® 186 186 ® ® Mildly Activated Rosin Liquid Flux Pen Mildly Activated Rosin Liquid Flux Pen For Lead-bearing and Lead-free alloys For Lead-bearing and Lead-free alloys Product Description Physical Properties ® Kester 186 Flux Pen is specifically designed for Specific Gravity: 0.879 ± 0.003 leaded and lead-free rework of conventional and Antoine Paar DMA 35 @ 25°C surface mount circuit board assemblies. Kester Percent Solids (typical): 36 186 under MIL-F-14256, was QPL approved as Tested to J-STD-004, IPC-TM-650, Method 2.3.34 Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are Acid Number (typical): 55.5 mg KOH/g of flux non-corrosive and non-conductive. Kester 186 Tested to J-STD-004, IPC-TM-650, Method 2.3.13 has been developed for use in critical applications where difficult assemblies are to be soldered, but Reliability Properties process requirements stipulate use of Type RMA flux. Kester 186 possess high thermal stability for Copper Mirror Corrosion: Low soldering multi-layer assemblies which require Tested to J-STD-004, IPC-TM-650, Method 2.3.32 higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the Corrosion Test: Low residue in normal cleaning solvents. There is no Tested to J-STD-004, IPC-TM-650, Method 2.6.15 surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic Silver Chromate: Pass activating agents and the inactive nature of the Tested to J-STD-004, IPC-TM-650, Method 2.3.33 residue permits leaving the residue on circuit Chloride and Bromides: 0.02% board assemblies for many applications. The flux Tested to J-STD-004, IPC-TM-650, Method 2.3.35 residue is also moisture and fungus resistant. Fluorides by Spot Test: Pass Performance Characteristics: Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 • High thermal stability SIR, IPC (typical): Pass • Improves soldering performance Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 • Eliminates the need and expense of cleaning • Classified as ROL0 per J-STD-004 Blank 186 RoHS Compliance 9 9 Day 1 5.0 ×10 Ω 3.1 × 10 Ω This product meets the requirements of the RoHS 9 9 Day 4 5.8 ×10 Ω 4.9 × 10 Ω (Restriction of Hazardous Substances) Directive, 9 9 Day 7 6.3 ×10 Ω 5.5 × 10 Ω 2002/95/EC Article 4 for the stated banned substances. 186 Flux Pen® Application Notes Flux Application: ® Kester 186 is applied to circuit boards via Flux Pen for rework of printed wire assemblies. Process Considerations: Kester 186 should only be applied to areas that will be fully heated by the soldering iron or other reflow tool. Care should be taken to avoid flooding the assembly. The surface tension has been adjusted to help the flux form a thin film on the board surface allowing rapid solvent evaporation. Cleaning: Kester 186 flux residues are non-conductive, non-corrosive and do not require removal in most applications. Storage and Shelf Life: Kester 186 is flammable. Store away from sources of ignition. Shelf life is 2 years from date of manufacture when handled properly and held at 10-25°C (50-77°F). Health & Safety: This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product. World Headquarters: 800 W. Thorndale Avenue, Itasca, Illinois, 60143 USA Phone: (+1) 847-297-1600 • Email: customerservice@kester.com • Website: www.kester.com Asia Pacific Headquarters European Headquarters Japanese Headquarters 500 Chai Chee Lane Zum Plom 5 20-11 Yokokawa 2-Chome Singapore 469024 08541 Neuensalz Sumida-Ku (+65) 6449-1133 Germany Tokyo 130-0003 Japan customerservice@kester.com.sg (+49) 3741 4233-0 (+81) 3-3624-5351 customerservice@kester-eu.com jpsales@kester.com.sg The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten- tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details. Rev: 04Jun07