[Print This Datasheet] Promentum MPCBL0040 Dual-core Xeon Compute Processing Module FEATURE SUMMARY The RadiSys® MPCBL0040 single board computer is a high compute board introducing powerful � Field tested high performance multi-core architecture compliant with the Advanced Telecom Computing Architecture board that is very well suited for (AdvancedTCA*) specification. In production since 2006 and field tested by several top tier Service thermally constrained Providers, the MPCBL0040 features two Dual-Core Intel® Xeon® processors LV 2.0 GHz, providing environments. Delivers superior a total of four processor cores per board. This design achieves significant performance improvements performance/watt ratings and in multithreaded applications such as IP Multimedia Subsystem (IMS), IPTV, and Wireless Control performance/$ value. Plane applications. � Superior subsystem scalability The MPCBL0040 is also designed to interoperate with AdvancedTCA products from RadiSys and and greater density; more with third-party building blocks meeting the PICMG* 3.0 specification. subscribers/transactions per board to allow more network Dual-Core Intel® Xeon® LV 2.0 GHz Processor elements in an AdvancedTCA* The processor subsystem on the MPCBL0040 offers: chassis, which improves system scalability � Field tested high performance board that is very well suited for thermally constrained environments. Delivers superior performance/watt ratings and performance/$ value. � Backplane supports high I/O requirements and access to � Superior subsystem scalability and greater density; more subscribers/transactions per board to high-speed storage systems allow more network elements in an AdvancedTCA* chassis, which improves system scalability � Enables carrier-grade system � Backplane supports high I/O requirements and access to high-speed storage systems reliability and manageability such as controlling board power and � Enables carrier-grade system reliability and manageability such as controlling board power and monitoring onboard sensors monitoring onboard sensors using dual Intelligent Platform Management Bus (IPMB) connections using dual Intelligent Platform Management Bus (IPMB) AdvancedMC* connections The MPCBL0040 has one AdvancedMC* which supports the next-generation mezzanine card standard optimized for AdvancedTCA. AdvancedMC uses PCI Express* and Gigabit Ethernet for maximum throughput. In addition, the increased board area and power envelope enables the MPCBL0040 to support high-density I/O and processor mezzanines. AdvancedMC provides full hot-swap support and allows management via an onboard IPMB bus AdvancedMC cards can also reduce time-to-market because AdvancedMC provides baseboard modularity via an easy-to-use expansion slot that requires no infrastructure changes. Promentum MPCBL0040 Specifications FEATURE FUNCTION DESCRIPTION Physical Dimensions Height - 8U, 14 inches (35.56 cm)   Width- 1.2 inches (3.048 cm)   Depth - 11.02 inches (28 cm)   Weight - 7 pounds (3.18 kg)— without packaging 8.82 pounds (4.01 kg) — with packaging     Compliance AdvancedTCA - PICMG 3.0 R1.0 and ECN0001 AdvancedMC- AMC.0, AMC.1, AMC.2 IPMI – IPMI v2.0 Processor Type Dual Core Intel® Xeon® processor LV 2.0 GHz   Core Dual core using Chip Multi Processing (CMP) architecture   Processor Side Bus 667 MHz Memory Cache memory 2 MB L2 cache per processor   Maximum memory capacity 8 GB SDRAM using two 4 GB DDR2-40 Registered ECC SDRAM DIMMs   Number of DIMM slots Two Chipset Memory Controller Hub Intel E7520   I/O Controller Hub Intel 6300ESB Operating System Linux* Validated with Red Hat Enterprise Linux 4, Update 3 Validated with MontaVista Linux Carrier Grade Edition (CGE)* 4.0 Validated with Wind River Platform for Network Equipment, Linux Edition* 1.2 Connectors,   One USB 2.0 port Front Panel One serial port (RJ45) One AdvancedMC* single-width, mid-size (x4/x8 PCI Express, x1 SAS, dual Gb Ethernet) Two 10/100/1000 Ethernet ports LEDs for hot swap, out-of-service, health, hard drive activity, and Ethernet portsOne USB 2.0 port Connectors,     Rear Transition Module Ports   One Serial port (RJ-45)   One USB 1.1 port     Connectors, Backplane   Dual Gigabit Ethernet (AdvancedTCA Base Interface) Quad Gigabit Ethernet (AdvancedTCA Fabric Interface; PICMG 3.1, option 2) Dual IPMB connections (Zone 1) Support for Rear Transition Module (Zone 3)   -   Power Supported Voltage (Normal) -38VDC to -72VDC   Maximum Power Draw 165W – includes two 4 GB DIMMs, one local SAS hard disk drive, and one AdvancedMC* card (25W maximum) Environment Ambient Temperature Operating (normal): 5° C to 40° C (board intake temperature) Operating (short term): -5° C to 55° C -40° C to 70° C (-104° F to 158° F) Storage: -40° C to 70° C Airflow Operating: 30 CFM per minute minimum Humidity Operating: 15% to 90% non condensing at 55° C Storage: 5% to 95% non-condensing at 40° Vibration Operating: 5 Hz to 100 Hz and back to 5 Hz @ 0.1Gs @ 0.1 octave/minute Shock, (unpackaged) Non-operating: 50 G, 170 inches/second trapezoidal             Regulatory Compliance NEBS Demonstrated NEBS Level 3 compliance Safety UL/cUL 60950-1 Safety for Information Technology Equipment E139761 EN/IEC 60950-1 Safety for Information Technology Equipment (CB Report and Certificate) Emissions CISPR22: 1997 & 2003/EN55022:1998 & EN55022 A1:2000 & A2:2003 Class A EN 300 386 V1.3.2:2003FCC Rules CFR 47:2003 Part 15B Class A ICES-003, Issue 4 (CISPR 22:1997 & A2:2002) Class Hazardous Substances Content meets requirements of EU RoHS Directive relying on exemptions for lead in solders for network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications (“Telecom”) and for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages (“Flip Chip”). Products using Telecom exemption ONLY comply with the RoHS Directive if used in exempted applications. Products using Flip Chip exemption may be labeled as Pb-free-Second Level Interconnect Storage Type Onboard storage controller with RAID 0/1support Support for onboard 2.5-inch Small Form Factor (SFF) Serial Attached SCSI (SAS) hard drive Redundant 128 MB flash drives Front panel SAS connector Support for SFF SAS hard drive on Rear Transition Module Ordering Information Information unavailable at this time. © 2010 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Promentum MPCBL0040 DATA SHEET | © 2010 RadiSys Corporation * All other trademarks are the properties of their respective owners.