INTEL DP55WB
Specifications
Audio
8-channel (5.1+ 2 independent multi-streaming) audio subsystem with three analog audio outputs using the Realtek* ALC888 audio codec
Chipset
Intel P55 Express Chipset
Expansion capabilities
One PCI Express* 2.0 x 16 bus add-in card connector; Two PCI Express 2.0 x 1 connectors; One PCI Conventional bus connector
Form factor
MicroATX (9.60 inches by 9.60 inches)
LAN support
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82578DC Gigabit Ethernet Controller
Memory
Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets; Support for DDR3 1333 /1066 MHz DIMMs; Support for up to 16 GB of system memory
Peripheral interfaces
Up to fourteen USB 2.0 ports; Six Serial ATA 3.0 Gb/s ports; One IEEE 1394a header
Processor
Intel Core i7
Intel Core i7 processor series in an LGA1156 socket; Intel Core i5 processor series in an LGA1156 socket
Features
- 5.1 Channel Intel High Definition Audio
- ATX Form Factor
- Dual-Channel DDR3 1333/1066 MHz memory support
- Intel Matrix Storage Technology
- Intel P55 Express Chipset
- Intel PRO 10/100/1000 Network Connection
- Lead-Free
- One IEEE 1394a port with one additional port via internal header; eight hi-speed USB 2.0 ports with six additional ports via 3 internal headers
- One PCI Express 2.0 x16 Slot
- Six SATA 3.0 GB/s Ports
- Support for the Intel Core i7 and Intel Core i5 processors in the LGA1156 package
- Two PCI Express 2.0 x1 slots and one PCI expansion slot
Datasheet
Extracted Text
proDuct BrIeF Intel® Desktop Board Dp55WB Media Series MicroATX Form Factor ® Intel Desktop Board DP55WB Media Series Flexible, reliable, and affordable Multimedia never looked so good Intel® Desktop Boards Media Series— the clear choice The Intel® Desktop Board DP55WB was Developed for the latest generation of designed to deliver new levels of performance multimedia applications and delivering Whether its digital photography or video and innovative features to mainstream PC incredible performance, the Intel Desktop editing, super-sized entertainment today users. Taking advantage of the latest Board DP55WB features the revolutionary demands breakthrough technology. The computing technology, this desktop board Intel® P55 Express Chipset. The two-chip Intel Desktop Board DP55WB delivers great is breaking barriers and delivering out- layout enables lower power consumption performance and the Intel P55 Express standing performance and bandwidth to and support for multiple platform Chipset series of boards is ideal for meet the demanding needs of beginners capabilities. A PCI Express* 2.0 x16 slot mid-level, high-performance desktops. as well as experienced multitaskers. With takes computing to the next level in creat- incredible support for up to eight threads ing and sharing high-definition content of processing power and dual-channel quickly and easily. DDR3 memory, the Intel Desktop Board DP55WB offers great tools for any Designed for ease and flexibility application. Build systems quickly with easy-to-locate, aligned front-panel headers at the edge of the board. Six SATA ports provide more data flexibility. Intel® Desktop Board DP55WB Media Series the boxed Intel® Desktop Board Dp55WB solution includes: • ATX 2.2 compliant I/O shield • SATA cables • Board and back panel I/O layout stickers • Quick reference guide • Intel® Express Installer driver and software DVD Software included: • Intel® Desktop utilities: Monitors system temperatures, voltages, fan speeds, and hard drive health; provides detailed system information; and tests system hardware for common errors. • Intel® Integrator Assistant (Internet download): Streamlines board integration. • DivX* for Windows*: Play DivX* videos and try out other features—post, e-mail, and store videos for a limited time. • Laplink* PC mover* Express: Transfer three software programs, files, and settings from your old PC to your new PC, quickly and easily. • Norton Internet Security* 2009 (90-day trial): Removes viruses automatically, blocks certain Internet worm attacks, and protects e-mail and instant messages. • Additional free software 2 Intel® Desktop Board DP55WB Media Series Features and Benefits 1 Support for the Intel® core™ i7 7 Intel® Matrix Storage technology: 10 9 8 and Intel® core™ i5 processors in RAID 0, 1, 5, and 10 with Intel® the LGA1156 package: Features Rapid Recover Technology increases 1 Intel® Turbo Boost Technology and performance data access and/or 2 Intel® Hyper-Threading Technology for data protection. exceptional performance and scalability, 5 4 8 one Ieee 1394a port with one and 8 MB Shared Intel® Smart Cache, additional port via internal header; enabling dynamic and efficient eight Hi-Speed uSB 2.0 ports with allocation of cache. six additional ports via three internal 2 Intel® p55 express chipset: headers: Provides the most flexible 1 Revolutionary new single chip increases connectivity options for front and routing space for additional onboard back panels. features and lowers power consumption. 9 Intel® pro 10/100/1000 Network 3 Dual-channel DDr3 1333 / 1066 MHz connection: Uses a new low-power 2 memory support: Four DIMM slots design and meets Energy Star* 5.0 3 support up to 16 GB memory connected specifications. 3 directly to the processor via the 10 5.1-Channel Intel® High Definition Integrated Memory Controller. 4 Audio : Enables high-quality integrated 4 one pcI express* 2.0 x16 slot: audio. Improves graphics bandwidth up to 11 Lead-free: Meets all worldwide 16 GB/s. regulatory requirements for lead-free 7 11 5 two pcI express 2.0 x1 slots and manufacturing. 6 8 one pcI expansion slot: Flexibility 12 12 AtX (9.6” x 9.6”) Form Factor: to support PCI Express and legacy 9.6” (24.38 cm) MicroATX board supports smaller PCI devices. towers and systems. 6 Six SATA 3.0 GB/s ports: Facilitates high-speed storage and data transfers. 3 9.6” (24.38 cm) mECHAnICAL Japan Intel® Desktop Board DP55WB Media Series Board Style VCCI V-3/04.04, V-4/03.04, Class B • MicroATX South Korea Technical Specifications Board Size KN-22:2005 and KN-24:2005 • 9.6” x 9.6” (24.38 cm x 24.38 cm) proceSSor Intel® pro 10/100/1000 Network connection taiwan Baseboard power requirements processor Support • New low-power design can meet Energy Star* 5.0 CNS 13438:2006 Class B • ATX 12 V • Intel® Core™ i7 and Intel® Core™ i5 processors in the specifications International LGA1156 package eNVIroNMeNt expansion capabilities CISPR 22:2005 +A1:2005 +A2:2006 Class B 1 • Intel® Turbo Boost Technology operating temperature • One PCI Express* 2.0 x16 slot 2 • Intel® Hyper-Threading Technology environmental compliance • 0° C to +55° C • Two PCI Express 2.0 x1 slots 5 • Supports Intel® 64 architecture europe • One PCI slot Storage temperature Europe RoHS (Directive 2002/95/EC) cHIpSet • -20° C to +70° C Audio New Intel® p55 express chipset 4 china • 5.1-channel Intel® High Definition Audio codec rEGuLATIonS AnD SAFETy STAnDArDS • Intel® 82P55 Platform Controller Hub (PCH) China RoHS (MII Order # 39) united States and canada SySteM MeMory • Intel® Matrix Storage Technology (RAID 0, 1, 5, 10) CSA/UL 60950-1, First Edition (Binational Standard) Lead-Free: The symbol is used to identify Memory capacity • Six onboard SATA ports electrical and electronic assemblies and com- • Four 240-pin DIMM connectors europe uSB 2.0 ponents in which the lead (Pb) concentration (Low Voltage Directive 2006/95/EC) Memory types Integrated Intel® pcH controllers level in any of the raw materials and the end product EN 60950-1:2006 • DDR3 1333 / 1066 SDRAM memory support • Eight Hi-Speed USB 2.0 ports via back panel is not greater than 0.1% by weight (1000 ppm). This • Non-ECC Memory • Six additional ports via internal headers International symbol is also used to indicate conformance to lead- IEC 60950-1:2001, First Edition free requirements and definitions adopted under System BIoS Memory Modes the European Union’s Restriction on Hazardous • 16 Mb Flash EEPROM with Intel® Platform Innovation • Dual- or single-channel operation support eMc regulations (tested in representative chassis) Substances (RoHS) directive, 2002/95/EC. Framework for EFI Plug and Play, IDE drive auto- united States Memory Voltage configure FCC 47 CFR Part 15, Subpart B • 1.5 V standard JEDEC voltage • Advanced configuration and power interface For ordering information, visit canada JumPErS AnD FronT-PAnEL ConnECTorS V3.0b, DMI 2.5 www.intel.com ICES-003 Class B Jumpers • Intel® Express BIOS update support: BIOS update • Single configuration jumper design via new F7 function key europe For the most current product information, • Jumper access for BIOS maintenance mode (EMC Directive 2004/108/EC) Hardware Management Features visit www.intel.com/go/idb Front-panel connectors EN 55022:2006 and EN 55024:1998 • Processor fan speed control • Reset, HD LED, Power LEDs, power on/off or http://ark.intel.com • System chassis fan speed control Australia/New Zealand • Three front-panel Hi-Speed USB 2.0 headers • Voltage and temperature sensing EN 55022:2006 Class B • Front-panel audio header For specific CPU compatibility, visit • Fan sensor inputs used to monitor fan activity • Power management support for ACPI 3.0b http://processormatch.intel.com 1 Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.com/technology/turboboost for more information. 2 Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see www.intel.com/info/hyperthreading. 3 System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system. 4 Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm 5 64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://developer.intel.com/technology/ intel64/index.htm for more information. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary. Actual Intel® Desktop Board may differ from the image shown. Intel, the Intel logo, Intel Core, and Core Inside are trademarks of Intel Corporation in the U.S. and other countries. * Other names and brands may be claimed as the property of others. Copyright © 2009 Intel Corporation. All rights reserved. 0709/AC/MS/PDF 322333-001US
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