product brief ® ® Intel Celeron Processor - Low Power for Applied Computing Product Highlights � 300 MHz and 400 MHz: - Built on the Intel 0.18 micron process - 128K Full speed on-die L2 cache operating at core frequency - Low profile, surface mount BGA package - BGA (31 x 27 x 2.5mm), (BGA2) - 495 leads in area array - Tcase: 0 to 100C � 650 MHz: Ultra-Low Voltage 650 MHz - Built on the Intel 0.13 micron process � 650 MHz processor speed - 256K Full speed on-die L2 cache operating at core frequency � 100 MHz processor side bus - Low profile, surface mount µFCBGA package � 8.3W TDP (max), 7.0W TDP (typ) - µFCBGA package (35 x 35 mm) � Supported with Intel 440MX and Intel 815E - 479 balls in area array chipsets - Tcase: 0 to 100C Product Overview � Functional features - MMX technology ® ® The Intel Celeron processors - Low Power, - Floating Point Unit (FPU) Ultra Low Power and Ultra Low Voltage now - Dynamic Execution Micro-Architecture provide an exceptional value for thermally - sensitive and space constrained applied On-Die L2 Cache with Error Checking and computing applications by combining the Correcting (ECC) optimal balance of cost, performance, and low Low Power 400 MHz power. Available in the small form factor BGA � package at 300 and 400 MHz with 128K of 400 MHz processor speed on-die L2 cache or the µFCBGA package at � 100 MHz processor side bus 650 MHz with 256K of on-die L2 cache. These � 10.1W TDP (max). 6.5 W TDP (typ) features make it ideal for value-based, low- profile, low-power applied computing ® ® � Supported with the Intel 815, Intel 815E, ® ® applications, such as data communications, Intel 440BX AGPset and Intel 440MX Chipsets telecommunications, industrial automation and transaction terminals. Ultra-Low Power 300 MHz The 300 MHz processor, at just 1.1V and 5.7 � 300 MHz processor speed W TDP (max), and the 650 MHz processor, also at 1.1V and with a 8.3W TDP (max), are � 100 MHz processor side bus ideal solutions for communication appliances � 5.7W TDP (max), 4.2 W TDP (typ) such as set-top boxes, network attached storage, web pads and other applications with � Supported with the Intel 815, Intel 815E, and the lower power envelopes and BOM Intel 440MX Chipsets requirements. Product Description ® The Embedded Intel Architecture low power family features a 100 MHz processor side bus, designed for a faster transfer of data, to yield an increase in performance. The 128K/256K of on-die L2 cache combined with the efficiencies of the 0.18 and 0.13 micron manufacturing processes offers good low power processor performance for value based systems. The compact form factor results in a low profile, meeting small space requirement. This enables a variety of value-based designs for thermally sensitive and space constrained environments. ® ® INTEL CELERON PROCESSORS - LOW POWER, ULTRA LOW POWER, & ULTRA LOW VOLTAGE CORE SPEED EXTERNAL L2 THERMAL DESIGN PRODUCT NUMBER (MHz) BUS SPEED (MHz) CACHE POWER (MAX) VOLTAGE TCASE PACKAGE RJ80530VY650256 650 100 256K 8.3 watts 1.1V 0-100C 479 µFCBGA KC80526LY400128 400 100 128K 10.1 watts 1.35V 0-100C 495 BGA KC80526LL300128 300 100 128K 5.7 watts 1.1V 0-100C 495 BGA CORE SPEED EXTERNAL L2 THERMAL DESIGN Intel Access Developer’s Site developer.intel.com ® Embedded Intel Architecture Home Page developer.intel.com/design/intarch Other Intel Support: developer.intel.com/design/litcentr Intel Literature Center (800) 548-4725 7a.m. to 7 p.m. CST (U.S. and Canada) International locations please contact your local sales office. 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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel, the Intel logo, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or other countries. *Other names and brands may be claimed as the property of others. For more information, visit the Intel Web site at: developer.intel.com UNITED STATES AND CANADA EUROPE ASIA-PACIFIC JAPAN SOUTH AMERICA Intel Corporation Intel Corporation (UK) Ltd. Intel Semiconductor Ltd. Intel Kabushiki Kaisha Intel Semicondutores do Brazil Robert Noyce Bldg. Pipers Way 32/F Two Pacific Place P.O. Box 115 Tsukuba-gakuen Rue Florida, 1703-2 and CJ22 2200 Mission College Blvd. Swindon 88 Queensway, Central 5-6 Tokodai, Tsukuba-shi CEP 04565-001 Sao Paulo-SP P.O. 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