Connectors 6 Connectors The pinouts for Interface Connectors X1A and X1B are documented for convenient reference. Please see the COM Express® Specification and COM Express® Design Guide for detailed, design-level information. 6.1 Connector Location 59 COMe-bPC2 / Pinout List 7 Pinout List 7.1 General Signal Description Type Description Bi-directional 3,3 V IO-Signal I/O-3,3 I/O-5T Bi-dir. 3,3V I/O (5V Tolerance) I/O-5 Bi-directional 5V I/O-Signal 3,3V Input I-3,3 I/OD Bi-directional Input/Output Open Drain 3,3V Input (5V Tolerance) I-5T OA Output Analog OD Output Open Drain 1,8V Output O-1,8 O-3,3 3,3V Output 5V Output O-5 DP-I/O Differential Pair Input/Output DP-I Differential Pair Input Differential Pair Output DP-O PU Pull-Up Resistor Pull-Down Resistor PD PWR Power Connection To protect external power lines of peripheral devices, make sure that: the wires have the right diameter to withstand the maximum available current the enclosure of the peripheral device fulfills the fire-protection requirements of IEC/EN60950 60 COMe-bPC2 / Pinout List 7.2 Connector X1A Row A Pin Signal Description Type Termination Comment A1 GND Power Ground PWR - - A2 GBE0_MDI3- GBE0_MDI3_N ; Ethernet Receive Data - DP-I - - A3 GBE0_MDI3+ GBE0_MDI3_P ; Ethernet Receive Data - DP-I - - A4 GBE0_LINK100# GBE0_LINK100# ; Ethernet Speed LED O-3,3 - - A5 GBE0_LINK1000# GBE0_LINK1000# ; Ethernet Speed LED O-3,3 - - A6 GBE0_MDI2- GBE0_MDI2_N ; Ethernet Receive Data - DP-I - - A7 GBE0_MDI2+ GBE0_MDI2_P ; Ethernet Receive Data - DP-I - - A8 GBE0_LINK# GBE0_LINK# ; LAN Link LED OD - - A9 GBE0_MDI1- GBE0_MDI1_N ; Ethernet Receive Data - DP-I - - A10 GBE0_MDI1+ GBE0_MDI1_P ; Ethernet Receive Data + DP-I - - A11 GND Power Ground PWR - - A12 GBE0_MDI0- GBE0_MDI0_N ; Ethernet Transmit Data - DP-O - - A13 GBE0_MDI0+ GBE0_MDI0_P ; Ethernet Transmit Data + DP-O - - A14 GBE0_CTREF GBE0_CTREF O-1,8 - is on a power rail controlled by Intels ME A15 SUS_S3# PM_SLP_S3_EXT# O-3,3 PU 10k 3,3V (S5) - A16 SATA0_TX+ SATA_TX0_P ; SATA 0 Transmit Data + DP-O - - A17 SATA0_TX- SATA_TX0_N ; SATA 0 Transmit Data - DP-O - - A18 SUS_S4# PM_SLP_S4_EXT# O-3,3 - - A19 SATA0_RX+ SATA_RX0_P ; SATA 0 Receive Data + DP-I - - A20 SATA0_RX- SATA_RX0_N ; SATA 0 Receive Data - DP-I - - A21 GND Power Ground PWR - - A22 SATA2_TX+ SATA_TX2_P ; SATA 2 Transmit Data + DP-O - - A23 SATA2_TX- SATA_TX2_N ; SATA 2 Transmit Data - DP-O - - A24 SUS_S5# PM_SLP_S#5 O-3,3 - - A25 SATA2_RX+ SATA_RX2_P ; SATA 2 Receive Data + DP-I - - A26 SATA2_RX- SATA_RX2_N ; SATA 2 Receive Data - DP-I - - A27 BATLOW# PM_BATLOW# ; Battery Low I-3,3 PU 8k25 3,3V (S5) - A28 ATA_ACT# ATA_LED# ; SATA LED O-3,3 PU 10k 3,3V (S0) int. PU 15k in ICH9 only active if PLTRST#=0 A29 AC_SYNC HDA_SYNC ; HD Audio Sync O-3,3 - opt. for x4: PU 1k 3,3V(S0) A30 AC_RST# HDA_RST# ; HD Audio Reset O-3,3 - int. PD 20k in ICH9 A31 GND Power Ground PWR - - A32 AC_BITCLK HDA_BITCLK ; HD Audio Clock O-3,3 int. PD 20k active only in S3 A33 AC_SDOUT HDA_SDOUT ; HD Audio Data O-3,3 int. PD 20k PU 1k 3,3V(S0)for X4 A34 BIOS_DISABLE# BIOS_DISABLE# I-3,3 - - A35 THRMTRIP# EXT_THRMTRIP# I/O-3,3 PU 10k 3,3V (S0) - A36 USB6- USB6_N ; USB Data – Port6 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant A37 USB6+ USB6_P ; USB Data + Port6 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant A38 USB_6_7_OC# USB_67_OC# ; USB OverCurrent Port 6/7 I-3,3 PU 10k 3,3V (S5) - A39 USB4- USB4_N ; USB Data - Port4 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant A40 USB4+ USB4_P ; USB Data + Port4 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant A41 GND Power Ground PWR - - A42 USB2- USB2_N ; USB Data - Port2 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant A43 USB2+ USB2_P ; USB Data + Port2 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant A44 USB_2_3_OC# USB_23_OC# ; USB OverCurrent Port 2/3 I-3,3 PU 10k 3,3V (S5) - A45 USB0- USB0_N ; USB Data - Port0 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant A46 USB0+ USB0_P ; USB Data + Port0 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant A47 VCC_RTC V_BAT PWR 3V - - A48 EXCD0_PERST# EXCD0_PERST#;Express card reset O-3,3 - - A49 EXCD0_CPPE# EXCD0_CPPE# ; capable c. request I-3,3 PU 10k 3,3V (S5) - A50 LPC_SERIRQ LPC_SERIRQ ; Serial Interrupt Request IO-3,3 PU 10k 3,3V (S0) - A51 GND Power Ground PWR - - A52 PCIE_TX5+ opt. PCI Express lane 5 + Transmit Nc - just available if no GbEthernet PHY is used. A53 PCIE_TX5- opt. PCI Express lane 5 - Transmit Nc - just available if no GbEthernet PHY is used. A54 GPI0 EXT_GPI0 ; General Purpose Input 0 I-3,3 PU 10k 3,3V (S0) - A55 PCIE_TX4+ PCI Express lane 4 + Transmit DP-O - - A56 PCIE_TX4- PCI Express lane 4 - Transmit DP-O - - A57 GND Power Ground PWR - - A58 PCIE_TX3+ PCI Express lane 3 + Transmit DP-O - - A59 PCIE_TX3- PCI Express lane 3 - Transmit DP-O - - A60 GND Power Ground PWR - - A61 PCIE_TX2+ PCI Express lane 2 + Transmit DP-O - - A62 PCIE_TX2- PCI Express lane 2 - Transmit DP-O - - A63 GPI1 EXT_GPI1 ; General Purpose Input 1 I-3,3 PU 10k 3,3V (S0) - A64 PCIE_TX1+ PCI Express lane 1 + Transmit DP-O - - 61 COMe-bPC2 / Pinout List A65 PCIE_TX1- PCI Express lane 1 - Transmit DP-O - - A66 GND Power Ground PWR - - A67 GPI2 EXT_GPI2 ; General Purpose Input 2 I-3,3 PU 10k 3,3V (S0) - A68 PCIE_TX0+ PCI Express lane 0 + Transmit DP-O - - A69 PCIE_TX0- PCI Express lane 0 - Transmit DP-O - - A70 GND Power Ground PWR - - A71 LVDS_A0+ LVDS_A_DATA0_P ; LVDS Channel A Data0+ DP-O - - A72 LVDS_A0- LVDS_A_DATA0_N ; LVDS Channel A Data0- DP-O - - A73 LVDS_A1+ LVDS_A_DATA1_P ; LVDS Channel A Data1+ DP-O - - A74 LVDS_A1- LVDS_A_DATA1_N ; LVDS Channel A Data1- DP-O - - A75 LVDS_A2+ LVDS_A_DATA2_P ; LVDS Channel A Data2+ DP-O - - A76 LVDS_A2- LVDS_A_DATA2_N ; LVDS Channel A Data2- DP-O - - A77 LVDS_VDD_EN LVDS_VDD_EN ; LVDS Panel Power Control O-3,3 PD 100k - A78 LVDS_A3+ LVDS_A_DATA3_P ; LVDS Channel A Data3+ DP-O - - A79 LVDS_A3- LVDS_A_DATA3_N ; LVDS Channel A Data3- DP-O - - A80 GND Power Ground PWR - - A81 LVDS_A_CK+ LVDS_A_CLK_P ; LVDS Channel A Clock+ DP-O - - A82 LVDS_A_CK- LVDS_A_CLK_N ; LVDS Channel A Clock- DP-O - - A83 LVDS_I2C_CK LVDS_DDC_CLK ; JILI I2C Clock I/O-3,3 PU 2k21 3,3V (s0) - A84 LVDS_I2C_DAT LVDS_DDC_DATA ; JILI I2C Data I/O-3,3 PU 2k21 3,3V (s0) - A85 GPI3 EXT_GPI3 ; General Purpose Input 3 I-3,3 PU 10k 3,3V (S0) - A86 KBD_RST# KBD_RST# ; Keyboard Reset I-3,3 PU 10k 3,3V (S0) - A87 KBD_A20GATE KBD_A20GATE I-3,3 PU 10k 3,3V (S0) - A88 PCIE0_CK_REF+ CLK_PCIE_CON_P DP-O - - A89 PCIE0_CK_REF- CLK_PCIE_CON_N DP-O - - A90 GND Power Ground PWR - - A91 RSVD n.c. Nc - - A92 RSVD n.c. Nc - - A93 GPO0 EXT_GPO0 ; General Purpose Output 0 O-3,3 PD 10k - A94 RSVD n.c. Nc - - A95 RSVD n.c. Nc - - A96 GND Power Ground PWR - - A97 VCC_12V 12V VCC PWR - 8.5-18V A98 VCC_12V 12V VCC PWR - 8.5-18V A99 VCC_12V 12V VCC PWR - 8.5-18V A100 GND Power Ground PWR - - A101 VCC_12V 12V VCC PWR - 8.5-18V A102 VCC_12V 12V VCC PWR - 8.5-18V A103 VCC_12V 12V VCC PWR - 8.5-18V A104 VCC_12V 12V VCC PWR - 8.5-18V A105 VCC_12V 12V VCC PWR - 8.5-18V A106 VCC_12V 12V VCC PWR - 8.5-18V A107 VCC_12V 12V VCC PWR - 8.5-18V A108 VCC_12V 12V VCC PWR - 8.5-18V A109 VCC_12V 12V VCC PWR - 8.5-18V A110 GND Power Ground PWR - - 62 COMe-bPC2 / Pinout List 7.3 Connector X1A Row B Pin Signal Description Type Termination Comment B1 GND Power Ground PWR - - B2 GBE0_ACT GBE0_ACT# ; Ethernet Activity LED OD - - B3 LPC_FRAME# LPC_FRAME# ; LPC Frame Indicator I-3,3 - - B4 LPC_AD0 LPC_AD0 ; LPC Adress & DATA Bus I/O-3,3 - int. PU 20k in ICH9 B5 LPC_AD1 LPC_AD1 ; LPC Adress & DATA Bus I/O-3,3 - int. PU 20k in ICH9 B6 LPC_AD2 LPC_AD2 ; LPC Adress & DATA Bus I/O-3,3 - int. PU 20k in ICH9 B7 LPC_AD3 LPC_AD3 ; LPC Adress & DATA Bus I/O-3,3 - int. PU 20k in ICH9 B8 LPC_DRQ0# LPC_DRQ#0 ; LPC Request 0 I-3,3 PU 10k 3,3V (S0) int. PU 20k in ICH9 B9 LPC_DRQ1# LPC_DRQ#1 ; LPC Request 1 I-3,3 PU 10k 3,3V (S0) int. PU 20k in ICH9 B10 LPC_CLK CLK_LPC_33M_EXT ; 33MHz LPC clock O-3,3 - - B11 GND Power Ground PWR - - B12 PWRBTN# EXT_PWRBTN# ; Power Button I-3,3 PU 20k 3,3V (S5) - B13 SMB_CK SMB_CLK_EXT ; SMBUS Clock O-3,3 PU 2k2 3,3V (S5) - B14 SMB_DAT SMB_DATA_EXT ; SMBUS Data IO-3,3 PU 2k2 3,3V (S5) - B15 SMB_ALERT# SMB_ALERT# ; SMBUS Interrupt IO-3,3 PU 1k0 3,3V (S5) - B16 SATA1_TX+ SATA_TX1_P ; SATA 1 Transmit Data + DP-O - - B17 SATA1_TX- SATA_TX1_N ; SATA 1 Transmit Data - DP-O - - B18 SUS_STAT# PM_SUS_ STAT# O-3,3 - - B19 SATA1_RX+ SATA_RX1_P ; SATA 1 Receive Data + DP-I - - B20 SATA1_RX- SATA_RX1_N ; SATA 1 Receive Data - DP-I - - B21 GND Power Ground PWR - - B22 SATA3_TX+ SATA_TX3_P ; SATA 3 Transmit Data + DP-O - - B23 SATA3_TX- SATA_TX3_N ; SATA 3 Transmit Data - DP-O - - B24 PWR_OK EXT_PWR_OK ; Power OK I-3,3 - - B25 SATA3_RX+ SATA_RX3_P ; SATA 3 Receive Data + DP-I - - B26 SATA3_RX- SATA_RX3_N ; SATA 3 Receive Data - DP-I - - B27 WDT WDT ; Watch Dog Timer O-3,3 - - B28 AC_SDIN2 HDA_SDIN2_ICH ; HD Audio Serial Input Data I-3,3 - int. PD 20k in ICH9 2 B29 AC_SDIN1 HDA_SDIN1_ICH ; HD Audio Serial Input Data I-3,3 - int. PD 20k in ICH9 1 B30 AC_SDIN0 HDA_SDIN0_ICH ; HD Audio Serial Input Data I-3,3 - int. PD 20k in ICH9 0 B31 GND Power Ground PWR - - B32 SPKR HDA_SPKR ; Speaker O-3,3 - int. PD 20k in ICH9 B33 I2C_CK I2C_CLK_EXT ; I2C clock O-3,3 PU 2k21 3,3V (S0) - B34 I2C_DAT I2C_DATA_EXT ; I2C data I/O-3,3 PU 2k21 3,3V (S0) - B35 THRM# PM_THRM# ; Over Temperature O-3,3 PU 8k25 3,3V (S0) - B36 USB7- USB7_N ; USB Data – Port7 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant B37 USB7+ USB7_P ; USB Data + Port7 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant B38 USB_4_5_OC# USB_45_OC# ; USB OverCurrent Port 4/5 I-3,3 PU 10k 3,3V (S5) - B39 USB5- USB5_N ; USB Data – Port5 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant B40 USB5+ USB5_P ; USB Data + Port5 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant B41 GND Power Ground PWR - - B42 USB3- USB3_N ; USB Data – Port3 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant B43 USB3+ USB3_P ; USB Data + Port3 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant B44 USB_0_1_OC# USB_01_OC# ; USB OverCurrent Port 0/1 I-3,3 PU 10k 3,3V (S5) - B45 USB1- USB1_N ; USB Data – Port1 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant B46 USB1+ USB1_P ; USB Data + Port1 DP-I/O - int. PD 15k in ICH9 ; 5V tolerant B47 EXCD1_PERST# EXCD1_PERST# ; Express card reset O-3,3 - - B48 EXCD1_CPPE# EXCD1_CPPE# ; capable c. request I-3,3 PU 10k 3,3V (S5) - B49 SYS_RESET# EXT_SYS_RESET# ; Reset Input I-3,3 PU 10k 3,3V (S5) - B50 CB_RESET# CB_RESET# ; Carrier board Reset O-3,3 - - B51 GND Power Ground PWR - - B52 PCIE_RX5+ opt. PCI Express lane 5 + Recieve Nc - just available if no GbEthernet PHY is used. B53 PCIE_RX5- opt. PCI Express lane 5 - Recieve Nc - just available if no GbEthernet PHY is used. B54 GPO1 EXT_GPO1 ; General Purpose Output 1 O-3,3 PD 10k - B55 PCIE_RX4+ PCI Express lane 4 + Recieve DP-I - availlable when ICH9-MDH or -R B56 PCIE_RX4- PCI Express lane 4 - Recieve DP-I - availlable when ICH9-MDH or -R B57 GPO2 EXT_GPO2 ; General Purpose Output 2 O-3,3 PD 10k - B58 PCIE_RX3+ PCI Express lane 3 + Recieve DP-I - availlable when ICH9-MDH or -R B59 PCIE_RX3- PCI Express lane 3 - Recieve DP-I - availlable when ICH9-MDH or -R B60 GND Power Ground PWR - - B61 PCIE_RX2+ PCI Express lane 2 + Recieve DP-I - - B62 PCIE_RX2- PCI Express lane 2 - Recieve DP-I - - 63 COMe-bPC2 / Pinout List B63 GPO3 EXT_GPO3 ; General Purpose Output 3 O-3,3 PD 10k - B64 PCIE_RX1+ PCI Express lane 1 + Recieve DP-I - - B65 PCIE_RX1- PCI Express lane 1 - Recieve DP-I - - B66 WAKE0# PCIE_WAKE# IO-3,3 PU 1k0 3,3V (S5) - B67 WAKE1# WAKE1# I-3,3 PU 10k 3,3V (S5) - B68 PCIE_RX0+ PCI Express lane 0 + Recieve DP-I - - B69 PCIE_RX0- PCI Express lane 0 - Recieve DP-I - - B70 GND Power Ground PWR - - B71 LVDS_B0+ LVDS_B_DATA0_P ; LVDS Channel B Data0+ DP-O - - B72 LVDS_B0- LVDS_B_DATA0_N ; LVDS Channel B Data0- DP-O - - B73 LVDS_B1+ LVDS_B_DATA1_P ; LVDS Channel B Data1+ DP-O - - B74 LVDS_B1- LVDS_B_DATA1_N ; LVDS Channel B Data1- DP-O - - B75 LVDS_B2+ LVDS_B_DATA2_P ; LVDS Channel B Data2+ DP-O - - B76 LVDS_B2- LVDS_B_DATA2_N ; LVDS Channel B Data2- DP-O - - B77 LVDS_B3+ LVDS_B_DATA3_P ; LVDS Channel B Data3+ DP-O - - B78 LVDS_B3- LVDS_B_DATA3_N ; LVDS Channel B Data3- DP-O - - B79 LVDS_BKLT_EN LVDS_BKLT_CTRL ; Panel Backlight ON O-3,3 PD 100k - B80 GND Power Ground PWR - - B81 LVDS_B_CK+ LVDS_B_CLK_P ; LVDS Channel B Clock+ DP-O - - B82 LVDS_B_CK- LVDS_B_CLK_N ; LVDS Channel B Clock- DP-O - - B83 LVDS_BKLT_CTRL LVDS_BKLT_CTRL ; Backlight Brightness Contr. O-3,3 - - B84 VCC_5V_SBY +V_STBY_ETX ; 5V Standby PWR 5V (S5) - - B85 VCC_5V_SBY +V_STBY_ETX ; 5V Standby PWR 5V (S5) - - B86 VCC_5V_SBY +V_STBY_ETX ; 5V Standby PWR 5V (S5) - - B87 VCC_5V_SBY +V_STBY_ETX ; 5V Standby PWR 5V (S5) - - B88 RSVD n.c. nc - - B89 VGA_RED CRT_RED ; Analog Video RGB-RED OA PD 150R - B90 GND Power Ground PWR - - B91 VGA_GRN CRT_GREEN ; Analog Video RGB-GREEN OA PD 150R - B92 VGA_BLU CRT_BLUE ; Analog Video RGB-BLUE OA PD 150R - B93 VGA_HSYNC CRT_HSYNC ; Analog Video H-Sync O-3,3 - - B94 VGA_VSYNC CRT_VSYNC ; Analog Video V-Sync O-3,3 - - B95 VGA_I2C_CK CRT_DDC_CLK ; Display Data Channel Clock I/O-5 PU 2k21 5V (S0) - B96 VGA_I2C_DAT CRT_DDC_DATA ; Display Data Channel Data I/O-5 PU 2k21 5V (S0) - B97 TV_DAC_A TV_DACA_CVBS ; Composite CVBS OA PD 150R - B98 TV_DAC_B TV_DADB_Y ; TV Luminance Signal OA PD 150R - B99 TV_DAC_C TV_DADC_C ; TV Chrominance Signal OA PD 150R - B100 GND Power Ground PWR - - B101 VCC_12V 12V VCC PWR - 8.5-18V B102 VCC_12V 12V VCC PWR - 8.5-18V B103 VCC_12V 12V VCC PWR - 8.5-18V B104 VCC_12V 12V VCC PWR - 8.5-18V B105 VCC_12V 12V VCC PWR - 8.5-18V B106 VCC_12V 12V VCC PWR - 8.5-18V B107 VCC_12V 12V VCC PWR - 8.5-18V B108 VCC_12V 12V VCC PWR - 8.5-18V B109 VCC_12V 12V VCC PWR - 8.5-18V B110 GND Power Ground PWR - - 64 COMe-bPC2 / Pinout List 7.4 Connector X1B Row C Pin Signal Description Type Termination Comment C1 GND Power Ground PWR - - C2 IDE_D7 IDE Data Bus I/O-5T PD 10k - C3 IDE_D6 IDE Data Bus I/O-5T - - C4 IDE_D3 IDE Data Bus I/O-5T - - C5 IDE_D15 IDE Data Bus I/O-5T - - C6 IDE_D8 IDE Data Bus I/O-5T - - C7 IDE_D9 IDE Data Bus I/O-5T - - C8 IDE_D2 IDE Data Bus I/O-5T - - C9 IDE_D13 IDE Data Bus I/O-5T - - C10 IDE_D1 IDE Data Bus I/O-5T - - C11 GND Power Ground PWR - - C12 IDE_D14 IDE Data Bus I/O-5T - - C13 IDE_IORDY IDE I/O Ready I/O-5T PU 4k7 3,3V (S0) - C14 IDE_IOR# IDE I/O Read I/O-3,3 - - C15 PCI_PME# PCI Power Management Event I/O-3,3 - int. PU 20k in ICH9 C16 PCI_GNT2# PCI Bus Grant 2 O-3,3 - int. PU 20k in ICH9 (if PCIRST#=0 AND PWROK=1) C17 PCI_REQ2# PCI Bus Request 2 I-5T PU 8k2 3,3V (S0) - C18 PCI_GNT1# PCI Bus Grant 1 O-3,3 - int. PU 20k in ICH9 (if PCIRST#=0 AND PWROK=1) C19 PCI_REQ1# PCI Bus Request 1 I-5T PU 8k2 3,3V (S0) - C20 PCI_GNT0# PCI Bus Grant 0 O-3,3 PD 1k0 int. PU 20k in ICH9 (if PCIRST#=0 AND PWROK=1) C21 GND Power Ground PWR - - C22 PCI_REQ0# PCI Bus Reqest 0 I-5T PU 8k2 3,3V (S0) - C23 PCI_RST# PCI Bus Reset O-3,3 - - C24 PCI_AD0 PCI Adress & Data Bus line I/O-5T - - C25 PCI_AD2 PCI Adress & Data Bus line I/O-5T - - C26 PCI_AD4 PCI Adress & Data Bus line I/O-5T - - C27 PCI_AD6 PCI Adress & Data Bus line I/O-5T - - C28 PCI_AD8 PCI Adress & Data Bus line I/O-5T - - C29 PCI_AD10 PCI Adress & Data Bus line I/O-5T - - C30 PCI_AD12 PCI Adress & Data Bus line I/O-5T - - C31 GND Power Ground PWR - - C32 PCI_AD14 PCI Adress & Data Bus line I/O-5T - - C33 PCI_C/BE1# PCI Bus Cmd Byte enables 1 I/O-5T - - C34 PCI_PERR# PCI Bus Grant Error I/O-5T PU 8k2 3,3V (S0) - C35 PCI_LOCK# PCI Bus Lock I/O-5T PU 8k2 3,3V (S0) - C36 PCI_DEVSEL# PCI Bus Device Select I/O-5T PU 8k2 3,3V (S0) - C37 PCI_IRDY# PCI Bus Bus Initiator Ready I/O-5T PU 8k2 3,3V (S0) - C38 PCI_C/BE2# PCI Bus Cmd Byte enables 2 I/O-5T - - C39 PCI_AD17 PCI Adress & Data Bus line I/O-5T - - C40 PCI_AD19 PCI Adress & Data Bus line I/O-5T - - C41 GND Power Ground PWR - - C42 PCI_AD21 PCI Adress & Data Bus line I/O-5T - - C43 PCI_AD23 PCI Adress & Data Bus line I/O-5T - - C44 PCI_C/BE3# PCI Bus Cmd Byte enables 3 I/O-5T - - C45 PCI_AD25 PCI Adress & Data Bus line I/O-5T - - C46 PCI_AD27 PCI Adress & Data Bus line I/O-5T - - C47 PCI_AD29 PCI Adress & Data Bus line I/O-5T - - C48 PCI_AD31 PCI Adress & Data Bus line I/O-5T - - C49 PCI_IRQA# PCI Bus Interrupt Request A I-5T PU 8k2 3,3V (S0) - C50 PCI_IRQB# PCI Bus Interrupt Request B I-5T PU 8k2 3,3V (S0) - C51 GND Power Ground PWR - - C52 PEG_RX0+ PCIexpress Graphics Recieve + (0) DP-I - - C53 PEG_RX0- PCIexpress Graphics Recieve - (0) DP-I - - C54 TYPE0# n.c. for type 2 module nc - - C55 PEG_RX1+ PCIexpress Graphics Recieve + (1) DP-I - - C56 PEG_RX1- PCIexpress Graphics Recieve - (1) DP-I - - C57 TYPE1# n.c. for type 2 module nc - - C58 PEG_RX2+ PCIexpress Graphics Recieve + (2) DP-I - - C59 PEG_RX2- PCIexpress Graphics Recieve - (2) DP-I - - C60 GND Power Ground PWR - - C61 PEG_RX3+ PCIexpress Graphics Recieve + (3) DP-I - - C62 PEG_RX3- PCIexpress Graphics Recieve - (3) DP-I - - C63 RSVD n.c. nc - - C64 RSVD n.c. nc - - 65 COMe-bPC2 / Pinout List C65 PEG_RX4+ PCIexpress Graphics Recieve + (4) DP-I - - C66 PEG_RX4- PCIexpress Graphics Recieve - (4) DP-I - - C67 RSVD n.c. nc - - C68 PEG_RX5+ PCIexpress Graphics Recieve + (5) DP-I - - C69 PEG_RX5- PCIexpress Graphics Recieve - (5) DP-I - - C70 GND Power Ground PWR - - C71 PEG_RX6+ PCIexpress Graphics Recieve + (6) DP-I - - C72 PEG_RX6- PCIexpress Graphics Recieve - (6) DP-I - - C73 SDVO_DATA SDVO_CTRLDATA I/O-3,3 - opt. PU 2k21 3,3V (S0) = enable SDVO/HDMI/DP interface C74 PEG_RX7+ PCIexpress Graphics Recieve + (7) DP-I - - C75 PEG_RX7- PCIexpress Graphics Recieve - (7) DP-I - - C76 GND Power Ground PWR - - C77 RSVD n.c. nc - - C78 PEG_RX8+ PCIexpress Graphics Recieve + (8) DP-I - - C79 PEG_RX8- PCIexpress Graphics Recieve - (8) DP-I - - C80 GND Power Ground PWR - - C81 PEG_RX9+ PCIexpress Graphics Recieve + (9) DP-I - - C82 PEG_RX9- PCIexpress Graphics Recieve - (9) DP-I - - C83 RSVD n.c. nc - - C84 GND Power Ground PWR - - C85 PEG_RX10+ PCIexpress Graphics Recieve + (10) DP-I - - C86 PEG_RX10- PCIexpress Graphics Recieve - (10) DP-I - - C87 GND Power Ground PWR - - C88 PEG_RX11+ PCIexpress Graphics Recieve + (11) DP-I - - C89 PEG_RX11- PCIexpress Graphics Recieve – (11) DP-I - - C90 GND Power Ground PWR - - C91 PEG_RX12+ PCIexpress Graphics Recieve + (12) DP-I - - C92 PEG_RX12- PCIexpress Graphics Recieve - (12) DP-I - - C93 GND Power Ground PWR - - C94 PEG_RX13+ PCIexpress Graphics Recieve + (13) DP-I - - C95 PEG_RX13- PCIexpress Graphics Recieve - (13) DP-I - - C96 GND Power Ground PWR - - C97 RSVD n.c. nc - - C98 PEG_RX14+ PCIexpress Graphics Recieve + (14) DP-I - - C99 PEG_RX14- PCIexpress Graphics Recieve - (14) DP-I - - C100 GND Power Ground PWR - - C101 PEG_RX15+ PCIexpress Graphics Recieve + (15) DP-I - - C102 PEG_RX15- PCIexpress Graphics Recieve - (15) DP-I - - C103 GND Power Ground PWR - - C104 VCC_12V 12V VCC PWR - 8.5-18V C106 VCC_12V 12V VCC PWR - 8.5-18V C105 VCC_12V 12V VCC PWR - 8.5-18V C107 VCC_12V 12V VCC PWR - 8.5-18V C108 VCC_12V 12V VCC PWR - 8.5-18V C109 VCC_12V 12V VCC PWR - 8.5-18V C110 GND Power Ground PWR - - 66 COMe-bPC2 / Pinout List 7.5 Connector X1B Row D Pin Signal Description Type Termination Comment D1 GND Power Ground PWR - - D2 IDE_D5 IDE Data Bus I/O-5T - - D3 IDE_D10 IDE Data Bus I/O-5T - - D4 IDE_D11 IDE Data Bus I/O-5T - - D5 IDE_D12 IDE Data Bus I/O-5T - - D6 IDE_D4 IDE Data Bus I/O-5T - - D7 IDE_D0 IDE Data Bus I/O-5T - - D8 IDE_REQ IDE Data Bus I/O-5T PD 5k62 - D9 IDE_IOW# IDE IO Write O-3,3 - - D10 IDE_ACK# IDE DMA Acknowledge O-3,3 - - D11 GND Power Ground PWR - - D12 IDE_IRQ IDE Interrupt Request I-5T PD 10k - D13 IDE_A0 IDE Adress Bus O-3,3 - - D14 IDE_A1 IDE Adress Bus O-3,3 - - D15 IDE_A2 IDE Adress Bus O-3,3 - - D16 IDE_CS1# IDE Chip Select Channel 0 O-3,3 - - D17 IDE_CS3# IDE Chip Select Channel 1 O-3,3 - - D18 IDE_RESET# IDE Hard Drive Reset O-3,3 - int. PU 31k in PATA bridge ; not 5V tolerant D19 PCI_GNT3# PCI Bus Grant 3 O-3,3 - int. PU 20k in ICH9 (if PCIRST#=0 AND PWROK=1) D20 PCI_REQ3# PCI Bus Reqest 0 I-5T PU 8k2 3,3V (S0) - D21 GND Power Ground PWR - - D22 PCI_AD1 PCI Adress & Data Bus line I/O-5T - - D23 PCI_AD3 PCI Adress & Data Bus line I/O-5T - - D24 PCI_AD5 PCI Adress & Data Bus line I/O-5T - - D25 PCI_AD7 PCI Adress & Data Bus line I/O-5T - - D26 PCI_C/BE0# PCI Bus Command and Byte enables 0 I/O-5T - - D27 PCI_AD9 PCI Adress & Data Bus line I/O-5T - - D28 PCI_AD11 PCI Adress & Data Bus line I/O-5T - - D29 PCI_AD13 PCI Adress & Data Bus line I/O-5T - - D30 PCI_AD15 PCI Adress & Data Bus line I/O-5T - - D31 GND Power Ground PWR - - D32 PCI_PAR PCI Bus Parity I/O-5T - - D33 PCI_SERR# PCI Bus System Error I/O-5T PU 8k2 3,3V (S0) - D34 PCI_STOP# PCI Bus Stop I/O-5T PU 8k2 3,3V (S0) - D35 PCI_TRDY# PCI Bus Target Ready I/O-5T PU 8k2 3,3V (S0) - D36 PCI_FRAME# PCI Bus Cycle Frame I/O-5T PU 8k2 3,3V (S0) - D37 PCI_AD16 PCI Adress & Data Bus line I/O-5T - - D38 PCI_AD18 PCI Adress & Data Bus line I/O-5T - - D39 PCI_AD20 PCI Adress & Data Bus line I/O-5T - - D40 PCI_AD22 PCI Adress & Data Bus line I/O-5T - - D41 GND Power Ground PWR - - D42 PCI_AD24 PCI Adress & Data Bus line I/O-5T - - D43 PCI_AD26 PCI Adress & Data Bus line I/O-5T - - D44 PCI_AD28 PCI Adress & Data Bus line I/O-5T - - D45 PCI_AD30 PCI Adress & Data Bus line I/O-5T - - D46 PCI_IRQC# PCI Bus Interrupt Request C I-5T PU 8k2 3,3V (S0) - D47 PCI_IRQD# PCI Bus Interrupt Request D I-5T PU 8k2 3,3V (S0) - D48 PCI_CLKRUN# PCI Clock Run I-5T PU 8k25 3,3V (S0) - D49 PCI_M66EN n.c. nc - - D50 PCI_CLK CLK_PCI_33M_EXT ; PCI Clock 33MHz O-3,3 - - D51 GND Power Ground PWR - - D52 PEG_TX0+ PCIexpress Graphics Transmit + (0) DP-O - - D53 PEG_TX0- PCIexpress Graphics Transmit - (0) DP-O - - D54 PEG_LANE_RV# PCIexpress Graphics Lane Reversal I-3,3 - - D55 PEG_TX1+ PCIexpress Graphics Transmit + (1) DP-O - - D56 PEG_TX1- PCIexpress Graphics Transmit - (1) DP-O - - D57 TYPE2# n.c. for type 2 module nc - - D58 PEG_TX2+ PCIexpress Graphics Transmit + (2) DP-O - - D59 PEG_TX2- PCIexpress Graphics Transmit - (2) DP-O - - D60 GND Power Ground PWR - - D61 PEG_TX3+ PCIexpress Graphics Transmit + (3) DP-O - - D62 PEG_TX3- PCIexpress Graphics Transmit - (3) DP-O - - D63 RSVD - nc - - D64 RSVD - nc - - 67 COMe-bPC2 / Pinout List D65 PEG_TX4+ PCIexpress Graphics Transmit + (4) DP-O - - D66 PEG_TX4- PCIexpress Graphics Transmit - (4) DP-O - - D67 GND Power Ground PWR - - D68 PEG_TX5+ PCIexpress Graphics Transmit + (5) DP-O - - D69 PEG_TX5- PCIexpress Graphics Transmit - (5) DP-O - - D70 GND Power Ground PWR - - D71 PEG_TX6+ PCIexpress Graphics Transmit + (6) DP-O - - D72 PEG_TX6- PCIexpress Graphics Transmit - (6) DP-O - - D73 SDVO_CLK SDVO_CTRLCLK I O-3,3 - - D74 PEG_TX7+ PCIexpress Graphics Transmit + (7) DP-O - - D75 PEG_TX7- PCIexpress Graphics Transmit - (7) DP-O - - D76 GND Power Ground PWR - - D77 IDE_CBLID IDE_CBLID# ; IDE cable type detect I/0-3,3 - opt. int. PU in IDE flash D78 PEG_TX8+ PCIexpress Graphics Transmit + (8) DP-O - - D79 PEG_TX8- PCIexpress Graphics Transmit - (8) DP-O - - D80 GND Power Ground PWR - - D81 PEG_TX9+ PCIexpress Graphics Transmit + (9) DP-O - - D82 PEG_TX9- PCIexpress Graphics Transmit - (9) DP-O - - D83 RSVD n.c. nc - - - D84 GND Power Ground PWR - - D85 PEG_TX10+ PCIexpress Graphics Transmit + (10) DP-O - - D86 PEG_TX10- PCIexpress Graphics Transmit - (10) DP-O - - D87 GND Power Ground PWR - - D88 PEG_TX1 1+ PCIexpress Graphics Transmit + (11) DP-O - - D89 PEG_TX11- PCIexpress Graphics Transmit - (11) DP-O - - D90 GND Power Ground PWR - - D91 PEG_TX12+ PCIexpress Graphics Transmit + (12) DP-O - - D92 PEG_TX12- PCIexpress Graphics Transmit - (12) DP-O - - D93 GND Power Ground PWR - - D94 PEG_TX13+ PCIexpress Graphics Transmit + (13) DP-O - - D95 PEG_TX13- PCIexpress Graphics Transmit - (13) DP-O - - D96 GND Power Ground PWR - - D97 PEG_ENABLE# PCIexpress Graphics Enable I-3,3 PU 10k 3,3V (S0) - D98 PEG_TX14+ PCIexpress Graphics Transmit + (14) DP-O - - D99 PEG_TX14- PCIexpress Graphics Transmit - (14) DP-O - - D100 GND Power Ground PWR - - D101 PEG_TX15+ PCIexpress Graphics Transmit + (15) DP-O - - D102 PEG_TX15- PCIexpress Graphics Transmit - (15) DP-O - - D103 GND Power Ground PWR - - D104 VCC_12V 12V VCC PWR - 8.5-18V D105 VCC_12V 12V VCC PWR - 8.5-18V D106 VCC_12V 12V VCC PWR - 8.5-18V D107 VCC_12V 12V VCC PWR - 8.5-18V D108 VCC_12V 12V VCC PWR - 8.5-18V D109 VCC_12V 12V VCC PWR - 8.5-18V D110 GND Power Ground PWR - - The termination resistors in these tables are already mounted on the ETXexpress® board. Refer to the design guide for information about additional termination resistors. 68 COMe-bPC2 / BIOS Operation 8 BIOS Operation The module is equipped with AMI® CORE8 BIOS, which is located in an onboard SPI/LPC flash memory. You can update the BIOS using a Flash utility. 8.1 Determining the BIOS Version To determine the AMI® BIOS version, immediately press the Pause key on your keyboard as soon as you see the following text display in the upper left corner of your screen: » AMIBIOS © 2006 American Megatrends, Inc. » BIOS Date: mm/dd/yyyy hh:mm:ss Ver: xx.xx.xx » Kontron® BIOS Version when the following string appears during bootup. Press to enter Setup The Info Menu then appears. The Setup Screen is composed of several sections: Setup Screen Location Function Menu Bar Top Lists and selects all top level menus. Legend Bar Right side Bottom Lists setup navigation keys. Item Specific Help Window Right side Top Help for selected item. Menu Window Left Center Selection fields for current menu. 70 COMe-bPC2 / BIOS Operation Menu Bar The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection. Legend Bar Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below describes the legend keys and their alternates. Key Function or General Help window. Exit menu. ← or → Arrow key Select a menu. ↑ or ↓ Arrow key Select fields in current menu. or Move cursor to top or bottom of current window. or Move cursor to next or previous page. Load the default configuration values for this menu. Save and exit. Execute command or select submenu. Refresh screen. Selecting an Item Use the ↑ or ↓ key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The Save Value commands in the Exit menu save the values displayed in all the menus. Displaying Submenus Use the ← or → key to move the cursor to the submenu you want. Then press . A pointer ( ►) marks all submenus. Item Specific Help Window The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the cursor to each field. General Help Window Pressing or on a menu brings up the General Help window that describes the legend keys and their alternates. Press to exit the General Help window. 71 COMe-bPC2 / BIOS Operation 8.4 BIOS Setup 8.4.1 Main Menu Feature Option Description System Time [hh:mm:ss] , , or selects field System Date [mm-dd-yyyy] , , or selects field 72 COMe-bPC2 / BIOS Operation 8.4.2 Module Info Module Component Steppings 73 COMe-bPC2 / BIOS Operation Module Software Revisions Current LVDS Configuration 74 COMe-bPC2 / BIOS Operation Memory Module Information Slot 1 75 COMe-bPC2 / BIOS Operation 8.4.3 Advanced Menu 76 COMe-bPC2 / BIOS Operation CPU Configuration Feature Option Description Hardware Prefetcher Enabled For UP platforms, leave it enabled. For DP/MP servers, it Disabled may use to tune performance to the specific application. Adjacent Cache Line Prefetch Enabled For UP platforms, leave it enabled. For DP/MP servers, it Disabled may use to tune performance to the specific application. Max CPUID Value Limit Disabled Disabled for WindowsXP Enabled Intel® Virtualization Tech Enabled When enabled, a VMM can utilize the additional HW Caps, provided by Intel® Virtualization Tech. Note: A Disabled full reset is required to change the setting. Execute-Disable Bit Capability Enabled When disabled, force the XD feature flag to always return 0 Disabled DTS-based Thermal Management Enable/Disable Thermal Management utilizing the CPU’s Enabled Digital Thermal Sensor Disabled DTS Calibration Enabled Enables and Disables the Calibration function of the Disabled CPU's Digital Thermal Sensor Intel® SpeedStep™ Enables and Disables the SpeedStep power management Enabled feature Disabled Intel® C-State Technology Enabled Enables and Disables the C - States. If enabled, the CPU Disabled is set to C2 - C4 state in idle mode Enhanced C-State Modes CPU idle is set to enhanced C-states, when enabled Enabled Disabled ACPI T-STATE tech Enabled Enable or Disable ACPI T-State technology Disabled CPU Performance High Select CPU Performance after POST Middle Low The CPU Performance relates to the used processor on the . The following table shows you the selected speed in the 3 performance stages. Product Number Processor High Middle Low 38008-0000-12-1 Celeron® M722 1,2GHz 1,2GHz 1,2GHz 38008-0000-12-2 SU9300 1,2GHz 1,2GHz 1,2GHz 38008-0000-12-3 Celeron® M723 1,2GHz 1,2GHz 1,2GHz 38008-0000-19-2 SL9400 1,86GHz 1,6GHz 1,6GHz 38008-0000-23-2 SP9300 2,26GHz 1,93GHz 1,6GHz 38009-0000-20-0 Celeron® 575 2,0GHz 2,0GHz 2,0GHz 38009-0000-19-2 T3100 1,9GHz 1,9GHz 1,9GHz 38009-0000-23-2 P8400 2,26GHz 1,93GHz 1,6GHz 38009-0000-25-2 T9400 2,53GHz 2,07GHz 1,6GHz 77 COMe-bPC2 / BIOS Operation IDE Configuration Feature Option Description SATA #1 Configurationer Disabled Enables or disables the SATA interface. Enabled Configure SATA#1 as Selects the mode for SATA#1 controller IDE Compatible RAID AHCI IDE Enhanced SATA#2 Configuration Disabled Controls the mode for the 2nd SATA controller in ICH-9 Enhanced Hard Disk Write Protect Disables/enables device write protection. It will be Disabled Enabled effective only if device is accessed through BIOS functions. IDE Detect Time Out (Sec.) Selects the time out value for the detection of ATA/ [0-35] 1 ATAPI devices ATA(PI) 80Pin Cable Detection Selects the mechanism for detecting 80Pin ATA(PI) Host & Device cables. Host Device 78 COMe-bPC2 / BIOS Operation IDE Device Submenu Feature Option Description Type Not Installed Selects the type of the IDE Devices connected to the Auto system CD/DVD ARMD LBA/Large Mode Disabled Disables the LBA mode or enables it, when a device Auto supports it Block (Multi-Sector Transfer) Disabled Disabled: The data transfer from and to the device Auto occurs one sector ata atime Auto: The data transfer from and to the device occurs multiple sectors at a time if the device supports ist PIO Mode Auto (Auto) Configures the PIO Mode 0 1 2 3 4 DMA Mode Auto SWDMA: Single Word DMA SWDMAn MWDMA: Multi Word DMA MWDMAn UDMA: Ultra DMA UDMAn S.M.A.R.T. Disables, Enables or automatically enables the Auto S.M.A.R.T feature (Self-Monitoring, Analysis and Enabled Reporting Technology) Disabled 32Bit Data Transfer Enabled Disables and Enables the 32Bit Data Transfer Mode Disabled 79 COMe-bPC2 / BIOS Operation AHCI Configuration Feature Option Description AHCI BIOS Support Enabled Enables / Disables the AHCI Support in BIOS Disabled AHCI CD/DVD Boot Time out 0 Selects the boot time out for AHCI CD/DVD devices 5 10 … 35 80 COMe-bPC2 / BIOS Operation AHCI PortN Submenu Feature Option Description SATA Port N Auto Enables / Disables this AHCI Port Not installed S.M.A.R.T. Disabled Enables and disables the SMART functionality. Enabled 81 COMe-bPC2 / BIOS Operation SuperIO Configuration Feature Option Description Floppy Controller Disabled Enables / Disables the floppy controller in BIOS Enabled Floppy Drive Swap If enabled floppy drive A and B are swapped. Disabled Enabled Serial Port1 Address Disabled Selects the Address of COM Port 1 3F8/IRQ4 2F8/IRQ3 3E8/IRQ4 2E8/IRQ3 Serial Port2 Address Disabled Selects the Address of COM Port 2 3F8/IRQ4 2F8/IRQ3 3E8/IRQ4 2E8/IRQ3 Parallel Port Address Disabled Selects the Address of the LPT Port 378 278 3BC Parallel Port Mode SPP Allows BIOS to Select Parallel Port Mode. (Only visible Bi-Directional when Parallel Port enabled.) ECP EPP+SPP ECP+SPP Parallel Port IRQ IRQ5 Allows BIOS to Select Parallel Port IRQ. (Only visible when Parallel Port enabled.) IRQ7 Keyboard Power On Disabled Selects the Mode for PS/2 Keyboard Power On Specific Key Any Key Specific Key Power On [Enter Key] Only available when Specific Key is selected then “Enter New Password” Pop Up appears Mouse Power On Selects teh Mode for PS/2 Mouse Power On Disables Left Button Right Button 82 COMe-bPC2 / BIOS Operation Floppy Configuration Submenu Feature Option Description Floppy A Disabled Selects the Floppy Drive A 360 KB 5 1/4” 1.2 MB 5 1/4” 720 KB 3 1/2” 1.44 MB 3 1/2” 2.88 MB 3 1/2” Floppy B Disabled Selects the Floppy Drive B 360 KB 5 1/4” 1.2 MB 5 1/4” 720 KB 3 1/2” 1.44 MB 3 1/2” 2.88 MB 3 1/2” 83 COMe-bPC2 / BIOS Operation ACPI Configuration Feature Option Description ACPI Version ACPI v.4.0 Selects the ACPI version ACPI v.3.0 ACPI v.2.0 ACPI v.1.0 ACPI APIC support Enabled Include ACPI APIC table pointer to RSDT pointer list. Disabled Repost Video on S3 Resume No If yes, Videobios is reinitialized after S3 Resume Yes Headless Mode Disabled Enables / Disables headless mode through ACPI Enabled USB Device Wakeup From S3/S4 Enables / Disables the possibility to wake up via USB Disabled from S3 and S4 Enabled High Performance Event Timer Disabled Enables / Disables the High Performance Event Timer Enabled HPET Memory Address Selects the Address of the High Performance Event FED00000h Timer FED01000h FED02000h FED03000h 84 COMe-bPC2 / BIOS Operation ACPI Cooling Options Feature Option Description Passive Trip Point Disabled This value controls the temperature of the ACPI Passive Trip Point - the point in which the OS will begin 40°C throttling the CPU. 45°C 50°C … 110°C Passive TC1 value 1 This value sets the TC1 value for the ACPI Passive 2 Cooling Formula. (Only visible when Passive Trip Point is 3 enabled.) … 16 Passive TC2 value 1 This value sets the TC2 value for the ACPI Passive 2 Cooling Formula. (Only visible when Passive Trip Point is … enabled.) 5 … 16 Passive TSP value 2 This item sets the TSP value for the ACPI Passive Cooling 4 Formula. It represents in tenths of a second how often … the OS will read the temperature when Passive Cooling 10 is Enabled. … 30 Critical Trip Point Disabled This value controls the temperature of the ACPI Critical 40°C Trip Point - the point in which the OS will shut off the 45°C system. 50°C … 110°C 85 COMe-bPC2 / BIOS Operation Passive Cooling The ACPI OS assesses the optimum CPU performance change necessary to lower the temperature using the following equation P[%] = TC1(Tn-Tn-1) + TC2(Tn-Tt) P is the performance delta, Tt is the target temperature = passive cooling trip point. The two coefficients TC1 and TC2 and the sampling period TSP are hardware dependent constants the end user must supply. It’s up to the end user to set the cooling preference of the system by setting the appropriate trip points in the BIOS setup. See chapter 12 of the ACPI specification (www.acpi.info) for more details 86 COMe-bPC2 / BIOS Operation PCIExpress Configuration Feature Option Description Relaxed Ordering Enables/Disables PCI Express Device Relaxed Ordering. Auto Disables Enabled Maximum Payload Size Auto Set Maximum Payload of PCI Express Device or allow 128 Bytes System BIOS to select the value. … 4096 Bytes Extended Tag Field If Enabled, allows Device to use 8-bit TAG field as a Auto requester. Disables Enabled No Snoop Auto Enables/Disables PCI Express Device No Snoop option. Disables Enabled Maximum Read Request Size Set Maximum Read Request Size of PCI Express Device or Auto allow System BIOS to select the value. 128 Bytes … 4096 Bytes Active State Power Management Disabled Enables/Disables PCI Express L0 and L1 link power Enabled states. Extended Synch If Enabled, allows generation of Extended Auto Synchronisation patterns. Disables Enabled PCIE Port N Auto Enables/Disables or autoconfigures the PCIE Port N Enabled Disabled PCIE High Priority Port Select the PCIE Port that gets higher priority than the Disabled others. Port 0 Port 1 Port 2 … Port 5 PCIE Port N IOxAPIC Enable Disabled Enables/Disables the APIC Support for the PCIE Port N Enabled 87 COMe-bPC2 / BIOS Operation USB Configuration Feature Option Description USB reset delay Disabled Enable extra delay after reset during USB initialization. Enabled This will give slow devices more time to get ready after they have been reset. Legacy USB Support Auto Enables support for legacy USB. Auto option disables Disabled legacy support if no USB devices are connected. Enabled Port 64/60 Emulation Disabled Enables I/O port 60h/64h emulation support. This Enabled should be enabled for the complete USB keyboard legacy support for non-USB aware OSes. USB 2.0 Controller Mode FullSpeed Configures the USB 2.0 controller in HiSpeed HiSpeed (480Mbps) or FullSpeed (12Mbps) BIOS EHCI Hand-Off Disabled This is a workaround for an OS without EHCI hand-off Enabled support. The EHCI ownership change should claim by the EHCI driver USB Beep Message Disabled Enables the beep during USB device enumeration Enabled 88 COMe-bPC2 / BIOS Operation USB Mass Storage Device Configuration Feature Option Description USB Mass Storage Reset Delay 10 Sec Number of seconds POST waits for the USB mass storage 20 Sec device after start unit command. 30 Sec 40 Sec Emulation Type If Auto USB devices with less than 20MB will be Auto emulated as floppy and remaining as hard drive. Forced Floppy FDD option can be used to force a HDD formatted drive Forced FDD to boot as FDD (Ex. ZIP drive). Hard Disk CDROM 89 COMe-bPC2 / BIOS Operation Hardware Health 90 COMe-bPC2 / BIOS Operation Module Hardware Health Configuration Feature Option Description H/W Health Function Disabled Enables Hardware Health Monitoring Device. Enabled PWM 1 Mode Setting Auto Fan Mode PWM Configuration Mode Setting Fan Always On Full Fan Disable Mode Fan Manually Mode PWM 1 Ramp Rate Time Slot 1 Time Slot 2 Time Slot 3 Time Slot 4 Time Slot 8 Time Slot 12 Time Slot 24 Time Slot 48 PWM 1 Control Duty Cycle Controls the length of a PWM duty cycle. [0…255] 200 Pulses/Rev [1…4] 2 Fan Voltage 12V Selects the fan voltage. (only possible with premium 5V fan hardware solution) 91 COMe-bPC2 / BIOS Operation Baseboard Hardware Health Feature Option Description H/W Health Function Disabled Enables Hardware Health Monitoring Device. Enabled Fan Speed Selector 1 Select the Fan1/2/3 Speed Divisor according to nominal 2 revolutions per minute of the used fan 4 … 128 Fan Ticks per Rev 1 Number of Ticks per Revolution 2 4 8 92 COMe-bPC2 / BIOS Operation Miscellaneous Settings Feature Option Description Post User Delay None Delay during POST 1 Sec 2 Sec … 10 Min Restore on AC Power Loss Power Off Controls the behavior after Power Loss in ATX mode Power On Power Up Delay Disabled Delay after power up, when in an G3 cycle 4 to 5 seconds 3 to 4 seconds 2 to 3 seconds 1 to 2 seconds On Reset Controls the behavior in reset case. Chipset Reset Power Cycle Standby Voltage 5V Standby Select which voltage is used for standby power. If using Auto a standard ATX power supply, select 5V. Keyboard Crisis Recovery Disabled Enables/Disables Keyboard Crisis Recovery function by Enabled USB keyboard S5 Eco Disabled Enables/Disables S5 Eco Mode to reduce supply current Enabled in soft off (S5). See manual for usage of S5 Eco. Spread Spectrum Disabled Enable/Disable Spread Spectrum for the selected clocks PCI CPU Both 93 COMe-bPC2 / BIOS Operation Event Log Configuration Feature Option Description View Event Log View All Unread Events in the Event Log Mark all events as read Mark All Unread Events as read Clear Event Log Discard All Unread Events in the Event Log 94 COMe-bPC2 / BIOS Operation MARS Interface Configuration Feature Option Description MARS Disabled Enables the MARS function Auto SMB Charger SMB Manager 95 COMe-bPC2 / BIOS Operation Watchdog Feature Option Description Mode Reset Selects the mode of the watchdog Disabled NMI Delay Controls the delay after the watchdog is initialized Disabled 1s 5s 10s 30s 1:00m 5:00m 10:00m 30:00m Timeout 0.4s Set the timout for Watchdog 1s 5s 10s 30s 1:00m 5:00m 10:00m 96 COMe-bPC2 / BIOS Operation I2C Busses Feature Option Description External I2C Bus Speed 800Khz Controls the Bus Speed of the external I2C bus 400Khz 200Khz … 3Khz 97 COMe-bPC2 / BIOS Operation Remote Access Configuration Feature Option Description Remote Access Enabled Enables Remote Access via AMI Console Redirection Disabled 98 COMe-bPC2 / BIOS Operation Ethernet Configuration Feature Option Description GbE LAN Disabled Disables / Enables the onboard Ethernet interface Enabled GbE LAN Boot Disables / Enables the PXE Boot ROM Disabled Enabled GbE Wake Up From S5 Disabled Disables / Enables the WOL function from S5 ACPI state Enabled 99 COMe-bPC2 / BIOS Operation Features 100 COMe-bPC2 / BIOS Operation ME Subsystem Configuration Feature Option Description BootBlock HECI Message Enabled Selects the mode of the watchdog Disabled HECI Message Enables / Disables the HECI Message Enabled Disabled End of Post S5 HECI Message Enabled Disabled ME-HECI Enabled Disabled 101 COMe-bPC2 / BIOS Operation Intel VT-d Configuration Feature Option Description Intel VT-d Enabled Enables / Disables Intel Virtualisation Technology Disabled support 102 COMe-bPC2 / BIOS Operation Trusted Computing Feature Option Description TCG/TPM Support Yes Enables / Disables Trusted Computing and Trusted No Platform Module 103 COMe-bPC2 / BIOS Operation 8.4.4 PCIPnP Menu Feature Option Description Clear NVRAM No Clear NVRAM once during next system boot. Yes Plug & Play O/S No No: all devices are initialized by BIOS Yes Yes: OS has to initialize some devices PCI Latency Timer 32 Value in units of PCI clocks for PCI device latency 64 register … 248 Allocate IRQ to PCI VGA Yes Decided if PCI VGA card does get an IRQ assigned if No requested Palette Snooping Disabled Disables and enables Palette Snooping Enabled PCI IDE BusMaster Disabled Disables and enables PCI IDE Busmaster Enabled OffBoard PCI/ISA IDE Card Auto Some IDE Cards needs this , with set to Auto it works PCISlot 1 with most cards PCISlot 2 … PCISlot 6 IRQ3 … IRQ15 Available Available: IRQ useable by PCI/PnP devices Reserved Reserved: IRQ is reserved for ISA devices DMA Channel 0 … DMA Channel 7 Available Available: DMA useable by PCI/PnP devices Reserved: IRQ is reserved for ISA devices Reserved 104 COMe-bPC2 / BIOS Operation 8.4.5 Boot 105 COMe-bPC2 / BIOS Operation Boot Setting Configuration Feature Option Description Quick Boot Enabled Disables or enables the quick boot feature Disabled Display Mode Graphics Select Display Mode Text Quiet Boot Disabled: Shows normal POST messages Disabled Enabled: Shows OEM Logo during boot up Enabled AddOn ROM Display Mode Force BIOS Set Display Mode for Option ROM Keep Current Bootup Num-Lock Select Power-On state for Num-Lock On Off PS/2 Mouse Support Auto Disables and enables or auto selects PS/2 Mouse Disabled Support Enabled Wait For 'F1' If Error Wait for F1 key to be pressed, if error Disabled Enabled Hit 'DEL' Message Display Enabled Displays: “Hit 'DEL' to run setup” during POST, if Disabled enabled Boot USB HDD first If enabled, boots new attached USB HDD always first. Disabled Enabled Interrupt 19 Capture Disabled Allows option ROMs to trap INT19h if enabled Enabled 106 COMe-bPC2 / BIOS Operation 8.4.6 Security Feature Option Description Change Supervisor Password Type in Change User Password Type in Boot Sector Virus Protection Disabled Enables or disables boot sector virus protection. Enabled 107 COMe-bPC2 / BIOS Operation 8.4.7 Chipset 108 COMe-bPC2 / BIOS Operation North Bridge Configuration Feature Option Description DRAM Frequency Auto Selects the DRAM frequency 800Mhz 1067Mhz Configure DRAM Timing by SPD Disabled Disables and Enables automatic DRAM configuration via Enabled SPD EEPROM TMRC Mode Disabled Disables and Enables the thermal memory reference Enabled code. TM Lock Disables and Enables the Thermal Sensor on Lock. Disabled Enabled TS on DIMM Disabled Disables and Enables the Thermal Sensor on DIMM. Enabled Boots Graphic Adapter Priority IGD Selects which graphics adapter is initialized during boot PCI/IGD up and gets priority PCI/PEG PEG/IGD PEG/PCI Internal Graphics Mode Select Disabled Select the mode for the interal graphicdevice Enabled, 32MB Enabled, 64MB Enabled, 128MB Max TOLUD Maximum value of “top of low usable DRAM” 3G Bytes 2.5G Bytes 2G Bytes Gfx Low Power Mode Disabled Disables and Enables the low power mode for the internal graphics device Enabled PEG Port Selects the initialization mode of the PCIexpress Auto graphics port Disabled Enable PEG Port Always 109 COMe-bPC2 / BIOS Operation Display Control Feature Option Description DVMT/FIXED Memory 128MB Configures the amount of memory for the Dynamic 256MB \Max DVMT Video Memory Technology PAVP Mode Configures the Protected Audio Video Path Disabled Light High Boot Display Device CRT Selects the Boot Display Devices TV SDVO CRT+SDVO LVDS CRT+LVDS TV Standard NTSC Selects the regarding TV standard for TV out interface PAL SECAM SMPTE240M ITU-R television SMPTE295M SMPTE296M EIA-770.2 EIA-770.3 TV Sub-Type Depending on TV Standard Selects the regarding TV Sub-Type HDMI DP Support Enables and disables the HDMI DP Support Disabled Enabled HDCP Support Disabled Enables and disables the HDCP Support Enabled 110 COMe-bPC2 / BIOS Operation Internal LVDS Configuration Feature Option Description Flat Panel Mode Auto Selects the Mode for the flat panel detection Fixed Mode PAID FPID Auto Fallback Disabled Selects what happens, when there is no EEPROM detected (only when FPM: Auto) Fixed Mode Flat Panel Type VGA 640×480 Selects the resolution of the LVDS display (only in FMP: … Fixed Mode) WXGA 1280×800 PAID/FPID [X] Selects the number of the PAID/FPID Channels Single Channel Selects, if 1x or 2x LVDS signals are used (only in FPM: Dual Channel Fixed Mode) Color Depth Selects the Color Depth of the connected LVDS display 18bit (only in FPM: Fixed Mode) 24bit open LDI 24bit Local Flat Panel Scaling Centered Selects the Scaling Options for the LVDS panel (only in Stretched FPM: Fixed Mode) Disabled Backlight Control Type None/External Selects the mode for Backlight Control I2C PWM Backlight Brightness [0…255] Selects the default setting for Backlight Brightness 111 COMe-bPC2 / BIOS Operation Southbridge Configuration Feature Option Description USB Functions Disabled Enables / Disables USB ports* 2 USB Ports 4 USB Ports … 8 USB Ports + IDE USB Port Configure 6+4 USB Ports Configures, how the ports are mapped internally to the 8+2 USB Ports USB controllers USB 2.0 Controller Enabled Enables / Disables the USB 2.0 controller. (only available when there is USB2ATA port disabled) Disabled Enable Lock Bit Disabled Enables Lock bit at end of POST. Only disable for Enabled debugging purposes. Port 80h Output LPC Selects the Inteface for Port 80h output during POST PCI Audio Controller Enables / Disables the HDA audio controller Enabled Disabled SMBUS Controller Enabled Enables / Disables the SMBus controller Disabled * The parallel ATA channel is hosted by an USB2PATA bridge at the 9th USB port. Disabling this port will also disable parallel ATA! 112 COMe-bPC2 / BIOS Operation LPC Decode Range Feature Option Description LPC Decode Range 1 Base [0…FFFF] Enter the Base Adress of the LPC decode range LPC Decode Range 1 Size Disabled Size of the decode range in kB 4 8 … 256 LPC Decode Range 2 Base [0…FFFF] Enter the Base Adress of the LPC decode range LPC Decode Range 2 Size Size of the decode range in kB Disabled 4 8 … 256 LPC Decode Range 3 Base [0…FFFF] Enter the Base Adress of the LPC decode range LPC Decode Range 3 Size Disabled Size of the decode range in kB 4 8 … 256 LPC Decode Range 4Eh/4Fh Enabled Enables disables the LPC decode range at 4Eh/4Fh Disabled LPC Decode Range 62h/66h Disabled Enables disables the LPC decode range at 62h/66h Enabled 113 COMe-bPC2 / BIOS Operation 8.4.8 Exit Menu . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 COMe-bPC2 / BIOS Operation . . . . 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