Intel® Desktop Board DG33FB Technical Product Specification May 2007 Order Number: D88105-001US ® The Intel Desktop Board DG33FB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG33FB Specification Update. Revision History Revision Revision History Date ® -001 First release of the Intel Desktop Board DG33FB Technical Product May 2007 Specification ® This product specification applies to only the standard Intel Desktop Board DG33FB with BIOS identifier DPP3510A.86A. Changes to this specification will be published in the Intel Desktop Board DG33FB Specification Update before being incorporated into a revision of this document. ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. 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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. ® Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, the Intel logo, Pentium, Core, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. Copyright © 2007, Intel Corporation. All rights reserved. Preface This Technical Product Specification (TPS) specifies the board layout, components, ® connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DG33FB. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DG33FB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter Description 1 A description of the hardware used on the board 2 A map of the resources of the board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information Typographical Conventions This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type. Notes, Cautions, and Warnings NOTE � Notes call attention to important information. INTEGRATOR’S NOTES # Integrator’s notes are used to call attention to information that may be useful to system integrators. CAUTION Cautions are included to help you avoid damaging hardware or losing data. iii Intel Desktop Board DG33FB Technical Product Specification Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1, 073,741,824 bits) KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their respective owners. iv Contents 1 Product Description 1.1 Overview........................................................................................ 10 1.1.1 Feature Summary ................................................................ 10 1.1.2 Board Layout....................................................................... 12 1.1.3 Block Diagram ..................................................................... 14 1.2 Legacy Considerations...................................................................... 15 1.3 Online Support................................................................................ 15 1.4 Processor ....................................................................................... 15 1.5 System Memory .............................................................................. 16 1.5.1 Memory Configurations ......................................................... 17 ® 1.6 Intel G33 Express Chipset............................................................... 19 1.6.1 Intel G33 Graphics Subsystem ............................................... 19 ® 1.6.2 Intel Viiv™ Processor Technology.......................................... 21 1.6.3 USB ................................................................................... 21 1.6.4 Serial ATA Interfaces ............................................................ 21 1.7 Parallel IDE Controller...................................................................... 22 1.8 Real-Time Clock Subsystem .............................................................. 22 1.9 Legacy I/O Controller....................................................................... 23 1.9.1 Serial Port Interface.............................................................. 23 1.9.2 Parallel Port Interface ........................................................... 23 1.9.3 Diskette Drive Interface ........................................................ 23 1.9.4 PS/2 Keyboard and Mouse Interface........................................ 23 1.10 Audio Subsystem............................................................................. 24 1.10.1 Audio Subsystem Software .................................................... 24 1.10.2 Audio Connectors and Headers............................................... 25 1.11 LAN Subsystem............................................................................... 26 ® 1.11.1 Intel 82566DC Gigabit Ethernet Controller.............................. 26 1.11.2 LAN Subsystem Software....................................................... 27 1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27 1.12 Hardware Management Subsystem .................................................... 28 1.12.1 Hardware Monitoring and Fan Control...................................... 28 1.12.2 Fan Monitoring..................................................................... 28 1.12.3 Chassis Intrusion and Detection.............................................. 28 1.12.4 Thermal Monitoring .............................................................. 29 1.13 Power Management ......................................................................... 30 1.13.1 ACPI .................................................................................. 30 1.13.2 Hardware Support ................................................................ 33 v Intel Desktop Board DG33FB Technical Product Specification 2 Technical Reference 2.1 Memory Map................................................................................... 37 2.1.1 Addressable Memory............................................................. 37 2.2 Connectors and Headers................................................................... 40 2.2.1 Back Panel Connectors.......................................................... 41 2.2.2 Component-side Connectors and Headers ................................ 42 2.3 Jumper Block.................................................................................. 50 2.4 Mechanical Considerations ................................................................ 51 2.4.1 Form Factor......................................................................... 51 2.5 Electrical Considerations................................................................... 52 2.5.1 Power Supply Considerations ................................................. 52 2.5.2 Fan Header Current Capability................................................ 53 2.5.3 Add-in Board Considerations .................................................. 53 2.6 Thermal Considerations.................................................................... 54 2.7 Reliability ....................................................................................... 56 2.8 Environmental ................................................................................ 57 3 Overview of BIOS Features 3.1 Introduction ................................................................................... 59 3.2 BIOS Flash Memory Organization....................................................... 60 3.3 Resource Configuration .................................................................... 60 3.3.1 PCI* Autoconfiguration.......................................................... 60 3.3.2 PCI IDE Support................................................................... 61 3.4 System Management BIOS (SMBIOS)................................................. 61 3.5 Legacy USB Support ........................................................................ 62 3.6 BIOS Updates ................................................................................. 63 3.6.1 Language Support ................................................................ 63 3.6.2 Custom Splash Screen .......................................................... 64 3.7 BIOS Recovery................................................................................ 64 3.8 Boot Options................................................................................... 65 3.8.1 CD-ROM Boot ...................................................................... 65 3.8.2 Network Boot....................................................................... 65 3.8.3 Booting Without Attached Devices........................................... 65 3.8.4 Changing the Default Boot Device During POST ........................ 65 3.9 Adjusting Boot Speed....................................................................... 66 3.9.1 Peripheral Selection and Configuration..................................... 66 3.9.2 BIOS Boot Optimizations ....................................................... 66 3.10 BIOS Security Features .................................................................... 67 4 Error Messages and Beep Codes 4.1 Speaker ......................................................................................... 69 4.2 BIOS Beep Codes ............................................................................ 69 4.3 BIOS Error Messages ....................................................................... 69 4.4 Port 80h POST Codes ....................................................................... 70 vi Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance..................................................................... 75 5.1.1 Safety Standards.................................................................. 75 5.1.2 European Union Declaration of Conformity Statement................ 76 5.1.3 Product Ecology Statements................................................... 78 5.1.4 EMC Regulations .................................................................. 82 5.1.5 Product Certification Markings (Board Level)............................. 84 5.2 Battery Disposal Information............................................................. 85 Figures 1. Major Board Components.................................................................. 12 2. Block Diagram................................................................................ 14 3. Memory Channel Configuration and DIMM Configuration........................ 18 4. Back Panel Audio Connector Options .................................................. 25 5. LAN Connector LED Locations............................................................ 27 6. Thermal Sensors and Fan Headers ..................................................... 29 7. Location of the Standby Power Indicator LED....................................... 36 8. Detailed System Memory Address Map ............................................... 38 9. Back Panel Connectors ..................................................................... 41 10. Component-side Connectors and Headers ........................................... 42 11. Connection Diagram for Front Panel Header ........................................ 47 12. Connection Diagram for Front Panel USB Headers ................................ 49 13. Location of the Jumper Block............................................................. 50 14. Board Dimensions........................................................................... 51 15. Localized High Temperature Zones..................................................... 55 Tables 1. Feature Summary............................................................................ 10 2. Board Components Shown in Figure 1 ................................................ 13 3. Supported Memory Configurations ..................................................... 16 4. Audio Jack Support.......................................................................... 24 5. LAN Connector LED States................................................................ 27 6. Effects of Pressing the Power Switch .................................................. 30 7. Power States and Targeted System Power........................................... 31 8. Wake-up Devices and Events ............................................................ 32 9. System Memory Map ....................................................................... 39 10. Component-side Connectors and Headers Shown in Figure 10................ 43 11. Serial ATA Connectors...................................................................... 44 12. Chassis Intrusion Header.................................................................. 44 13. Serial Port Header ........................................................................... 44 14. Front and Rear Chassis Fan Headers .................................................. 44 15. Processor Fan Header ...................................................................... 44 16. Front Panel Audio Header ................................................................. 45 17. Auxiliary Front Panel Power/Sleep LED Header..................................... 45 18. Processor Core Power Connector........................................................ 46 vii Intel Desktop Board DG33FB Technical Product Specification 19. Main Power Connector...................................................................... 46 20. Front Panel Header .......................................................................... 47 21. States for a One-Color Power LED...................................................... 48 22. States for a Two-Color Power LED...................................................... 48 23. Auxiliary Front Panel Power LED Header.............................................. 48 24. BIOS Setup Configuration Jumper Settings.......................................... 50 25. Recommended Power Supply Current Values ....................................... 52 26. Fan Header Current Capability........................................................... 53 27. Thermal Considerations for Components ............................................. 56 28. Desktop Board DG33FB Environmental Specifications............................ 57 29. BIOS Setup Program Menu Bar.......................................................... 60 30. BIOS Setup Program Function Keys.................................................... 60 31. Acceptable Drives/Media Types for BIOS Recovery ............................... 64 32. Boot Device Menu Options ................................................................ 65 33. Supervisor and User Password Functions............................................. 67 34. Beep Codes .................................................................................... 69 35. BIOS Error Messages ....................................................................... 69 36. Port 80h POST Code Ranges.............................................................. 70 37. Port 80h POST Codes ....................................................................... 71 38. Typical Port 80h POST Sequence........................................................ 74 39. Safety Standards............................................................................. 75 40. Lead-Free Board Markings ................................................................ 81 41. EMC Regulations ............................................................................. 82 42. Product Certification Markings ........................................................... 84 viii 1 Product Description What This Chapter Contains 1.1 Overview........................................................................................ 10 1.2 Legacy Considerations...................................................................... 15 1.3 Online Support................................................................................ 15 1.4 Processor ....................................................................................... 15 1.5 System Memory .............................................................................. 16 ® 1.6 Intel G33 Express Chipset............................................................... 19 1.7 Parallel IDE Controller...................................................................... 22 1.8 Real-Time Clock Subsystem .............................................................. 22 1.9 Legacy I/O Controller....................................................................... 23 1.10 Audio Subsystem............................................................................. 24 1.11 LAN Subsystem............................................................................... 26 1.12 Hardware Management Subsystem .................................................... 28 1.13 Power Management ......................................................................... 30 9 Intel Desktop Board DG33FB Technical Product Specification 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the Desktop Board DG33FB. Table 1. Feature Summary Form Factor ATX (11.60 inches by 9.60 inches [294.64 millimeters by 243.84 millimeters]) Processor Support for the following: ® • Intel Core™2 Quad processor in an LGA775 socket with a 1066 MHz system bus ® • Intel Core™2 Duo processor in an LGA775 socket with a 1333 or 1066 or 800 MHz system bus ® ® • Intel Pentium Dual-Core processor in an LGA775 socket with an 800 MHz system bus ® ® • Intel Celeron processor in an LGA775 socket with an 800 MHz system bus • Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets Memory • Support for DDR2 667 or DDR2 800 MHz DIMMs • Support for up to 8 GB of system memory ® Chipset Intel G33 Express Chipset, consisting of: ® • Intel 82G33 Graphics and Memory Controller Hub (GMCH) ® • Intel 82801IH I/O Controller Hub (ICH9DH) ® ® Video Intel Graphics Media Accelerator (Intel GMA) 3100 onboard graphics subsystem Audio 6-channel (5.1) audio subsystem using the Realtek* ALC888 audio codec Legacy I/O Control Legacy I/O controller for diskette drive, serial, and PS/2* ports • 12 USB 2.0 ports Peripheral Interfaces • Four Serial ATA interfaces • One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support • One diskette drive interface • One IEEE 1394a port • PS/2 keyboard and mouse ports • One serial port header (may require specialized chassis or cable for use) ® LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82566DC Gigabit Ethernet Controller ® • Intel BIOS (resident in the SPI Flash device) BIOS • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS • Support for PCI* Local Bus Specification Revision 2.3 Instantly Available PC Technology • Support for PCI Express* Revision 1.1 • Suspend to RAM support • Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports continued 10 Product Description Table 1. Feature Summary (continued) • Three PCI Conventional bus connectors Expansion Capabilities • Three PCI Express x1 bus add-in card connector • One PCI Express x16 bus add-in card connector ® ® • Intel Quiet System Technology implemented through the Intel Management Hardware Monitor Engine in ICH9DH Subsystem • Voltage sense to detect out of range power supply voltages • Thermal sense to detect out of range thermal values • Four fan headers • Three fan sense inputs used to monitor fan activity For information about Refer to Available configurations for the Desktop Board DG33FB Section 1.2, page 15 11 Intel Desktop Board DG33FB Technical Product Specification 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1. 12 Product Description Table 2. Board Components Shown in Figure 1 Item/callout from Figure 1 Description A PCI Conventional bus add-in card connector B Auxiliary rear chassis fan header C PCI Express x1 connector D PCI Express x1 connector E PCI Conventional bus add-in card connector F Front panel audio header G PCI Conventional bus add-in card connector H PCI Express x1 connector I Speaker J PCI Express x16 connector K Back panel connectors L Processor core power connector (2 X 2) M Rear chassis fan header N LGA775 processor socket O Intel 82G33 GMCH P Processor fan header Q DIMM Channel A sockets R Serial port header S DIMM Channel B sockets T Main Power connector (2 X 12) U Diskette drive connector V Chassis intrusion header W Battery X Front chassis fan header Y BIOS Setup configuration jumper block Z Auxiliary front panel power LED header AA Front panel header BB Serial ATA connectors [4] CC Parallel ATA IDE connector DD Front panel USB headers [3] EE Intel 82801IH I/O Controller Hub (ICH9DH) FF IEEE 1394a header 13 Intel Desktop Board DG33FB Technical Product Specification 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2. Block Diagram 14 Product Description 1.2 Legacy Considerations ® This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following: • No parallel port • The location of the floppy drive connector has moved • No serial port on the back panel • The serial port header is located between the memory sockets and may require a specialized chassis or cabling solution to use 1.3 Online Support To find information about… Visit this World Wide Web site: Intel Desktop Board DG33FB http://www.intel.com/products/motherboard/DG33FB/index.htm Desktop Board Support http://support.intel.com/support/motherboards/desktop Available configurations for the http://www.intel.com/products/motherboard/DG33FB/index.htm Desktop Board DG33FB Supported processors http://www.intel.com/go/findcpu Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS- 025414.htm 1.4 Processor The board is designed to support the following processors: • Intel Core 2 Quad processor in an LGA775 socket with a 1066 MHz system bus • Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus • Intel Pentium Dual-Core processor in an LGA775 socket with an 800 MHz system bus • Intel Celeron processor in an LGA775 socket with an 800 MHz system bus Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 95 W. The processors listed above are only supported when falling within the wattage requirements of the DG33FB board. See the Intel web site listed below for the most up-to-date list of supported processors. For information about… Refer to: Supported processors http://www.intel.com/go/findcpu CAUTION INTEGRATOR’S NOTE # Use only ATX12V-compliant power supplies. For information about Refer to Power supply connectors Section 2.2.2.4, page 46 15 Intel Desktop Board DG33FB Technical Product Specification 1.5 System Memory The board has four DIMM sockets and supports the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported. • 8 GB maximum total system memory. Refer to Section 2.1.1 on page 37 for information on the total amount of addressable memory. • Minimum total system memory: 512 MB • Non-ECC DIMMs • Serial Presence Detect • DDR2 667 or DDR2 800 MHz SDRAM DIMMs • DDR2 667 DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP) • DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP) � NOTE To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This enables the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency. Table 3 lists the supported DIMM configurations. Table 3. Supported Memory Configurations Smallest usable Largest usable Maximum capacity DIMM (one x16 DIMM (one x8 with four identical DIMM SDRAM Single-sided Double-sided x8 Double-sided Type Technology DIMM) DIMM) DIMMs DDR2 667 512 Mbit 256 MB 1 GB 4 GB DDR2 667 1 Gbit 512 MB 2 GB 8 GB DDR2 800 512 Mbit 256 MB 1 GB 4 GB DDR2 800 1 Gbit 512 MB 2 GB 8 GB For information about… Refer to: Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS- 025414.htm 16 Product Description 1.5.1 Memory Configurations The Intel 82G33 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used. • Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used. • Flex mode. This mode provides the most flexible performance characteristics. The bottommost DRAM memory (the memory that is lowest within the system memory map) is mapped to dual channel operation; the topmost DRAM memory (the memory that is nearest to the 8 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels. For information about… Refer to: Memory Configuration Examples http://support.intel.com/support/motherboards/desktop/sb/CS- 025414.htm 17 Intel Desktop Board DG33FB Technical Product Specification Figure 3 illustrates the memory channel and DIMM configuration. NOTE � The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels are black. Figure 3. Memory Channel Configuration and DIMM Configuration INTEGRATOR’S NOTE # Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the Intel Management Engine in ICH9DH. 18 Product Description ® 1.6 Intel G33 Express Chipset The Intel G33 Express chipset consists of the following devices: • Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801IH I/O Controller Hub (ICH9DH) with DMI interconnect The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D, and display capabilities. The ICH9DH is a centralized controller for the board’s I/O paths. The chipset supports the following features: • Onboard Graphics • Dynamic Video Memory Technology • USB • Serial ATA • Parallel IDE For information about Refer to The Intel G33 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2 1.6.1 Intel G33 Graphics Subsystem The Intel G33 Express chipset contains two separate, mutually exclusive graphics options. Either the Intel Graphics Media Accelerator 3100 (Intel GMA 3100) graphics controller (contained within the 82G33 GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express x16 add-in card is installed, the Intel GMA 3100 graphics controller is disabled. ® 1.6.1.1 Intel Graphics Media Accelerator 3100 Graphics Controller The Intel GMA 3100 graphics controller features the following: • 400 MHz core frequency • High quality texture engine ⎯ DX9.0c* and OpenGL* 1.4 compliant ⎯ Hardware Pixel Shader 2.0 ⎯ Vertex Shader Model 2.0 • 3D Graphics Rendering enhancements ⎯ 1.6 dual texture GigaPixel/sec max fill rate ⎯ 16-bit and 32-bit color ⎯ Vertex cache • Video ⎯ Software DVD at 30 fps full screen ⎯ DVMT support up to 256 MB 19 Intel Desktop Board DG33FB Technical Product Specification • Display ⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA) ⎯ Dual independent display support ⎯ DDC2B compliant interface with Advanced Digital Display 2 card or Media Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display connections 1.6.1.2 Dynamic Video Memory Technology (DVMT) DVMT enables enhanced graphics and memory performance through highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be allocated to DVMT on systems that have 512 MB or more of total system memory installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem. DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions. NOTE � The use of DVMT requires operating system driver support. 1.6.1.3 Configuration Modes The video modes supported by this board are based on the Extended Display Identification Data (EDID) modes of the monitor to which the system is connected. Standard monitors are assumed. 1.6.1.4 Advanced Digital Display (ADD2/MEC) Card Support The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a 225 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC card is detected, the Intel GMA 3100 graphics controller is enabled and the PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be accessed by the ADD2/MEC card. An ADD2/MEC card can either be configured to support simultaneous display with the primary VGA display or can be configured to support dual independent display as an extended desktop configuration with different color depths and resolutions. ADD2/MEC cards can be designed to support the following configurations: • Low Voltage Differential Signaling (LVDS) • Single device operating in dual channel mode • HDTV output • HDMI support (when used with the HD Audio Link) 20 Product Description ® 1.6.2 Intel Viiv™ Processor Technology ® This Intel desktop board supports Intel Viiv™ processor technology. To be eligible for the Intel Viiv processor technology brand, a system must meet certain hardware and software requirements. To get the list of requirements for Intel Viiv processor technology branding as well as all the features supported by Intel Viiv processor technology, refer to: http://www.intel.com/products/viiv/index.htm 1.6.3 USB The board supports up to 12 USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. The ICH9DH provides the USB controller for all ports. The port arrangement is as follows: • Six ports are implemented with stacked back panel connectors • Six ports are routed to three separate front panel USB headers For information about Refer to The location of the USB connectors on the back panel Figure 9, page 41 The location of the front panel USB headers Figure 10, page 42 1.6.4 Serial ATA Interfaces The board provides four Serial ATA (SATA) connectors, which support one device per connector. 1.6.4.1 Serial ATA Support The DG33FB Desktop Board’s Serial ATA controller offers four independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of four Serial ATA devices. A point-to- point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel. For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP operating system. NOTE � Many Serial ATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors. For more information, see: http://www.serialata.org/ For information about Refer to The location of the Serial ATA connectors Figure 10, page 42 21 Intel Desktop Board DG33FB Technical Product Specification 1.7 Parallel IDE Controller The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • Programmed I/O (PIO): processor controls data transfer. • 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. • Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec. • ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible. • ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec. • ATA-133: DMA protocol on IDE bus allows host and target throttling. The ATA-133 logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer rates in excess of 100 MB/sec. � NOTE ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling. The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS. For information about Refer to The location of the Parallel ATA IDE connector Figure 10, page 42 1.8 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied. � NOTE If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 12 shows the location of the battery. 22 Product Description 1.9 Legacy I/O Controller The I/O controller provides the following features: • One serial port header • One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support • Serial IRQ interface compatible with serialized IRQ support for PCI systems • PS/2-style mouse and keyboard interfaces • Interface for one 1.44 MB or 2.88 MB diskette drive • Intelligent power management, including a programmable wake-up event interface • PCI power management support The BIOS Setup program provides configuration options for the I/O controller. 1.9.1 Serial Port Interface The serial port header is located on the component side of the board. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support. For information about Refer to The location of the serial port header Figure 10, page 42 The serial port header signal mapping Table 11, page 44 1.9.2 Parallel Port Interface The parallel port connector is located on the back panel of the board. Use the BIOS Setup program to set the parallel port mode. For information about Refer to The location of the parallel port connector Figure 9, page 41 1.9.3 Diskette Drive Interface The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface. For information about Refer to The location of the diskette drive connector Figure 10, page 42 1.9.4 PS/2 Keyboard and Mouse Interface The PS/2 keyboard and mouse connectors are located on the back panel. NOTE � The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected. For information about Refer to The location of the keyboard and mouse connectors Figure 9, page 41 23 Intel Desktop Board DG33FB Technical Product Specification 1.10 Audio Subsystem The onboard audio subsystem consists of the following: • Intel 82801IH (ICH9DH) • Realtek ALC888 audio codec • Back panel audio connectors • Component-side audio headers: ® ⎯ Intel High Definition Audio front panel header ⎯ HD audio link header The audio subsystem supports the following features: • A signal-to-noise (S/N) ratio of 95 dB • Independent 5.1 audio playback from back panel connectors and stereo playback from the Intel High Definition Audio front panel header. NOTE � Systems built with AC 97 front panel will not be able to obtain the Microsoft Windows Vista* logo after June 2007. Table 4 lists the supported functions of the front panel and back panel audio jacks. Table 4. Audio Jack Support Supports Supports Supports Supports Audio Jack Line in? Line out? Microphone? Headphones? Front panel – Green No Yes No Yes Front panel – Pink No No Yes No Back panel – Blue Yes Yes No No Back panel – Green No Yes No Yes Back panel – Pink No Yes Yes No 1.10.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 15 24 Product Description 1.10.2 Audio Connectors and Headers The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors. The front/back panel audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 4. Item Description A Line in B Line out C Mic in Figure 4. Back Panel Audio Connector Options NOTE � The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. For information about Refer to The location of the front panel audio header Figure 10, page 42 The signal names of the front panel audio header Table 16, page 45 The back panel audio connectors Section 2.2.1, page 41 25 Intel Desktop Board DG33FB Technical Product Specification 1.11 LAN Subsystem The LAN subsystem consists of the following: • Intel 82566DC Gigabit Ethernet Controller (10/100/1000 Mbits/sec) • Intel 82801IH (ICH9DH) • RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include: • CSMA/CD protocol engine • LAN connect interface between ICH9DH and the LAN controller • PCI Conventional bus power management ⎯ ACPI technology support ⎯ LAN wake capabilities • LAN subsystem software For information about Refer to LAN software and drivers http://downloadcenter.intel.com ® 1.11.1 Intel 82566DC Gigabit Ethernet Controller The Intel 82566DC Gigabit Ethernet Controller supports the following features: • PCI Express link • 10/100/1000 IEEE 802.3 compliant • Compliant to IEEE 802.3x flow control support • 802.1p and 802.1q • TCP, IP, UDP checksum offload (for IPv4 and IPv6) • Full device driver compatibility • PCI Express power management support 26 Product Description 1.11.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 15 1.11.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below). Item Description A Link LED (Green) B Data Rate LED (Green/Yellow) Figure 5. LAN Connector LED Locations Table 5 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 5. LAN Connector LED States LED LED Color LED State Condition Off LAN link is not established. Link Green On LAN link is established. Blinking LAN activity is occurring. Off 10 Mbits/sec data rate is selected. Data Rate Green/Yellow Green 100 Mbits/sec data rate is selected. Yellow 1000 Mbits/sec data rate is selected. 27 Intel Desktop Board DG33FB Technical Product Specification 1.12 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • Fan monitoring and control • Thermal and voltage monitoring • Chassis intrusion detection 1.12.1 Hardware Monitoring and Fan Control The features of the hardware monitoring and fan control include: • Intel Quiet System Technology, delivering acoustically-optimized thermal management • Fan speed control controllers and sensors integrated into the ICH9DH • Four thermal sensors (processor, 82G33 GMCH, 82801IH ICH9DH, and a remote thermal sensor) • Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.25 V, and +VCCP) to detect levels above or below acceptable values • Thermally monitored closed-loop fan control, for all four fans, that can adjust the fan speed or switch the fans on or off as needed 1.12.2 Fan Monitoring ® Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.13.2.2, page 34 Location of the fan headers Figure 6, page 29 1.12.3 Chassis Intrusion and Detection The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position. For information about Refer to The location of the chassis intrusion header Figure 10, page 42 28 Product Description 1.12.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description A Auxiliary rear chassis fan B Rear chassis fan C Thermal diode, located on processor die D Thermal diode, located on the GMCH die E Processor fan F Front chassis fan G Thermal diode, located on the ICH9DH die Figure 6. Thermal Sensors and Fan Headers NOTE � The minimum thermal reporting threshold for the GMCH is 66°C. The GMCH thermal sensor will display 66°C until the temperature rises above this point. 29 Intel Desktop Board DG33FB Technical Product Specification 1.13 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB ⎯ Wake from PS/2 devices ⎯ Power Management Event signal (PME#) wake-up support 1.13.1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the board requires an operating system that provides full ACPI support. ACPI features include: • Plug and Play (including bus and device enumeration) • Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives • Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state • A Soft-off feature that enables the operating system to power-off the computer • Support for multiple wake-up events (see Table 8 on page 32) • Support for a front panel power and sleep mode switch Table 6 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 6. Effects of Pressing the Power Switch If the system is in this …and the power switch state… is pressed for …the system enters this state Off Less than four seconds Power-on (ACPI G2/G5 – Soft off) (ACPI G0 – working state) On Less than four seconds Soft-off/Standby (ACPI G0 – working state) (ACPI G1 – sleeping state) On More than four seconds Fail safe power-off (ACPI G0 – working state) (ACPI G2/G5 – Soft off) Sleep Less than four seconds Wake-up (ACPI G1 – sleeping state) (ACPI G0 – working state) Sleep More than four seconds Power-off (ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off) 30 Product Description 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 7 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 7. Power States and Targeted System Power Global Processor Targeted System (Note 1) States Sleeping States States Device States Power G0 – working S0 – working C0 – working D0 – working Full power > 30 W state state. G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 52.5 W state stopped grant device specification specific. (Note 2) G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W state RAM. Context except for saved to RAM. wake-up logic. (Note 2) G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W state disk. Context except for saved to disk. wake-up logic. (Note 2) G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W Context not saved. except for Cold boot is wake-up logic. required. G3 – No power to the No power D3 – no power for No power to the system. mechanical off. system. wake-up logic, Service can be performed AC power is except when safely. disconnected provided by from the battery or computer. external source. Notes: 1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply. 2. Dependent on the standby power consumption of wake-up devices used in the system. 31 Intel Desktop Board DG33FB Technical Product Specification 1.13.1.2 ENERGY STAR* In 2007, the US Department of Energy and the US Environmental Protection Agency revised the ENERGY STAR* requirements. Intel has worked directly with these two governmental agencies to define the new requirements. Currently Intel Desktop Boards meet the new requirements. For information about Refer to ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar 1.13.1.3 Wake-up Devices and Events Table 8 lists the devices or specific events that can wake the computer from specific states. Table 8. Wake-up Devices and Events These devices/events can wake up the computer… …from this state (Note) LAN S1, S3, S4, S5 (Note) PME# signal S1, S3, S4, S5 Power switch S1, S3, S4, S5 PS/2 devices S1, S3 RTC alarm S3, S4, S5 Serial port S3 USB S3 WAKE# signal S1, S3, S4, S5 Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On will enable a wake-up event from LAN in the S5 state. NOTE � The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events. 32 Product Description 1.13.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The board provides several power management hardware features, including: • Power connector • Fan headers • LAN wake capabilities • Instantly Available PC technology • Wake from USB • Wake from PS/2 keyboard • PME# signal wake-up support • WAKE# signal wake-up support LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. NOTE � The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support. 1.13.2.1 Power Connector ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. For information about Refer to The location of the main power connector Figure 10, page 42 The signal names of the main power connector Table 19, page 46 33 Intel Desktop Board DG33FB Technical Product Specification 1.13.2.2 Fan Headers The function/operation of the fan headers is as follows: • The fans are on when the board is in the S0 state. • The fans are off when the board is off or in the S3, S4, or S5 state. • The processor and Auxiliary fan headers are wired to a fan tachometer input and the Front and Rear fan headers share the tachometer input of the hardware monitoring and fan control device. All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed. • All fan headers have a +12 V DC connection. For information about Refer to The locations of the fan headers and thermal sensors Figure 6, page 29 The signal names of the processor fan header Table 15, page 44 The signal names of the chassis fan headers Table 14, page 44 1.13.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in the following ways: • The PCI Express WAKE# signal • The PCI bus PME# signal for PCI 2.3 compliant LAN designs • The onboard LAN subsystem 34 Product Description 1.13.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to- RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 8 on page 32 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.3 compliant add-in cards and drivers. 1.13.2.5 Wake from USB USB bus activity wakes the computer from ACPI S3 state. NOTE � Wake from USB requires the use of a USB peripheral that supports Wake from USB. 1.13.2.6 Wake from PS/2 Devices PS/2 device activity wakes the computer from an ACPI S3 state. 1.13.2.7 PME# Signal Wake-up Support When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state (with Wake on PME enabled in BIOS). 1.13.2.8 WAKE# Signal Wake-up Support When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state. 35 Intel Desktop Board DG33FB Technical Product Specification 1.13.2.9 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. Figure 7. Location of the Standby Power Indicator LED 36 2 Technical Reference What This Chapter Contains 2.1 Memory Map................................................................................... 37 2.2 Connectors and Headers................................................................... 40 2.3 Jumper Block.................................................................................. 50 2.4 Mechanical Considerations ................................................................ 51 2.5 Electrical Considerations................................................................... 52 2.6 Thermal Considerations.................................................................... 54 2.7 Reliability ....................................................................................... 56 2.8 Environmental ................................................................................ 57 2.1 Memory Map 2.1.1 Addressable Memory The board utilizes 8 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 8 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: • BIOS/ SPI Flash (8 Mbits) • Local APIC (19 MB) • Digital Media Interface (40 MB) • Front side bus interrupts (17 MB) • PCI Express configuration space (256 MB) • GMCH base address registers, internal graphics ranges, PCI Express ports (up to 512 MB) • Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express add-in cards • Intel Management Engine support (6 MB) • Base graphics memory support (1 MB or 8 MB) 37 Intel Desktop Board DG33FB Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses. 8 GB Top of System Address Space Upper 4 GB of address space FLASH APIC ~20 MB Reserved PCI Memory Range - contains PCI, chipsets, 1 MB Direct Media Interface 0FFFFFH (DMI), and ICH ranges Upper BIOS (approximately 750 MB) area (64 KB) 0F0000H 960 KB 0EFFFFH Lower BIOS area Top of usable (64 KB; DRAM (memory 16 KB x 4) visible to the 0E0000H operating system) 896 KB 0DFFFFH Add-in Card BIOS and Buffer area (128 KB; 16 KB x 8) 0C0000H DRAM 768 KB 0BFFFFH Range Standard PCI/ ISA Video Memory (SMM 1 MB Memory) 128 KB 640 KB 0A0000H DOS 640 KB 09FFFFH Compatibility DOS area Memory (640 KB) 00000H 0 MB 0 KB OM18311 Figure 8. Detailed System Memory Address Map 38 Technical Reference Table 9 lists the system memory map. Table 9. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI bus). Dependent on video adapter used. 640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by memory manager software) 512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory 0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory 39 Intel Desktop Board DG33FB Technical Product Specification 2.2 Connectors and Headers CAUTION Only the following connectors and headers have overcurrent protection: Back panel and front panel USB, PS/2, and VGA. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors/headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. NOTE � Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices. This section describes the board’s connectors and headers. The connectors and headers can be divided into these groups: • Back panel I/O connectors (see page 41) • Component-side connectors and headers (see page 42) 40 Technical Reference 2.2.1 Back Panel Connectors Figure 9 shows the locations of the back panel connectors. Item Description A PS/2 mouse port B PS/2 keyboard port C VGA port D IEEE 1394a port E USB ports [2] F USB ports [2] G LAN H USB ports [2] I Line in J Mic in K Line out Figure 9. Back Panel Connectors 41 Intel Desktop Board DG33FB Technical Product Specification 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers 42 Technical Reference Table 10 lists the component-side connectors and headers identified in Figure 10. Table 10. Component-side Connectors and Headers Shown in Figure 10 Item/callout from Figure 10 Description A PCI Conventional bus add-in card connector B Auxiliary rear chassis fan header C PCI Express x1 connector D PCI Express x1 connector E PCI Conventional bus add-in card connector F Front panel audio header G PCI Conventional bus add-in card connector H PCI Express x1 connector I PCI Express x16 connector J Processor core power connector (2 X 2) K Rear chassis fan header L Processor fan header M Serial port header N Main power connector (2 X 12) O Diskette drive connector P Chassis intrusion header Q Front chassis fan header R Auxiliary front panel power LED header S Front panel header T Serial ATA connectors [4] U Parallel ATA IDE connector V Front panel USB header W Front panel USB header X Front panel USB header Y IEEE 1394a header 43 Intel Desktop Board DG33FB Technical Product Specification 2.2.2.1 Signal Tables for the Connectors and Headers Table 11. Serial ATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 12. Chassis Intrusion Header Pin Signal Name 1 Intruder 2 Ground Table 13. Serial Port Header Pin Signal Name Pin Signal Name 1 DCD 2 RXD# 3 TXD# 4 DTR 5 Ground 6 DSR 7 RTS 8 CTS 9 RI 10 Key (no pin) Table 14. Front and Rear Chassis Fan Headers Pin Signal Name 1 Control 2 +12 V 3 Tach Table 15. Processor Fan Header Pin Signal Name 1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL 44 Technical Reference Table 16. Front Panel Audio Header Pin Signal Name Pin Signal Name 1 [Port 1] Left channel 2 Ground 3 [Port 1] Right channel 4 PRESENCE# (Dongle present) 5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN 7 SENSE_SEND (Jack detection) 8 Key (no pin) 9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • One PCI Express x16 connector supporting simultaneous transfer speeds up to 4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent bandwidth. • PCI Express x1: three PCI Express x1 connectors. The x1 interface supports simultaneous transfer speeds up to 250 Mbytes/sec of peak bandwidth per direction and up to 500 MBytes/sec concurrent bandwidth. • PCI Conventional (rev 2.3 compliant) bus: three PCI Conventional bus add-in card connectors. The SMBus is routed to all PCI Conventional bus connectors. PCI Conventional bus add-in cards with SMBus support can access sensor data and other information residing on the board. Note the following considerations for the PCI Conventional bus connectors: • All of the PCI Conventional bus connectors are bus master capable. • SMBus signals are routed to all PCI Conventional bus connectors. This enables PCI Conventional bus add-in boards with SMBus support to access sensor data on the board. The specific SMBus signals are as follows: ⎯ The SMBus clock line is connected to pin A40. ⎯ The SMBus data line is connected to pin A41. 2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. Table 17. Auxiliary Front Panel Power/Sleep LED Header Pin Signal Name In/Out Description 1 HDR_BLNK_GRN Out Front panel green LED 2 Not connected 3 HDR_BLNK_YEL Out Front panel yellow LED 45 Intel Desktop Board DG33FB Technical Product Specification 2.2.2.4 Power Supply Connectors The board has the following power supply connectors: • Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected. • Processor core power – a 2 x 2 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting. Table 18. Processor Core Power Connector Pin Signal Name Pin Signal Name 1 Ground 2 Ground 3 +12 V 4 +12 V Table 19. Main Power Connector Pin Signal Name Pin Signal Name 1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/off) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Good) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V (Note) (Note) 11 +12 V 23 +5 V (Note) (Note) 12 2 x 12 connector detect 24 Ground Note: When using a 2 x 10 power supply cable, this pin will be unconnected. For information about Refer to Power supply considerations Section 2.5.1, page 52 46 Technical Reference 2.2.2.5 Front Panel Header This section describes the functions of the front panel header. Table 20 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 20. Front Panel Header In/ In/ Pin Signal Out Description Pin Signal Out Description Hard Drive Activity LED Power LED 1 HD_PWR Out Hard disk LED pull-up 2 HDR_BLNK_ Out Front panel green to +5 V GRN LED 3 HDA# Out Hard disk active LED 4 HDR_BLNK_ Out Front panel yellow YEL LED Reset Switch On/Off Switch 5 Ground Ground 6 FPBUT_IN In Power switch 7 FP_RESET# In Reset switch 8 Ground Ground Power Not Connected 9 +5 V Power 10 N/C Not connected Figure 11. Connection Diagram for Front Panel Header 2.2.2.5.1 Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: • A Serial ATA hard drive connected to an onboard Serial ATA connector • A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector 47 Intel Desktop Board DG33FB Technical Product Specification 2.2.2.5.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.5.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED. Table 21 shows the possible states for a one-color LED. Table 22 shows the possible states for a two-color LED. Table 21. States for a One-Color Power LED LED State Description Off Power off/sleeping Steady Green Running Table 22. States for a Two-Color Power LED LED State Description Off Power off Steady Green Running Steady Yellow Sleeping � NOTE The colors listed in Table 21 and Table 22 are suggested colors only. Actual LED colors are chassis-specific. 2.2.2.5.4 Power Switch Header Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal. 2.2.2.6 Auxiliary Front Panel Power LED Header Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. Table 23. Auxiliary Front Panel Power LED Header Pin Signal Name In/Out Description 1 HDR_BLNK_GRN Out Front panel green LED 2 Not connected 3 HDR_BLNK_YEL Out Front panel yellow LED 48 Technical Reference 2.2.2.7 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES # • The +5 V DC power on the front panel USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 12. Connection Diagram for Front Panel USB Headers 49 Intel Desktop Board DG33FB Technical Product Specification 2.3 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 13 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode. Table 24 lists the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match. Figure 13. Location of the Jumper Block Table 24. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration The BIOS uses current configuration information and Normal 1-2 passwords for booting. 32 1 After the POST runs, Setup runs automatically. The Configure 2-3 maintenance menu is displayed. 32 1 The BIOS attempts to recover the BIOS configuration. See Recovery None Section 3.7 for more information on BIOS recovery. 32 1 50 Technical Reference 2.4 Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 14 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 11.60 inches by 9.60 inches [292 millimeters by 241 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. Figure 14. Board Dimensions 51 Intel Desktop Board DG33FB Technical Product Specification 2.5 Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor specification. • The potential relation between 3.3 VDC and +5 VDC power rails • The current capability of the +5 VSB line • All timing parameters • All voltage tolerances For example, for a system consisting of a supported 65 W processor (see Section 1.4 on page 15 for a list of supported processors), 1 GB DDR2 RAM, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is 300 W. Table 25 lists the recommended power supply current values. Table 25. Recommended Power Supply Current Values 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB Output Voltage 15 A 15 A 10 A 10 A 0.3 A 3.0 A Current For information about Refer to Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/s b/CS-026472.htm 52 Technical Reference 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 26 lists the current capability of the fan headers. Table 26. Fan Header Current Capability Fan Header Maximum Available Current Processor fan 2.0 A Front chassis fan 1.5 A Rear chassis fan 1.5 A Auxiliary fan 2.0 A 2.5.3 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for a fully loaded board (all six expansion slots and the PCI Express x16 connector filled) must not exceed 14 A. 53 Intel Desktop Board DG33FB Technical Product Specification 2.6 Thermal Considerations CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor o voltage regulator area (shown in Figure 15) can reach a temperature of up to 85 C in an open chassis. 54 Technical Reference Figure 15 shows the locations of the localized high temperature zones. Item Description A Processor voltage regulator area B Processor C Intel 82G33 GMCH D Intel 82801IH (ICH9DH) Figure 15. Localized High Temperature Zones 55 Intel Desktop Board DG33FB Technical Product Specification Table 27 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 27. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates o Intel 82G33 GMCH 97 C (under bias) o Intel 82801IH (ICH9DH) 92 C (under bias) For information about Refer to Processor datasheets and specification updates Section 1.2, page 15 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG33FB MTBF is 134,638 hours. 56 Technical Reference 2.8 Environmental Table 28 lists the environmental specifications for the board. Table 28. Desktop Board DG33FB Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +70 °C Operating 0 °C to +55 °C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second² Packaged Half sine 2 millisecond Product weight (pounds) Free fall (inches) Velocity change (inches/sec²) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz 20 Hz to 500 Hz: 0.02 g² Hz (flat) Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat) 40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz 57 Intel Desktop Board DG33FB Technical Product Specification 58 3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction ................................................................................... 59 3.2 BIOS Flash Memory Organization....................................................... 60 3.3 Resource Configuration .................................................................... 60 3.4 System Management BIOS (SMBIOS)................................................. 61 3.5 Legacy USB Support ........................................................................ 62 3.6 BIOS Updates ................................................................................. 63 3.7 BIOS Recovery................................................................................ 64 3.8 Boot Options................................................................................... 65 3.9 Adjusting Boot Speed....................................................................... 66 3.10 BIOS Security Features .................................................................... 67 3.1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as DPP3510A.86A. When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below. Maintenance Main Advanced Security Power Boot Exit NOTE � The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 50 shows how to put the board in configure mode. 59 Intel Desktop Board DG33FB Technical Product Specification Table 29 lists the BIOS Setup program menu features. Table 29. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Clears Displays Configures Sets Configures Selects boot Saves or passwords and processor advanced passwords power options discards displays and memory features and security management changes to processor configuration available features features and Setup information through the power supply program chipset controls options Table 30 lists the function keys available for menu screens. Table 30. BIOS Setup Program Function Keys BIOS Setup Program Function Key Description <←> or <→> Selects a different menu screen (Moves the cursor left or right) <↑> or <↓> Selects an item (Moves the cursor up or down) Selects a field (Not implemented) Executes command or selects the submenu Load the default configuration values for the current menu Save the current values and exits the BIOS Setup program Exits the menu 3.2 BIOS Flash Memory Organization The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 8 Mbit (1024 KB) flash memory device. 3.3 Resource Configuration 3.3.1 PCI* Autoconfiguration The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card. 60 Overview of BIOS Features 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. The BIOS determines the capabilities of each drive and configures them to optimize capacity and performance. To take advantage of the high capacities typically available today, hard drives are automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending on the capability of the drive. You can override the auto-configuration options by specifying manual configuration in the BIOS Setup program. To use ATA-66/100/133 features the following items are required: • An ATA-66/100/133 peripheral device • An ATA-66/100/133 compatible cable • ATA-66/100/133 operating system device drivers NOTE � Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive. 3.4 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information: • BIOS data, such as the BIOS revision level • Fixed-system data, such as peripherals, serial numbers, and asset tags • Resource data, such as memory size, cache size, and processor speed • Dynamic data, such as event detection and error logging Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page. 61 Intel Desktop Board DG33FB Technical Product Specification 3.5 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.) 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used. 7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit. To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions. 62 Overview of BIOS Features 3.6 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: ® • Intel Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web. ® • Intel Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM. Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS. NOTE � Review the instructions distributed with the upgrade utility before attempting a BIOS update. For information about Refer to BIOS update utilities http://support.intel.com/support/motherboards/desktop/s b/CS-022312.htm 3.6.1 Language Support The BIOS Setup program and help messages are supported in US English. Additional languages are available in the Integrator’s Toolkit utility. Check the Intel website for details. 63 Intel Desktop Board DG33FB Technical Product Specification 3.6.2 Custom Splash Screen ® During POST, an Intel splash screen is displayed by default. This splash screen can ® be augmented with a custom splash screen. The Intel Integrator Toolkit that is available from Intel can be used to create a custom splash screen. NOTE � If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/ Additional Intel software tools http://developer.intel.com/products/motherboard/dg965wh/tools.htm and http://developer.intel.com/design/motherbd/software.htm 3.7 BIOS Recovery It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 31 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable. Table 31. Acceptable Drives/Media Types for BIOS Recovery Media Type Can be used for BIOS recovery? CD-ROM drive connected to the Parallel ATA interface Yes CD-ROM drive connected to the Serial ATA interface Yes USB removable drive (a USB flash drive, for example) Yes USB diskette drive (with a 1.44 MB diskette) No USB hard disk drive No Legacy diskette drive (with a 1.44 MB diskette) connected to the No legacy diskette drive interface For information about Refer to BIOS recovery http://support.intel.com/support/motherboards/desktop 64 Overview of BIOS Features 3.8 Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled. 3.8.1 CD-ROM Boot Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, ATAPI CD- ROM is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot from the next defined drive. 3.8.2 Network Boot The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full. 3.8.3 Booting Without Attached Devices For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: • Video adapter • Keyboard • Mouse 3.8.4 Changing the Default Boot Device During POST Pressing the key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices (as set in the BIOS setup program’s Boot Device Priority Submenu). Table 32 lists the boot device menu options. Table 32. Boot Device Menu Options Boot Device Menu Function Keys Description <↑> or <↓> Selects a default boot device Exits the menu, saves changes, and boots from the selected device Exits the menu without saving changes 65 Intel Desktop Board DG33FB Technical Product Specification 3.9 Adjusting Boot Speed These factors affect system boot speed: • Selecting and configuring peripherals properly • Optimized BIOS boot parameters 3.9.1 Peripheral Selection and Configuration The following techniques help improve system boot speed: • Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds, that minimize hard drive startup delays. • Select a CD-ROM drive with a fast initialization rate. This rate can influence POST execution time. • Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in POST. These features may add time to the boot process. • Try different monitors. Some monitors initialize and communicate with the BIOS more quickly, which enables the system to boot more quickly. 3.9.2 BIOS Boot Optimizations Use of the following BIOS Setup program settings reduces the POST execution time. • In the Boot Menu, set the hard disk drive as the first boot device. As a result, the POST does not first seek a diskette drive, which saves about one second from the POST execution time. • In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can reduce up to four seconds of option ROM boot time. NOTE � It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen. This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program). 66 Overview of BIOS Features 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode. • The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode. • If only the supervisor password is set, pressing the key at the password prompt of the BIOS Setup program allows the user restricted access to Setup. • If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered. • Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer. • For enhanced security, use different passwords for the supervisor and user passwords. • Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length. Table 33 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen. Table 33. Supervisor and User Password Functions Password Password Password Supervisor to Enter During Set Mode User Mode Setup Options Setup Boot Neither Can change all Can change all None None None (Note) (Note) options options Supervisor Can change all Can change a Supervisor Password Supervisor None only options limited number of options User only N/A Can change all Enter Password User User options Clear User Password Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or and user set options limited number Enter Password user user of options Note: If no password is set, any user can change all Setup options. 67 Intel Desktop Board DG33FB Technical Product Specification 68 4 Error Messages and Beep Codes What This Chapter Contains 4.1 Speaker ......................................................................................... 69 4.2 BIOS Beep Codes ............................................................................ 69 4.3 BIOS Error Messages ....................................................................... 69 4.4 Port 80h POST Codes ....................................................................... 70 4.1 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 12 4.2 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS displays an error message describing the problem (see Table 34). Table 34. Beep Codes Type Pattern Frequency Memory error Three long beeps 1280 Hz Thermal warning Four alternating beeps: High tone: 2000 Hz High tone, low tone, high tone, low tone Low tone: 1600 Hz 4.3 BIOS Error Messages Table 35 lists the error messages and provides a brief description of each. Table 35. BIOS Error Messages Error Message Explanation CMOS Battery Low The battery may be losing power. Replace the battery soon. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values. Memory Size Decreased Memory size has decreased since the last boot. If no memory was removed, then memory may be bad. No Boot Device Available System did not find a device to boot. 69 Intel Desktop Board DG33FB Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display. NOTE � The POST card must be installed in PCI bus connector 1. The following tables provide information about the POST codes generated by the BIOS: • Table 36 lists the Port 80h POST code ranges • Table 37 lists the Port 80h POST codes themselves • Table 38 lists the Port 80h POST sequence NOTE � In the tables listed above, all POST codes and range values are listed in hexadecimal. Table 36. Port 80h POST Code Ranges Range Category/Subsystem 00 – 0F Debug codes: Can be used by any PEIM/driver for debug. 10 – 1F Host Processors: 1F is an unrecoverable CPU error. 20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected. 30 – 3F Recovery: 3F indicated recovery failure. 40 – 4F Reserved for future use. 50 – 5F I/O Busses: PCI, USB, ATA, etc. 5F is an unrecoverable error. Start with PCI. 60 – 6F Reserved for future use (for new busses). 70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error. 80 – 8F Reserved for future use (new output console codes). 90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error. A0 – AF Reserved for future use (new input console codes). B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error. C0 – CF Reserved for future use. D0 – DF Boot device selection. E0 – FF E0 – EE: Miscellaneous codes. See Table 37. EF: boot/S3 resume failure. F0 – FF: FF processor exception. 70 Error Messages and Beep Codes Table 37. Port 80h POST Codes POST Code Description of POST Operation Host Processor 10 Power-on initialization of the host processor (Boot Strap Processor) 11 Host processor Cache initialization (including APs) 12 Starting Application processor initialization 13 SMM initialization Chipset 21 Initializing a chipset component Memory 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 24 Programming timing parameters in the memory controller and the DIMMs 25 Configuring memory 26 Optimizing memory settings 27 Initializing memory, such as ECC init 28 Testing memory PCI Bus 50 Enumerating PCI busses 51 Allocating resources to PCI bus 52 Hot Plug PCI controller initialization 53 – 57 Reserved for PCI Bus USB 58 Resetting USB bus 59 Reserved for USB ATA/ATAPI/SATA 5A Resetting PATA/SATA bus and all devices 5B Reserved for ATA SMBus 5C Resetting SMBus 5D Reserved for SMBus Local Console 70 Resetting the VGA controller 71 Disabling the VGA controller 72 Enabling the VGA controller Remote Console 78 Resetting the console controller 79 Disabling the console controller 7A Enabling the console controller continued 71 Intel Desktop Board DG33FB Technical Product Specification Table 37. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS/2 or USB) 90 Resetting keyboard 91 Disabling keyboard 92 Detecting presence of keyboard 93 Enabling the keyboard 94 Clearing keyboard input buffer 95 Instructing keyboard controller to run Self Test (PS/2 only) Mouse (PS/2 or USB) 98 Resetting mouse 99 Disabling mouse 9A Detecting presence of mouse 9B Enabling mouse Fixed Media B0 Resetting fixed media B1 Disabling fixed media B2 Detecting presence of a fixed media (IDE hard drive detection etc.) B3 Enabling/configuring a fixed media Removable Media B8 Resetting removable media B9 Disabling removable media BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.) BC Enabling/configuring a removable media BDS Dy Trying boot selection y (y=0 to 15) PEI Core E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN EFI_SW_PEI_PC_HANDOFF_TO_NEXT) E2 Permanent memory found E1, E3 Reserved for PEI/PEIMs DXE Core E4 Entered DXE phase E5 Started dispatching drivers E6 Started connecting drivers continued 72 Error Messages and Beep Codes Table 37. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers E7 Waiting for user input E8 Checking password E9 Entering BIOS setup EB Calling Legacy Option ROMs Runtime Phase/EFI OS Boot F4 Entering Sleep state F5 Exiting Sleep state F8 EFI boot service ExitBootServices ( ) has been called F9 EFI runtime service SetVirtualAddressMap ( ) has been called FA EFI runtime service ResetSystem ( ) has been called PEIMs/Recovery 30 Crisis Recovery has initiated per User request 31 Crisis Recovery has initiated by software (corrupt flash) 34 Loading recovery capsule 35 Handing off control to the recovery capsule 3F Unable to recover 73 Intel Desktop Board DG33FB Technical Product Specification Table 38. Typical Port 80h POST Sequence POST Code Description 21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loading recovery capsule E4 Entered DXE phase 12 Starting application processor initialization 13 SMM initialization 50 Enumerating PCI busses 51 Allocating resourced to PCI bus 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 95 Keyboard Self Test EB Calling Video BIOS 58 Resetting USB bus 5A Resetting PATA/SATA bus and all devices 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 5A Resetting PATA/SATA bus and all devices 28 Testing memory 90 Resetting keyboard 94 Clearing keyboard input buffer E7 Waiting for user input 01 INT 19 00 Ready to boot 74 5 Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance..................................................................... 75 5.2 Battery Disposal Information............................................................. 85 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board DG33FB: • Safety standards • European Union Declaration of Conformity statement • Product Ecology statements • Electromagnetic Compatibility (EMC) standards • Product certification markings 5.1.1 Safety Standards Desktop Board DG33FB complies with the safety standards stated in Table 39 when correctly installed in a compatible host system. Table 39. Safety Standards Standard Title UL 60950-1, First Edition Information Technology Equipment – Safety - Part 1: General Requirements (USA and Canada) EN 60950-1:2006, Second Information Technology Equipment – Safety - Part 1: General Edition Requirements (European Union) IEC 60950-1:2005, Second Information Technology Equipment – Safety - Part 1: General Edition Requirements (International) 75 Intel Desktop Board DG33FB Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DG33FB is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive). The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions. This product follows the provisions of the European Directives 2004/108/EC and 2006/95/EC. Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a 2006/95/EC. Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC & 2006/95/EC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC & 2006/95/EC. Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC kehtestatud nõuetele. Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä. Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC & 2006/95/EC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC & 2006/95/EC. Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 2004/108/EC και 2006/95/EC. Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 2004/108/EC & 2006/95/EC. Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC & 2006/95/EC. Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC u 2006/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC & 2006/95/EC. 76 Regulatory Compliance and Battery Disposal Information Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC i 73/23/EWG. Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC & 2006/95/EC. Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC & 2006/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC a 2006/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in 2006/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC & 2006/95/EC. Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar. 77 Intel Desktop Board DG33FB Technical Product Specification 5.1.3 Product Ecology Statements The following information is provided to address worldwide product ecology concerns and regulations. 5.1.3.1 Disposal Considerations This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly. 5.1.3.2 Recycling Considerations As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling. Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. 中文 作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作 恰当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc. 78 Regulatory Compliance and Battery Disposal Information Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées. Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc. 日本語 インテルでは、環境保護活動の一環として、使い終えたインテル ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル プログラムを発足させました。 対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/intel /other/ehs/product_ecology （英語）をご覧ください。 Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir- butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada. Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc. Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д. 79 Intel Desktop Board DG33FB Technical Product Specification Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur. Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen http://www.intel.com/intel/other/ehs/product_ecology Web sayfasına gidin. 5.1.3.3 Lead Free Desktop Board This Desktop Board is a European Union Restriction of Hazardous Substances (EU RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six materials. One of the six restricted materials is lead. This Desktop Board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability. This Desktop Board is referred to as “Lead-free second level interconnect.” The board substrate and the solder connections from the board to the components (second-level connections) are all lead free. China bans the same substances and has the same limits as EU RoHS; however it requires different product marking and controlled substance information. The required mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as the number of years for which controlled listed substances will not leak or chemically deteriorate while in the product. 80 Regulatory Compliance and Battery Disposal Information nd Table 40 shows the various forms of the “Lead-Free 2 Level Interconnect” mark as it appears on the board and accompanying collateral. Table 40. Lead-Free Board Markings Description Mark nd Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board substrate and the or solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm). or 81 Intel Desktop Board DG33FB Technical Product Specification 5.1.4 EMC Regulations Desktop Board DG33FB complies with the EMC regulations stated in Table 41 when correctly installed in a compatible host system. Table 41. EMC Regulations Regulation Title FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Subpart B Frequency Devices. (USA) ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus. (Canada) (Class B) EN55022: 2006 Limits and methods of measurement of Radio Interference Characteristics (Class B) of Information Technology Equipment. (European Union) EN55024:1998 Information Technology Equipment – Immunity Characteristics Limits and methods of measurement. (European Union) EN55022:2006 Australian Communications Authority, Standard for Electromagnetic (Class B) Compatibility. (Australia and New Zealand) CISPR 222005 Limits and methods of measurement of Radio Disturbance Characteristics of +A1:2005 +A2:2006 Information Technology Equipment. (International) (Class B) CISPR 24: 1997 Information Technology Equipment – Immunity Characteristics – Limits and +A1:2001 +A2:2002 Methods of Measurement. (International) VCCI V-3/2007.04, Voluntary Control for Interference by Information Technology Equipment. V-4/2007.04, Class B (Japan) 82 Regulatory Compliance and Battery Disposal Information Japanese Kanji statement translation: this is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual. Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments. 83 Intel Desktop Board DG33FB Technical Product Specification 5.1.5 Product Certification Markings (Board Level) Desktop Board DG33FB has the product certification markings shown in Table 42: Table 42. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel desktop boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. Includes Intel name and DG33FB model designation. CE mark. Declaring compliance to European Union (EU) EMC directive and Low Voltage directive. Australian Communications Authority (ACA) C-tick mark. Includes adjacent Intel supplier code number, N-232. Japan VCCI (Voluntary Control Council for Interference) mark. S. Korea MIC (Ministry of Information and Communication) mark. Includes adjacent MIC certification number: CPU-DG33FB (B) For information about MIC certification, go to http://support.intel.com/support/motherboards/desktop/ Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturer’s recognition mark. Consists of a unique V-0 UL recognized manufacturer’s logo, along with a flammability rating (solder side). China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years. 84 Regulatory Compliance and Battery Disposal Information 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement. FORHOLDSREGEL Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning. OBS! Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning. VIKTIGT! Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna. VARO Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti. VORSICHT Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend. AVVERTIMENTO Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore. 85 Intel Desktop Board DG33FB Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. ATENÇÃO Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região. AŚCIAROŽZNAŚĆ Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі. UPOZORNÌNÍ V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí. Προσοχή Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς. VIGYAZAT Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni. 86 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska. PRECAUTIE Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului. ВНИМАНИЕ При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям. UPOZORNENIE Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia. POZOR Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. . UYARI Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır. OСТОРОГА Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля. 87 Intel Desktop Board DG33FB Technical Product Specification 88