Intel® Desktop Board D975XBX2 Technical Product Specification October 2006 Order Number: D73645-001US ® The Intel Desktop Board D975XBX2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D975XBX2 Specification Update. Revision History Revision Revision History Date ® -001 First release of the Intel Desktop Board D975XBX2 Technical Product October 2006 Specification ® This product specification applies to only the standard Intel Desktop Board D975XBX2 with BIOS identifier BX97520J.86A. Changes to this specification will be published in the Intel Desktop Board D975XBX2. Specification Update before being incorporated into a revision of this document. ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. 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Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. Copyright © 2006, Intel Corporation. All rights reserved. Preface This Technical Product Specification (TPS) specifies the board layout, components, ® connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board D975XBX2. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board D975XBX2 and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter Description 1 A description of the hardware used on the Desktop Board D975XBX2 2 A map of the resources of the Desktop Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information Typographical Conventions This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type. Notes, Cautions, and Warnings NOTE � Notes call attention to important information. INTEGRATOR’S NOTES # Integrator’s notes are used to call attention to information that may be useful to system integrators. CAUTION Cautions are included to help you avoid damaging hardware or losing data. iii Intel Desktop Board D975XBX2 Technical Product Specification Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) (NxnX) When used in the description of a component, N indicates component type, xn are the relative coordinates of its location on the Desktop Board D975XBX2, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area. GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbits/sec Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/sec Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their respective owners. iv Contents 1 Product Description 1.1 Overview......................................................................................... 12 1.1.1 Feature Summary ................................................................. 12 1.1.2 Manufacturing Options ........................................................... 13 1.1.3 Board Layout ........................................................................ 14 1.1.4 Block Diagram ...................................................................... 16 1.2 Online Support................................................................................. 17 1.3 Processor ........................................................................................ 17 1.4 System Memory ............................................................................... 18 1.4.1 Memory Configurations .......................................................... 20 ® 1.5 Intel 975X Chipset .......................................................................... 24 1.5.1 USB..................................................................................... 24 1.5.2 IDE Support ......................................................................... 25 1.5.3 Real-Time Clock, CMOS SRAM, and Battery .............................. 26 1.6 Discrete Serial ATA Interface (Optional) .............................................. 27 1.6.1 Serial ATA Controller.............................................................. 27 1.6.2 External Serial ATA Support.................................................... 27 1.7 PCI Express Connectors..................................................................... 28 1.8 IEEE-1394a Connectors (Optional)...................................................... 29 1.9 Legacy I/O Controller........................................................................ 29 1.9.1 Serial Port ............................................................................ 29 1.9.2 Parallel Port.......................................................................... 30 1.9.3 Diskette Drive Controller ........................................................ 30 1.9.4 Keyboard and Mouse Interface................................................ 30 1.10 Audio Subsystem.............................................................................. 31 1.10.1 Audio Subsystem Software ..................................................... 31 1.10.2 Audio Connectors .................................................................. 31 1.10.3 8-Channel (7.1) Audio Subsystem ........................................... 32 1.10.4 6-Channel (5.1) Audio Subsystem ........................................... 33 1.11 LAN Subsystem................................................................................ 34 ® 1.11.1 Intel 82573E/82573L Gigabit Ethernet Controller..................... 34 1.11.2 RJ-45 LAN Connector with Integrated LEDs .............................. 34 1.11.3 Alert Standard Format (ASF) Support ...................................... 35 ® 1.11.4 Intel Active Management Technology (Optional) ...................... 35 1.11.5 LAN Subsystem Software ....................................................... 37 1.12 Hardware Management Subsystem ..................................................... 37 1.12.1 Hardware Monitoring and Fan Control ASIC .............................. 37 1.12.2 Thermal Monitoring ............................................................... 38 1.12.3 Fan Monitoring...................................................................... 39 1.12.4 Chassis Intrusion and Detection .............................................. 39 v Intel Desktop Board D975XBX2 Technical Product Specification 1.13 Power Management .......................................................................... 39 1.13.1 ACPI.................................................................................... 39 1.13.2 Hardware Support ................................................................. 42 1.14 Onboard Power Button ...................................................................... 46 1.15 Onboard LEDs .................................................................................. 47 1.16 Trusted Platform Module (Optional)..................................................... 48 2 Technical Reference 2.1 Memory Resources ........................................................................... 49 2.1.1 Addressable Memory ............................................................. 49 2.1.2 Memory Map......................................................................... 51 2.2 DMA Channels.................................................................................. 51 2.3 Fixed I/O Map .................................................................................. 52 2.4 PCI Configuration Space Map ............................................................. 53 2.5 Interrupts........................................................................................ 54 2.6 PCI Conventional Interrupt Routing Map.............................................. 55 2.7 Connectors ...................................................................................... 56 2.7.1 Back Panel Connectors........................................................... 56 2.7.2 Component-side Connectors and Headers................................. 59 2.8 Jumper Block ................................................................................... 70 2.9 Mechanical Considerations ................................................................. 71 2.9.1 Form Factor.......................................................................... 71 2.9.2 I/O Shield ............................................................................ 72 2.10 Electrical Considerations.................................................................... 74 2.10.1 DC Loading........................................................................... 74 2.10.2 Add-in Board Considerations................................................... 74 2.10.3 Fan Header Current Capability ................................................ 75 2.10.4 Power Supply Considerations .................................................. 75 2.11 Thermal Considerations..................................................................... 76 2.12 Reliability......................................................................................... 78 2.13 Environmental.................................................................................. 79 3 Overview of BIOS Features 3.1 Introduction..................................................................................... 81 3.2 Resource Configuration ..................................................................... 82 3.2.1 PCI Autoconfiguration ............................................................ 82 3.2.2 PCI IDE Support.................................................................... 82 3.3 System Management BIOS (SMBIOS) ................................................. 83 3.4 Watchdog Timer ............................................................................... 83 3.5 Legacy USB Support ......................................................................... 84 3.6 BIOS Updates .................................................................................. 84 3.6.1 Language Support ................................................................. 85 3.6.2 Custom Splash Screen ........................................................... 85 vi Contents 3.7 Boot Options.................................................................................... 85 3.7.1 CD-ROM Boot ....................................................................... 85 3.7.2 Network Boot........................................................................ 85 3.7.3 Booting Without Attached Devices ........................................... 86 3.7.4 Changing the Default Boot Device During POST......................... 86 3.8 BIOS Security Features ..................................................................... 87 4 Error Messages and Beep Codes 4.1 Speaker .......................................................................................... 89 4.2 BIOS Beep Codes ............................................................................. 89 4.3 BIOS Error Messages ........................................................................ 89 4.4 Port 80h POST Codes ........................................................................ 90 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance...................................................................... 95 5.1.1 Safety Regulations ................................................................ 95 5.1.2 European Union Declaration of Conformity Statement ................ 95 5.1.3 Product Ecology Statements ................................................... 97 5.1.4 EMC Regulations ..................................................................101 5.1.5 Product Certification Markings (Board Level)............................102 5.2 Battery Disposal Information.............................................................103 Figures 1. Desktop Board Components............................................................... 14 2. Block Diagram.................................................................................. 16 3. Memory Channel and DIMM Configuration............................................ 20 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 21 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 21 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs ........... 22 7. Single Channel (Asymmetric) Mode Configuration with One DIMM........... 23 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 23 9. Location of External Serial ATA-Compatible SATA Port........................... 27 10. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem.............................................................................. 32 11. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem.............................................................................. 33 12. LAN Connector LED Locations............................................................. 34 13. Sensors and Fan Connectors.............................................................. 38 14. Location of the Standby Power Indicator LED ....................................... 45 15. Location of the Onboard Power Button ................................................ 46 16. Location of the CPU and Processor Voltage Regulator LEDs .................... 47 17. Detailed System Memory Address Map................................................ 50 18. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem................. 57 19. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem................. 58 20. Component-side Connectors and Headers............................................ 59 vii Intel Desktop Board D975XBX2 Technical Product Specification 21. Connection Diagram for Front Panel Header......................................... 66 22. Connection Diagram for Front Panel USB Headers................................. 68 23. Connection Diagram for Front Panel IEEE 1394a Header........................ 69 24. Location of the Jumper Block ............................................................. 70 25. Board Dimensions............................................................................. 71 26. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem.............................................................................. 72 27. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem.............................................................................. 73 28. Localized High Temperature Zones ..................................................... 77 Tables 1. Feature Summary............................................................................. 12 2. Manufacturing Options ...................................................................... 13 3. Components Shown in Figure 1 .......................................................... 15 4. Supported Memory Configurations ...................................................... 18 5. Memory Operating Frequencies .......................................................... 19 6. LAN Connector LED States................................................................. 34 7. Effects of Pressing the Power Switch ................................................... 40 8. Power States and Targeted System Power ........................................... 41 9. Wake-up Devices and Events ............................................................. 42 10. System Memory Map ........................................................................ 51 11. DMA Channels.................................................................................. 51 12. I/O Map........................................................................................... 52 13. PCI Configuration Space Map ............................................................. 53 14. Interrupts........................................................................................ 54 15. PCI Interrupt Routing Map ................................................................. 55 16. Component-side Connectors and Headers Shown in Figure 20................ 60 17. ATAPI CD-ROM Connector (Optional) .................................................. 61 18. Front Panel Audio Header .................................................................. 61 19. Front Chassis, Rear Chassis, and MCH Fan Headers .............................. 61 20. Processor Fan and Auxiliary Rear Fan Header....................................... 61 21. Chassis Intrusion Header................................................................... 62 22. SCSI Hard Drive Activity LED Header (Optional) ................................... 62 23. Serial ATA Connectors....................................................................... 62 24. Main Power Connector....................................................................... 64 25. Processor Core Power Connector (2 x 4 Pin)......................................... 64 26. Processor Core Power Connector (2 x 2 Pin)......................................... 64 27. Auxiliary PCI Express Graphics Power.................................................. 64 28. Auxiliary Front Panel Power/Sleep LED Header ..................................... 65 29. Front Panel Header ........................................................................... 66 30. States for a One-Color Power LED....................................................... 67 31. States for a Two-Color Power LED ...................................................... 67 32. BIOS Setup Configuration Jumper Settings .......................................... 70 33. DC Loading Characteristics ................................................................ 74 viii Contents 34. Fan Header Current Capability............................................................ 75 35. Thermal Considerations for Components.............................................. 78 36. Environmental Specifications.............................................................. 79 37. BIOS Setup Program Menu Bar........................................................... 82 38. BIOS Setup Program Function Keys .................................................... 82 39. Boot Device Menu Options ................................................................. 86 40. Supervisor and User Password Functions ............................................. 87 41. Beep Codes ..................................................................................... 89 42. BIOS Error Messages ........................................................................ 89 43. Port 80h POST Code Ranges .............................................................. 90 44. Port 80h POST Codes ........................................................................ 91 45. Typical Port 80h POST Sequence ........................................................ 94 46. Safety Regulations............................................................................ 95 47. Lead-Free Board Markings ................................................................100 48. EMC Regulations..............................................................................101 49. Product Certification Markings ...........................................................102 ix Intel Desktop Board D975XBX2 Technical Product Specification x 1 Product Description What This Chapter Contains 1.1 Overview......................................................................................... 12 1.2 Online Support................................................................................. 17 1.3 Processor ........................................................................................ 17 1.4 System Memory ............................................................................... 18 ® 1.5 Intel 975X Chipset .......................................................................... 24 1.6 Discrete Serial ATA Interface (Optional) .............................................. 27 1.7 PCI Express Connectors..................................................................... 28 1.8 IEEE-1394a Connectors (Optional)...................................................... 29 1.9 Legacy I/O Controller........................................................................ 29 1.10 Audio Subsystem.............................................................................. 31 1.11 LAN Subsystem................................................................................ 34 1.12 Hardware Management Subsystem ..................................................... 37 1.13 Power Management .......................................................................... 39 1.14 Onboard Power Button ...................................................................... 46 1.15 Onboard LEDs .................................................................................. 47 1.16 Trusted Platform Module (Optional)..................................................... 48 11 Intel Desktop Board D975XBX2 Technical Product Specification 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]) Form Factor ® • Intel Core™2 Extreme Processor in an LGA775 socket with a 1066 MHz Processor system bus ® • Intel Core™2 Duo Processor in an LGA775 socket with a 1066 MHz system bus ® ® • Intel Pentium Processor Extreme Edition in an LGA775 socket with a 1066 or 800 MHz system bus ® ® • Intel Pentium 4 Processor Extreme Edition in an LGA775 socket with a 1066 MHz system bus ® ® • Intel Pentium D Processor in an LGA775 socket with an 800 MHz system bus ® ® • Intel Pentium 4 Processor in an LGA775 socket with an 800 MHz system bus • Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets Memory • Support for DDR2 800, DDR2 667, and DDR2 533 MHz DIMMs • Support for up to 8 GB of system memory • Support for ECC and non-ECC memory ® Chipset Intel 975X Chipset, consisting of: ® • Intel 82975X Memory Controller Hub (MCH) ® • Intel 82801GR I/O Controller Hub (ICH7-R) or ® Intel 82801GH I/O Controller Hub (ICH7-DH) ® Audio Intel High Definition Audio subsystem Legacy I/O Control Legacy I/O controller for diskette drive, serial, parallel, and PS/2 ports USB Support for USB 2.0 devices • Eight USB ports Peripheral Interfaces • One serial port • One parallel port • Four Serial ATA interfaces with RAID support • One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support • One diskette drive interface • PS/2* keyboard and mouse ports ® • Intel BIOS resident in the SPI Flash device BIOS • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS • Watchdog timer providing automatic recovery after two failed power-on self-tests (POSTs) • Support for PCI Local Bus Specification Revision 2.2 Instantly Available PC Technology • Support for PCI Express* Revision 1.0a • Suspend to RAM support • Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the LAN Support ® 82573E/82573L Gigabit Ethernet Controller Intel continued 12 Product Description Table 1. Feature Summary (continued) • Two PCI* Conventional bus add-in card connectors (SMBus routed to both PCI Expansion Conventional bus add-in card connectors) Capabilities • One Primary PCI Express x16 (electrical x16 or x8) bus add-in card connector • One Secondary PCI Express x16 (electrical x8) bus add-in card connector • One PCI Express x16 (electrical x4) bus add-in card connector • Hardware monitoring and fan control ASIC Hardware Monitor Subsystem • Voltage sense to detect out of range power supply voltages • Thermal sense to detect out of range thermal values • Three fan headers • Three fan sense inputs used to monitor fan activity • Fan speed control • Support for Product Environmental Control Interface (PECI) 1.1.2 Manufacturing Options Table 2 describes the manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you. Table 2. Manufacturing Options ® ® BIOS support for Intel Active Management Technology (Intel AMT) AMT A 1 x 4-pin ATAPI-style connector for connecting an internal ATAPI CD-ROM drive ATAPI CD-ROM to the audio mixer Connector Audio Subsystem Intel High Definition Audio subsystem in one of the following configurations: • 8-channel (7.1) audio subsystem with five analog audio outputs and two S/PDIF digital audio outputs (coaxial and optical) using the SigmaTel* 9274D audio codec • 6-channel (5.1) audio subsystem with three analog audio outputs using the Sigmatel 9227 audio codec Provides required additional power when using high power (75 W or greater) add-in Auxiliary PCI cards in either or both the Secondary PCI Express x16 (electrical x8) and the PCI Express Graphics Express x16 (electrical x4) bus add-in card connectors Power Connector • Marvell* 88SE6145 SATA RAID controller Discrete SATA RAID Controller • Four SATA connectors (in addition to the four SATA connectors on the ICH7-R/ICH7-DH SATA interface) IEEE-1394a controller and two IEEE-1394a connectors: one back panel connector IEEE-1394a and one front-panel header Interface ® A 3-pin header for powering a fan for the Intel 82975X Memory Controller Hub MCH Fan Header (MCH) One of the following connectors for providing +12 V power to the processor voltage Processor Core regulator: Power Connector • 2 x 4-pin (requires a power supply with a dual-rail 2 x 4 power cable). Boards equipped with the 2 x 4-pin processor core power connector will also include heatsinks in the processor voltage regulator area. • 2 x 2-pin Allows add-in hard drive controllers (SCSI or other) to use the same LED as the SCSI Hard Drive onboard IDE controller LED Header A component that enhances platform security Trusted Platform Module (TPM) 13 Intel Desktop Board D975XBX2 Technical Product Specification For information about Refer to Available configurations for the board Section 1.2, page 17 1.1.3 Board Layout Figure 1 shows the location of the major components. Figure 1. Desktop Board Components Table 3 lists the components identified in Figure 1. 14 Product Description Table 3. Components Shown in Figure 1 Item/callout from Figure 1 Description A Auxiliary rear fan header B PCI Conventional bus add-in card connector 2 C PCI Express x16 (electrical x4) bus add-in card connector PCI Conventional bus add-in card connector 1 D Secondary PCI Express x16 (electrical x8) bus add-in card connector E Front panel audio header F ® Intel 82801G I/O Controller Hub (ICH7-R or ICH7-DH) G Primary PCI Express x16 (electrical x16 or x8) bus add-in card connector H Rear chassis fan header I J Auxiliary PCI Express Graphics Power Connector (optional) Back panel connectors K ATAPI CD-ROM connector (optional) L Processor core power connector M Memory Controller Hub (MCH) fan header (optional) N LGA775 processor socket O P Intel 82975X MCH Q DIMM Channel A sockets [2] R Processor fan header S DIMM Channel B sockets [2] T Main power connector U Diskette drive connector V BIOS Setup configuration jumper block W Chassis intrusion header X Onboard power button Y Battery Z Parallel ATE IDE connector AA Serial ATA connectors (ICH7-R/ICH7-DH RAID) [4] BB Front chassis fan header Auxiliary front panel power LED header CC Front panel USB headers [2] DD IEEE-1394a front panel header EE Serial ATA RAID connectors (Discrete RAID) (optional) [3] FF Serial ATA RAID connector compatible with external Serial ATA adapter (red) GG SCSI Hard Drive Activity LED header (optional) HH Front panel header II Speaker JJ 15 Intel Desktop Board D975XBX2 Technical Product Specification 1.1.4 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. PCI Express Interface Gigabit Ethernet LAN PCI Express x16 Controller Connector (Electrical x4) Slot SMBus Parallel ATA Parallel ATA Back Panel/Front Panel USB IDE Connector IDE Interface USB Ports LGA775 Serial Port System Bus Processor (1066/800 MHz) LPC Bus Parallel Port Socket I/O PS/2 Mouse Controller PS/2 Keyboard Primary SMBus PCI Express Diskette Drive x16 Connector Connector Secondary PCI Express x16 Connector Intel 975X Chipset Intel 82801GR/ Serial Peripheral Intel 82975X 82801GH Interface (SPI) Memory Controller I/O Controller Hub Flash PCI Express Hub (MCH) (ICH7-R/ICH7-DH) Device X16 Interface Dual-Channel TPM Component Memory Bus LPC Bus Channel A (Optional) DIMMs (2) SMBus SATA IDE SATA IDE Channel B Connectors (4) DIMMs (2) Interface IEEE-1394a PCI IEEE-1394a Connectors Controller Front Panel Mic In Bus (Optional) (Optional) Front Panel Line Out SATA RAID Discrete SATA RAID PCI Connectors (4) Controller Mic In/Retasking Jack Bus (Optional) (Optional) Line In/Retasking Jack PCI Bus Audio Line Out/Retasking Jack Codec PCI Slot 1 CD-ROM (Optional) PCI Slot 2 SMBus S/PDIF Hardware Monitoring Center and LFE/Retasking Jack and Fan Control ASIC Surround Left-Right/Retasking Jack OM18546 Figure 2. Block Diagram 16 DMI Interconnect High Definition Audio Link LPC Bus Product Description 1.2 Online Support To find information about… Visit this World Wide Web site: Intel Desktop Board D975XBX2 http://www.intel.com/design/motherbd under “Desktop Board Products” or “Desktop Board Support” http://support.intel.com/support/motherboards/desktop Available configurations for the http://developer.intel.com/design/motherbd/bx2/bx2_available.htm Desktop Board D975XBX2 Processor data sheets http://www.intel.com/design/litcentr ICH7-R/ICH7-DH addressing http://developer.intel.com/design/chipsets/datashts Custom splash screens http://intel.com/design/motherbd/gen_indx.htm Audio software and utilities http://www.intel.com/design/motherbd LAN software and drivers http://www.intel.com/design/motherbd 1.3 Processor The board is designed to support the following processors: • Intel Core 2 Extreme Processor in an LGA775 socket with a 1066 MHz system bus • Intel Core 2 Duo Processor in an LGA775 socket with a 1066 MHz system bus • Intel Pentium Processor Extreme Edition in an LGA775 socket with a 1066 or 800 MHz system bus • Intel Pentium 4 Processor Extreme Edition in an LGA775 socket with a 1066 MHz system bus • Intel Pentium D Processor in an LGA775 socket with an 800 MHz system bus • Intel Pentium 4 Processor in an LGA775 socket with an 800 MHz system bus See the Intel web site listed below for the most up-to-date list of supported processors. For information about… Refer to: Supported processors for the board http://www.intel.com/design/motherbd/bx2/bx2_proc.htm CAUTION Use only the processors listed on web site above. Use of unsupported processors can damage the board, the processor, and the power supply. INTEGRATOR’S NOTE # This board has specific requirements for providing power to the processor. Refer to Section 2.7.2.1 on page 63 for information on power supply requirements for this board. 17 Intel Desktop Board D975XBX2 Technical Product Specification 1.4 System Memory The board has four DIMM sockets and supports the following memory features: • 1.8 V and 1.9 V DDR2 SDRAM DIMMs • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported. • 8 GB maximum total system memory. Refer to Section 2.1.1 on page 49 for information on the total amount of addressable memory. • Minimum total system memory: 128 MB • ECC DIMMs and non-ECC DIMMs • Serial Presence Detect • DDR2 800, DDR2 667, and DDR2 533 MHz SDRAM DIMMs � NOTES • Remove the Primary PCI Express x16 (electrical x16 or x8) video card before installing or upgrading memory to avoid interference with the memory retention mechanism. • To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non- SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency. Table 4 lists the supported DIMM configurations. Table 4. Supported Memory Configurations DIMM Configuration SDRAM SDRAM Organization Number of SDRAM (Note 1) (Note 2) Capacity Density Front-side/Back-side Devices 128 MB SS 256 Mbit 16 M x 16/empty 4 [5] 256 MB SS 256 Mbit 32 M x 8/empty 8 [9] 256 MB SS 512 Mbit 32 M x 16/empty 4 [5] 512 MB DS 256 Mbit 32 M x 8/32 M x 8 16 [18] 512 MB SS 512 Mbit 64 M x 8/empty 8 [9] 512 MB SS 1 Gbit 64 M x 16/empty 4 [5] 1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16 [18] 1024 MB SS 1 Gbit 128 M x 8/empty 8 [9] 2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16 [18] Notes: 1. In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to single-sided memory modules (containing one row of SDRAM). 2. In the fifth column, the number in brackets specifies the number of SDRAM devices on an ECC DIMM. 18 Product Description INTEGRATOR’S NOTE # Refer to Section 2.1.1, on page 49 for additional information on available memory. NOTE � Regardless of the DIMM type used, the memory frequency will either be equal to or less than the processor system bus frequency. For example, if DDR2 800 memory is used with a 533 MHz system bus frequency processor, the memory will operate at 533 MHz. Table 5 lists the resulting operating memory frequencies based on the combination of DIMMs and processors. Table 5. Memory Operating Frequencies DIMM Type Processor System Bus Frequency Resulting Memory Frequency DDR2 533 800 MHz 533 MHz DDR2 533 1066 MHz 533 MHz DDR2 667 800 MHz 667 MHz DDR2 667 1066 MHz 667 MHz DDR2 800 800 MHz 800 MHz DDR2 800 1066 MHz 800 MHz 19 Intel Desktop Board D975XBX2 Technical Product Specification 1.4.1 Memory Configurations The Intel 82975X MCH supports two types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used. • Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used. Figure 3 illustrates the memory channel and DIMM configuration. NOTE � The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black. Figure 3. Memory Channel and DIMM Configuration 20 Product Description 1.4.1.1 Dual Channel (Interleaved) Mode Configurations Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs. Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs Figure 5 shows a dual channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B. Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs 21 Intel Desktop Board D975XBX2 Technical Product Specification Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels. Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 22 Product Description 1.4.1.2 Single Channel (Asymmetric) Mode Configurations NOTE � Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated. Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM Figure 8 shows a single channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B. Figure 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs 23 Intel Desktop Board D975XBX2 Technical Product Specification ® 1.5 Intel 975X Chipset The Intel 975X chipset consists of the following devices: • Intel 82975X Memory Controller Hub (MCH) with Direct Media Interface (DMI) interconnect • One of the following: ⎯ Intel 82801GR I/O Controller Hub (ICH7-R) with DMI interconnect ⎯ Intel 82801GH I/O Controller Hub (ICH7-DH) with DMI interconnect The MCH is a centralized controller for the system bus, the memory bus, the PCI Express bus, and the DMI interconnect. The ICH7 is a centralized controller for the board’s I/O paths. The BIOS code is stored in the Serial Peripheral Interface (SPI) Flash device. For information about Refer to The Intel 975X chipset http://developer.intel.com/ Resources used by the chipset Chapter 2 1.5.1 USB The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. The ICH7-R/ICH7-DH provides the USB controller for all ports. The port arrangement is as follows: • Four ports are implemented with dual stacked back panel connectors adjacent to the audio connectors • Four ports are routed to two separate front panel USB headers NOTES � Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices. For information about Refer to The location of the USB connectors on the back panel Figure 19, page 58 The location of the front panel USB headers Figure 20, page 59 24 Product Description 1.5.2 IDE Support The board provides five IDE interface connectors: • One parallel ATA IDE connector that supports two devices • Four serial ATA IDE connectors that support one device per connector 1.5.2.1 Parallel ATE IDE Interface The ICH7-R/ICH7-DH’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • Programmed I/O (PIO): processor controls data transfer. • 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. • Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec. • ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible. • ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH7-R/ ICH7-DH’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec. � NOTE ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling. The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS. For information about Refer to The location of the Parallel ATA IDE connector Figure 20, page 59 1.5.2.2 Serial ATA Interfaces The ICH7-R/ICH7-DH’s Serial ATA controller offers four independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of four Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel. For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. 25 Intel Desktop Board D975XBX2 Technical Product Specification Native mode is the preferred mode for configurations using the Microsoft Windows* XP and Microsoft Windows 2000 operating systems. NOTE � Many Serial ATA drives use new low-voltage power connectors and require adaptors or power supplies equipped with low-voltage power connectors. For more information, see: http://www.serialata.org/ For information about Refer to The location of the Serial ATA IDE connectors on the D975XBX2 board Figure 20, page 59 1.5.2.3 Serial ATA RAID The ICH7-R/ICH7-DH supports the following RAID (Redundant Array of Independent Drives) levels: • RAID 0 - data striping • RAID 1 - data mirroring • RAID 0+1 (or RAID 10) - data striping and mirroring • RAID 5 - distributed parity 1.5.2.4 SCSI Hard Drive Activity LED Header (Optional) The SCSI hard drive activity LED header is a 1 x 2-pin header that allows an add-in hard drive controller to use the same LED as the onboard IDE controller. For proper operation, this header should be wired to the LED output of the add-in hard drive controller. The LED indicates when data is being read from, or written to, either the add-in hard drive controller or the onboard IDE controller (Parallel ATA or Serial ATA). For information about Refer to The location of the SCSI hard drive activity LED header Figure 20, page 59 The signal names of the SCSI hard drive activity LED header Table 22, page 62 1.5.3 Real-Time Clock, CMOS SRAM, and Battery A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied. � NOTE If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 14 shows the location of the battery. 26 Product Description 1.6 Discrete Serial ATA Interface (Optional) 1.6.1 Serial ATA Controller As a manufacturing option, the board provides a Marvell 88SE6145 Serial ATA (SATA) controller and four connectors (that support one device per connector) for SATA devices. These connectors are in addition to the four SATA connectors of the ICH7-R/ICH7-DH SATA interface. The Marvell 88SE6145 controller uses the PCI bus for data transfer with a theoretical maximum transfer rate of 3 Gbits/sec per port. The discrete SATA interface supports the following RAID levels: • RAID 0 • RAID 1 NOTE � The Marvell 88SE6145 controller supports single drive non-RAID configurations as well as RAID configurations. For information about Refer to The location of the discrete SATA RAID connectors Figure 20, page 59 1.6.2 External Serial ATA Support The red Serial ATA connector can be used with a back panel adapter for an external SATA drive. Figure 9 shows the location of the External Serial ATA-compatible SATA port. Figure 9. Location of External Serial ATA-Compatible SATA Port 27 Intel Desktop Board D975XBX2 Technical Product Specification 1.7 PCI Express Connectors The board provides the following PCI Express connectors: • One Primary PCI Express x16 (electrical x16 or x8) bus add-in card connector. The x16 interface supports simultaneous (full duplex) transfers up to 8 GBytes/sec. Single-ended (half duplex) transfers are supported at up to 4 GBytes/sec. • One Secondary PCI Express x16 (electrical x8) bus add-in card connector: The board provides a PCI Express add-in card connector in the form of a physical x16 connector with electrical routing of x8. This connector is an electrical equivalent of a PCI Express x8 bus add-in card connector. This connector also supports x4 and x1 PCI Express add-in cards. • One PCI Express x16 (electrical x4) bus add-in card connector: The board provides a PCI Express add-in card connector in the form of a physical x16 connector with electrical routing of x4. This connector is an electrical equivalent of a PCI Express x4 bus add-in card connector. This connector supports x4 and x1 PCI Express add-in cards. For optimum performance, observe the following recommendations for the PCI Express add-in card connectors: • If you are installing a single PCI Express Graphics card, install it in the Primary PCI Express x16 (electrical x16 or x8) bus add-in card connector. • If you are installing two PCI Express Graphics cards, install them in the Primary PCI Express x16 (electrical x16 or x8) bus add-in card connector and the Secondary PCI Express x16 (electrical x8) bus add-in card connector. The PCI Express interfaces for the Primary and Secondary PCI Express x16 connectors are routed through the MCH. The PCI Express interface for the PCI Express x16 (electrical x4) connector is routed through the ICH7-R/ICH7-DH. Therefore, the Primary and Secondary PCI Express x16 connectors provide higher performance than the PCI Express x16 (electrical x4) bus add-in card connector. For information about Refer to The locations of the specific PCI Express x16 add-in card connectors Figure 1, page 14 INTEGRATOR’S NOTE # Although the PCI Express specification allows x16 cards to auto-negotiate down from x16 to x4 and x1 and may function properly, such configurations have not been validated on this board. Please consult your add-in card vendor prior to attempting to use a PCI Express x16 add-in card in this connector. The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the underlying PCI Express architecture is compatible with PCI Conventional compliant operating systems. Additional features of the PCI Express interface includes the following: • Support for the PCI Express enhanced configuration mechanism • Automatic discovery, link training, and initialization • Support for Active State Power Management (ASPM) • SMBus 2.0 support 28 Product Description • Wake# signal supporting wake events from ACPI S1, S3, S4, or S5 • Software compatible with the PCI Power Management Event (PME) mechanism defined in the PCI Power Management Interface Specification, Rev. 1.1 1.8 IEEE-1394a Connectors (Optional) The optional IEEE-1394 interface addresses interconnection of both computer peripherals and consumer electronics with these features: • IEEE-1394a operation • Support for up to 63 peer-to-peer devices • Operation ranging from 100 Mbits/sec to 400 Mbits/sec (depending on cable type) • Connection over short and long distances • Support for both asynchronous and isochronous data transfer As a manufacturing option, the board includes two IEEE-1394a connectors as follows: • One IEEE-1394a connector located on the back panel. • One IEEE-1394a front-panel header located on the component side. For information about Refer to The location of the back panel IEEE-1394a connector Figure 18, page 57 The location of the front panel IEEE-1394a header Figure 20, page 59 The signal names of the front panel IEEE-1394a header Section 2.7.2.6, page 69 1.9 Legacy I/O Controller The legacy I/O controller provides the following features: • One serial port • One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support • Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems • PS/2-style mouse and keyboard interfaces • Interface for one 1.44 MB or 2.88 MB diskette drive • Intelligent power management, including a programmable wake-up event interface • PCI Conventional bus power management support The BIOS Setup program provides configuration options for the legacy I/O controller. 1.9.1 Serial Port The board has one serial port connector located on the back panel. The serial port supports data transfers at rates of up to 115.2 kbits/sec with BIOS support. For information about Refer to The location of the serial port A connector Figure 19, page 58 29 Intel Desktop Board D975XBX2 Technical Product Specification 1.9.2 Parallel Port The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup program to set the parallel port mode. For information about Refer to The location of the parallel port connector Figure 19, page 58 1.9.3 Diskette Drive Controller The legacy I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface. For information about Refer to The location of the diskette drive connector on the D975XBX2 board Figure 20, page 59 1.9.4 Keyboard and Mouse Interface PS/2 keyboard and mouse connectors are located on the back panel. NOTE � The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected. For information about Refer to The location of the keyboard and mouse connectors Figure 19, page 58 30 Product Description 1.10 Audio Subsystem The board supports the Intel High Definition audio subsystem based on the SigmaTel 9274D or the SigmaTel 9227 audio codec. The audio subsystem supports the following features: • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to user’s definition, or can be automatically switched depending on the recognized device type. • Stereo input and output for all back panel jacks • Line out and Mic in functions for front panel audio jacks • A signal-to-noise (S/N) ratio of 90 dB 1.10.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 17 1.10.2 Audio Connectors The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio connectors include the following: • Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors) • ATAPI CD-ROM (an optional 1 x 4-pin ATAPI-style connector for connecting an internal ATAPI CD-ROM drive to the audio mixer) The functions of the back panel audio connectors are dependent on which subsystem is present. The 8-channel (7.1) audio subsystem is described in Section 1.10.3; the 6-channel (5.1) audio subsystem is described in Section 1.10.4. For information about Refer to The locations of the front panel audio header and the optional ATAPI Figure 20, page 59 CD-ROM connector The signal names of the front panel audio header Table 18, page 61 The signal names of the optional ATAPI CD-ROM connector Table 17, page 61 The back panel audio connectors Section 2.7.1, page 56 31 Intel Desktop Board D975XBX2 Technical Product Specification 1.10.3 8-Channel (7.1) Audio Subsystem The 8-channel (7.1) audio subsystem includes the following: • Intel 82801G I/O Controller Hub (ICH7-R/ICH7-DH) • SigmaTel 9274D audio codec • Microphone input that supports a single dynamic, condenser, or electret microphone The back panel audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 10. Front Panel Audio Connectors [Routed from Front Panel Audio Header] Mic In/Retasking Jack Line Out/Retasking Jack [Pink] [Green] Surround Left and Right/ Side Surround Retasking Jack Left and Right/ [Black] Line In/Retasking Jack [Blue] Center channel and Line Out/Retasking Jack LFE (Subwoofer)/Retasking Jack [Green] [Orange] S/PDIF Digital Audio Out Mic In/Retasking Jack Optical [Pink] OM18352 Figure 10. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem For information about Refer to The back panel audio connectors Section 2.7.1, page 56 32 Product Description 1.10.4 6-Channel (5.1) Audio Subsystem The 6-channel (5.1) audio subsystem includes the following: • Intel 82801G I/O Controller Hub (ICH7-R/ICH7-DH) • SigmaTel 9227 audio codec • Microphone input that supports a single dynamic, condenser, or electret microphone The back panel audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 11. Front Panel Audio Connectors Back Panel Audio Connectors [Routed from Front Panel Audio Header] Line In/Retasking Jack [Blue] Mic In/ Line Out/ Retasking Jack Retasking Jack Line Out/Retasking Jack [Pink] [Green] [Green] Mic In/Retasking Jack [Pink] OM18469 Figure 11. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem For information about Refer to The back panel audio connectors Section 2.7.1, page 56 33 Intel Desktop Board D975XBX2 Technical Product Specification 1.11 LAN Subsystem ® The LAN subsystem includes the Intel 82573 Gigabit (10/100/1000 Mbits/sec) Ethernet Controller and an RJ-45 LAN connector with integrated status LEDs. ® 1.11.1 Intel 82573E/82573L Gigabit Ethernet Controller The Intel 82573E/82573L Gigabit Ethernet Controller supports the following features: • PCI Express link • 10/100/1000 IEEE 802.3 compliant • Compliant to IEEE 802.3x flow control support • Jumbo frame support • TCP, IP, UDP checksum offload • Transmit TCP segmentation • Advanced packet filtering • Full device driver compatibility • PCI Express Power Management Support The 82573E Gigabit Ethernet Controller supports Alert Standard Format (ASF) 2.0 and Intel Active Management Technology (Intel AMT). 1.11.2 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 12 below). Link LED Data Rate LED (Green) (Green/Yellow) OM18329 Figure 12. LAN Connector LED Locations Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 6. LAN Connector LED States LED LED Color LED State Condition Off LAN link is not established. Link Green On LAN link is established. Blinking LAN activity is occurring. Off 10 Mbits/sec data rate is selected. Data Rate Green/Yellow Green 100 Mbits/sec data rate is selected. Yellow 1000 Mbits/sec data rate is selected. 34 Product Description 1.11.3 Alert Standard Format (ASF) Support The board provides the following ASF support for PCI Express x1 bus add-in LAN cards and PCI Conventional bus add-in LAN cards: • Monitoring of system firmware progress events, including: ⎯ BIOS present ⎯ Primary processor initialization ⎯ Memory initialization ⎯ Video initialization ⎯ PCI resource configuration ⎯ Hard-disk initialization ⎯ User authentication ⎯ Starting operating system boot process • Monitoring of system firmware error events, including: ⎯ Memory missing ⎯ Memory failure ⎯ No video device ⎯ Keyboard failure ⎯ Hard-disk failure ⎯ No boot media • Boot options to boot from different types of boot devices • Reset, shutdown, power cycle, and power up options • LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. ® 1.11.4 Intel Active Management Technology (Optional) Intel Active Management Technology (Intel AMT) offers IT organizations tamper- resistant and persistent management capabilities. Specifically, Intel AMT is a hardware-based solution that offers encrypted and persistent asset management and remote diagnostics and/or recovery capabilities for networked platforms. With Intel AMT, IT organizations can easily get accurate platform information, and can perform remote updating, diagnostics, debugging and repair of a system, regardless of the state of the operating system and the power state of the system. Intel AMT enables IT organizations to discover, heal, and protect all of their computing assets, regardless of system state in the manner described below. • Discovering hardware and software computing assets: ⎯ Intel AMT stores hardware and software asset information in non-volatile memory and allows IT to read the asset information anytime, even if the PC is off ⎯ Users cannot remove or prevent IT organization access to the information because it does not rely on software agents 35 Intel Desktop Board D975XBX2 Technical Product Specification • Healing systems remotely, regardless of the operating system or system state: ⎯ Intel AMT provides out-of-band diagnostics and recovery capabilities for IT organizations to remotely diagnose and repair PCs after software, operating system, or hardware failures ⎯ Alerting and event logging help IT organizations detect and diagnose problems quickly to reduce end-user downtime • Protecting the enterprise against malicious software attacks: ⎯ Intel AMT helps IT organizations keep software versions and virus protection consistent and up-to-date across the enterprise ⎯ Version information is stored in non-volatile memory for access anytime by third party software to check and, if necessary, wake a system to perform off- hours updates. The key features of Intel AMT include: • Secure Out of Band (OOB) system management that allows remote management of PCs regardless of system power or operating system state: ⎯ SSL3.1/TLS encryption ⎯ HTTP authentication ⎯ TCP/IP ⎯ HTTP web GUI ⎯ XML/SOAP API • Remote troubleshooting and recovery that can significantly reduce desk-side visits and potentially increasing efficiency of IT technical staff: ⎯ System event log ⎯ IDE-R or PXE boot; Network drive or remote CD boot ⎯ Serial over LAN ⎯ OOB diagnostics ⎯ Remote control ⎯ Remote BIOS update • Proactive alerting that decreases downtime and minimizes time to repair: ⎯ Programmable policies ⎯ Operating system lock-up alert ⎯ Boot failure alert ⎯ Hardware failure alerts • Third party non-volatile storage that prevents users from removing critical inventory, remote control, or virus protection agents: ⎯ Nonvolatile storage for agents ⎯ Tamper-resistant • Remote hardware and software asset tracking that eliminates time-consuming manual inventory tracking, which also reduces asset accounting costs: ⎯ E-Asset Tag ⎯ HW/SW inventory For information about Refer to Intel Active Management Technology http://www.intel.com/technology/manage/iamt/index.htm 36 Product Description 1.11.5 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 17 1.12 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • Fan monitoring and control (through the hardware monitoring and fan control ASIC) • Thermal and voltage monitoring • Chassis intrusion detection • Support for Product Environmental Control Interface (PECI) 1.12.1 Hardware Monitoring and Fan Control ASIC The features of the hardware monitoring and fan control ASIC include: • Internal ambient temperature sensor • Two remote thermal diode sensors for direct monitoring of processor temperature and ambient temperature sensing • Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to detect levels above or below acceptable values • Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed • SMBus interface For information about Refer to The location of the fan headers and sensors for thermal monitoring Figure 13, page 38 37 Intel Desktop Board D975XBX2 Technical Product Specification 1.12.2 Thermal Monitoring Figure 13 shows the location of the sensors and fan headers. Item Description A Thermal diode, located on processor die B Ambient temperature sensor, internal to hardware monitoring and fan control ASIC C Remote ambient temperature sensor D Processor fan header E Rear chassis fan header F Front chassis fan header G Auxiliary chassis fan header Figure 13. Sensors and Fan Connectors 38 Product Description 1.12.3 Fan Monitoring Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. The level of monitoring and control is dependent on the hardware monitoring ASIC used with the Desktop Board. For information about Refer to The functions of the fan headers Section 1.13.2.2, page 43 1.12.4 Chassis Intrusion and Detection The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position. 1.13 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Resume on Ring ⎯ Wake from USB ⎯ Wake from PS/2 devices ⎯ Power Management Event signal (PME#) wake-up support ⎯ PCI Express WAKE# signal support 1.13.1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include: • Plug and Play (including bus and device enumeration) • Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives • Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state • A Soft-off feature that enables the operating system to power-off the computer • Support for multiple wake-up events (see Table 9 on page 42) • Support for a front panel power and sleep mode switch 39 Intel Desktop Board D975XBX2 Technical Product Specification Table 7 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 7. Effects of Pressing the Power Switch If the system is in this …and the power switch is state… pressed for …the system enters this state Off Less than four seconds Power-on (ACPI G2/G5 – Soft off) (ACPI G0 – working state) On Less than four seconds Soft-off/Standby (ACPI G0 – working state) (ACPI G1 – sleeping state) On More than four seconds Fail safe power-off (ACPI G0 – working state) (ACPI G2/G5 – Soft off) Sleep Less than four seconds Wake-up (ACPI G1 – sleeping state) (ACPI G0 – working state) Sleep More than four seconds Power-off (ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off) 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. 40 Product Description Table 8 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 8. Power States and Targeted System Power Processor Targeted System (Note 1) Global States Sleeping States States Device States Power G0 – working S0 – working C0 – working D0 – working Full power > 30 W state state. G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 52.5 W state stopped grant device specification specific. (Note 2) G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W state RAM. Context except for saved to RAM. wake-up logic. (Note 2) G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W state disk. Context except for saved to disk. wake-up logic. (Note 2) G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W Context not saved. except for Cold boot is wake-up logic. required. G3 – No power to the No power D3 – no power for No power to the system. mechanical off system. wake-up logic, Service can be performed except when safely. AC power is provided by disconnected battery or from the external source. computer. Notes: 1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply. 2. Dependent on the standby power consumption of wake-up devices used in the system. 41 Intel Desktop Board D975XBX2 Technical Product Specification 1.13.1.2 Wake-up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states. Table 9. Wake-up Devices and Events These devices/events can wake up the computer… …from this state (Note) LAN S1, S3, S4, S5 Modem (back panel Serial Port A) S1, S3 (Note) PME# signal S1, S3, S4, S5 Power switch S1, S3, S4, S5 PS/2 devices S1, S3 RTC alarm S1, S3, S4, S5 USB S1, S3 WAKE# S1, S3, S4, S5 Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On will enable a wake-up event from LAN in the S5 state. NOTE � The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events. 1.13.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The board provides several power management hardware features, including: • Power connector • Fan headers • LAN wake capabilities • Instantly Available PC technology • Resume on Ring • Wake from USB • Wake from PS/2 keyboard • PME# signal wake-up support • WAKE# signal wake-up support LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. 42 Product Description Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal). NOTE � The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support. 1.13.2.1 Power Connector When an ACPI-enabled system receives the appropriate command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. For information about Refer to The location of the main power connector Figure 20, page 59 The signal names of the main power connector Table 24, page 63 1.13.2.2 Fan Headers The function/operation of the fan headers is as follows: • The fans are on when the board is in the S0 or S1 state. • The fans are off when the board is off or in the S3, S4, or S5 state. • Each fan header is wired to a fan tachometer input of the hardware monitoring and fan control ASIC • All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed • All fan headers have a +12 V DC connection For information about Refer to The location of the fan headers Figure 20, page 59 The location of the fan headers and sensors for thermal monitoring Figure 13, page 38 The signal names of the fan headers Section 2.7.1.1, page 57 43 Intel Desktop Board D975XBX2 Technical Product Specification 1.13.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in the following ways: • The PCI Express WAKE# signal • The PCI Conventional bus PME# signal for PCI 2.2 compliant LAN designs • The onboard LAN subsystem 1.13.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to- RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 9 on page 42 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers. 1.13.2.5 Resume on Ring The operation of Resume on Ring can be summarized as follows: • Resumes operation from ACPI S1 or S3 states • Detects incoming call similarly for external and internal modems • Requires modem interrupt be unmasked for correct operation 44 Product Description 1.13.2.6 Wake from USB USB bus activity wakes the computer from ACPI S1 or S3 states. NOTE � Wake from USB requires the use of a USB peripheral that supports Wake from USB. 1.13.2.7 Wake from PS/2 Devices PS/2 device activity wakes the computer from an ACPI S1 or S3 state. 1.13.2.8 PME# Signal Wake-up Support When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS). 1.13.2.9 WAKE# Signal Wake-up Support When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state. 1.13.2.10 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 14 shows the location of the standby power indicator LED on the D975XBX2 board. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. OM18534 Figure 14. Location of the Standby Power Indicator LED 45 Intel Desktop Board D975XBX2 Technical Product Specification 1.14 Onboard Power Button CAUTION Electrostatic discharge (ESD) can damage components. The onboard power button should be used only at an ESD workstation using an antistatic wrist strap and a conductive foam pad. If such a station is not available, some ESD protection can be provided by wearing an antistatic wrist strap and attaching it to a metal part of the computer chassis. The board provides a power button that can be used to turn the computer on or off. This button is intended for use at integration facilities to remove standby power before making changes to the system configuration, or for testing purposes. The power button on the front panel is recommended for all other instances of turning the computer on or off. To turn the computer off using the onboard power button, keep the button pressed down for three seconds. Figure 15. Location of the Onboard Power Button 46 Product Description 1.15 Onboard LEDs In addition to the standby power indicator, the board contains two LEDs that indicate the following: • The CPU LED indicates an elevated temperature on the processor that could effect performance • The VR LED indicates an elevated temperature in the processor voltage regulator circuit that could effect performance Figure 16 shows the locations of the LEDs. Item Description LED Color A CPU LED Red B VR LED Red Figure 16. Location of the CPU and Processor Voltage Regulator LEDs 47 Intel Desktop Board D975XBX2 Technical Product Specification 1.16 Trusted Platform Module (Optional) The optional Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today’s software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The TPM is specifically designed to shield unencrypted keys and platform authentication information from software-based attacks. For information about Refer to TPM http://www.intel.com/design/motherbd/bx2/ 48 2 Technical Reference What This Chapter Contains 2.1 Memory Resources ........................................................................... 49 2.2 DMA Channels.................................................................................. 51 2.3 Fixed I/O Map .................................................................................. 52 2.4 PCI Configuration Space Map ............................................................. 53 2.5 Interrupts........................................................................................ 54 2.6 PCI Conventional Interrupt Routing Map.............................................. 55 2.7 Connectors ...................................................................................... 56 2.8 Jumper Block ................................................................................... 70 2.9 Mechanical Considerations ................................................................. 71 2.10 Electrical Considerations.................................................................... 74 2.11 Thermal Considerations..................................................................... 76 2.12 Reliability......................................................................................... 78 2.13 Environmental.................................................................................. 79 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes 8 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 8 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: • BIOS/SPI Flash device (8 Mbit) • Local APIC (19 MB) • Digital Media Interface (40 MB) • Front side bus interrupts (17 MB) • PCI Express configuration space (256 MB) • MCH base address registers, internal graphics ranges, PCI Express ports (up to 512 MB) • Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express add-in cards The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 17 shows a schematic of 49 Intel Desktop Board D975XBX2 Technical Product Specification the system memory map. All installed system memory can be used when there is no overlap of system addresses. 8 GB Top of System Address Space Upper 4 GB of address space FLASH APIC ~20 MB Reserved PCI Memory Range - contains PCI, chipsets, 1 MB Direct Media Interface 0FFFFFH (DMI), and ICH ranges Upper BIOS (approximately 750 MB) area (64 KB) 0F0000H 960 KB 0EFFFFH Lower BIOS area Top of usable (64 KB; DRAM (memory 16 KB x 4) visible to the 0E0000H 896 KB operating system) 0DFFFFH Add-in Card BIOS and Buffer area (128 KB; 16 KB x 8) 0C0000H DRAM 768 KB 0BFFFFH Range Standard PCI/ ISA Video Memory (SMM 1 MB Memory) 128 KB 640 KB 0A0000H 640 KB DOS 09FFFFH Compatibility DOS area Memory (640 KB) 00000H 0 MB 0 KB OM18311 Figure 17. Detailed System Memory Address Map 50 Technical Reference 2.1.2 Memory Map Table 10 lists the system memory map. Table 10. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used. 640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by memory manager software) 512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory 0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory 2.2 DMA Channels Table 11. DMA Channels DMA Channel Number Data Width System Resource 0 8 or 16 bits Open 1 8 or 16 bits Parallel port 2 8 or 16 bits Diskette drive 3 8 or 16 bits Parallel port (for ECP or EPP) 4 8 or 16 bits DMA controller 5 16 bits Open 6 16 bits Open 7 16 bits Open 51 Intel Desktop Board D975XBX2 Technical Product Specification 2.3 Fixed I/O Map Table 12. I/O Map Address (hex) Size Description 0000 - 00FF 256 bytes Used by the Desktop Board D975XBX2. Refer to the ICH7-R/ICH7-DH data sheet for dynamic addressing information. 0170 - 0177 8 bytes Secondary Parallel ATA IDE channel command block 01F0 - 01F7 8 bytes Primary Parallel ATA IDE channel command block (Note 1) 0228 - 022F 8 bytes LPT3 (Note 1) 0278 - 027F 8 bytes LPT2 (Note 1) 02E8 - 02EF 8 bytes COM4 (Note 1) 02F8 - 02FF 8 bytes COM2 0374 - 0377 4 bytes Secondary Parallel ATA IDE channel control block 0377, bits 6:0 7 bits Secondary IDE channel status port 0378 - 037F 8 bytes LPT1 03E8 - 03EF 8 bytes COM3 03F0 - 03F5 6 bytes Diskette channel 03F4 – 03F7 1 byte Primary Parallel ATA IDE channel control block 03F8 - 03FF 8 bytes COM1 04D0 - 04D1 2 bytes Edge/level triggered PIC LPTn + 400 8 bytes ECP port, LPTn base address + 400h (Note 2) 0CF8 - 0CFB 4 bytes PCI Conventional bus configuration address register (Note 3) 0CF9 1 byte Reset control register 0CFC - 0CFF 4 bytes PCI Conventional bus configuration data register FFA0 - FFA7 8 bytes Primary Parallel ATA IDE bus master registers FFA8 - FFAF 8 bytes Secondary Parallel ATA IDE bus master registers Notes: 1. Default, but can be changed to another address range. 2. Dword access only. 3. Byte access only. � NOTE Some additional I/O addresses are not available due to ICH7-R/ICH7-DH address aliasing. The ICH7-R/ICH7-DH data sheet provides more information on address aliasing. For information about Refer to Obtaining the ICH7-R/ICH7-DH data sheet Section 1.2 on page 17 52 Technical Reference 2.4 PCI Configuration Space Map Table 13. PCI Configuration Space Map Bus Device Function Number (hex) Number (hex) Number (hex) Description 00 00 00 Memory controller of Intel 82975X component 00 01 00 PCI Express x16 graphics port 00 1B 00 Intel High Definition Audio controller 00 1C 00 PCI Express port 1 00 1C 01 PCI Express port 2 (Gigabit Ethernet controller bridge) 00 1C 02 PCI Express port 3 00 1C 03 PCI Express port 4 (not used) 00 1D 00 USB UHCI controller 1 00 1D 01 USB UHCI controller 2 00 1D 02 USB UHCI controller 3 00 1D 03 USB UHCI controller 4 00 1D 07 EHCI controller 00 1E 00 PCI bridge 00 1F 00 PCI controller 00 1F 01 Parallel ATA IDE controller 00 1F 02 Serial ATA controller 00 1F 03 SMBus controller (Note) 00 00 Gigabit Ethernet controller (Note) 00 00 PCI Conventional bus connector 1 (Note) 01 00 PCI Conventional bus connector 2 (Note) 05 00 IEEE-1394a controller Note: Bus number is dynamic and can change based on add-in cards used. 53 Intel Desktop Board D975XBX2 Technical Product Specification 2.5 Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH7-R/ICH7-DH component. The PIC is supported in Microsoft Windows 98 SE and Microsoft Windows ME and uses the first 16 interrupts. The APIC is supported in Microsoft Windows 2000 and Microsoft Windows XP and supports a total of 24 interrupts. Table 14. Interrupts IRQ System Resource NMI I/O channel check 0 Reserved, interval timer 1 Reserved, keyboard buffer full 2 Reserved, cascade interrupt from slave PIC 3 User available (Note 1) 4 COM1 5 User available 6 Diskette drive (Note 1) 7 LPT1 8 Real-time clock 9 User available 10 User available 11 User available 12 Onboard mouse port (if present, else user available) 13 Reserved, math coprocessor 14 Primary Parallel ATA/Serial ATA – Legacy Mode (if present, else user available) 15 Secondary Parallel ATA/Serial ATA – Legacy Mode (if present, else user available) (Note 2) 16 User available (through PIRQA) (Note 2) 17 User available (through PIRQB) (Note 2) 18 User available (through PIRQC) (Note 2) 19 User available (through PIRQD) (Note 2) 20 User available (through PIRQE) (Note 2) 21 User available (through PIRQF) (Note 2) 22 User available (through PIRQG) (Note 2) 23 User available (through PIRQH) Notes: 1. Default, but can be changed to another IRQ. 2. Available in APIC mode only. 54 Technical Reference 2.6 PCI Conventional Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI Conventional bus connectors and onboard PCI Conventional devices. The PCI Conventional specification describes how interrupts can be shared between devices attached to the PCI Conventional bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices. In some special cases where maximum performance is needed from a device, a PCI Conventional device should not share an interrupt with other PCI Conventional devices. Use the following information to avoid sharing an interrupt with a PCI Conventional add-in card. PCI Conventional devices are categorized as follows to specify their interrupt grouping: • INTA: By default, all add-in cards that require only one interrupt are in this category. For almost all cards that require more than one interrupt, the first interrupt on the card is also classified as INTA. • INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is classified as INTB. (This is not an absolute requirement.) • INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a fourth interrupt is classified as INTD. The ICH7-R/ICH7-DH has eight Programmable Interrupt Request (PIRQ) input signals. All PCI Conventional interrupt sources either onboard or from a PCI Conventional add-in card connect to one of these PIRQ signals. Some PCI Conventional interrupt sources are electrically tied together on the board and therefore share the same interrupt. Table 15 shows an example of how the PIRQ signals are routed. Table 15. PCI Interrupt Routing Map ICH7-R/ICH7-DH PIRQ Signal Name PCI Interrupt Source PIRQA PIRQB PIRQC PIRQD PIRQE PIRQF PIRQG PIRQH PCI bus connector 1 INTD INTA INTB INTC PCI bus connector 2 INTD INTC INTA INTB IEEE-1394a controller INTA Discrete SATA Controller INTA NOTE � In PIC mode, the ICH7-R/ICH7-DH can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 6, 7, 9, 10, 11, 12, 14, and 15). Typically, a device that does not share a PIRQ line will have a unique interrupt. However, in certain interrupt- constrained situations, it is possible for two or more of the PIRQ lines to be connected to the same IRQ signal. Refer to Table 14 for the allocation of PIRQ lines to IRQ signals in APIC mode. PCI interrupt assignments to the USB ports, Serial ATA ports, and PCI Express ports are dynamic. 55 Intel Desktop Board D975XBX2 Technical Product Specification 2.7 Connectors CAUTION Only the following connectors have overcurrent protection: back panel USB, front panel USB, and PS/2. The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. This section describes the board’s connectors. The connectors can be divided into these groups: • Back panel I/O connectors • Component-side I/O connectors and headers (see page 59) 2.7.1 Back Panel Connectors The back panel configuration is dependent upon which audio subsystem is present. The configurations are as follows: • 8-channel (7.1) audio subsystem (five analog audio output connectors and two digital audio output connectors), described on page 57 • 6-channel (5.1) audio subsystem (three analog audio output connectors), described on page 58 56 Technical Reference 2.7.1.1 Back Panel Connectors For 8-Channel (7.1) Audio Subsystem Figure 18 shows the location of the back panel connectors for boards equipped with the 8-channel (7.1) audio subsystem. A D F H I J K MN B C E G L OM18535 Item Description PS/2 mouse port A PS/2 keyboard port B Serial port A C Parallel port D Digital audio out coaxial E IEEE-1394a connector F G USB ports (four) LAN H Center channel and LFE (subwoofer) audio out/ Retasking Jack G I Surround left/right channel audio out/Retasking Jack H J Audio line in/Retasking Jack C K L Digital audio out optical M Mic in/Retasking Jack B N Front left/right channel audio out/Two channel audio line out/Retasking Jack D Figure 18. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem NOTE � The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. 57 Intel Desktop Board D975XBX2 Technical Product Specification 2.7.1.2 Back Panel Connectors For 6-Channel (5.1) Audio Subsystem Figure 19 shows the location of the back panel connectors for boards equipped with the 6-channel (5.1) audio subsystem. A DF G HI BCE OM18536 Item Description PS/2 mouse port A PS/2 keyboard port B Serial port A C Parallel port D E USB ports (four) LAN F Audio line in/Retasking Jack C G H Mic in/Retasking Jack B Front left/right channel audio out/Two channel audio line out/Retasking Jack D I Figure 19. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem NOTE � The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. 58 Technical Reference 2.7.2 Component-side Connectors and Headers Figure 20 shows the locations of the component-side connectors and headers. Figure 20. Component-side Connectors and Headers Table 16 lists the component-side connectors and headers identified in Figure 20. 59 Intel Desktop Board D975XBX2 Technical Product Specification Table 16. Component-side Connectors and Headers Shown in Figure 20 Item/callout from Figure 20 Description A Auxiliary rear fan header B PCI Conventional bus add-in card connector 2 PCI Express x16 (electrical x4) bus add-in card connector C PCI Conventional bus add-in card connector 1 D E Secondary PCI Express x16 (electrical x8) bus add-in card connector F Front panel audio header G Primary PCI Express x16 (electrical x16 or x8) bus add-in card connector Rear chassis fan header H I Auxiliary PCI Express Graphics Power connector (optional) J ATAPI CD-ROM connector (optional) K Processor core power connector MCH fan header (optional) L Processor fan header M N Main power connector O Diskette drive connector Chassis intrusion header P Parallel ATA IDE connector Q R Serial ATA connector 3 (ICH7-R/ICH7-DH RAID) S Serial ATA connector 2(ICH7-R/ICH7-DH RAID) Serial ATA connector 1 (ICH7-R/ICH7-DH RAID) T Front chassis fan header U V Serial ATA connector 0 (ICH7-R/ICH7-DH RAID) W Auxiliary front panel power LED header Front panel USB headers X Front panel IEEE-1394a header [blue] (optional) Y Z Serial ATA connector 7 (Discrete RAID) (optional) AA Serial ATA connector 6 (Discrete RAID) (optional) Serial ATA connector 5 (Discrete RAID) (optional) BB Serial ATA RAID connector compatible with external Serial ATA adapter (optional) CC DD SCSI hard drive activity indicator LED header (optional) EE Front panel header 60 Technical Reference Table 17. ATAPI CD-ROM Connector (Optional) Pin Signal Name 1 Left audio input from CD-ROM 2 CD audio differential ground 3 CD audio differential ground 4 Right audio input from CD-ROM Table 18. Front Panel Audio Header Pin Signal Name Pin Signal Name 1 Port E [Port 1] Left Channel 2 Ground 3 Port E [Port 1] Right Channel 4 Presence# (dongle present) 5 Port F [Port 2] Right Channel 6 Port E [Port 1] Sense return (jack detection) 7 Port E [Port 1] and Port F [Port 2] 8 Key Sense send (jack detection) 9 Port F [Port 2] Left Channel 10 Port F [Port 2] Sense return (jack detection) INTEGRATOR’S NOTE # The front panel audio header is colored yellow. Table 19. Front Chassis, Rear Chassis, and MCH Fan Headers Pin Signal Name 1 Control 2 +12 V 3 Tach Table 20. Processor Fan and Auxiliary Rear Fan Header Pin Signal Name 1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL 61 Intel Desktop Board D975XBX2 Technical Product Specification Table 21. Chassis Intrusion Header Pin Signal Name 1 Intruder 2 Ground Table 22. SCSI Hard Drive Activity LED Header (Optional) Pin Signal Name 1 ACT# 2 No connect Table 23. Serial ATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground 62 Technical Reference 2.7.2.1 Power Supply Connectors The board has three power supply connectors: • Main power – a 2 x 12 connector. The board requires a power supply with a 2 x 12 main power cable. • Processor core power – This connector provides power directly to the processor voltage regulator and must always be used. Depending on manufacturing options, the board will contain either a 2 x 4 or a 2 x 2 connector for the processor voltage regulator. • Auxiliary PCI Express graphics power – a 1 x 4 connector. This connector provides the required additional power when using high power (75 W or greater) add-in cards in either or both the Secondary PCI Express x16 (electrical x8) and the PCI Express x16 (electrical x4) bus add-in card connectors. CAUTION Regardless of the connector type (2 x 4 or a 2 x 2), the Processor core power connector must always be used. Failure to do so will prevent the board from booting. If the board is equipped with a 2 x 4 power connector, you must use a power supply with a dual-rail 2 x 4 Processor core power cable. Failure to do so may cause damage to the board. CAUTION If high power (75 W or greater) add-in cards are installed in either or both the Secondary PCI Express x16 (electrical x8) and the PCI Express x16 (electrical x4) bus add-in card connectors, the Auxiliary PCI Express graphics power connector must be used. Failure to do so may cause damage to the board and the add-in cards. 63 Intel Desktop Board D975XBX2 Technical Product Specification Table 24. Main Power Connector Pin Signal Name Pin Signal Name 1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/off) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Good) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V 11 +12 V 23 +5 V 12 2 x 12 connector detect 24 Ground Table 25. Processor Core Power Connector (2 x 4 Pin) Pin Signal Name Pin Signal Name 1 Ground 5 +12 V – Rail 1 2 Ground 6 +12 V – Rail 1 3 Ground 7 +12 V – Rail 2 4 Ground 8 +12 V – Rail 2 Table 26. Processor Core Power Connector (2 x 2 Pin) Pin Signal Name Pin Signal Name 1 Ground 2 +12 V 2 Ground 4 +12 V Table 27. Auxiliary PCI Express Graphics Power Pin Signal Name 1 +12 V 2 1 x 4 connector detect 3 Ground 4 +5 V 64 Technical Reference 2.7.2.2 Add-in Card Connectors The board has the following add-in card connectors: • Primary PCI Express x16 (electrical x16 or x8) bus add-in card connector; one connector supporting simultaneous transfers up to 8 GBytes/sec • Secondary PCI Express x16 (electrical x8) bus add-in card connector; one connector supporting simultaneous transfers up to 4 GBytes/sec • PCI Express x16 (electrical x4) add-in card connector; one connector supporting simultaneous transfers up to 1 GBytes/sec. This connector can also be used for PCI Express x1 add-in cards. • PCI Conventional (rev 2.2 compliant) bus; two PCI Conventional bus add-in card connectors. Note the following considerations for the PCI Conventional bus connectors: • All of the PCI Conventional bus connectors are bus master capable. • SMBus signals are routed to both PCI Conventional bus connectors. This enables PCI Conventional bus add-in boards with SMBus support to access sensor data on the Desktop Board. The specific SMBus signals are as follows: ⎯ The SMBus clock line is connected to pin A40. ⎯ The SMBus data line is connected to pin A41. 2.7.2.3 Auxiliary Front Panel Power/Sleep LED Header Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. Table 28. Auxiliary Front Panel Power/Sleep LED Header Pin Signal Name In/Out Description 1 HDR_BLNK_GRN Out Front panel green LED 2 Not connected 3 HDR_BLNK_YEL Out Front panel yellow LED 65 Intel Desktop Board D975XBX2 Technical Product Specification 2.7.2.4 Front Panel Header This section describes the functions of the front panel header. Table 29 lists the signal names of the front panel header. Figure 21 is a connection diagram for the front panel header. Table 29. Front Panel Header Pin Signal In/ Description Pin Signal In/ Description Out Out Hard Drive Activity LED Power LED [Orange] [Green] 1 HD_PWR Out Hard disk LED pull-up 2 HDR_BLNK_ Out Front panel green to +5 V GRN LED 3 HAD# Out Hard disk active LED 4 HDR_BLNK_ Out Front panel yellow YEL LED Reset Switch On/Off Switch [Blue] [Red] 5 Ground Ground 6 FPBUT_IN In Power switch 7 FP_RESET# In Reset switch 8 Ground Ground Power Not Connected 9 +5 V Power 10 N/C Not connected +5 V DC N/C 9 87 Power Reset Switch Switch 65 4 3 - Hard Drive Activity LED 2 1 + Dual- Single- colored colored Power LED Power LED OM18331 Figure 21. Connection Diagram for Front Panel Header 66 - + + - Technical Reference 2.7.2.4.1 Hard Drive Activity LED Header [Orange] Pins 1 and 3 [Orange] can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: • A Serial ATA hard drive connected to an onboard Serial ATA connector • An IDE hard drive connected to an onboard IDE connector 2.7.2.4.2 Reset Switch Header [Blue] Pins 5 and 7 [Blue] can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.7.2.4.3 Power/Sleep LED Header [Green] Pins 2 and 4 [Green] can be connected to a one- or two-color LED. Table 30 shows the possible states for a one-color LED. Table 31 shows the possible states for a two-color LED. Table 30. States for a One-Color Power LED LED State Description Off Power off/sleeping Steady Green Running Table 31. States for a Two-Color Power LED LED State Description Off Power off Steady Green Running Steady Yellow Sleeping � NOTE The colors listed in Table 30 and Table 31 are suggested colors only. Actual LED colors are product- or customer-specific. 2.7.2.4.4 Power Switch Header [Red] Pins 6 and 8 [Red] can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal. 67 Intel Desktop Board D975XBX2 Technical Product Specification 2.7.2.5 Front Panel USB Headers Figure 22 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES # • The +5 V DC power on the USB headers is fused. • Pins 1, 3, 5, and 7 comprise one USB port. • Pins 2, 4, 6, and 8 comprise one USB port. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-performance USB devices. Power Power 1 2 (+5 V DC) (+5 V DC) D- D- One One 3 4 USB USB Port Port D+ D+ 5 6 Ground 7 8 Ground 10 Key (no pin) No connect OM18317 Figure 22. Connection Diagram for Front Panel USB Headers 68 Technical Reference 2.7.2.6 Front Panel IEEE 1394a Header (Optional) Figure 23 is a connection diagram for the IEEE 1394a header. TPA+ 1 2 TPA- Ground 3 4 Ground TPB+ 5 6 TPB- +12 V DC 7 8 +12 V DC Key (no pin) Ground 10 OM18316 Figure 23. Connection Diagram for Front Panel IEEE 1394a Header INTEGRATOR’S NOTES # • The IEEE 1394a header is blue. • The +12 V DC power on the IEEE 1394a header is fused. • The IEEE 1394a header provides one IEEE 1394a port. 69 Intel Desktop Board D975XBX2 Technical Product Specification 2.8 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 24 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode. Table 32 describes the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match. Figure 24. Location of the Jumper Block Table 32. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 The BIOS uses current configuration information and passwords for booting. 32 1 Configure 2-3 After the POST runs, Setup runs automatically. The maintenance menu is displayed. 32 1 Recovery None The BIOS attempts to recover the BIOS configuration. A recovery diskette is required. 32 1 70 Technical Reference 2.9 Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 25 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. Figure 25. Board Dimensions 71 Intel Desktop Board D975XBX2 Technical Product Specification 2.9.2 I/O Shield The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to pass certification testing. Figure 26 shows the I/O shield for boards with the 8-channel (7.1) audio subsystem. Figure 27 shows the I/O shield for boards with the 6-channel (5.1) audio subsystem. Dimensions are given in inches to a tolerance of ±0.02 inches. The figures also indicate the position of each cutout. Additional design considerations for I/O shields relative to chassis requirements are described in the ATX specification. NOTE � The I/O shield drawings in this document are for reference only. I/O shields compliant with the ATX chassis specification are available from Intel. 162.3 REF [6.390] 1.6 – 0.12 [0.063 – 0.005] 20 – 0.254 TYP [0.787 – 0.10] 159.2 – 0.12 1.55 REF [0.061] [6.268 – 0.005] 22.45 [0.884] 8x R 0.5 MIN 7.01 [0.276]  1.00 [0.039] A A 0.00 11.81 [0.00] [0.465] 11.81 14.17 [0.465] [0.558] 12.04 [0.474] 12.81 [0.504] Pictorial View OM18540 Figure 26. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem 72 0.00 [0.00] 8.81 [0.347] 20.28 [0.799] 26.91 [1.059] 61.54 [2.423] 93.74 [3.690] 113.63 [4.473] 146.88 [5.783] Technical Reference 162.3 REF [6.390] 1.6 – 0.12 [0.063 – 0.005] 20 – 0.254 TYP [0.787 – 0.10] 1.55 REF 159.2 – 0.12 [0.061] [6.268 – 0.005] 22.45 [0.884] 8x R 0.5 MIN 7.012 [0.276]  1.00 [0.039] A A 0.00 11.81 [0.00] [0.465] 11.811 14.17 [0.465] [0.558] 12.04 [0.474] Pictorial View OM18541 Figure 27. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem 73 0.00 [0.00] 8.805 [0.347] 20.283 [0.799] 26.911 [1.059] 93.74 [3.690] 113.63 [4.473] 146.88 [5.783] Intel Desktop Board D975XBX2 Technical Product Specification 2.10 Electrical Considerations 2.10.1 DC Loading Table 33 lists the DC loading characteristics of the board. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems. The analysis does not include PCI add-in cards. Minimum values assume a light load placed on the board that is similar to an environment with no applications running and no USB current draw. Maximum values assume a load placed on the board that is similar to a heavy gaming environment with a 500 mA current draw per USB port. These calculations are not based on specific processor values or memory configurations but are based on the minimum and maximum current draw possible from the board’s power delivery subsystems to the processor, memory, and USB ports. Use the datasheets for add-in cards, such as PCI, to determine the overall system power requirements. The selection of a power supply at the system level is dependent on the system’s usage model and not necessarily tied to a particular processor clock frequency. Table 33. DC Loading Characteristics DC Current at: Mode DC Power +3.3 V +5 V +12 V -12 V +5 VSB Minimum loading 300 W 5 A 11 A 19 A 0 A 0.34 A (S0) 1.25 A (S3) Maximum loading 750 W 25 A 27 A 46 A 0.40 A 0.34 A (S0) 1.25 A (S3) 2.10.2 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for the desktop board is as follows: a fully loaded board (all five expansion slots) must not exceed 10 A. 74 Technical Reference 2.10.3 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 34 lists the current capability of the fan headers. Table 34. Fan Header Current Capability Fan Connector Maximum Available Current Processor fan 3.0 A Front chassis fan 1.5 A Rear chassis fan 1.5 A Auxiliary rear fan 3.0 A MCH fan (optional) 1.5 A 2.10.4 Power Supply Considerations CAUTION The +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. System integrators should refer to the power usage values listed in Table 33 when selecting a power supply for use with the board. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the following recommendations found in the ATX form factor specification. • The potential relation between 3.3 VDC and +5 VDC power rails • The current capability of the +5 VSB line • All timing parameters • All voltage tolerances 75 Intel Desktop Board D975XBX2 Technical Product Specification 2.11 Thermal Considerations This board features a thermal protection circuit in the processor voltage regulator area. This circuit protects the processor voltage regulator from overheating and damaging the board. The thermal protection circuit in the processor voltage regulator sensor is o triggered at approximately 120 C. This trigger will cause the processor to enter a throttling mode (slowing down the processor if it exceeds its maximum operating temperature) and allow the processor voltage regulator to cool down. INTEGRATOR’S NOTE # Use a processor heatsink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area. CAUTION When using BIOS Setup program options to increase processor voltage and frequency above the supported ranges, the temperature in the processor voltage regulator area will rise. This area of the board will require increased airflow. Direct airflow over the processor voltage regulator is crucial to preventing throttling and keeping the processor voltage regulator area cool. This is particularly important when using liquid cooling. All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. Figure 28 shows the locations of the localized high temperature zones. 76 Technical Reference Item Description A Intel 82801G ICH7-R/ICH7-DH B Intel 82975X MCH C Processor voltage regulator area D Processor Figure 28. Localized High Temperature Zones CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.13. 77 Intel Desktop Board D975XBX2 Technical Product Specification Table 35 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 35. Thermal Considerations for Components Component Temperature o Intel 82801G ICH7-R/ICH7-DH 110 C (under bias) o Intel 82975X MCH 99 C (under bias) Processor For processor case temperature, see processor datasheets and processor specification updates o Processor voltage regulator area 120 C (under bias) NOTE � o For hardware monitoring application software, an alert point of 110 C is recommended as a starting point for the processor voltage regulator area. For information about Refer to Intel Pentium 4 processor datasheets and specification updates Section 1.2, page 17 2.12 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 99,721 hours. 78 Technical Reference 2.13 Environmental Table 36 lists the environmental specifications for the board. Table 36. Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +70 °C Operating 0 °C to +55 °C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second² Packaged Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz 20 Hz to 500 Hz: 0.02 g² Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat) 40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz 79 Intel Desktop Board D975XBX2 Technical Product Specification 80 3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction..................................................................................... 81 3.2 Resource Configuration ..................................................................... 82 3.3 System Management BIOS (SMBIOS) ................................................. 83 3.4 Watchdog Timer ............................................................................... 83 3.5 Legacy USB Support ......................................................................... 84 3.6 BIOS Updates .................................................................................. 84 3.7 Boot Options.................................................................................... 85 3.8 BIOS Security Features ..................................................................... 87 3.1 Introduction The BIOS is stored in the Serial Peripheral Interface (SPI) Flash device and can be updated using a disk-based program. The SPI contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as BX97520J.86A. When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below. Maintenance Main Advanced Performance Security Power Boot Exit NOTE � The maintenance menu is displayed only when the board is in configure mode. Section 2.8 on page 70 shows how to put the board in configure mode. The performance menu is an optional menu and not present on all versions of the board. 81 Intel Desktop Board D975XBX2 Technical Product Specification Table 37 lists the BIOS Setup program menu features. Table 37. BIOS Setup Program Menu Bar Menu Function Maintenance Clears passwords and displays processor information Main Displays processor and memory configuration Advanced Configures advanced features available through the chipset Performance Allows adjustment of processor and memory timing parameters Security Sets passwords and security features Power Configures power management features and power supply controls Boot Selects boot options Exit Saves or discards changes to Setup program options Table 38 lists the function keys available for menu screens. Table 38. BIOS Setup Program Function Keys BIOS Setup Program Function Key Description <←> or <→> Selects a different menu screen (moves the cursor left or right) <↑> or <↓> Selects an item (moves the cursor up or down) Selects a field (not implemented) Executes command or selects the submenu Load the default configuration values for the current menu Save the current values and exits the BIOS Setup program Exits the menu 3.2 Resource Configuration 3.2.1 PCI Autoconfiguration The BIOS automatically configures PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card. 3.2.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. The interface also supports second-generation SATA drives. The BIOS determines the capabilities of each drive and configures them to optimize capacity and performance. To take advantage of the high capacities typically available today, hard drives are automatically configured for 82 Overview of BIOS Features Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending on the capability of the drive. You can override the auto-configuration options by specifying manual configuration in the BIOS Setup program. To use ATA-66/100 features the following items are required: • An ATA-66/100 peripheral device • An ATA-66/100 compatible cable • ATA-66/100 operating system device drivers NOTE � Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For example, do not connect an ATA hard drive as a slave to an ATAPI CD- ROM drive. 3.3 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information: • BIOS data, such as the BIOS revision level • Fixed-system data, such as peripherals, serial numbers, and asset tags • Resource data, such as memory size, cache size, and processor clock frequency • Dynamic data, such as event detection and error logging Non-Plug and Play operating systems, such as Microsoft Windows NT*, require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. 3.4 Watchdog Timer The board includes a watchdog timer circuit. The watchdog timer provides automatic recovery after two failed power-on self-tests (POSTs) following use of the BIOS performance menu. 83 Intel Desktop Board D975XBX2 Technical Product Specification 3.5 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used. To install an operating system that supports USB, follow the operating system’s installation instructions. 3.6 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: ® • Intel Express BIOS Update utility, which enables automated updating while in the Microsoft Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a 1.44 MB diskette, or a CD-ROM, or from the file location on the Web. ® • Intel Flash Memory Update Utility, which requires creation of a boot diskette and manual rebooting of the system. Using this utility, the BIOS can be updated from a file on a 1.44 MB diskette or a CD-ROM. Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS. NOTE � Review the instructions distributed with the upgrade utility before attempting a BIOS update. For information about Refer to The Intel World Wide Web site Section 1.2, page 17 84 Overview of BIOS Features 3.6.1 Language Support The BIOS Setup program and help messages are supported in US English. Additional languages are available in the Integrator’s Toolkit utility. Check the Intel website for details. 3.6.2 Custom Splash Screen ® During POST, an Intel splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE � If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about The Intel World Wide Web site Section 1.2, page 17 3.7 Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled. 3.7.1 CD-ROM Boot Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot from the next defined drive. 3.7.2 Network Boot The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full. 85 Intel Desktop Board D975XBX2 Technical Product Specification 3.7.3 Booting Without Attached Devices For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: • Video adapter • Keyboard • Mouse 3.7.4 Changing the Default Boot Device During POST Pressing the key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices (as set in the BIOS setup program’s Boot Device Priority Submenu). Table 39 lists the boot device menu options. Table 39. Boot Device Menu Options Boot Device Menu Function Keys Description <↑> or <↓> Selects a default boot device Exits the menu, saves changes, and boots from the selected device Exits the menu without saving changes 86 Overview of BIOS Features 3.8 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode. • The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode. • If only the supervisor password is set, pressing the key at the password prompt of the BIOS Setup program allows the user restricted access to Setup. • If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered. • Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer. • For enhanced security, use different passwords for the supervisor and user passwords. • Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length. Table 40 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen. Table 40. Supervisor and User Password Functions Password Supervisor Password to Password Set Mode User Mode Setup Options Enter Setup During Boot Neither Can change all Can change all None None None (Note) (Note) options options Supervisor Can change all Can change a Supervisor Password Supervisor None only options limited number of options User only N/A Can change all Enter Password User User options Clear User Password Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or and user set options limited Enter Password user user number of options Note: If no password is set, any user can change all Setup options. 87 Intel Desktop Board D975XBX2 Technical Product Specification 88 4 Error Messages and Beep Codes What This Chapter Contains 4.1 Speaker .......................................................................................... 89 4.2 BIOS Beep Codes ............................................................................. 89 4.3 BIOS Error Messages ........................................................................ 89 4.4 Port 80h POST Codes ........................................................................ 90 4.1 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 14 4.2 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS displays an error message describing the problem (see Table 41). Table 41. Beep Codes Type Pattern Frequency Memory error Three long beeps 1280 Hz Thermal warning Four alternating beeps: High tone: 2000 Hz High tone, low tone, high tone, low tone Low tone: 1600 Hz 4.3 BIOS Error Messages Table 42 lists the error messages and provides a brief description of each. Table 42. BIOS Error Messages Error Message Explanation CMOS Battery Low The battery may be losing power. Replace the battery soon. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values. Memory Size Decreased Memory size has decreased since the last boot. If no memory was removed then memory may be bad. No Boot Device Available System did not find a device to boot. 89 Intel Desktop Board D975XBX2 Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST-codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display. NOTE � The POST card must be installed in PCI bus connector 1. The following tables provide information about the POST codes generated by the BIOS: • Table 43 lists the Port 80h POST code ranges • Table 44 lists the Port 80h POST codes themselves • Table 45 lists the Port 80h POST sequence NOTE � In the tables listed above, all POST codes and range values are listed in hexadecimal. Table 43. Port 80h POST Code Ranges Range Category/Subsystem 00 – 0F Debug codes: Can be used by any PEIM/driver for debug. 10 – 1F Host Processors: 1F is an unrecoverable CPU error. 20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected. 30 – 3F Recovery: 3F indicated recovery failure. 40 – 4F Reserved for future use 50 – 5F I/O buses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI. 60 – 6F Reserved for future use (for new buses) 70 – 7F Output devices: All output consoles. 7F is an unrecoverable error. 80 – 8F Reserved for future use (new output console codes) 90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error. A0 – AF Reserved for future use (new input console codes) B0 – BF Boot devices: Includes fixed media and removable media. BF is an unrecoverable error. C0 – CF Reserved for future use D0 – DF Boot device selection E0 – FF F0 – FF: FF processor exception. E0 – EE: Miscellaneous codes. See Table 44. EF boot/S3: resume failure. 90 Error Messages and Beep Codes Table 44. Port 80h POST Codes POST Code Description of POST Operation Host Processor 10 Power-on initialization of the host processor (Boot Strap Processor) 11 Host processor Cache initialization (including APs) 12 Starting Application processor initialization 13 SMM initialization Chipset 21 Initializing a chipset component Memory 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 24 Programming timing parameters in the memory controller and the DIMMs 25 Configuring memory 26 Optimizing memory settings 27 Initializing memory, such as ECC init 28 Testing memory PCI Bus 50 Enumerating PCI buses 51 Allocating resources to PCI bus 52 Hot Plug PCI controller initialization 53 – 57 Reserved for PCI Bus USB 58 Resetting USB bus 59 Reserved for USB ATA/ATAPI/SATA 5A Resetting PATA/SATA bus and all devices 5B Reserved for ATA SMBus 5C Resetting SMBUS 5D Reserved for SMBUS Local Console 70 Resetting the VGA controller 71 Disabling the VGA controller 72 Enabling the VGA controller Remote Console 78 Resetting the console controller 79 Disabling the console controller 7A Enabling the console controller continued 91 Intel Desktop Board D975XBX2 Technical Product Specification Table 44. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS2 or USB) 90 Resetting keyboard 91 Disabling the keyboard 92 Detecting the presence of the keyboard 93 Enabling the keyboard 94 Clearing keyboard input buffer 95 Instructing keyboard controller to run Self Test (PS2 only) Mouse (PS2 or USB) 98 Resetting mouse 99 Detecting mouse 9A Detecting presence of mouse 9B Enabling mouse Fixed Media B0 Resetting fixed media B1 Disabling fixed media B2 Detecting presence of a fixed media (IDE hard drive detection, etc.) B3 Enabling/configuring a fixed media Removable media B8 Resetting removable media B9 Disabling removable media BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.) BC Enabling/configuring a removable media BDS Dy Trying boot selection y (y=0 to 15) PEI Core E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN EFI_SW_PEI_PC_HANDOFF_TO_NEXT) E2 Permanent memory found E1, E3 Reserved for PEI/PEIMs DXE Core E4 Entered DXE phase E5 Started dispatching drivers E6 Started connecting drivers continued 92 Error Messages and Beep Codes Table 44. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers E7 Waiting for user input E8 Checking password E9 Entering BIOS setup EB Calling Legacy Option ROMs Runtime Phase/EFI OS Boot F4 Entering Sleep state F5 Exiting Sleep state F8 EFI boot service ExitBootServices ( ) has been called F9 EFI runtime service SetVirtualAddressMap ( ) has been called FA EFI runtime service ResetSystem ( ) has been called PEIMs/Recovery 30 Crisis Recovery has initiated per user request 31 Crisis Recovery has initiated by software (corrupt flash) 34 Loading recovery capsule 35 Handing off control to the recovery capsule 3F Unable to recover 93 Intel Desktop Board D975XBX2 Technical Product Specification Table 45. Typical Port 80h POST Sequence POST Code Description 21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loading recovery capsule E4 Entered DXE phase 12 Starting Application processor initialization 13 SMM initialization 50 Enumerating PCI buses 51 Allocating resourced to PCI bus 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 95 Keyboard Self Test EB Calling Video BIOS 58 Resetting USB bus 5A Resetting PATA/SATA bus and all devices 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 5A Resetting PATA/SATA bus and all devices 28 Testing memory 90 Resetting keyboard 94 Clearing keyboard input buffer E7 Waiting for user input 01 INT 19 00 Ready to boot 94 5 Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance...................................................................... 95 5.2 Battery Disposal Information.............................................................103 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board D975XBX2: • Safety regulations • European Union Declaration of Conformity statement • Product Ecology statements • Electromagnetic Compatibility (EMC) regulations • Product certification markings 5.1.1 Safety Regulations Desktop Board D975XBX2 complies with the safety regulations stated in Table 46 when correctly installed in a compatible host system. Table 46. Safety Regulations Regulation Title UL 60950-1:2003/ Information Technology Equipment – Safety - Part 1: General Requirements (USA and Canada) CSA C22.2 No. 60950-1-03 EN 60950-1:2002 Information Technology Equipment – Safety - Part 1: General Requirements (European Union) IEC 60950-1:2001, First Edition Information Technology Equipment – Safety - Part 1: General Requirements (International) 5.1.2 European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board D975XBX2 is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage Directive). 95 Intel Desktop Board D975XBX2 Technical Product Specification The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions. This product follows the provisions of the European Directives 89/336/EEC and 73/23/EEC. Čeština Tento výrobek odpovídá požadavkům evropských směrnic 89/336/EEC a 73/23/EEC. Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 89/336/EEC & 73/23/EEC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 89/336/EEC & 73/23/EEC. Eesti Antud toode vastab Euroopa direktiivides 89/336/EEC ja 73/23/EEC kehtestatud nõuetele. Suomi Tämä tuote noudattaa EU-direktiivin 89/336/EEC & 73/23/EEC määräyksiä. Français Ce produit est conforme aux exigences de la Directive Européenne 89/336/EEC & 73/23/EEC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 89/336/EEC & 73/23/EEC. Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 89/336/ΕΟΚ και 73/23/ΕΟΚ. Magyar E termék megfelel a 89/336/EEC és 73/23/EEC Európai Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 89/336/ EEC & 73/23/EEC. Italiano Questo prodotto è conforme alla Direttiva Europea 89/336/EEC & 73/23/EEC. Latviešu Šis produkts atbilst Eiropas Direktīvu 89/336/EEC un 73/23/EEC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 89/336/EEC ir 73/23/EEC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 89/336/EEC u 73/23/EEC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC & 73/23/EEC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 89/336/EWG i 73/23/EWG. Portuguese Este produto cumpre com as normas da Diretiva Européia 89/336/EEC & 73/23/EEC. 96 Regulatory Compliance and Battery Disposal Information Español Este producto cumple con las normas del Directivo Europeo 89/336/EEC & 73/23/EEC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 89/336/EEC a 73/23/EEC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 89/336/EGS in 73/23/EGS. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 89/336/EEC & 73/23/EEC. Türkçe Bu ürün, Avrupa Birliği’nin 89/336/EEC ve 73/23/EEC yönergelerine uyar. 5.1.3 Product Ecology Statements The following information is provided to address worldwide product ecology concerns and regulations. 5.1.3.1 Disposal Considerations This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly. 5.1.3.2 Recycling Considerations As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to select locations for proper recycling. Please consult the http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. 中文 作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰 当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 97 Intel Desktop Board D975XBX2 Technical Product Specification Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc. Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées. Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc. 日本語 インテルでは、環境保護活動の一環として、使い終えたインテル ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル プログラムを発足させました。 対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/intel/ other/ehs/product_ecology/Recycling_Program.htm （英語）をご覧ください。 Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. 98 Regulatory Compliance and Battery Disposal Information Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada. Consulte o site http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm (em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc. Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm за информацией об этой программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д. Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur. Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm Web sayfasına gidin. 5.1.3.3 Lead Free Desktop Board This desktop board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability. This desktop board is referred to as “Lead-free second level interconnect.” The board substrate and the solder connections from the board to the components (second-level connections) are all lead free. Table 47 shows the various nd forms of the “Lead-Free 2 Level Interconnect” mark as it appears on the board and accompanying collateral. 99 Intel Desktop Board D975XBX2 Technical Product Specification Table 47. Lead-Free Board Markings Description Mark nd Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board substrate and the or solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm). or 100 Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Desktop Board D975XBX2 complies with the EMC regulations stated in Table 48 when correctly installed in a compatible host system. Table 48. EMC Regulations Regulation Title FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B, Radio Frequency Devices. (USA) ICES-003 (Class B) Interference-Causing Equipment Standard, Digital Apparatus. (Canada) EN55022: 1998 (Class B) Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union) EN55024: 1998 Information Technology Equipment – Immunity Characteristics Limits and methods of measurement. (European Union) AS/NZS CISPR 22 Australian Communications Authority, Standard for Electromagnetic (Class B) Compatibility. (Australia and New Zealand) CISPR 22, 3rd Edition, Limits and methods of measurement of Radio Disturbance Characteristics (Class B) of Information Technology Equipment. (International) CISPR 24: 1997 Information Technology Equipment – Immunity Characteristics – Limits and Methods of Measurement. (International) VCCI (Class B) Voluntary Control Council for Interference by Information Technology Equipment. (Japan) Japanese Kanji statement translation: this is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual. 101 Intel Desktop Board D975XBX2 Technical Product Specification Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Desktop Board D975XBX2 has the product certification markings shown in Table 49: Table 49. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel desktop boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. Includes Intel name and D975XBX2 model designation. CE mark. Declaring compliance to European Union (EU) EMC directive (89/336/EEC) and Low Voltage directive (73/23/EEC). Australian Communications Authority (ACA) C-tick mark. Includes adjacent Intel supplier code number, N-232. Japan VCCI (Voluntary Control Council for Interference) mark. S. Korea MIC (Ministry of Information and Communication) mark. Includes adjacent MIC certification number: CPU-D975XBX2 For information about MIC certification, go to http://support.intel.com/support/motherboards/desktop/ Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturer’s recognition mark. Consists of a unique V-0 UL recognized manufacturer’s logo, along with a flammability rating (solder side). 102 Regulatory Compliance and Battery Disposal Information 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement. FORHOLDSREGEL Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning. OBS! Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning. VIKTIGT! Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna. VARO Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti. VORSICHT Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend. AVVERTIMENTO Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore. 103 Intel Desktop Board D975XBX2 Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. ATENÇÃO Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região. AŚCIAROŽZNAŚĆ Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі. UPOZORNÌNÍ V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí. Προσοχή Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς. VIGYAZAT Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni. 104 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska. PRECAUŢIE Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului. ВНИМАНИЕ При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям. UPOZORNENIE Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia. POZOR Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. . UYARI Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır. OСТОРОГА Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля. 105 Intel Desktop Board D975XBX2 Technical Product Specification 106