INTEL D845EPI
Specifications
Audio
Audio subsystem for AC ‘97 processing using the Realtek ALC202A codec
BIOS
Intel/AMI BIOS (resident in the 4 Mbit FWH)
Chipset
Intel 845E Chipset
Expansion Capabilities
Three PCI bus add-in card connectors (SMBus routed to PCI bus connector 2)
Form Factor
microATX (9.20 inches by 8.20 inches [233.68 millimeters by 208.28 millimeters])
I/O Control
SMSC LPC47M172 LPC Bus I/O controller or National Semiconductor PC87372
LAN
Intel 82562ET
Processor
Intel Pentium 4
Support for an Intel Pentium 4 processor in an mPGA478 socket with a
USB
Support for USB 2.0 devices
Video
AGP connector supporting 1.5 V 4X AGP cards
Datasheet
Intel=D845EPI=Datasheet1-2113015602.pdf
1379 KiB
Extracted Text
®
Intel Desktop Board D845EPI
Technical Product Specification
July 2003
Order Number: C46810-001
®
The Intel Desktop Board D845EPI may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized
errata are documented in the Intel Desktop Board D845EPI Specification Update.
Revision History
Revision Revision History Date
®
-001 First release of the Intel Desktop Board D845EPI Technical Product July 2003
Specification.
®
This product specification applies to only standard Intel Desktop Board D845EPI with BIOS
identifier VA84510A.86A.
Changes to this specification will be published in the Intel Desktop Board D845EPI Specification
Update before being incorporated into a revision of this document.
®
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS
PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE
OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL
PROPERTY RIGHT.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does
not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
Intel products are not intended for use in medical, life saving, or life sustaining applications or for any other application in
which the failure of the Intel product could create a situation where personal injury or death may occur.
Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
®
The Intel Desktop Board D845EPI may contain design defects or errors known as errata that may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other countries 708-296-9333.
Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other
countries.
†
Other names and brands may be claimed as the property of others.
Copyright 2003, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
®
power and environmental requirements, and the BIOS for the Intel Desktop Board D845EPI. It
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board D845EPI
and their components to the vendors, system integrators, and other engineers and technicians who
need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D845EPI
2 A map of the resources of the Desktop Board
3 The features supported by the BIOS Setup program
4 The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
✏
Notes call attention to important information.
INTEGRATOR’S NOTES
�
Integrator’s notes are used to call attention to information that may be useful to system
integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board D845EPI Technical Product Specification
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Board D845EPI, and X is the instance of the
particular part at that general location. For example, J5J1 is a connector, located at 5J. It is
the first connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
†
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview ....................................................................................................................12
1.1.1 Feature Summary ........................................................................................12
1.1.2 Manufacturing Options .................................................................................13
1.1.3 Board Layout................................................................................................14
1.2 Block Diagram ............................................................................................................15
1.3 Online Support ...........................................................................................................16
1.4 Operating System Support .........................................................................................16
1.5 Design Specifications .................................................................................................17
1.6 Processor ...................................................................................................................20
1.7 System Memory .........................................................................................................21
®
1.8 Intel 845E Chipset ....................................................................................................23
1.8.1 AGP .............................................................................................................23
1.8.2 USB..............................................................................................................24
1.8.3 IDE Interfaces ..............................................................................................24
1.8.4 Real-Time Clock, CMOS SRAM, and Battery...............................................25
1.9 I/O Controller..............................................................................................................26
1.9.1 Serial Ports ..................................................................................................26
1.9.2 Parallel Port..................................................................................................26
1.9.3 Diskette Drive Controller ..............................................................................26
1.9.4 Keyboard and Mouse Interface ....................................................................26
1.10 Audio Subsystem........................................................................................................27
1.10.1 Audio Connectors.........................................................................................27
1.10.2 Audio Subsystem Software ..........................................................................28
1.11 LAN Subsystem (Optional) .........................................................................................28
®
1.11.1 Intel 82562ET Platform LAN Connect Device.............................................28
1.11.2 RJ-45 LAN Connector with Integrated LEDs ................................................28
1.11.3 LAN Subsystem Software ............................................................................29
1.12 Hardware Management Subsystem (Optional) ...........................................................29
1.12.1 Hardware Monitoring and Fan Control ASIC ................................................29
1.12.2 Fan Monitoring .............................................................................................29
1.12.3 Chassis Intrusion and Detection...................................................................29
1.13 Power Management ...................................................................................................30
1.13.1 ACPI.............................................................................................................30
1.13.2 Hardware Support ........................................................................................32
2 Technical Reference
2.1 Introduction.................................................................................................................37
2.2 Memory Map ..............................................................................................................37
2.3 Fixed I/O Map.............................................................................................................38
2.4 DMA Channels ...........................................................................................................39
2.5 PCI Configuration Space Map ....................................................................................39
2.6 Interrupts ....................................................................................................................40
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Intel Desktop Board D845EPI Technical Product Specification
2.7 PCI Interrupt Routing Map..........................................................................................41
2.8 Connectors.................................................................................................................43
2.8.1 Back Panel Connectors................................................................................44
2.8.2 Internal I/O Connectors ................................................................................45
2.8.3 External I/O Connectors...............................................................................50
2.9 Jumper Blocks............................................................................................................54
2.9.1 Front Panel Audio Connector/Jumper Block.................................................54
2.9.2 BIOS Setup Configuration Jumper Block......................................................55
2.10 Mechanical Considerations.........................................................................................56
2.10.1 I/O Shield .....................................................................................................57
2.11 Electrical Considerations ............................................................................................58
2.11.1 DC Loading ..................................................................................................58
2.11.2 Add-in Board Considerations........................................................................58
2.11.3 Fan Connector Current Capability ................................................................58
2.11.4 Power Supply Considerations ......................................................................59
2.12 Thermal Considerations..............................................................................................59
2.13 Reliability ....................................................................................................................61
2.14 Environmental ............................................................................................................61
2.15 Regulatory Compliance ..............................................................................................62
2.15.1 Safety Regulations .......................................................................................62
2.15.2 EMC Regulations .........................................................................................62
2.15.3 European Union Declaration of Conformity Statement .................................63
2.15.4 Product Ecology Statements ........................................................................64
2.15.5 Product Certification Markings (Board Level) ...............................................64
3 Overview of BIOS Features
3.1 Introduction.................................................................................................................65
3.2 BIOS Flash Memory Organization ..............................................................................66
3.3 Resource Configuration..............................................................................................66
3.3.1 PCI Autoconfiguration ..................................................................................66
3.3.2 PCI IDE Support...........................................................................................66
3.4 System Management BIOS (SMBIOS).......................................................................67
3.5 Legacy USB Support ..................................................................................................67
3.6 BIOS Updates ............................................................................................................68
3.6.1 Language Support........................................................................................69
3.6.2 Custom Splash Screen.................................................................................69
3.7 Recovering BIOS Data ...............................................................................................69
3.8 Boot Options...............................................................................................................70
3.8.1 CD-ROM Boot..............................................................................................70
3.8.2 Network Boot................................................................................................70
3.8.3 Booting Without Attached Devices ...............................................................70
3.8.4 Changing the Default Boot Device During POST..........................................70
®
3.9 Fast Booting Systems with Intel Rapid BIOS Boot....................................................71
3.9.1 Peripheral Selection and Configuration ........................................................71
3.9.2 Intel Rapid BIOS Boot ..................................................................................71
3.10 BIOS Security Features..............................................................................................72
vi
Contents
4 BIOS Setup Program
4.1 Introduction.................................................................................................................73
4.2 Maintenance Menu.....................................................................................................74
4.3 Main Menu..................................................................................................................75
4.4 Advanced Menu..........................................................................................................76
4.4.1 PCI Configuration Submenu.........................................................................77
4.4.2 Boot Configuration Submenu .......................................................................78
4.4.3 Peripheral Configuration Submenu...............................................................79
4.4.4 IDE Configuration Submenu.........................................................................81
4.4.5 Diskette Configuration Submenu..................................................................84
4.4.6 Event Log Configuration Submenu...............................................................85
4.4.7 Video Configuration Submenu......................................................................86
4.4.8 USB Configuration Submenu .......................................................................87
4.4.9 Chipset Configuration Submenu...................................................................88
4.5 Security Menu ............................................................................................................90
4.6 Power Menu ...............................................................................................................91
4.6.1 ACPI Submenu ............................................................................................91
4.7 Boot Menu..................................................................................................................92
4.7.1 Boot Device Priority Submenu......................................................................93
4.7.2 Hard Disk Drives Submenu ..........................................................................94
4.7.3 Removable Devices Submenu .....................................................................94
4.7.4 ATAPI CD-ROM Drives Submenu................................................................95
4.8 Exit Menu ...................................................................................................................96
5 Error Messages and Beep Codes
5.1 BIOS Error Messages.................................................................................................97
5.2 Port 80h POST Codes................................................................................................99
5.3 Bus Initialization Checkpoints ...................................................................................103
5.4 Speaker ...................................................................................................................104
5.5 BIOS Beep Codes ....................................................................................................104
Figures
1. Desktop Board D845EPI Components........................................................................14
2. Block Diagram............................................................................................................15
3. Location of the Standby Power Indicator LED on the D845EPI Board ........................35
4. Back Panel Connectors ..............................................................................................44
5. Audio, Power, and Hardware Control Connectors ......................................................46
6. Add-in Board and Peripheral Interface Connectors.....................................................49
7. External I/O Connectors .............................................................................................50
8. Connection Diagram for Front Panel Connector .........................................................51
9. Connection Diagram for Front Panel USB Connector.................................................53
10. Location of the Jumper Blocks....................................................................................54
11. Desktop Board Dimensions ........................................................................................56
12. I/O Shield Dimensions ................................................................................................57
13. Localized High Temperature Zones............................................................................60
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Intel Desktop Board D845EPI Technical Product Specification
Tables
1. Feature Summary.......................................................................................................12
2. Manufacturing Options ...............................................................................................13
3. Specifications .............................................................................................................17
4. Supported System Bus Frequency and Memory Speed Combinations.......................21
5. Supported DDR DIMM Configurations........................................................................22
6. LAN Connector LED States........................................................................................28
7. Effects of Pressing the Power Switch .........................................................................30
8. Power States and Targeted System Power ................................................................31
9. Wake-up Devices and Events.....................................................................................32
10. Fan Connector Function/Operation.............................................................................33
11. System Memory Map..................................................................................................37
12. I/O Map ......................................................................................................................38
13. DMA Channels ...........................................................................................................39
14. PCI Configuration Space Map ....................................................................................39
15. Interrupts ....................................................................................................................40
16. PCI Interrupt Routing Map..........................................................................................42
17. Front Panel Audio Connector .....................................................................................47
18. ATAPI CD-ROM Connector ........................................................................................47
19. ATX12V Power Connector..........................................................................................47
20. Rear Chassis Fan Connector .....................................................................................48
21. Processor Fan Connector...........................................................................................48
22. Main Power Connector ...............................................................................................48
23. Front Chassis Fan Connector.....................................................................................48
24. Chassis Intrusion Connector.......................................................................................48
25. Serial Port B Connector (optional) ..............................................................................50
26. Auxiliary Front Panel Power/Sleep/Message-Waiting LED Connector ........................51
27. Front Panel Connector ...............................................................................................51
28. States for a One-Color Power LED.............................................................................52
29. States for a Two-Color Power LED.............................................................................52
30. Front Panel Audio Connector/Jumper Block ...............................................................55
31. BIOS Setup Configuration Jumper Settings................................................................55
32. DC Loading Characteristics ........................................................................................58
33. Fan Connector Current Capability ..............................................................................58
34. Thermal Considerations for Components ...................................................................60
35. Desktop Board D845EPI Environmental Specifications ..............................................61
36. Safety Regulations .....................................................................................................62
37. EMC Regulations........................................................................................................62
38. Product Certification Markings....................................................................................64
39. Boot Device Menu Options.........................................................................................70
40. Supervisor and User Password Functions..................................................................72
41. BIOS Setup Program Menu Bar .................................................................................73
42. BIOS Setup Program Function Keys ..........................................................................74
43. Maintenance Menu.....................................................................................................74
44. Main Menu..................................................................................................................75
45. Advanced Menu..........................................................................................................76
46. PCI Configuration Submenu .......................................................................................77
viii
Contents
47. Boot Configuration Submenu......................................................................................78
48. Peripheral Configuration Submenu.............................................................................79
49. IDE Configuration Submenu .......................................................................................81
50. Primary/Secondary IDE Master/Slave Submenus.......................................................82
51. Diskette Configuration Submenu ................................................................................84
52. Event Log Configuration Submenu.............................................................................85
53. Video Configuration Submenu....................................................................................86
54. USB Configuration Submenu......................................................................................87
55. Chipset Configuration Submenu.................................................................................88
56. Security Menu ............................................................................................................90
57. Power Menu ...............................................................................................................91
58. ACPI Submenu...........................................................................................................91
59. Boot Menu..................................................................................................................92
60. Boot Device Priority Submenu....................................................................................93
61. Hard Disk Drives Submenu ........................................................................................94
62. Removable Devices Submenu....................................................................................94
63. ATAPI CD-ROM Drives Submenu ..............................................................................95
64. Exit Menu ...................................................................................................................96
65. BIOS Error Messages.................................................................................................97
66. Uncompressed INIT Code Checkpoints......................................................................99
67. Boot Block Recovery Code Checkpoints ....................................................................99
68. Runtime Code Uncompressed in F000 Shadow RAM ..............................................100
69. Bus Initialization Checkpoints ...................................................................................103
70. Upper Nibble High Byte Functions............................................................................103
71. Lower Nibble High Byte Functions............................................................................104
72. Beep Codes..............................................................................................................105
ix
Intel Desktop Board D845EPI Technical Product Specification
x
1 Product Description
What This Chapter Contains
1.1 Overview ....................................................................................................................12
1.2 Block Diagram ............................................................................................................15
1.3 Online Support ...........................................................................................................16
1.4 Operating System Support .........................................................................................16
1.5 Design Specifications .................................................................................................17
1.6 Processor ...................................................................................................................20
1.7 System Memory .........................................................................................................21
®
1.8 Intel 845E Chipset ....................................................................................................23
1.9 I/O Controller..............................................................................................................26
1.10 Audio Subsystem........................................................................................................27
1.11 LAN Subsystem (Optional) .........................................................................................28
1.12 Hardware Management Subsystem (Optional) ...........................................................29
1.13 Power Management ...................................................................................................30
11
Intel Desktop Board D845EPI Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
®
Table 1 summarizes the major features of the Intel Desktop Board D845EPI.
Table 1. Feature Summary
Form Factor
microATX (9.20 inches by 8.20 inches [233.68 millimeters by 208.28 millimeters])
® ®
Processor • Support for an Intel Pentium 4 processor in an mPGA478 socket with a
400/533 MHz system bus
® ®
• Support for an Intel Celeron processor in an mPGA478 socket with a
400 MHz system bus
Memory • Two 184-pin DDR SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for single-sided or double-sided DIMMs (DDR333/266/200)
• Support for up to 2 GB system memory
®
Chipset
Intel 845E Chipset, consisting of:
®
• Intel 82845E Memory Controller Hub (MCH)
®
• Intel 82801DB I/O Controller Hub (ICH4)
• 4 Mbit Firmware Hub (FWH)
Video AGP connector supporting 1.5 V 4X AGP cards
Audio Audio subsystem for AC ‘97 processing using the Realtek ALC202A codec
I/O Control SMSC LPC47M172 LPC Bus I/O controller or National Semiconductor PC87372
I/O controller
USB Support for USB 2.0 devices
Peripheral • Up to six USB ports
Interfaces
• One serial port
• One parallel port
• Two IDE interfaces with UDMA 33, ATA-66/100 support
• One diskette drive interface
†
• PS/2 keyboard and mouse ports
• Three fan connectors
Expansion Three PCI bus add-in card connectors (SMBus routed to PCI bus connector 2)
Capabilities
BIOS • Intel/AMI BIOS (resident in the 4 Mbit FWH)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available • Support for PCI Local Bus Specification Revision 2.2
PC Technology
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
12
Product Description
1.1.2 Manufacturing Options
Table 2 describes the manufacturing options on the Desktop Board D845EPI. Not every
manufacturing option is available in all marketing channels. Please contact your Intel
representative to determine which manufacturing options are available to you.
Table 2. Manufacturing Options
®
LAN Intel 82562ET 10/100 Mbit/sec Platform LAN Connect (PLC) device
Hardware Monitor • Hardware monitoring and fan control ASIC
Subsystem
• Three fan sense inputs used to monitor fan activity
• Chassis intrusion detection
Serial Port B Connector for a second serial port
For information about Refer to
The board’s compliance level with ACPI, Plug and Play, and SMBIOS Section 1.5, page 17
Available configurations for the Desktop Board D845EPI Section 1.3, page 16
13
Intel Desktop Board D845EPI Technical Product Specification
1.1.3 Board Layout
Figure 1 shows the location of the major components on the Desktop Board D845EPI.
A B C
D
BB
E
F
G
AA
H
Z
Y
I
X
J
W
K
V
UTL SO R Q P NM
OM16243
A Audio codec O IDE connectors
B Intel 82562ET 10/100 Mbit/sec (PLC) device P Speaker
(optional)
C ATAPI CD-ROM connector Q Battery
D Back panel connectors R Auxiliary front panel power LED connector
E +12V power connector (ATX12V) S Front chassis fan connector
F Rear chassis fan connector T Chassis intrusion connector
G Intel 82845E MCH U BIOS Setup configuration jumper block
H mPGA478 processor socket V 4 Mbit Firmware Hub (FWH)
I Processor fan connector W Front panel connector
J DIMM sockets X Front panel USB connector
K Serial Port B connector (optional) Y Intel 82801DB I/O Controller Hub (ICH4)
L I/O Controller Z AGP connector
M Power connector AA PCI bus add-in card connectors
N Diskette drive connector BB Front panel audio connector
Figure 1. Desktop Board D845EPI Components
14
Product Description
1.2 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Back Panel /
Front Panel
= connector or socket
USB Ports
USB
Serial Ports
LPC Bus
Parallel Port
Primary/ UDMA 33 and
I/O
PS/2 Mouse
Secondary IDE ATA-66/100
Controller
PS/2 Keyboard
Diskette Drive
SMBus
mPGA478 System Bus
Connector
Processor Socket (400/533 MHz)
LPC
Bus
Intel 82801DB 4 Mbit
Intel 82845E
AHA
Memory Controller I/O Controller Hub Firmware Hub
Bus
(ICH4) (FWH)
Hub (MCH)
Intel 845E Chipset
CSMA/CD
AGP
Unit
Interface
4X AGP Connector Interface
(1.5 V only)
Memory Bus
Physical
LAN
DIMM Banks (2) Layer
Connector
SMBus Interface
AC Link (Optional)
(Optional)
PCI Bus
PCI Slot 1
PCI Slot 2 SMBus
Line In
Realtek
PCI Slot 3 Line Out
ALC202A
Mic In
Audio Codec
CD-ROM
OM16270
Figure 2. Block Diagram
15
Intel Desktop Board D845EPI Technical Product Specification
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board D845EPI under http://www.intel.com/design/motherbd
“Desktop Board Products” or “Desktop
Board Support” http://support.intel.com/support/motherboards/desktop
Available configurations for the Desktop http://developer.intel.com/design/motherbd/pi/pi_available.htm
Board D845EPI
Processor data sheets http://www.intel.com/design/litcentr
ICH4 addressing http://developer.intel.com/design/chipsets/datashts
Custom splash screens http://intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
1.4 Operating System Support
The Desktop Board D845EPI supports drivers for all of the onboard hardware and subsystems
under the following operating systems:
†
• Windows XP
• Windows ME
• Windows 2000
• Microsoft Windows 98 SE
For information about Refer to
Supported drivers Section 1.3
NOTE
✏
Third party vendors may offer other drivers.
16
Product Description
1.5 Design Specifications
Table 3 lists the specifications applicable to the Desktop Board D845EPI.
Table 3. Specifications
Reference Specification Version, Revision Date, The information is
Name Title and Ownership available from…
AC ’97 Audio Codec ’97 Revision 2.2, ftp://download.intel.com/labs/
September 2000, media/audio/download/ac97r
Intel Corporation. 22.pdf
ACPI Advanced Configuration and Version 1.0b, http://www.acpi.info/spec10b.
Power Interface February 08, 1999, htm
Specification Intel Corporation,
Microsoft Corporation, and
Toshiba Corporation.
AGP Accelerated Graphics Port Revision 2.0, http://www.agpforum.org/spec
Interface Specification May 4, 1998, s_specs.htm
Intel Corporation.
ASF Alert Standard Format (ASF) Version 1.03, http://www.dmtf.org/standards
Specification June 20, 2001, /documents/ASF/DSP0114.p
DMTF, df
Intel Corporation.
ATA/ Information Technology-AT Revision 3, http://www.t13.org
ATAPI-5 Attachment with Packet February 29, 2000,
Interface - 5 (ATA/ATAPI-5) Contact: T13 Chair,
Seagate Technology.
ATX ATX Specification Version 2.03, http://www.formfactors.org/de
December 1998, veloper/specs/atx/atxspecs.ht
Intel Corporation. m
ATX12V ATX/ATX12V Power Supply Version 1.2, http://www.formfactors.org/de
Design Guide August 2000, veloper/specs/atx/atxspecs.ht
Intel Corporation. m
BIS Boot Integrity Services (BIS) Version 1.0, http://www.intel.com/labs/man
Application Programming August 4, 1999, age/wfm/wfmspecs.htm
Interface (API) Intel Corporation.
DDR Double Data Rate (DDR) Version 1.0, http://www.jedec.org/
SDRAM Specification
SDRAM June 2000,
JEDEC Solid State
Technology Association.
Design Specification for a Revision 1.0, http://www.jedec.org/
184 Pin DDR Unbuffered October 2001,
DIMM JEDEC Solid State
Technology Association.
®
Intel JEDEC DDR 200/266 Revision 0.9, http://developer.intel.com/tec
Unbuffered DIMM September 27, 2001, hnology/memory/index.htm
Specification Addendum Intel Corporation.
continued
17
Intel Desktop Board D845EPI Technical Product Specification
Table 3. Specifications (continued)
Reference Specification Version, Revision Date and The information is
Name Title Ownership available from…
EHCI Enhanced Host Revision 1.0, http://developer.intel.com/t
Controller Interface March 12, 2002, echnology/usb/download/e
Specification for Intel Corporation. hci-r10.pdf
Universal Serial Bus
EPP IEEE Std 1284.1-1997 Version 1.7, http://standards.ieee.org/re
(Enhanced Parallel Port) 1997, ading/ieee/std_public/descr
Institute of Electrical and iption/busarch/1284.1-
Electronic Engineers. 1997_desc.html
El Torito Bootable CD-ROM Version 1.0, http://www.phoenix.com/res
Format Specification January 25, 1995, ources/specs-cdrom.pdf
Phoenix Technologies Limited
and International Business
Machines Corporation.
LPC Low Pin Count Interface Revision 1.0, http://www.intel.com/design
Specification September 29, 1997, /chipsets/industry/lpc.htm
Intel Corporation.
MicroATX microATX Motherboard Version 1.0, http://www.formfactors.org/
Interface Specification December 1997, developer/motherboard.htm
Intel Corporation.
PCI PCI Local Bus Revision 2.2, http://www.pcisig.com/speci
Specification December 18, 1998, fications
PCI Special Interest Group.
PCI Bus Power Revision 1.1, http://www.pcisig.com/speci
Management Interface December 18, 1998, fications
Specification PCI Special Interest Group.
Plug and Plug and Play BIOS Version 1.0a, http://www.microsoft.com/h
Play Specification May 5, 1994, wdev/tech/PnP/default.msp
Compaq Computer Corporation, x
Phoenix Technologies Limited,
and Intel Corporation.
PXE Preboot Execution Version 2.1, ftp://download.intel.com/lab
Environment September 20, 1999, s/manage/wfm/download/
Intel Corporation. /pxespec.pdf
SFX SFX/SFX12V Power Version 2.0, http://www.formfactors.org/
Supply Design Guide May 2001, developer/specs/sfx/sfx12v.
Intel Corporation. pdf
continued
18
Product Description
Table 3. Specifications (continued)
Reference Specification Version, Revision Date The information is
Name Title and Ownership available from…
SMBIOS System Management Version 2.3.1, http://www.dmtf.org/downlo
BIOS March 16, 1999, ad/standards/DSP0119.pdf
American Megatrends
Incorporated,
Award Software International
Incorporated,
Compaq Computer Corporation,
Dell Computer Corporation,
Hewlett-Packard Company,
Intel Corporation,
International Business Machines
Corporation,
Phoenix Technologies Limited,
and SystemSoft Corporation.
TFX12V TFX12V Power Supply Revision 1.01, http://www.formfactors.org/
Design Guide May 2002 developer/specs/tfx12v/tfx1
Intel Corporation. 2v_psdg_101.pdf
UHCI Universal Host Controller Revision 1.1, http://developer.intel.com/d
Interface Design Guide March 1996, esign/USB/UHCI11D.htm
Intel Corporation.
USB Universal Serial Bus Revision 2.0, http://www.usb.org/developers/
Specification April 27, 2000, docs.html
Compaq Computer Corporation,
Hewlett-Packard Company,
Lucent Technologies Inc.,
Intel Corporation,
Microsoft Corporation,
NEC Corporation, and
Koninklijke Philips Electronics
N.V.
WfM Wired for Management Version 2.0, http://www.intel.com/labs/m
Baseline December 18, 1998, anage/wfm/wfmspecs.htm
Intel Corporation.
19
Intel Desktop Board D845EPI Technical Product Specification
1.6 Processor
The board is designed to support the following:
• Intel Pentium 4 processors in an mPGA478 processor socket with a 533/400 MHz system bus
• Intel Celeron processors in an mPGA478 processor socket with a 400 MHz system bus
See the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors for the D845EPI board http://www.intel.com/design/motherbd/pi/pi_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
INTEGRATOR’S NOTES
�
• Use only ATX12V-, SFX12V-, or TFX12V-compliant power supplies with the Desktop Board
D845EPI. ATX12V, SFX12V, and TFX12V power supplies have an additional power lead that
provides required supplemental power for the processor. Always connect the 20-pin and 4-pin
leads of ATX12V, SFX12V, and TFX12V power supplies to the corresponding connectors on
the desktop board, otherwise the board will not boot.
• Do not use a standard ATX power supply. The board will not boot with a standard ATX power
supply.
• Refer to Table 4 on page 21 for a list of supported system bus frequency and memory speed
combinations.
For information about Refer to
Power supply connectors Section 2.8.2.2, page 46
20
Product Description
1.7 System Memory
The Desktop Board D845EPI has two DIMM sockets and supports the following memory features:
• 2.5 V (only) 184-pin DDR SDRAM DIMMs with gold-plated contacts
• Unbuffered single-sided or double-sided DIMMs
• Maximum total system memory: 2 GB; minimum total system memory: 64 MB
• DDR333/266/200 MHz SDRAM DIMMs only
• Serial Presence Detect (SPD)
• Suspend to RAM
Table 4 lists the supported system bus frequency and memory speed combinations.
Table 4. Supported System Bus Frequency and Memory Speed Combinations
If the processor's system bus frequency is… You can use this type of DIMM…
533 MHz DDR333 or DDR266
400 MHz DDR266 or DDR200
CAUTION
Do not use ECC DIMMs with this board. Using ECC DIMMs could damage the board.
INTEGRATOR’S NOTES
�
• Registered DIMMs are not supported.
• Double-sided x16 DIMMs are not supported.
• If a full-length PCI add-in card is installed in PCI bus connector 1 (the PCI bus connector
closest to the processor), remove the add-in card before installing or upgrading memory to
avoid interference with the memory retention mechanism.
NOTE
✏
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be
populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows
the BIOS to read the SPD data and program the chipset to accurately configure memory settings
for optimum performance.
For information about Refer to
Obtaining DDR SDRAM specifications Section 1.5, page 17
Obtaining the PC Serial Presence Detect (SPD) Specification Section 1.5, page 17
21
Intel Desktop Board D845EPI Technical Product Specification
Table 5 lists the supported DDR DIMM configurations.
Table 5. Supported DDR DIMM Configurations
DIMM Configuration DDR SDRAM DDR SDRAM Organization Number of DDR
(Note)
Capacity Density Front-side/Back-side SDRAM Devices
64 MB SS 64 Mbit 8 M x 8/empty 8
64 MB SS 128 Mbit 8 M x 16/empty 4
128 MB DS 64 Mbit 8 M x 8/8 M x 8 16
128 MB SS 128 Mbit 16 M x 8/empty 8
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB DS 128 Mbit 16 M x 8/16 M x 8 16
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
Note: In this column, “DS” refers to double-sided memory modules (containing DDR SDRAM devices on both sides)
and “SS” refers to single-sided memory modules (containing DDR SDRAM devices on only one side).
22
Product Description
®
1.8 Intel 845E Chipset
The Intel 845E chipset consists of the following devices:
• Intel 82845E Memory Controller Hub (MCH) with Accelerated Hub Architecture (AHA) bus
• Intel 82801DB I/O Controller Hub (ICH4) with AHA bus
• Firmware Hub (FWH)
The MCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the
Accelerated Hub Architecture interface. The ICH4 is a centralized controller for the board’s I/O
paths. The FWH provides the nonvolatile storage of the BIOS.
For information about Refer to
The Intel 845E chipset http://developer.intel.com/
Resources used by the chipset Chapter 2
1.8.1 AGP
The AGP connector supports AGP add-in cards with 1.5 V Switching Voltage Level (SVL).
Legacy 3.3 V AGP cards are not supported.
For information about Refer to
The location of the AGP connector Figure 1, page 14
NOTE
✏
Install memory in the DIMM sockets prior to installing the AGP video card to avoid interference
with the memory retention mechanism.
NOTE
✏
The AGP connector is keyed for 1.5 V AGP cards only. Do not attempt to install a legacy 3.3 V
AGP card. The AGP connector is not mechanically compatible with legacy 3.3 V AGP cards.
AGP is a high-performance interface for graphics-intensive applications, such as 3D applications.
While based on the PCI Local Bus Specification, Rev. 2.2, AGP is independent of the PCI bus and
is intended for exclusive use with graphical display devices. AGP overcomes certain limitations of
the PCI bus related to handling large amounts of graphics data with the following features:
• Pipelined memory read and write operations that hide memory access latency
• Demultiplexing of address and data on the bus for nearly 100 percent efficiency
For information about Refer to
Obtaining the Accelerated Graphics Port Interface Specification Section 1.5, page 17
23
Intel Desktop Board D845EPI Technical Product Specification
1.8.2 USB
The board supports up to six USB 2.0 ports, fully supports UHCI and EHCI, and uses UHCI- and
EHCI-compatible drivers. For more than six USB devices, an external hub can be connected to
any of the ports.
The ICH4 provides the USB controller for all ports. The port arrangement is as follows:
• Two ports are implemented with stacked back panel connectors, adjacent to the PS/2
connectors
• Two ports are implemented with stacked back panel connectors, adjacent to the audio
connectors
• Two ports are routed to the front panel USB connector
NOTE
✏
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the
requirements for full-speed devices.
1.8.3 IDE Interfaces
The ICH4’s IDE controller has two independent bus-mastering IDE interfaces that can be
independently enabled. The IDE interfaces support the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH4’s ATA-100
logic can achieve transfer rates up to 100 MB/sec.
24
Product Description
INTEGRATOR’S NOTE
�
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections,
noise, and inductive coupling.
The IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA devices.
The BIOS supports 48-bit Logical Block Addressing (LBA) and Extended Cylinder Head Sector
(ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The Desktop Boards support Laser Servo (LS-120) diskette technology through the IDE interfaces.
The BIOS supports booting from an LS-120 drive.
NOTE
✏
The BIOS will always recognize an LS-120 drive as an ATAPI floppy drive. To ensure correct
operation, do not configure the drive as a hard disk drive.
1.8.4 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
INTEGRATOR’S NOTE
�
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
25
Intel Desktop Board D845EPI Technical Product Specification
1.9 I/O Controller
The SMSC LPC47M172 I/O or National Semiconductor PC87372 controller provides the
following features:
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.44 MB or 2.88 MB diskette drive
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
For information about Refer to
SMSC LPC47M172 I/O controller http://www.smsc.com
National Semiconductor I/O controller http://www.national.com
1.9.1 Serial Ports
The Desktop Board has two serial port connectors. Serial port A is located on the back panel.
Serial port B (optional) is accessible using a connector on the component side of the Desktop
Board. The serial ports support data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port A connector Figure 4, page 44
The location of the optional serial port B connector Figure 7, page 50
1.9.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup
program to set the parallel port mode.
1.9.3 Diskette Drive Controller
The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the
diskette drive interface.
1.9.4 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel.
INTEGRATOR’S NOTE
�
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top
PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is
connected or disconnected.
26
Product Description
1.10 Audio Subsystem
The audio subsystem consists of the following devices:
• Intel 82801DB I/O Controller Hub (ICH4)
• Realtek ALC202A audio codec
The audio subsystem includes these features:
• Signal-to-noise ratio ≥ 90 dB
• Supports wake events (driver dependent)
• Mic in pre-amp that supports dynamic, condenser, and electret microphones
The audio subsystem supports the following audio interfaces:
• ATAPI-style connector: CD-ROM
• Front panel audio connector, including pins for:
Line out
Mic in
• Back panel audio connectors:
Line out
Line in
Mic in
1.10.1 Audio Connectors
1.10.1.1 Front Panel Audio Connector
A 2 x 5-pin connector provides mic in and line out signals for front panel audio connectors.
For information about Refer to
The location of the connector Figure 5, page 46
The signal names of the front panel audio connector Table 17, page 47
Obtaining the Front Panel I/O Connectivity Design Guide Section 1.5, page 17
NOTE
✏
The front panel audio connector is alternately used as a jumper block for routing audio signals.
Refer to Section 2.9.1 on page 54 for more information.
1.10.1.2 ATAPI CD-ROM Audio Connector
A 1 x 4-pin ATAPI-style connector connects an internal ATAPI CD-ROM drive to the audio
mixer.
For information about Refer to
The location of the ATAPI CD-ROM connector Figure 5, page 46
The signal names of the ATAPI CD-ROM connector Table 18, page 47
27
Intel Desktop Board D845EPI Technical Product Specification
1.10.2 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 16
1.11 LAN Subsystem (Optional)
The Network Interface Controller subsystem consists of the ICH4 (with integrated LAN Media
Access Controller) and a physical layer interface device. Features of the LAN subsystem include:
• PCI Bus Master interface
• CSMA/CD Protocol Engine
• Serial CSMA/CD unit interface that supports the 82562ET (10/100 Mbit/sec Ethernet)
• PCI Power Management
Supports ACPI technology
Supports LAN wake capabilities
®
1.11.1 Intel 82562ET Platform LAN Connect Device
The Intel 82562ET component provides an interface to the back panel RJ-45 connector with
integrated LEDs.
The Intel 82562ET provides the following functions:
• Basic 10/100 Ethernet LAN connectivity
• Supports RJ-45 connector with status indicator LEDs on the back panel
• Full device driver compatibility
• ACPI support
• Programmable transit threshold
• Configuration EEPROM that contains the MAC address
1.11.2 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector. Table 6 describes the LED states when the
Desktop Board is powered up and the LAN subsystem is operating.
Table 6. LAN Connector LED States
LED Color LED State Condition
Green Off 10 Mbit/sec data rate is selected.
On 100 Mbit/sec data rate is selected.
Yellow Off LAN link is not established.
On (steady state) LAN link is established.
On (brighter and pulsing) The computer is communicating with another computer on
the LAN.
28
Product Description
1.11.3 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section 1.3, page 16
1.12 Hardware Management Subsystem (Optional)
The hardware management features enable the boards to be compatible with the Wired for
Management (WfM) specification. The board has several hardware management features,
including the following:
• Fan monitoring (through the I/O controller or the hardware monitoring and fan control ASIC)
• Thermal and voltage monitoring
• Chassis intrusion detection
For information about Refer to
The WfM specification Section 1.5, page 17
1.12.1 Hardware Monitoring and Fan Control ASIC
The features of the hardware monitoring and fan control ASIC include:
• Internal ambient temperature sensor
• Two remote thermal diode sensors for direct monitoring of processor temperature and ambient
temperature sensing
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to
detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or
switch the fans on or off as needed
• SMBus interface
• Fan monitoring for all three fan connectors
1.12.2 Fan Monitoring
®
Fan monitoring can be implemented using Intel LANDesk Client Manager or third-party
software.
For information about Refer to
The functions of the fan connectors Section 1.13.2.2, page 33
1.12.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is removed. The
security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion
connector. When the chassis cover is removed, the mechanical switch is in the closed position.
29
Intel Desktop Board D845EPI Technical Product Specification
1.13 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
Power connector
Fan connectors
LAN wake capabilities
Instantly Available PC technology
Resume on Ring
Wake from USB
Wake from PS/2 devices
Power Management Event signal (PME#) wake-up support
1.13.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with this board requires an operating system that
provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 9 on page 32)
• Support for a front panel power and sleep mode switch
Table 7 lists the system states based on how long the power switch is pressed, depending on how
ACPI is configured with an ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch
…and the power switch is
If the system is in this state… pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than four seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than four seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)
30
Product Description
For information about Refer to
The Desktop Boards’ compliance level with ACPI Section 1.5, page 17
1.13.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 8 lists the power states supported by the Desktop Board D845EPI along with the associated
system power targets. See the ACPI specification for a complete description of the various system
and power states.
Table 8. Power States and Targeted System Power
Processor Targeted System
(Note 1)
Global States Sleeping States States Device States Power
G0 – working S0 – working C0 – working D0 – working Full power > 30 W
state state.
G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 52.5 W
state stopped grant device
specification
specific.
(Note 2)
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W
state RAM. Context except for
saved to RAM. wake-up logic.
(Note 2)
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W
state disk. Context except for
saved to disk. wake-up logic.
(Note 2)
G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off system. wake-up logic, Service can be performed
except when safely.
AC power is
provided by
disconnected
battery or external
from the
source.
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered
by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
31
Intel Desktop Board D845EPI Technical Product Specification
1.13.1.2 Wake-up Devices and Events
Table 9 lists the devices or specific events that can wake the computer from specific states.
Table 9. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
(Note)
LAN S1, S3, S4, S5
Modem (back panel Serial Port A) S1, S3
(Note)
PME# signal S1, S3, S4, S5
Power switch S1, S3, S4, S5
PS/2 devices S1, S3
RTC alarm S1, S3, S4, S5
USB S1, S3
Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On
will enable a wake-up event from LAN in the S5 state.
NOTE
✏
The use of these wake-up events from an ACPI state requires an operating system that provides full
ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.
1.13.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities
and Instantly Available PC technology features are used. Failure to do so can damage the power
supply. The total amount of standby current required depends on the wake devices supported and
manufacturing options.
The Desktop Board D845EPI provides several power management hardware features, including:
• Power connector
• Fan connectors
• LAN wake capabilities
• Instantly Available PC technology
• Resume on Ring
• Wake from USB
• Wake from PS/2 keyboard
• PME# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the +5 V
standby line. The sections discussing these features describe the incremental standby power
requirements for each.
32
Product Description
Resume on Ring enables telephony devices to access the computer when it is in a power-managed
state. The method used depends on the type of telephony device (external or internal).
NOTE
✏
The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an
operating system that provides full ACPI support.
1.13.2.1 Power Connector
ATX12V-, SFX12V-, and TFX12V-compliant power supplies can turn off the system power
through system control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it was in before
power was interrupted (on or off). The computer’s response can be set using the Last Power State
feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the power connector Figure 5, page 46
The signal names of the power connector Table 22, page 48
The BIOS Setup program’s Boot menu Table 59, page 92
The ATX, SFX, and TFX12V specifications Section 1.5, page 17
1.13.2.2 Fan Connectors
Table 10 summarizes the function/operation of the fan connectors.
Table 10. Fan Connector Function/Operation
Connector Description
Processor fan • +12 V DC connection for a processor fan or active fan heatsink.
• Fan is on in the S0 or S1 state.
Fan is off when the system is off or in the S3, S4, or S5 state.
• Option to wire the fan tachometer input to the I/O controller or the Hardware
Monitoring and Fan Control ASIC.
Front chassis fan • +12 V DC connection for a system or chassis fan.
• Fan is on in the S0 or S1 state.
Fan is off when the system is off or in the S3, S4, or S5 state.
• Option to wire the fan tachometer input to the Hardware Monitoring and Fan
Control ASIC.
Rear chassis fan • +12 V DC connection for a system or chassis fan.
• Fan is on in the S0 or S1 state.
Fan is off when the system is off or in the S3, S4, or S5 state.
• Option to wire the fan tachometer input to the I/O controller or the Hardware
Monitoring and Fan Control ASIC.
33
Intel Desktop Board D845EPI Technical Product Specification
1.13.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN
subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface.
†
Upon detecting a Magic Packet frame, the LAN subsystem asserts a wake-up signal that powers
up the computer. Depending on the LAN implementation, the board supports LAN wake
capabilities with ACPI in the following ways:
• The PCI bus PME# signal for PCI 2.2 compliant LAN designs
• The onboard LAN subsystem
1.13.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate standby current
when implementing Instantly Available PC technology can damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM)
sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is
off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a
wake-up device or event, the system quickly returns to its last known wake state. Table 9 on
page 32 lists the devices and events that can wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. For information on
the version of this specification, see Section 1.5.
Add-in boards that also support this specification can participate in power management and can be
used to wake the computer.
The use of Instantly Available PC technology requires operating system support and PCI 2.2
compliant add-in cards and drivers.
1.13.2.5 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the computer
appears to be off. Figure 3 shows the location of the standby power indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power
cord before installing or removing any devices connected to the board. Failure to do so could
damage the board and any attached devices.
34
Product Description
CR1F1
OM16244
Figure 3. Location of the Standby Power Indicator LED on the D845EPI Board
1.13.2.6 Resume on Ring
The operation of Resume on Ring can be summarized as follows:
• Resumes operation from ACPI S1 or S3 states
• Detects incoming call similarly for external and internal modems
• Requires modem interrupt be unmasked for correct operation
1.13.2.7 Wake from USB
USB bus activity wakes the computer from ACPI S1 or S3 states.
NOTE
✏
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.13.2.8 Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1 or S3 state.
1.13.2.9 PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4,
or S5 state (with Wake on PME enabled in BIOS).
35
Intel Desktop Board D845EPI Technical Product Specification
36
2 Technical Reference
What This Chapter Contains
2.1 Introduction.................................................................................................................37
2.2 Memory Map ..............................................................................................................37
2.3 Fixed I/O Map.............................................................................................................38
2.4 DMA Channels ...........................................................................................................39
2.5 PCI Configuration Space Map ....................................................................................39
2.6 Interrupts ....................................................................................................................40
2.7 PCI Interrupt Routing Map..........................................................................................41
2.8 Connectors.................................................................................................................43
2.9 Jumper Blocks............................................................................................................54
2.10 Mechanical Considerations.........................................................................................56
2.11 Electrical Considerations ............................................................................................58
2.12 Thermal Considerations..............................................................................................59
2.13 Reliability ....................................................................................................................61
2.14 Environmental ............................................................................................................61
2.1 Introduction
Sections 2.2 - 2.6 contain several standalone tables. Table 11 describes the system memory map,
Table 12 shows the I/O map, Table 13 lists the DMA channels, Table 14 defines the PCI
configuration space map, and Table 15 describes the interrupts. The remaining sections in this
chapter are introduced by text found with their respective section headings.
2.2 Memory Map
Table 11. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K - 2097152 K 100000 - 7FFFFFFF 2047 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Available high DOS memory (open
to the PCI bus)
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
37
Intel Desktop Board D845EPI Technical Product Specification
2.3 Fixed I/O Map
Table 12. I/O Map
Address (hex) Size Description
0000 - 00FF 256 bytes Used by the Desktop Board D845EPI. Refer to the ICH4
data sheet for dynamic addressing information.
0170 - 0177 8 bytes Secondary IDE channel
01F0 - 01F7 8 bytes Primary IDE channel
(Note 1)
0228 - 022F 8 bytes LPT3
(Note 1)
0278 - 027F 8 bytes LPT2
(Note 1)
02E8 - 02EF 8 bytes COM4
(Note 1)
02F8 - 02FF 8 bytes COM2
0376 1 byte Secondary IDE channel command port
0377, bits 6:0 7 bits Secondary IDE channel status port
0378 - 037F 8 bytes LPT1
03B0 - 03BB 12 bytes Intel 82845E MCH
03C0 - 03DF 32 bytes Intel 82845E MCH
03E8 - 03EF 8 bytes COM3
03F0 - 03F5 6 bytes Diskette channel 1
03F6 1 byte Primary IDE channel command port
03F8 - 03FF 8 bytes COM1
04D0 - 04D1 2 bytes Edge/level triggered PIC
LPTn + 400 8 bytes ECP port, LPTn base address + 400h
(Note 2)
0CF8 - 0CFB 4 bytes PCI configuration address register
(Note 3)
0CF9 1 byte Turbo and reset control register
0CFC - 0CFF 4 bytes PCI configuration data register
FFA0 - FFA7 8 bytes Primary bus master IDE registers
FFA8 - FFAF 8 bytes Secondary bus master IDE registers
Notes:
1. Default, but can be changed to another address range
2. Dword access only
3. Byte access only
✏ NOTE
Some additional I/O addresses are not available due to ICH4 address aliasing. The ICH4 data
sheet provides more information on address aliasing.
For information about Refer to
Obtaining the ICH4 data sheet Section 1.3 on page 16
38
Technical Reference
2.4 DMA Channels
Table 13. DMA Channels
DMA Channel Number Data Width System Resource
0 8 or 16 bits Open
1 8 or 16 bits Parallel port
2 8 or 16 bits Diskette drive
3 8 or 16 bits Parallel port (for ECP or EPP)
4 8 or 16 bits DMA controller
5 16 bits Open
6 16 bits Open
7 16 bits Open
2.5 PCI Configuration Space Map
Table 14. PCI Configuration Space Map
Bus Device Function
Number (hex) Number (hex) Number (hex) Description
00 00 00 Memory controller of Intel 82845E component
00 01 00 Host to AGP bridge (virtual P2P)
00 1E 00 Hub link to PCI bridge
00 1F 00 Intel 82801DB ICH4 PCI to LPC bridge
00 1F 01 IDE controller
00 1F 03 SMBus controller
00 1F 05 AC ’97 audio controller
00 1F 06 AC ’97 modem controller (optional)
00 1D 00 USB UHCI controller 1
00 1D 01 USB UHCI controller 2
00 1D 02 USB UHCI controller 3
00 1D 07 EHCI controller
01 00 00 AGP add-in card
02 08 00 LAN controller (optional)
02 00 00 PCI bus connector 1
02 01 00 PCI bus connector 2
02 02 00 PCI bus connector 3
39
Intel Desktop Board D845EPI Technical Product Specification
2.6 Interrupts
The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the
Advanced Programmable Interrupt Controller (APIC) portion of the ICH4 component. The PIC is
supported in Windows 98 SE and Windows ME and uses the first 16 interrupts. The APIC is
supported in Windows 2000 and Windows XP and supports a total of 24 interrupts.
Table 15. Interrupts
IRQ System Resource
NMI I/O channel check
0 Reserved, interval timer
1 Reserved, keyboard buffer full
2 Reserved, cascade interrupt from slave PIC
(Note 1)
3 COM2
(Note 1)
4 COM1
5 LPT2 (Plug and Play option)/User available
6 Diskette drive
(Note 1)
7 LPT1
8 Real-time clock
9 Reserved for ICH4 system management bus
10 User available
11 User available
12 Onboard mouse port (if present, else user available)
13 Reserved, math coprocessor
14 Primary IDE (if present, else user available)
15 Secondary IDE (if present, else user available)
(Note 2)
16 USB UHCI controller 1 (through PIRQA)
(Note 2)
17 AC ’97 audio/modem/User available (through PIRQB)
(Note 2)
18 ICH4 USB controller 3 (through PIRQC)
(Note 2)
19 ICH4 USB controller 2 (through PIRQD)
(Note 2)
20 ICH4 LAN (optional) (through PIRQE)
(Note 2)
21 User available (through PIRQF)
(Note 2)
22 User available (through PIRQG)
(Note 2)
23 ICH4 USB 2.0 EHCI controller/User available (through PIRQH)
Notes:
1. Default, but can be changed to another IRQ.
2. Available in APIC mode only.
40
Technical Reference
2.7 PCI Interrupt Routing Map
This section describes interrupt sharing and how the interrupt signals are connected between the
PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can
be shared between devices attached to the PCI bus. In most cases, the small amount of latency
added by interrupt sharing does not affect the operation or throughput of the devices. In some
special cases where maximum performance is needed from a device, a PCI device should not share
an interrupt with other PCI devices. Use the following information to avoid sharing an interrupt
with a PCI add-in card.
PCI devices are categorized as follows to specify their interrupt grouping:
• INTA: By default, all add-in cards that require only one interrupt are in this category. For
almost all cards that require more than one interrupt, the first interrupt on the card is also
classified as INTA.
• INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is
classified as INTB. (This is not an absolute requirement.)
• INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a
fourth interrupt is classified as INTD.
The ICH4 has eight Programmable Interrupt Request (PIRQ) input signals. All PCI interrupt
sources either onboard or from a PCI add-in card connect to one of these PIRQ signals. Some PCI
interrupt sources are electrically tied together on the Desktop Board D845EPI and therefore share
the same interrupt. Table 16 shows an example of how the PIRQ signals are routed.
For example, using Table 16 as a reference, assume an add-in card using INTA is plugged into PCI
bus connector 3. In PCI bus connector 3, INTA is connected to PIRQC, which is already
connected to the ICH4 USB. The add-in card in PCI bus connector 3 now shares an interrupt with
the onboard interrupt source.
41
Intel Desktop Board D845EPI Technical Product Specification
Table 16. PCI Interrupt Routing Map
ICH4 PIRQ Signal Name
PCI Interrupt Source
PIRQA PIRQB PIRQC PIRQD PIRQE PIRQF PIRQG PIRQH
AGP connector INTA INTB
ICH4 USB UHCI controller 1 INTA
SMBus controller INTB
ICH4 USB UHCI controller 2 INTB
AC ’97 ICH4 Audio/Modem INTB
ICH4 LAN INTA
ICH4 USB UHCI controller 3 INTC
ICH4 USB 2.0 EHCI controller INTD
PCI bus connector 1 INTD INTA INTB INTC
PCI bus connector 2 INTC INTB INTA INTD
PCI bus connector 3 INTD INTC INTA INTB
NOTE
✏
In PIC mode, the ICH4 can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 6,
7, 9, 10, 11, 12, 14, and 15). Typically, a device that does not share a PIRQ line will have a
unique interrupt. However, in certain interrupt-constrained situations, it is possible for two or
more of the PIRQ lines to be connected to the same IRQ signal. Refer to Table 15 for the
allocation of PIRQ lines to IRQ signals in APIC mode.
42
Technical Reference
2.8 Connectors
CAUTION
Only the back panel USB, front panel USB, VGA, and PS/2 connectors have overcurrent
protection. The Desktop Boards’ internal connectors are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do
not use these connectors to power devices external to the computer’s chassis. A fault in the load
presented by the external devices could cause damage to the computer, the interconnecting cable,
and the external devices themselves.
This section describes the board’s connectors. The connectors can be divided into these groups:
• Back panel I/O connectors (see page 44)
PS/2 keyboard and mouse
USB (four ports)
Parallel port
Serial port A
LAN (optional)
Audio (line out, line in, and mic in)
• Internal I/O connectors (see page 45)
Audio (ATAPI CD-ROM and front panel audio)
Fans
Power
Add-in boards (PCI)
IDE
Diskette drive
Chassis intrusion
• External I/O connectors (see page 50)
Serial Port B (optional)
Auxiliary front panel power/sleep/message-waiting LED
Front panel (power/sleep/message-waiting LED, power switch, hard drive activity LED,
reset switch, and auxiliary front panel power LED)
Front panel USB (one connector for two ports)
NOTE
✏
When installing the board in a microATX chassis, make sure that peripheral devices are installed
at least 1.5 inches above the main power connector, the diskette drive connector, the IDE
connector, and the DIMM sockets.
43
Intel Desktop Board D845EPI Technical Product Specification
2.8.1 Back Panel Connectors
Figure 4 shows the location of the back panel connectors. The back panel connectors are
color-coded in compliance with PC 99 recommendations. The figure legend below lists the
colors used.
E F H
C
A
J
B
D G I
OM16245
Item Description Color
A PS/2 mouse port Green
B PS/2 keyboard port Purple
C USB ports Black
D Serial port A Teal
E Parallel port Burgundy
F LAN (optional) Black
G USB ports Black
H Audio line in Light blue
I Mic in Pink
J Audio line out Lime green
Figure 4. Back Panel Connectors
44
Technical Reference
INTEGRATOR’S NOTE
�
The back panel audio line out connector is designed to power headphones or amplified speakers
only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
2.8.2 Internal I/O Connectors
The internal I/O connectors are divided into the following functional groups:
• Audio, power, and hardware control (see page 46)
Front panel audio
ATAPI CD-ROM
Fans (3)
ATX12V power
Main power
Chassis intrusion
• Add-in boards and peripheral interfaces (see page 49)
PCI bus
IDE
Diskette drive
2.8.2.1 Expansion Slots
The Desktop Board has three PCI rev 2.2 compliant local bus slots. The SMBus is routed to PCI
bus connector 2.
INTEGRATOR’S NOTE
�
This document references back-panel slot numbering with respect to processor location on the
Desktop Board. PCI slots are identified as PCI slot #x, starting with the slot closest to the
processor. The ATX/microATX specifications identify expansion slot locations with respect to the
far edge of a full-sized ATX chassis. The ATX specification and the Desktop Board’s silkscreen
are opposite and could cause confusion. The ATX numbering convention is made without respect
to slot type, but refers to an actual slot location on a chassis. Figure 6 on page 49 illustrates the
Desktop Board’s PCI slot numbering.
45
Intel Desktop Board D845EPI Technical Product Specification
2.8.2.2 Audio, Power, and Hardware Control Connectors
Figure 5 shows the location of the audio, power, and hardware control connectors.
A BC
12
1
4
9 10
3
D
1 2
1
3 4
1
E
3
11
20
10 1
1
1 3
H G F
OM16246
Item Description For more information see:
A Front panel audio Table 17
B ATAPI CD-ROM (black) Table 18
C +12 V power connector (ATX12V) Table 19
D Rear chassis fan Table 20
E Processor fan Table 21
F Main power Table 22
G Front chassis fan Table 23
H Chassis intrusion Table 24
Figure 5. Audio, Power, and Hardware Control Connectors
46
Technical Reference
Table 17. Front Panel Audio Connector
Pin Signal Name Pin Signal Name
1 MIC_IN 2 Ground
3 MIC_BIAS 4 +5 V
5 RIGHT_OUT 6 RIGHT_IN
7 No connect 8 Key
9 LEFT_OUT 10 LEFT_IN
Table 18. ATAPI CD-ROM Connector
Pin Signal Name
1 Left audio input from CD-ROM
2 CD audio differential ground
3 CD audio differential ground
4 Right audio input from CD-ROM
INTEGRATOR’S NOTES
�
• Use only ATX12V-, SFX12V-, or TFX12V-compliant power supplies with this board. ATX12V,
SFX12V, and TFX12V power supplies have an additional power lead that provides required
supplemental power for the processor. Always connect the 20-pin and 4-pin leads of ATX12V,
SFX12V, and TFX12V power supplies to the corresponding connectors on the Desktop Board,
otherwise the Desktop Board will not boot.
• Do not use a standard ATX power supply. The Desktop Board will not boot with a standard
ATX power supply.
Table 19. ATX12V Power Connector
Pin Signal Name Pin Signal Name
1 Ground 2 Ground
3 +12 V 4 +12 V
47
Intel Desktop Board D845EPI Technical Product Specification
Table 20. Rear Chassis Fan Connector
Pin Signal Name
1 Ground (default) or
FNT_REAR_FAN_CTRL (optional)
2 +12 V
3 No connect (default) or
REAR_TACH_OUT (optional)
Table 21. Processor Fan Connector
Pin Signal Name
1 Ground (default) or CPU_FAN_TACH
(optional)
2 +12 V
3 No connect (default) or
CPU_FAN_TACH
Table 22. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 11 +3.3 V
2 +3.3 V 12 -12 V
3 Ground 13 Ground
4 +5 V 14 PS-ON# (power supply remote on/off)
5 Ground 15 Ground
6 +5 V 16 Ground
7 Ground 17 Ground
8 PWRGD (Power Good) 18 No connect
9 +5 V (Standby) 19 +5 V
10 +12 V 20 +5 V
Table 23. Front Chassis Fan Connector
Pin Signal Name
1 Ground (default) or
FNT_REAR_FAN_CTRL (optional)
2 +12 V
3 No connect (default) or
FRONT_FAN_TACH (optional)
Table 24. Chassis Intrusion Connector
Pin Signal Name
1 Intruder
2 Ground
48
Technical Reference
2.8.2.3 Add-in Board and Peripheral Interface Connectors
Figure 6 shows the location of the add-in board connector and peripheral connectors for the
Desktop Board D845EPI. Note the following considerations for the PCI bus connectors:
• All of the PCI bus connectors are bus master capable.
• SMBus signals are routed to PCI bus connector 2, enabling PCI bus add-in boards with SMBus
support to access sensor data on the Desktop Board. The SMBus signals are as follows:
The SMBus clock line is connected to pin A40.
The SMBus data line is connected to pin A41.
A B C D
2
40
39 2
1
2 40 34
39
1 33
1
G F E
OM16247
Item Description
A PCI bus connector 3
B PCI bus connector 2
C PCI bus connector 1
D AGP connector
E Diskette drive
F Primary IDE
G Secondary IDE
Figure 6. Add-in Board and Peripheral Interface Connectors
49
Intel Desktop Board D845EPI Technical Product Specification
2.8.3 External I/O Connectors
Figure 7 shows the locations of the external I/O connectors.
1
2
D
7
10
1
2
9 1
C A
8
8 2
9
13
B
OM16248
Item Description For more information see:
A Serial Port B (optional) Table 25
B Auxiliary front panel power/sleep/message-waiting LED Table 26
C Front panel Table 27 and Figure 8
D Front panel USB Figure 9
Figure 7. External I/O Connectors
Table 25. Serial Port B Connector (optional)
Pin Signal Name Pin Signal Name
1 DCD 2 RXD
3 TXD 4 DTR
5 Ground 6 DSR
7 RTS 8 CTS
9 RI 10 Not connected
50
Technical Reference
2.8.3.1 Auxiliary Front Panel Power/Sleep/Message-Waiting LED Connector
Pins 1 and 3 of this connector duplicate the signals on pins 2 and 4 of the front panel connector.
Table 26 lists the signal names of the Auxiliary Front Panel Power/Sleep/Message-Waiting LED
connector.
Table 26. Auxiliary Front Panel Power/Sleep/Message-Waiting LED Connector
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
2.8.3.2 Front Panel Connector
This section describes the functions of the front panel connector. Table 27 lists the signal names
of the front panel connector. Figure 8 is a connection diagram for the front panel connector.
Table 27. Front Panel Connector
Pin Signal In/Out Description Pin Signal In/Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED pull-up 2 HDR_BLNK_ Out Front panel green
(750 Ω) to +5 V GRN LED
3 HAD# Out Hard disk active LED 4 HDR_BLNK_ Out Front panel yellow
YEL LED
Reset Switch On/Off Switch
5 Ground Ground 6 SWITCH_ON# In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
9 +5 V Out Power 10 No connect Not connected
Single-colored Dual-colored
Power LED Power LED
�
1 2 � �
Hard Drive
Activity LED
� 3 4
� �
5 6
Reset
Power
Switch Switch
7 8
9
N/C
+5 V DC
OM16110
Figure 8. Connection Diagram for Front Panel Connector
51
Intel Desktop Board D845EPI Technical Product Specification
2.8.3.2.1 Hard Drive Activity LED Connector
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from
or written to a hard drive. For the LED to function properly, an IDE drive must be connected to
the onboard IDE interface.
2.8.3.2.2 Reset Switch Connector
Pins 5 and 7 can be connected to a momentary SPST type switch that is normally open. When the
switch is closed, the Desktop Board resets and runs the POST.
2.8.3.2.3 Power/Sleep/Message Waiting LED Connector
Pins 2 and 4 can be connected to a one- or two-color LED. Table 28 shows the possible states for
a one-color LED. Table 29 shows the possible states for a two-color LED.
Table 28. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Blinking Green Running/message waiting
Table 29. States for a Two-Color Power LED
LED State Description
Off Power off
Steady Green Running
Blinking Green Running/message waiting
Steady Yellow Sleeping
Blinking Yellow Sleeping/message waiting
INTEGRATOR’S NOTE
�
To use the message waiting function, ACPI must be enabled in the operating system and a
message-capturing application must be invoked.
2.8.3.2.4 Power Switch Connector
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must
pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off.
(The time requirement is due to internal debounce circuitry on the Desktop Board D845EPI.) At
least two seconds must pass before the power supply will recognize another on/off signal.
52
Technical Reference
2.8.3.3 Front Panel USB Connector
Figure 9 is a connection diagram for the front panel USB connector.
INTEGRATOR’S NOTES
�
• The +5 V DC power on the USB connector is fused.
• Pins 1, 3, 5, and 7 comprise one USB port.
• Pins 2, 4, 6, and 8 comprise one USB port.
• Use only a front panel USB connector that conforms to the USB 2.0 specification for high-
speed USB devices.
Power Power
1 2
(+5 V DC) (+5 V DC)
D− D−
3 4
One One
USB USB
Port Port
D+ 5 6 D+
7 8
Ground
Ground
Key (no pin) 10
No Connect
OM15963
Figure 9. Connection Diagram for Front Panel USB Connector
53
Intel Desktop Board D845EPI Technical Product Specification
2.9 Jumper Blocks
CAUTION
Do not move any jumpers with the power on. Always turn off the power and unplug the power
cord from the computer before changing a jumper setting. Otherwise, the Desktop Board could be
damaged.
Figure 10 shows the location of the jumper blocks.
A
2
1
9 10
J8A1
B
31
J9H2
OM16249
Item Description Reference Designator
A Front panel audio connector/jumper block J8A1
B BIOS Setup configuration jumper block J9H2
Figure 10. Location of the Jumper Blocks
2.9.1 Front Panel Audio Connector/Jumper Block
This connector has two functions:
• With jumpers installed, the audio line out signals are routed to the back panel audio line out
connector.
• With jumpers removed, the connector provides audio line out and mic in signals for front panel
audio connectors.
Table 30 describes the two configurations of this connector/jumper block.
54
Technical Reference
CAUTION
Do not place jumpers on this block in any configuration other than the one described in Table 30.
Other jumper configurations are not supported and could damage the Desktop Board.
Table 30. Front Panel Audio Connector/Jumper Block
Jumper Setting Configuration
1 and 2 Audio line out signals are routed to the back panel audio line out
1 2
connector. The back panel audio line out connector is shown in Figure 4
3 4
on page 44.
5 and 6
5 6
7
9 and 10
9 10
Audio line out and mic in signals are available for front panel audio
1 2
No jumpers connectors. Table 17 on page 47 lists the names of the signals available
34
installed on this connector when no jumpers are installed.
5 6
7
9 10
INTEGRATOR’S NOTE
�
When the jumpers are removed and this connector is used for front panel audio, the back panel
audio line out and mic in connectors are disabled.
2.9.2 BIOS Setup Configuration Jumper Block
The 3-pin jumper block determines the BIOS Setup program’s mode. Table 31 describes the
jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to
configuration mode and the computer is powered-up, the BIOS compares the processor version and
the microcode version in the BIOS and reports if the two match.
Table 31. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal The BIOS uses current configuration information and
3 1
1-2 passwords for booting.
Configure After the POST runs, Setup runs automatically. The
3 1
2-3 maintenance menu is displayed.
Recovery The BIOS attempts to recover the BIOS configuration. A
3 1
None recovery diskette is required.
55
Intel Desktop Board D845EPI Technical Product Specification
2.10 Mechanical Considerations
The Desktop Board D845EPI is designed to fit into either a microATX or an ATX-form-factor
chassis. Figure 11 illustrates the mechanical form factor for the Desktop Board. Dimensions are
given in inches [millimeters]. The outer dimensions are 9.20 inches by 8.20 inches
[233.68 millimeters by 208.28 millimeters]. Location of the I/O connectors and mounting holes
are in compliance with the ATX specification.
INTEGRATOR’S NOTE
�
When installing the Desktop Board in a microATX chassis, make sure that peripheral devices are
installed at least 1.5 inches above the main power connector, the diskette drive connector, the IDE
connector, and the DIMM sockets.
.800
[20.32]
6.50
[165.10]
6.10
[154.94]
5.20
[132.08]
0.00
1.700
[42.5] 9.050
[229.87]
.150
8.800
2.600
[3.81]
[223.52]
[66.04]
0.00
OM16250
Figure 11. Desktop Board Dimensions
56
Technical Reference
2.10.1 I/O Shield
The back panel I/O shield for the Desktop Board D845EPI must meet specific dimension and
material requirements. Systems based on this Desktop Board need the back panel I/O shield to
pass emissions (EMI) certification testing. Figure 12 shows the critical dimensions of the I/O
shield. Dimensions are given in inches [millimeters], to a tolerance of ±0.020 inches
[0.508 millimeters].
The figures also indicate the position of each cutout. Additional design considerations for I/O
shields relative to chassis requirements are described in the ATX specification. See Section 1.5 for
information about the ATX specification.
INTEGRATOR’S NOTE
�
An I/O shield compliant with the ATX chassis specification 2.03 is available from Intel.
6.390 Ref
[162.300]
0.063±0.005
[1.600±0.120]
0.787±0.010 TYP [20±0.254]
3x Dia 0.330 [8.380]
0.039 Dia. [1.000]
8X R0.5 MIN
0.884
[22.450] 0.519
[13.190]
0.276
0.027
[7.012]
[0.690]
1.89
0.00
Ref
0.465
[11.811]
0.465
[11.811]
0.567
[14.400]
0.567
[14.400]
0.621
[15.770]
Pictorial
View
OM12352
Figure 12. I/O Shield Dimensions
57
0.00
0.447
[11.345]
1.195
[30.360]
1.807
[45.892]
2.079
[52.804]
5.010
[127.250]
5.732
[145.584]
Intel Desktop Board D845EPI Technical Product Specification
2.11 Electrical Considerations
2.11.1 DC Loading
Table 32 lists the DC loading characteristics of the board. This data is based on a DC analysis of
all active components within the board that impact its power delivery subsystems. The analysis
does not include PCI add-in cards. Minimum values assume a light load placed on the board that
is similar to an environment with no applications running and no USB current draw. Maximum
values assume a load placed on the board that is similar to a heavy gaming environment with a
500 mA current draw per USB port. These calculations are not based on specific processor values
or memory configurations but are based on the minimum and maximum current draw possible
from the board’s power delivery subsystems to the processor, memory, and USB ports.
Use the datasheets for add-in cards, such as PCI and AGP, to determine the overall system power
requirements. The selection of a power supply at the system level is dependent on the system’s
usage model and not necessarily tied to a particular processor speed.
Table 32. DC Loading Characteristics
DC Current at:
Mode DC Power +3.3 V +5 V +12 V -12 V +5 VSB
Minimum loading 190.00 W 5.00 A 11.00 A 9.00 A 0.03 A 0.60 A
Maximum loading 286.00 W 11.00 A 15.00 A 13.00 A 0.10 A 1.40 A
2.11.2 Add-in Board Considerations
The Desktop Board D845EPI is designed to provide 2 A (average) of +5 V current for each add-in
board. The total +5 V current draw for add-in boards for a fully loaded Desktop Board D845EPI
(all four expansion slots filled) must not exceed 8 A.
2.11.3 Fan Connector Current Capability
CAUTION
The processor fan must be connected to the processor fan connector, not to a chassis fan
connector. Connecting the processor fan to a chassis fan connector may result in onboard
component damage that will halt fan operation.
Table 33 lists the current capability of the fan connectors on the Desktop Board D845EPI.
Table 33. Fan Connector Current Capability
Fan Connector Maximum Available Current
Processor fan 1.00 A
Front chassis fan 1.00 A
Rear chassis fan 1.00 A
58
Technical Reference
2.11.4 Power Supply Considerations
CAUTION
The +5 V standby line for the power supply must be capable of providing adequate +5 V standby
current. Failure to do so can damage the power supply. The total amount of standby current
required depends on the wake devices supported and manufacturing options.
System integrators should refer to the power usage values listed in Table 32 when selecting a
power supply for use with the Desktop Board D845EPI.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the following recommendations found in the indicated
sections of the ATX form factor specification:
• The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2)
• The current capability of the +5 VSB line (Section 4.2.1.2)
• All timing parameters (Section 4.2.1.3)
• All voltage tolerances (Section 4.2.2)
For information about Refer to
Section 1.5, page 17
The ATX form factor specification
2.12 Thermal Considerations
CAUTION
Ensure that the ambient temperature does not exceed the Desktop Board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case temperature
and malfunction. For information about the maximum operating temperature, see the
environmental specifications in Section 2.14.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
o
(item A in Figure 13) can reach a temperature of up to 85 C in an open chassis.
Figure 13 shows the locations of the localized high temperature zones.
59
Intel Desktop Board D845EPI Technical Product Specification
A
B
D
C
OM16251
Item Description
A Processor voltage regulator area
B Processor
C Intel 82845E MCH
D Intel 82801DB ICH4
Figure 13. Localized High Temperature Zones
Table 34 provides maximum case temperatures for Desktop Board D845EPI components that are
sensitive to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when considering
proper airflow to cool the Desktop Board D845EPI.
Table 34. Thermal Considerations for Components
Component Maximum Case Temperature
Intel Pentium 4 processor For processor case temperature, see processor datasheets and
processor specification updates
o
Intel 82845E MCH 92 C (under bias)
o
Intel 82801DB ICH4 110 C (under bias)
60
Technical Reference
2.13 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board D845EPI MTBF is
131566.83 hours.
2.14 Environmental
Table 35 lists the environmental specifications for the Desktop Board D845EPI.
Table 35. Desktop Board D845EPI Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40 °C to +70 °C
Operating 0 °C to +55 °C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
61
Intel Desktop Board D845EPI Technical Product Specification
2.15 Regulatory Compliance
This section describes the Desktop Boards’ compliance with U.S. and international safety and
electromagnetic compatibility (EMC) regulations.
2.15.1 Safety Regulations
Table 36 lists the safety regulations the Desktop Board D845EPI complies with when correctly
installed in a compatible host system.
Table 36. Safety Regulations
Regulation Title
UL 60950 3rd ed., 2000/CSA Bi-National Standard for Safety of Information Technology Equipment
C22.2 No. 60950-00 including Electrical Business Equipment. (USA and Canada)
EN 60950:2000 The Standard for Safety of Information Technology Equipment including
Electrical Business Equipment. (European Union)
rd
IEC 60950, 3 Edition, 1999 The Standard for Safety of Information Technology Equipment including
Electrical Business Equipment. (International)
2.15.2 EMC Regulations
Table 37 lists the EMC regulations the Desktop Board D845EPI complies with when correctly
installed in a compatible host system.
Table 37. EMC Regulations
Regulation Title
FCC (Class B) Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B,
Radio Frequency Devices. (USA)
ICES-003 (Class B) Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022: 1998 (Class B) Limits and methods of measurement of Radio Interference
Characteristics of Information Technology Equipment. (European
Union)
EN55024: 1998 Information Technology Equipment – Immunity Characteristics Limits
and methods of measurement. (European Union)
AS/NZS 3548 (Class B) Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
rd
CISPR 22, 3 Edition (Class B) Limits and methods of measurement of Radio Disturbance
Characteristics of Information Technology Equipment. (International)
CISPR 24: 1997 Information Technology Equipment – Immunity Characteristics – Limits
and Methods of Measurements. (International)
62
Technical Reference
2.15.2.1 FCC Compliance Statement (USA)
Product Type: D845EPI Desktop Board
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to a different electrical branch circuit from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel Corporation could
void the user’s authority to operate the equipment.
2.15.2.2 Canadian Compliance Statement
This Class B digital apparatus complies with Canadian ICES-003.
Cet appereil numérique de la classe B est conforme à la norme NMB-003 du Canada.
2.15.3 European Union Declaration of Conformity Statement
®
We, Intel Corporation, declare under our sole responsibility that the product: Intel Desktop Board
D845EPI is in conformity with all applicable essential requirements necessary for CE marking,
following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and
Council Directive 73/23/EEC (Safety/Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for distribution within all
member states of the EU with no restrictions.
This product follows the provisions of the European Directives 89/336/EEC and 73/23/EEC.
63
Intel Desktop Board D845EPI Technical Product Specification
2.15.4 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and
regulations.
2.15.4.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on
the printed wiring board assembly.
2.15.4.2 Recycling Considerations
Intel encourages its customers to recycle its products and their components (e.g., batteries, circuit
boards, plastic enclosures, etc.) whenever possible. In the U.S., a list of recyclers in your area can
be found at:
http://www.eiae.org
In the absence of a viable recycling option, products and their components must be disposed of in
accordance with all applicable local environmental regulations.
2.15.5 Product Certification Markings (Board Level)
Table 38 lists the board’s product certification markings.
Table 38. Product Certification Markings
Description Marking
UL joint US/Canada Recognized Component mark. Includes adjacent
UL file number for Intel Desktop Boards: E210882 (component side).
FCC Declaration of Conformity logo mark for Class B equipment;
includes Intel name and D845EPI model designation (component side).
CE mark. Declares compliance to European Union (EU) EMC directive
(89/336/EEC) and Low Voltage directive (73/23/EEC) (component side).
The CE mark should also be on the shipping container.
Australian Communications Authority (ACA) C-Tick mark. Includes
adjacent Intel supplier code number, N-232. The C-tick mark should
also be on the shipping container.
Printed wiring board manufacturer’s recognition mark: consists of a
94V-0
unique UL recognized manufacturer’s logo, along with a flammability
rating (solder side).
64
3 Overview of BIOS Features
What This Chapter Contains
3.1 Introduction.................................................................................................................65
3.2 BIOS Flash Memory Organization ..............................................................................66
3.3 Resource Configuration..............................................................................................66
3.4 System Management BIOS (SMBIOS).......................................................................67
3.5 Legacy USB Support ..................................................................................................67
3.6 BIOS Updates ............................................................................................................68
3.7 Recovering BIOS Data ...............................................................................................69
3.8 Boot Options...............................................................................................................70
®
3.9 Fast Booting Systems with Intel Rapid BIOS Boot....................................................71
3.10 BIOS Security Features..............................................................................................72
3.1 Introduction
The Desktop Board D845EPI uses an Intel/AMI BIOS that is stored in the Firmware Hub (FWH)
and can be updated using a disk-based program. The FWH contains the BIOS Setup program,
POST, the PCI auto-configuration utility, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
initial production BIOSs are identified as VA84510A.86A.
When the Desktop Board’s jumper is set to configuration mode and the computer is powered-up,
the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two
match.
For information about Refer to
The Desktop Boards’ compliance level with Plug and Play Section 1.5, page 17
65
Intel Desktop Board D845EPI Technical Product Specification
3.2 BIOS Flash Memory Organization
The Firmware Hub (FWH) includes a 4 Mbit (512 KB) symmetrical flash memory device.
Internally, the device is grouped into eight 64-KB blocks that are individually erasable, lockable,
and unlockable.
3.3 Resource Configuration
3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards.
Autoconfiguration lets a user insert or remove PCI cards without having to configure the system.
When a user turns on the system after adding a PCI card, the BIOS automatically configures
interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are
considered to be available for use by the add-in card.
For information about the versions of PCI and Plug and Play supported by the BIOS, see
Section 1.5.
3.3.2 PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the two
PCI IDE connectors with independent I/O channel support. The IDE interface supports hard drives
up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape
drives, and Ultra DMA drives (see Section 1.5 for the supported version of ATAPI). The BIOS
determines the capabilities of each drive and configures them to optimize capacity and
performance. To take advantage of the high capacities typically available today, hard drives are
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending
on the capability of the drive. You can override the auto-configuration options by specifying
manual configuration in the BIOS Setup program.
To use ATA-66/100 features the following items are required:
• An ATA-66/100 peripheral device
• An ATA-66/100 compatible cable
• ATA-66/100 operating system device drivers
NOTE
✏
ATA-66/100 compatible cables are backward compatible with drives using slower IDE transfer
protocols. If an ATA-66/100 disk drive and a disk drive using any other IDE transfer protocol are
attached to the same cable, the maximum transfer rate between the drives is reduced to that of the
slowest device.
NOTE
✏
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For
example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive.
66
Overview of BIOS Features
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in
a managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates for
system components. The MIF database defines the data and provides the method for accessing this
information. The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
†
Non-Plug and Play operating systems, such as Windows NT , require an additional interface for
obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such
operating systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information.
For information about Refer to
The Desktop Boards’ compliance level with SMBIOS Section 1.5, page 17
3.5 Legacy USB Support
Legacy USB support enables USB devices such as keyboards, mice, and hubs to be used even
when the operating system’s USB drivers are not yet available. Legacy USB support is used to
access the BIOS Setup program, and to install an operating system that supports USB. By default,
Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and
configure the BIOS Setup program and the maintenance menu.
4. POST completes.
67
Intel Desktop Board D845EPI Technical Product Specification
5. The operating system loads. While the operating system is loading, USB keyboards and mice
are recognized and may be used to configure the operating system. (Keyboards and mice are
not recognized during this period if Legacy USB support was set to Disabled in the BIOS
Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are
recognized by the operating system, and Legacy USB support from the BIOS is no longer
used.
To install an operating system that supports USB, verify that Legacy USB support in the BIOS
Setup program is set to Enabled and follow the operating system’s installation instructions.
NOTE
✏
Legacy USB support is for keyboards, mice, and hubs only. Other USB devices are not supported
in legacy mode.
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on the Intel
World Wide Web site:
®
• Intel Express BIOS Update utility, which enables automated updating while in the Windows
environment. Using this utility, the BIOS can be updated from a file on a hard disk, a 1.44 MB
diskette, or a CD-ROM, or from the file location on the Web.
®
• Intel Flash Memory Update Utility, which requires creation of a boot diskette and manual
rebooting of the system. Using this utility, the BIOS can be updated from a file on a 1.44 MB
diskette (from a legacy diskette drive or an LS-120 diskette drive) or a CD-ROM.
Both utilities support the following BIOS maintenance functions:
• Verifying that the updated BIOS matches the target system to prevent accidentally installing
an incompatible BIOS.
• Updating both the BIOS boot block and the main BIOS. This process is fault tolerant to
prevent boot block corruption.
• Updating the BIOS boot block separately.
• Changing the language section of the BIOS.
• Updating replaceable BIOS modules, such as the video BIOS module.
• Inserting a custom splash screen.
NOTE
✏
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
For information about Refer to
The Intel World Wide Web site Section 1.3, page 16
68
Overview of BIOS Features
3.6.1 Language Support
The BIOS Setup program and help messages are supported in five languages: US English,
German, Italian, French, and Spanish. The default language is US English, which is present unless
another language is selected in the BIOS Setup program.
3.6.2 Custom Splash Screen
During POST, an Intel splash screen is displayed by default. This splash screen can be replaced
with a custom splash screen. A utility is available from Intel to assist with creating a custom
splash screen. The custom splash screen can be programmed into the flash memory using the
BIOS upgrade utility. Information about this capability is available on the Intel Support World
Wide Web site.
For information about Refer to
The Intel World Wide Web site Section 1.3, page 16
3.7 Recovering BIOS Data
Some types of failure can destroy the BIOS. For example, the data can be lost if a power outage
occurs while the BIOS is being updated in flash memory. The BIOS can be recovered from a
diskette using the BIOS recovery mode. When recovering the BIOS, be aware of the following:
• Because of the small amount of code available in the non-erasable boot block area, there is no
video support. You can only monitor this procedure by listening to the speaker or looking at
the diskette drive LED.
• The recovery process may take several minutes; larger BIOS flash memory devices require
more time.
• Two beeps and the end of activity in the diskette drive indicate successful BIOS recovery.
• A series of continuous beeps indicates a failed BIOS recovery.
To create a BIOS recovery diskette, a bootable diskette must be created and the BIOS update files
copied to it. BIOS upgrades and the Intel Flash Memory Update Utility are available from Intel
Customer Support through the Intel World Wide Web site.
NOTE
✏
Even if the computer is configured to boot from an LS-120 diskette (in the Setup program’s
Removable Devices submenu), the BIOS recovery diskette must be a standard 1.44 MB diskette not
a 120 MB diskette.
For information about Refer to
The BIOS recovery mode jumper settings Section 2.9.2, page 55
The Boot menu in the BIOS Setup program Section 4.7, page 92
Contacting Intel customer support Section 1.3, page 16
69
Intel Desktop Board D845EPI Technical Product Specification
3.8 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives,
CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device,
the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled.
3.8.1 CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format
specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a
boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD
in the CD-ROM drive, the system will attempt to boot from the next defined drive.
For information about Refer to
The El Torito specification Section 1.5, page 17
3.8.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard
LAN or a network add-in card with a remote boot ROM installed.
Pressing the message.
continued
100
Error Messages and Beep Codes
Table 68. Runtime Code Uncompressed in F000 Shadow RAM (continued)
Code Description of POST Operation
40 To prepare the descriptor tables.
42 To enter in virtual mode for memory test.
43 To enable interrupts for diagnostics mode.
44 To initialize data to check memory wrap around at 0:0.
45 Data initialized. Going to check for memory wrap around at 0:0 and finding the total system
memory size.
46 Memory wrap around test done. Memory size calculation over. About to go for writing patterns to
test memory.
47 Pattern to be tested written in extended memory. Going to write patterns in base 640k memory.
48 Patterns written in base memory. Going to find out amount of memory below 1M memory.
49 Amount of memory below 1M found and verified. Going to find out amount of memory above 1M
memory.
4B Amount of memory above 1M found and verified. Check for soft reset and going to clear memory
below 1M for soft reset. (If power on, go to check point # 4Eh).
4C Memory below 1M cleared. (SOFT RESET) Going to clear memory above 1M.
4D Memory above 1M cleared. (SOFT RESET) Going to save the memory size. (Go to check
point # 52h).
4E Memory test started. (NOT SOFT RESET) About to display the first 64k memory size.
4F Memory size display started. This will be updated during memory test. Going for sequential and
random memory test.
50 Memory testing/initialization below 1M complete. Going to adjust displayed memory size for
relocation/shadow.
51 Memory size display adjusted due to relocation/ shadow. Memory test above 1M to follow.
52 Memory testing/initialization above 1M complete. Going to save memory size information.
53 Memory size information is saved. CPU registers are saved. Going to enter in real mode.
54 Shutdown successful, CPU in real mode. Going to disable gate A20 line and disable parity/NMI.
57 A20 address line, parity/NMI disable successful. Going to adjust memory size depending on
relocation/shadow.
58 Memory size adjusted for relocation/shadow. Going to clear Hit message.
59 Hit message cleared.
Frequently asked questions
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