INTEL DP55KG
Specifications
Audio
Intel High Definition Audio? subsystem in the following configuration
Audio (back channel + front channel)
10-ch
Chipset
Intel P55 Express Chipset
Energy Star
Yes
eSATA Ports
2
Firewire
1+1
Form Factor
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Integrated LAN
10/100/1000
LAN Support
Intel PRO 10/100/1000 Network Connection (82578DC)
Low Halogen Options Available
MDDS
Max CPU Configuration
1
Memory
Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
Parallel Ports
0
PATA Ports
0
Processor
View supported processors for the most current list of compatible processors.
RAID Configuration
0,1,5,10 & Matrix
SATA Ports
8
Serial Ports
0
Video
Nvidia SLI* and ATI CrossFire* technology support enables two graphics cards to work together for ultimate 3D gaming performance and visual quality
Features
- 16 Mb symmetrical flash memory device
- Intel Express BIOS Update
- Intel Platform Innovation Framework for extensible firmware
- interface
- Support for ATI Crossfire and NVIDIA SLI technology rounds off the platform with amazing graphics performance.
- Support for SMBIOS
Datasheet
Intel-DP55KG-datasheet1-1861223480.pdf
4499 KiB
Extracted Text
Intel® Desktop Board
DP55KG
Technical Product Specification
September 2009
Order Number: E70713-001US
®
The Intel Desktop Board DP55KG may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DP55KG Specification Update.
Revision History
Revision Revision History Date
®
-001 First release of the Intel Desktop Board DP55KG Technical Product September 2009
Specification
®
This product specification applies to only the standard Intel Desktop Board DP55KG with BIOS
identifier KGIBX10J.86A.
Changes to this specification will be published in the Intel Desktop Board DP55KG Specification
Update before being incorporated into a revision of this document.
®
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, Core i7, and Core i5 are trademarks of Intel Corporation or its subsidiaries in the United States and
other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2009, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel Desktop Board DP55KG.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DP55KG and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DP55KG
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DP55KG Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 System Memory .............................................................................. 15
1.5.1 Memory Configurations ......................................................... 16
®
1.6 Intel P55 Express Chipset ............................................................... 18
1.6.1 USB ................................................................................... 18
1.6.2 SATA Interfaces ................................................................... 19
1.7 Discrete SATA Controller .................................................................. 20
1.7.1 eSATA Support .................................................................... 20
1.8 Real-Time Clock Subsystem .............................................................. 20
1.9 Legacy I/O Controller....................................................................... 21
1.9.1 Consumer Infrared (CIR)....................................................... 21
1.10 Audio Subsystem............................................................................. 22
1.10.1 Audio Subsystem Software .................................................... 22
1.10.2 Audio Connectors and Headers............................................... 22
1.10.3 8-Channel (7.1) Audio Subsystem........................................... 23
1.11 LAN Subsystem............................................................................... 24
®
1.11.1 Intel 82578DC Gigabit Ethernet Controller.............................. 24
1.11.2 LAN Subsystem Software....................................................... 25
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 25
1.12 Bluetooth* Technology Support ......................................................... 26
1.13 Hardware Management Subsystem .................................................... 26
1.13.1 Hardware Monitoring and Fan Control...................................... 26
1.13.2 Fan Monitoring..................................................................... 27
1.13.3 Chassis Intrusion and Detection.............................................. 27
1.13.4 Thermal Monitoring .............................................................. 28
1.14 Power Management ......................................................................... 29
1.14.1 ACPI................................................................................... 29
1.14.2 Hardware Support ................................................................ 32
1.15 Onboard Power Button ..................................................................... 37
1.15.1 ENERGY STAR* 4.0 and 5.0, E-Standby, and
ErP Compliance.................................................................... 38
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Intel Desktop Board DP55KG Technical Product Specification
2 Technical Reference
2.1 Memory Resources .......................................................................... 39
2.1.1 Addressable Memory............................................................. 39
2.1.2 Memory Map........................................................................ 41
2.2 Connectors and Headers................................................................... 41
2.2.1 Back Panel Connectors.......................................................... 42
2.2.2 Component-side Connectors and Headers ................................ 43
2.3 Jumper Block.................................................................................. 53
2.4 Mechanical Considerations ................................................................ 55
2.4.1 Form Factor......................................................................... 55
2.5 Electrical Considerations................................................................... 56
2.5.1 Power Supply Considerations ................................................. 56
2.5.2 Fan Header Current Capability................................................ 57
2.5.3 Add-in Board Considerations .................................................. 57
2.6 Thermal Considerations.................................................................... 58
2.7 Reliability ....................................................................................... 60
2.8 Environmental ................................................................................ 60
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 61
3.2 BIOS Flash Memory Organization....................................................... 62
3.3 Resource Configuration .................................................................... 62
3.3.1 PCI Autoconfiguration ........................................................... 62
3.4 System Management BIOS (SMBIOS)................................................. 63
3.5 Legacy USB Support ........................................................................ 63
3.6 BIOS Updates ................................................................................. 64
3.6.1 Language Support ................................................................ 64
3.6.2 Custom Splash Screen .......................................................... 65
3.7 BIOS Recovery................................................................................ 65
3.8 Boot Options................................................................................... 66
3.8.1 Optical Drive Boot ................................................................ 66
3.8.2 Network Boot....................................................................... 66
3.8.3 Booting Without Attached Devices........................................... 66
3.8.4 Changing the Default Boot Device During POST ........................ 66
3.9 Adjusting Boot Speed....................................................................... 67
3.9.1 Peripheral Selection and Configuration..................................... 67
3.9.2 BIOS Boot Optimizations ....................................................... 67
3.10 BIOS Security Features .................................................................... 68
3.11 BIOS Performance Features .............................................................. 69
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 71
4.2 BIOS Beep Codes ............................................................................ 71
4.3 Front-panel Power LED Blink Codes.................................................... 72
4.4 BIOS Error Messages ....................................................................... 72
4.5 Port 80h POST Codes ....................................................................... 73
vi
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 79
5.1.1 Safety Standards.................................................................. 79
5.1.2 European Union Declaration of Conformity Statement................ 80
5.1.3 Product Ecology Statements................................................... 81
5.1.4 EMC Regulations .................................................................. 85
5.1.5 Product Certification Markings (Board Level)............................. 86
5.2 Battery Disposal Information............................................................. 87
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram................................................................................ 13
3. Memory Channel and DIMM Configuration ........................................... 17
4. Back Panel Audio Connector Options .................................................. 23
5. LAN Connector LED Locations............................................................ 25
6. Thermal Sensors and Fan Headers ..................................................... 28
7. Locations of Indicator LEDs............................................................... 36
8. Location of the Onboard Power Button................................................ 37
9. Detailed System Memory Address Map ............................................... 40
10. Back Panel Connectors ..................................................................... 42
11. Component-side Connectors and Headers ........................................... 43
12. Connection Diagram for Front Panel Header ........................................ 50
13. Connection Diagram for Front Panel USB Headers ................................ 52
14. Connection Diagram for IEEE 1394a Header ........................................ 52
15. Location of the Jumper Block............................................................. 53
16. Board Dimensions........................................................................... 55
17. Localized High Temperature Zones..................................................... 59
Tables
1. Feature Summary.............................................................................. 9
2. Components Shown in Figure 1 ......................................................... 12
3. Supported Memory Configurations ..................................................... 15
4. LAN Connector LED States................................................................ 25
5. Effects of Pressing the Power Switch .................................................. 29
6. Power States and Targeted System Power........................................... 30
7. Wake-up Devices and Events ............................................................ 31
8. System Memory Map ....................................................................... 41
9. Component-side Connectors and Headers Shown in Figure 11................ 44
10. Front Panel Audio Header ................................................................. 45
11. SATA Connectors............................................................................. 45
12. S/PDIF Header................................................................................ 45
13. Chassis Intrusion Header.................................................................. 46
14. Processor, Front and Rear Chassis, and Auxiliary (4-Pin)
Fan Headers ................................................................................... 46
15. Processor Core Power Connector........................................................ 48
vii
Intel Desktop Board DP55KG Technical Product Specification
16. Main Power Connector...................................................................... 49
17. Front Panel Header .......................................................................... 50
18. States for a One-Color Power LED...................................................... 51
19. States for a Two-Color Power LED...................................................... 51
20. BIOS Setup Configuration Jumper Settings.......................................... 54
21. Recommended Power Supply Current Values ....................................... 56
22. Fan Header Current Capability........................................................... 57
23. Thermal Considerations for Components ............................................. 59
24. Environmental Specifications............................................................. 60
25. BIOS Setup Program Menu Bar.......................................................... 62
26. BIOS Setup Program Function Keys.................................................... 62
27. Acceptable Drives/Media Types for BIOS Recovery ............................... 65
28. Boot Device Menu Options ................................................................ 66
29. Supervisor and User Password Functions............................................. 68
30. BIOS Beep Codes ............................................................................ 71
31. Front-panel Power LED Blink Codes.................................................... 72
32. BIOS Error Messages ....................................................................... 72
33. Port 80h POST Code Ranges.............................................................. 73
34. Port 80h POST Codes ....................................................................... 74
35. Typical Port 80h POST Sequence........................................................ 77
36. Safety Standards............................................................................. 79
37. Lead-Free Board Markings ................................................................ 84
38. EMC Regulations............................................................................. 85
39. Product Certification Markings ........................................................... 86
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Form Factor
® ®
• Intel Core™ i7 and Intel Core™ i5 processors in an LGA1156 socket:
Processor
― 1 x16 PCIe 2.0 Graphics interface (operates in x8 mode when second slot
is populated)
― 1 x8 PCIe 2.0 Graphics interface
― Two DDR3 memory channels
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
Memory
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
• Support for 1 Gb and 2 Gb memory technology
• Support for up to 16 GB of system memory with four DIMMs using 2 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
® ®
Intel P55 Express Chipset consisting of the Intel P55 Platform Controller
Chipset
Hub (PCH)
®
Audio Intel High Definition Audio subsystem using the Realtek* ALC889 audio codec
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)
• Fourteen USB 2.0 ports:
Peripheral
Interfaces
― Eight ports are implemented with stacked back panel connectors
― Two internal headers support four additional ports
― One vertical connector
― One port used to connect the onboard Bluetooth* Module
• Eight internal Serial ATA (SATA) 3.0 Gb/s interfaces:
― Six interfaces through Intel P55 PCH with RAID support (black)
― Two interfaces through a discrete Marvell* controller 88E6145 (blue)
• Two back panel External Serial ATA (eSATA) 3.0 Gb/s ports (red) through a
discrete Marvell controller
• Two IEEE 1394a ports:
― One port via a back panel connector
― One port via a front-panel header (blue)
• Onboard Bluetooth module with a connector for an external antenna
Wireless Interface
®
• Intel BIOS resident in the SPI Flash device
BIOS
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
continued
9
Intel Desktop Board DP55KG Technical Product Specification
Table 1. Feature Summary (continued)
• Support for PCI* Local Bus Specification Revision 2.2
Instantly Available
PC Technology • Support for PCI Express* Revision 2.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports
®
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel 82578DC Gigabit
LAN Support
Ethernet Controller
• One PCI Express 2.0 x16 (x8 when the PCI Express x8 connector is used) bus
Expansion
add-in card connector (blue)
Capabilities
• One PCI Express 2.0 x8 bus add-in card connector (blue)
• Two PCI Express x1 bus add-in card connectors from the PCH
• One PCI Express x4 bus add-in card connector from the PCH
• Two PCI conventional bus connectors from the PCH
• Hardware monitoring and fan control ASIC Heceta 6P
Hardware Monitor
Subsystem • Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers using PWM control
• Four fan sense inputs used to monitor fan activity
• Fan speed control using voltage control (4-pin fan headers front, rear and Aux)
with selectable support in BIOS for 3 wire fans
• Support for Platform Environmental Control Interface (PECI)
10
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DP55KG.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
11
Intel Desktop Board DP55KG Technical Product Specification
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A PCI Conventional bus add-in card connector
B PCI Express x4 bus add-in card connector
C PCI Conventional bus add-in card connector
D PCI Express x8 bus add-in card connector
E Front panel audio header
F S/PDIF out header
G PCI Express x1 bus add-in card connector
H Rear chassis fan header
I PCI Express x1 bus add-in card connector
J PCI Express x16 bus add-in card connector
K Battery
L Back panel connectors
M Vertical USB connector
N Processor core power connector (2 X 4)
O Processor fan header
P Processor LED (red)
Q Voltage Regulator LED (red)
R LGA1156 processor socket
S Post Code LED Display
T DIMM Channel A sockets (2)
U DIMM Channel B sockets (2)
V Onboard power button
W Standby power indicator LED (green)
X Main power connector
Y Front panel header
Z Front panel CIR receiver (input) header
AA Back panel CIR emitter (output) header
BB Alternate front panel power LED header
CC Front chassis fan header
DD Front panel USB headers (2)
EE IEEE 1394a front panel header
FF Intel P55 Platform Controller Hub (PCH)
GG BIOS Setup configuration jumper block
HH SATA connectors
II Chassis intrusion header
JJ Onboard Bluetooth module with external antenna
KK Piezo Speaker
LL Auxiliary PCI Express graphics power connector (SATA-style)
MM Auxiliary fan header
12
Product Description
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram
13
Intel Desktop Board DP55KG Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port connector
• No floppy drive connector
• No serial port connector or header
• No PS/2 connectors
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DP55KG http://www.intel.com/products/motherboard/DP55KG/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the Intel http://www.intel.com/products/motherboard/DP55KG/index.htm
Desktop Board DP55KG
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.4 Processor
The board is designed to support the Intel Core i7 and Intel Core i5 processors in an
LGA1156 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W with margin to allow for greater than
130 W. The processors listed above are only supported when falling within the
wattage requirements of the Intel Desktop Board DP55KG. See the Intel web site
listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 56 for information on power supply requirements for this board.
14
Product Description
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.35 V DDR3 SDRAM DIMMs (New JEDEC Specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 16 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 39 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 512 MB x16 module
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1600 MHz, 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
• XMP version 1.2 performance profile support for memory speeds above 1333 MHz
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM Configuration SDRAM SDRAM Organization Number of SDRAM
(Note)
Capacity Density Front-side/Back-side Devices
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16
2048 MB SS 2 Gbit 256 M x 8/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x 8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
15
Intel Desktop Board DP55KG Technical Product Specification
1.5.1 Memory Configurations
The Intel Core i7 and Intel Core i5 processors supports the following types of memory
organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
16
Product Description
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
For the system to boot, always install memory into the blue DIMM memory slots if
only installing two DIMMs in your configuration.
17
Intel Desktop Board DP55KG Technical Product Specification
®
1.6 Intel P55 Express Chipset
The Intel P55 Express Chipset consisting of the Intel P55 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and
PCIe interfaces. The PCH is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel P55 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 USB
The board supports up to fourteen USB 2.0 ports, supports EHCI, and has two internal
hubs (RMH) that allow the use of EHCI-compatible drivers.
The PCH provides the USB controller for all ports. The port arrangement is as follows:
• Eight ports are implemented with stacked back panel connectors
• Two internal headers that support four additional ports
• One onboard vertical USB connector that supports one port
• One port used to connect the onboard Bluetooth Module
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 42
The location of the front panel USB headers Figure 11, page 43
18
Product Description
1.6.2 SATA Interfaces
The board provides eight internal SATA connectors. Six connectors (black) are through
the PCH, which support one device per connector, and two additional connectors
(blue) from a discrete controller.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
3 Gb/s per port. One device can be installed on each port for a maximum of eight
SATA devices. A point-to-point interface is used for host to device connections, unlike
Parallel ATA (PATA) IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA controller can operate in both legacy and native modes. In legacy
mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native
mode, standard PCI Conventional bus resource steering is used. Native mode is the
preferred mode for configurations using the Windows* XP, Windows Vista*, and
Windows 7* operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/.
For information about Refer to
The location of the SATA connectors Figure 11, page 43
1.6.2.1 SATA RAID
The board supports the following RAID (Redundant Array of Independent Drives)
levels via the PCH:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
RAID functionality is only supported when using drives connected to the six SATA
connectors (black) from the PCH.
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS.
Also, during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation. Both Microsoft Windows Vista and Microsoft
Windows 7 include the necessary RAID drivers for both AHCI and RAID without the
need to install separate RAID drivers using the F6 switch in the operating system
installation process.
19
Intel Desktop Board DP55KG Technical Product Specification
1.7 Discrete SATA Controller
The board includes a discrete Marvell 88E6145 SATA controller that provides two
internal SATA ports (blue) and two eSATA ports (red) on the back panel.
1.7.1 eSATA Support
The red eSATA connectors on the back panel can be used to connect an eSATA drive.
They can also be used for port replication, which allows the aggregation of multiple
hard drives on each of the eSATA ports. Figure 10 on page 42 shows the location of
the External SATA -compatible SATA ports on the back panel.
The Marvell 88E6145 controller uses the PCI Express bus for data transfer with a
theoretical maximum transfer rate of 3 Gb/s per port. These connectors are in
addition to the six SATA connectors of the PCH SATA interface.
To use the eSATA ports you must enable RAID support in the BIOS for the Marvell
discrete controller. The two internal ports can stay in the default IDE mode if RAID is
not required.
The discrete SATA interface supports the following RAID levels:
• RAID 0
• RAID 1
NOTE
The Marvell 88E6145 controller supports single drive non-RAID configurations as well
as RAID configurations. For RAID configurations, you must install the RAID drivers by
pressing F6 during operating system installation. See your operating system
installation documentation for more information about installing drivers during the
installation process.
1.8 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail date and time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
20
Product Description
1.9 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the
supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.
21
Intel Desktop Board DP55KG Technical Product Specification
1.10 Audio Subsystem
The board supports the Intel High Definition Audio subsystem based on the Realtek
ALC889 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 14
1.10.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
• Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for
front panel audio connectors) (yellow)
• S/PDIF audio header (1 x 4-pin header) (yellow)
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 11, page 43
The signal names of the front panel audio header and S/PDIF header Table 10, page 45
The back panel audio connectors Section 2.2.1, page 42
22
Product Description
1.10.3 8-Channel (7.1) Audio Subsystem
The 8-channel (7.1) audio subsystem includes the following:
• Intel P55 PCH
• Realtek ALC889 audio codec
• Microphone input that supports a single dynamic, condenser, or electret
microphone
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A S/PDIF Optical input
B S/PDIF Optical output
C Surround left/right channel audio out/Retasking Jack
D Center channel and LFE (subwoofer) audio out/Retasking Jack
E Line in (Side Channel Surround) audio out/Retasking Jack
F Line out/Headphone (Stereo)/Retasking Jack
G Mic in
H Side Surround
Figure 4. Back Panel Audio Connector Options
For information about Refer to
The back panel audio connectors Section 2.2.1, page 42
23
Intel Desktop Board DP55KG Technical Product Specification
1.11 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82578DC Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• Intel 82801IJR (PCH)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• PCI Conventional bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
®
1.11.1 Intel 82578DC Gigabit Ethernet Controller
The Intel 82578DC Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• PCI Express link
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
24
Product Description
1.11.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.11.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
Item Description
A Link LED (green)
B Data Rate LED (green/yellow)
Figure 5. LAN Connector LED Locations
Table 4 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 4. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected.
Data Rate Green/Yellow Green 100 Mbits/s data rate is selected.
Yellow 1000 Mbits/s data rate is selected.
25
Intel Desktop Board DP55KG Technical Product Specification
1.12 Bluetooth* Technology Support
The Bluetooth Module plus external antenna enables the user to connect with a variety
of Bluetooth enabled devices. Driver support is provided by Microsoft operating
systems like Microsoft Vista and Microsoft 7. The Bluetooth driver stack is supplied by
Microsoft but some Bluetooth enable devices might provide additional Bluetooth
features and for proper functioning of those features, will need their own supplied
drivers installed.
For information about Refer to
Obtaining Bluetooth information and drivers http://msdn.microsoft.com/en-
us/library/aa362932(VS.85).aspx
1.13 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.13.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
• Fan speed control controllers and sensors provided by the Hardware Monitoring
and Fan Control ASIC
• Thermal sensors in the processor and PCH
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.1 V, and
+VCCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed or switch the fans on or off as needed
26
Product Description
1.13.2 Fan Monitoring
®
Fan monitoring can be implemented using Intel Desktop Control Center or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.14.2.2, page 33
1.13.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 11, page 43
27
Intel Desktop Board DP55KG Technical Product Specification
1.13.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan header
B Voltage regulator thermal diode
C Processor fan header
D Thermal diode, located on processor die
E Front chassis fan header
F Thermal diode, located on the Intel P55 Express
Chipset
G Auxiliary fan header
Figure 6. Thermal Sensors and Fan Headers
28
Product Description
1.14 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB
⎯ Power Management Event signal (PME#) wake-up support
⎯ PCI Express WAKE# signal support
⎯ Wake from Consumer IR
1.14.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 7 on page 31)
• Support for a front panel power and sleep mode switch
Table 5 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 5. Effects of Pressing the Power Switch
If the system is in this …and the power switch is
state… pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than six seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than six seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)
29
Intel Desktop Board DP55KG Technical Product Specification
1.14.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 6 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 6. Power States and Targeted System Power
Processor Targeted System
(Note 1)
Global States Sleeping States States Device States Power
G0 – working S0 – working C0 – working D0 – working Full power > 30 W
state state.
G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 52.5 W
state stopped grant device
specification
specific.
(Note 2)
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W
state RAM. Context except for
saved to RAM. wake-up logic.
(Note 2)
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W
state disk. Context except for
saved to disk. wake-up logic.
(Note 2)
G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off system. wake-up logic, Service can be performed
except when safely.
AC power is
provided by
disconnected
battery or
from the
external source.
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
30
Product Description
1.14.1.2 Wake-up Devices and Events
Table 7 lists the devices or specific events that can wake the computer from specific
states.
Table 7. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
Note 1)
(
Power switch S1, S3, S4, S5
(Note 1)
RTC alarm S1, S3, S4, S5
(Note 1)
LAN S1, S3, S4, S5
USB S1, S3
(Note 1)
PME# signal S1, S3, S4, S5
(Note 1)
WAKE# S1, S3, S4, S5
(Note 2)
Consumer IR S3, S4, S5
Notes:
1. S4 implies operating system support only.
2. Wake from S4 and S5 is recommended by Microsoft.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
31
Intel Desktop Board DP55KG Technical Product Specification
1.14.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• PME# signal wake-up support
• WAKE# signal wake-up support
• Wake from Consumer IR
• +5 V Standby Power Indicator LED
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
1.14.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the main power connector Figure 11, page 43
The signal names of the main power connector Table 16, page 49
32
Product Description
1.14.2.2 Fan Headers
The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 or S1 state
• The fans are off when the board is off or in the S3, S4, or S5 state
• Each fan header is wired to a fan tachometer input of the hardware monitoring and
fan control ASIC
• All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed
• All fan headers have a +12 V DC connection
• 4-pin fan headers are controlled by Pulse Width Modulation
For information about Refer to
The location of the fan headers Figure 11, page 43
The location of the fan headers and sensors for thermal monitoring Figure 6, page 28
1.14.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby
current when implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
• The PCI Express WAKE# signal
• The PCI bus PME# signal for PCI 2.3 compliant LAN designs
⎯ By Ping
⎯ Magic Packet
• The onboard LAN subsystem
• Wake from CIR
• Wake from S5
33
Intel Desktop Board DP55KG Technical Product Specification
1.14.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 7 on page 31 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.
1.14.2.5 Wake from USB
USB bus activity wakes the computer from ACPI S1 or S3 states.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and is supported by the operating system.
1.14.2.6 PME# Signal Wake-up Support
When the PME# signal on the PCI Conventional bus is asserted, the computer wakes
from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS).
1.14.2.7 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S1, S3, S4, or S5 state.
1.14.2.8 Wake from Consumer IR
CIR activity wakes the computer from an ACPI S3, S4, or S5 state.
1.14.2.9 Wake from S5
When the RTC Date and Time is set in the BIOS, the computer will automatically wake
from S5 state.
34
Product Description
1.14.2.10 +5 V Standby Power Indicator LED and Additional LEDs
The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power
indicator LED on the board.
CAUTION
If AC power has been switched off and the standby power indicators are still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
In addition to the standby power indicator, the board contains three LEDs that indicate
the following:
• The processor LED indicates an elevated temperature on the processor that could
effect performance
• The Voltage Regulator LED indicates an elevated temperature in the processor
voltage regulator circuit that could effect performance
• The hard drive LED indicates SATA drive activity
35
Intel Desktop Board DP55KG Technical Product Specification
Figure 7 shows the location of these additional LEDs.
Item Description
A Processor LED (red)
B Voltage regulator LED (red)
C Standby power indicator LED (green)
D SATA drive activity LEDs (red)
Figure 7. Locations of Indicator LEDs
36
Product Description
1.15 Onboard Power Button
The board provides a power button that can be used to turn the computer on or off.
This button is intended for use at integration facilities to provide the ability to power
on/off the board without the need to attach a front panel switch (the onboard power
button duplicates the functionality of the front panel button and functions in exactly
the same manner).
The power button on the front panel is recommended for all other instances of turning
the computer on or off. To turn the computer off using the onboard power button,
keep the button pressed down for three seconds. Figure 8 shows the location of the
onboard power button.
Figure 8. Location of the Onboard Power Button
CAUTION
Electrostatic discharge (ESD) can damage components. The onboard power button
should be used only at an ESD workstation using an antistatic wrist strap and a
conductive foam pad. If such a station is not available, some ESD protection can be
provided by wearing an antistatic wrist strap and attaching it to a metal part of the
computer chassis.
37
Intel Desktop Board DP55KG Technical Product Specification
1.15.1 ENERGY STAR* 4.0 and 5.0, E-Standby, and ErP
Compliance
The US Department of Energy and the US Environmental Protection Agency have
continually revised the ENERGY STAR requirements. Intel has worked directly with
these two governmental agencies in the definition of new requirements.
For information about Refer to
ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
Intel Desktop Board DP55KG also meets the following international program
requirements in combination with an appropriately efficient power supply:
• Korea E-Standby by meeting the Energy Star 4.0 and 5.0 requirements
• European Union ErP by drawing ~52mA on the 5V STBY PS rail while in S5 power
state
38
2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory
The board utilizes 16 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM
(total system memory). On a system that has 16 GB of system memory installed, it is
not possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• BIOS/SPI Flash device (16 Mbit)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• PCH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. Figure 9 shows a schematic of
the system memory map. All installed system memory can be used when there is no
overlap of system addresses.
39
Intel Desktop Board DP55KG Technical Product Specification
Figure 9. Detailed System Memory Address Map
40
Technical Reference
2.1.2 Memory Map
Table 8 lists the system memory map.
Table 8. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K - 16777216 K 100000 - 3FFFFFFFF 16382 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
2.2 Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB, as well as IEEE 1394a.
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB or 1394 header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors. The connectors can be divided into
these groups:
• Back panel I/O connectors
• Component-side I/O connectors and headers (see page 43)
41
Intel Desktop Board DP55KG Technical Product Specification
2.2.1 Back Panel Connectors
Figure 10 shows the location of the back panel connectors for the board.
Item Description
A eSATA ports
B Back-to-BIOS button
C S/PDIF in (optical)
D S/PDIF out (optical)
E USB ports
F IEEE 1394a connector
G USB ports
H LAN
I USB ports
J Surround left/right channel audio out
K Side Surround
L Center channel and LFE (subwoofer) audio out
M Audio line in/(Side Surround) audio out
N Front left/right channel audio out/Two channel audio line out
O Mic in
Figure 10. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
42
Technical Reference
2.2.2 Component-side Connectors and Headers
Figure 11 shows the locations of the component-side connectors and headers.
Figure 11. Component-side Connectors and Headers
Table 9 lists the component-side connectors and headers identified in Figure 11.
43
Intel Desktop Board DP55KG Technical Product Specification
Table 9. Component-side Connectors and Headers Shown in Figure 11
Item/callout
from Figure 11 Description
A PCI Conventional bus add-in card connector
B PCI Express x4 bus add-in card connector (Physical x16 compatible connector)
C PCI Conventional bus add-in card connector
D PCI Express x8 bus add-in card connector (Physical x16 compatible connector)
E Front panel audio header
F S/PDIF out header
G PCI Express x1 bus add-in card connector
H Rear chassis fan header
I PCI Express x1 bus add-in card connector
J PCI Express x16 bus add-in card connector
K Vertical USB connector
L Processor core power connector (2 X 4)
M Processor fan header
N Main power connector
O Front panel header
P Front panel CIR receiver (input) header
Q Front panel CIR emitter (output) header
R Alternate front panel power LED header
S Front chassis fan header
T Front panel USB header
U Front panel USB header
V IEEE 1394a header
W SATA connectors
X Chassis intrusion header
Y Auxiliary PCI Express graphics power connector (SATA-style)
Z Auxiliary fan header
44
Technical Reference
2.2.2.1 Signal Tables for the Connectors and Headers
Table 10. Front Panel Audio Header
Pin Signal Name Pin Signal Name
1 [Port 2] Left channel 2 Ground
3 [Port 2] Right channel 4 PRESENCE# (Dongle present)
5 [Port 1] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 11. SATA Connectors
Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Table 12. S/PDIF Header
Pin Signal Name
1 Ground
2 S/PDIF out
3 Key (no pin)
4 +5 VDC
45
Intel Desktop Board DP55KG Technical Product Specification
Table 13. Chassis Intrusion Header
Pin Signal Name
1 Intruder#
2 Ground
Table 14. Processor, Front and Rear Chassis, and Auxiliary
(4-Pin) Fan Headers
Pin Signal Name
(Note)
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Note: These fan headers use Pulse Width Modulation control for fan speed.
Table 20. Back Panel CIR Emitter (Output) Header
Pin Signal Name
1 Emitter out 1
2 Emitter out 2
3 Ground
4 Key (no pin)
5 Jack detect 1
6 Jack detect 2
Table 21. Front Panel CIR Receiver (Input) Header
Pin Signal Name
1 Ground
2 LED
3 NC
4 Learn-in
5 5 V standby
6 VCC
7 Key (no pin)
8 CIR Input
46
Technical Reference
2.2.2.2 Add-in Card Connectors
The board has the following add-in card connectors:
• PCI Express 2.0 x16: one PCI Express 2.0 x16 connector supporting simultaneous
transfer speeds up to 8 GB/s of peak bandwidth per direction and up to 16 GB/s
concurrent bandwidth.
• PCI Express 2.0 x8: one PCI Express 2.0 x 8 connector supporting simultaneous
transfer speeds up to 4 GB/s of peak bandwidth per direction and up to 8 GB/s
concurrent bandwidth.
• PCI Express 2.0 x4: one PCI Express 2.0 x4 connector (implemented using a x4
physical connector capable of accepting a x16 card). The x4 interface supports
simultaneous transfer speeds up to 500 MB/s of peak bandwidth per direction and
up to 4 GB/s concurrent bandwidth.
• PCI Express 2.0 x1: two PCI Express 2.0 x1 connectors. The x1 interface
supports simultaneous transfer speeds up to 1 GB/s of peak bandwidth per
direction and up to 2 GB/s concurrent bandwidth.
• PCI Conventional (rev 2.3 compliant) bus: two PCI Conventional bus add-in card
connectors.
Note the following considerations for the PCI Conventional bus connector:
• The PCI Conventional bus connectors are bus master capable.
• SMBus signals are routed to the PCI Conventional bus connectors. This enables
PCI Conventional bus add-in boards with SMBus support to access sensor data on
the desktop board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
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Intel Desktop Board DP55KG Technical Product Specification
2.2.2.3 Power Supply Connectors
The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and
24 unconnected.
• Processor core power – a 2 x 4 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
• Auxiliary PCI Express graphics power connector (SATA style) – this
connector provides the required additional power when using high power (75 W or
greater) add-in cards in either or both the PCI Express x16 and the PCI Express x8
bus add-in card connectors. See Figure 1 for location.
CAUTION
If high power (75 W or greater) add-in cards are installed in either or both the
Secondary PCI Express x16 and the PCI Express x4 bus add-in card connectors, the
Auxiliary PCI Express graphics power connector must be used. Failure to do so may
cause damage to the board and the add-in cards.
Table 15. Processor Core Power Connector
Pin Signal Name Pin Signal Name
1 Ground 2 +12 V
3 Ground 4 +12 V
5 Ground 6 +12 V
7 Ground 8 +12 V
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Technical Reference
Table 16. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
(Note) (Note)
11 +12 V 23 +5 V
(Note) (Note)
12 2 x 12 connector detect 24 Ground
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
For information about Refer to
Power supply considerations Section 2.5.1 on page 56
49
Intel Desktop Board DP55KG Technical Product Specification
2.2.2.4 Front Panel Header
This section describes the functions of the front panel header. Table 17 lists the signal
names of the front panel header. Figure 12 is a connection diagram for the front panel
header.
Table 17. Front Panel Header
In/ In/
Pin Signal Out Description Pin Signal Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED 2 HDR_BLNK_GRN Out Front panel green
pull-up to +5 V LED
3 HDA# Out Hard disk active 4 HDR_BLNK_YEL Out Front panel yellow
LED LED
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
Figure 12. Connection Diagram for Front Panel Header
2.2.2.4.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires a SATA hard
drive or optical drive connected to an onboard SATA connector.
50
Technical Reference
2.2.2.4.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.4.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 18 shows the
possible states for a one-color LED. Table 19 shows the possible states for a two-color
LED.
Table 18. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Table 19. States for a Two-Color Power LED
LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 18 and Table 19 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.4.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
51
Intel Desktop Board DP55KG Technical Product Specification
2.2.2.5 Front Panel USB Headers
Figure 13 is a connection diagram for the front panel USB headers.
NOTE
• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 13. Connection Diagram for Front Panel USB Headers
2.2.2.6 Front Panel IEEE 1394a Header
Figure 14 is a connection diagram for the IEEE 1394a header.
NOTE
• The +12 V DC power on the IEEE 1394a header is fused.
• The IEEE 1394a header provides one IEEE 1394a port.
Figure 14. Connection Diagram for IEEE 1394a Header
52
Technical Reference
2.3 Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 15 shows the location of the jumper block. The 3-pin jumper block determines
the BIOS Setup program’s mode. Table 20 describes the jumper settings for the three
modes: normal, configure, and recovery. When the jumper is set to configure mode
and the computer is powered-up, the BIOS compares the processor version and the
microcode version in the BIOS and reports if the two match.
Figure 15. Location of the Jumper Block
53
Intel Desktop Board DP55KG Technical Product Specification
Table 20. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal 1-2 The BIOS uses current configuration information and
passwords for booting.
Configure 2-3 After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Note that this Configure mode is the only way to clear the
BIOS/CMOS settings. Press F9 (restore defaults) while in
Configure mode to restore the BIOS/CMOS settings to their
default values.
Recovery None The BIOS attempts to recover the BIOS configuration. A
recovery CD or flash drive is required.
54
Technical Reference
2.4 Mechanical Considerations
2.4.1 Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters].
The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by
243.84 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.
Figure 16. Board Dimensions
55
Intel Desktop Board DP55KG Technical Product Specification
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 95 W processor (see Section 1.4
on page 14 for a list of supported processors), 2 GB DDR3 RAM, one high end video
card, one hard disk drive, one optical drive, and all board peripherals enabled, the
minimum recommended power supply is 460 W. Table 21 lists the recommended
power supply current values.
Table 21. Recommended Power Supply Current Values
Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB
Current 22 A 20 A 16 A 16 A 0.3 A 1.5 A
For information about Refer to
Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb
/CS-026472.htm
56
Technical Reference
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 22 lists the current capability of the fan headers.
Table 22. Fan Header Current Capability
Fan Header Maximum Available Current
Processor fan 1.5 A
Front chassis fan 1.0 A
Rear chassis fan 1.0 A
Auxiliary chassis fan 1.5 A
2.5.3 Add-in Board Considerations
The board is designed to provide 2 A (average) of current for each add-in board from
the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board
(all six expansion slots filled) must not exceed the system’s power supply +5 V
maximum current or 14 A in total.
57
Intel Desktop Board DP55KG Technical Product Specification
2.6 Thermal Considerations
CAUTION
o
A chassis with a maximum internal ambient temperature of 38 C at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
o
voltage regulator area (shown in Figure 17) can reach a temperature of up to 85 C in
an open chassis.
Figure 17 shows the locations of the localized high temperature zones.
58
Technical Reference
Item Description
A Processor voltage regulator area
B Processor
C Intel P55 Express Chipset
Figure 17. Localized High Temperature Zones
Table 23 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 23. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
o
Intel P55 Express Chipset 111 C (under bias)
For information about Refer to
Processor datasheets and specification updates Section 1.3, page 14
59
Intel Desktop Board DP55KG Technical Product Specification
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is
93,854.50112 hours.
2.8 Environmental
Table 24 lists the environmental specifications for the board.
Table 24. Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40 °C to +70 °C
Operating 0 °C to +55 °C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
60
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as KGIBX10J.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the
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