INTEL BLKD915PGNLPAK10
Specifications
Additional Connectors (Optional)
4 x Hi-Speed USB
Audio Codec
Realtek ALC860
Bus Clock
333 MHz, 400 MHz
Chipset Type
Intel 915P Express / Intel ICH6
Compatible Processors
Pentium 4 Extreme Edition, Celeron D, Pentium 4
Compliant Standards
High Definition Audio
Expansion Slot(s)
4 x DIMM 184-pin, 1 x PCIe x16, 4 x PCI, 2 x PCIe x1, 1 x CPU
Features
Dual channel memory architecture
Interfaces
4 x USB 2.0, 1 x Serial, 1 x Parallel, 1 x PS/2 keyboard, 1 x PS/2 mouse, 1 x Audio line-in - Mini-jack, 1 x Audio line-out - Mini-jack, 1 x Microphone - Mini-jack
Internal Interfaces
1 x Floppy
Max Bus Speed
800 MHz
Max Processors Qty
1
Max Size
4 GB
Modem
None
Power Connectors
4-pin ATX12V connector, 24-pin main power connector
Processor
Intel Pentium 4
Processor Socket
LGA775 Socket
Product Type
Motherboard - ATX
Speed
PC2700, PC3200
Storage Interfaces
Intel ICH6 : ATA-100 - connector(s): 1 x 40pin IDC - 2 device(s), Intel ICH6 : Serial ATA-150 - connector(s): 4 x 7pin Serial ATA - 4 device(s)
Technology
DDR SDRAM
Type
High Definition Audio
Features
- 533/800 MHz
- ATX form factor
- Four (4) 184-pin DIMM slots
- Four (4) PCI slots
- Four (4) Serial ATA interfaces
- Intel 915P chipset
- Intel high-definition audio
- LPC Bus I/O controller
- One (1) floppy controller
- One (1) PCIe x16 slot
- One (1) UDMA/33/66/100 IDE controllers
- Socket 775
- Supports up to 4 GB DDR SDRAM (DDR 333/400 MHz)
- Two (2) PCIe x1 slots
Datasheet
Intel=D915PGN=datasheet1-619782658.pdf
2014 KiB
Extracted Text
®
Intel Desktop Boards
D915PGN/D915PSY
Technical Product Specification
June 2004
Order Number: C68598-001
®
The Intel Desktop Board D915PGN/D915PSY may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D915PGN/D915PSY Specification Update.
Revision History
Revision Revision History Date
®
-001 First release of the Intel Desktop Board D915PGN/D915PSY Technical June 2004
Product Specification.
®
This product specification applies to only standard Intel Desktop Boards D915PGN and
D915PGN with BIOS identifier EV91510A.86A.
Changes to this specification will be published in the Intel Desktop Board D915PGN/D915PSY
Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH
PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN
MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not
provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
®
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other
countries.
* Other names and brands may be claimed as the property of others.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
®
power and environmental requirements, and the BIOS for these Intel Desktop Boards: D915PGN
and D915PSY. It describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Boards
D915PGN and D915PSY and their components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Boards D915PGN and D915PSY
2 A map of the resources of the Desktop Boards
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
✏
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Boards D915PGN and D915PSY, and X is the
instance of the particular part at that general location. For example, J5J1 is a connector,
located at 5J. It is the first connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 PCI Bus Terminology Change......................................................................................11
1.2 Board Differences ........................................................................................................11
1.3 Overview ......................................................................................................................12
1.3.1 Feature Summary..........................................................................................12
1.3.2 Manufacturing Options ..................................................................................13
1.3.3 Board Layouts ...............................................................................................14
1.3.4 Block Diagram ...............................................................................................18
1.4 Online Support .............................................................................................................19
1.5 Processor.....................................................................................................................19
1.6 System Memory ...........................................................................................................20
1.6.1 Memory Configurations .................................................................................22
®
1.7 Intel 915P Chipset......................................................................................................26
1.7.1 USB ...............................................................................................................26
1.7.2 IDE Support...................................................................................................26
1.7.3 Real-Time Clock, CMOS SRAM, and Battery................................................28
1.8 PCI Express Connectors..............................................................................................28
1.9 I/O Controller................................................................................................................29
1.9.1 Serial Ports....................................................................................................29
1.9.2 Parallel Port...................................................................................................29
1.9.3 Diskette Drive Controller................................................................................29
1.9.4 Keyboard and Mouse Interface .....................................................................30
1.10 Audio Subsystem .........................................................................................................30
1.10.1 Audio Subsystem Software ...........................................................................30
1.10.2 Audio Connectors..........................................................................................30
®
1.10.3 Intel High Definition Audio Subsystem ........................................................31
1.11 LAN Subsystem ...........................................................................................................32
®
1.11.1 Intel 82562EZ Physical Layer Interface Device...........................................32
1.11.2 Alert Standard Format (ASF) Support ...........................................................33
1.11.3 LAN Subsystem Software..............................................................................34
®
1.11.4 Intel Wireless Connect Technology (Optional) ............................................34
1.12 Hardware Management Subsystem.............................................................................34
1.12.1 Hardware Monitoring and Fan Control ASIC .................................................34
1.12.2 Thermal Monitoring........................................................................................36
1.12.3 Fan Monitoring...............................................................................................37
1.12.4 Chassis Intrusion and Detection....................................................................38
1.13 Power Management .....................................................................................................38
1.13.1 ACPI ..............................................................................................................38
1.13.2 Hardware Support .........................................................................................41
1.14 Trusted Platform Module (Optional) .............................................................................46
1.14.1 System Requirements ...................................................................................46
1.14.2 Warning of Potential Data Loss.....................................................................46
1.14.3 Security Precautions......................................................................................47
1.14.4 Trusted Platform Module Ownership .............................................................48
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Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.14.5 Enabling the Trusted Platform Module ..........................................................49
1.14.6 Assuming Trusted Platform Module Ownership ............................................49
1.14.7 Recovery Procedures....................................................................................50
1.14.8 Clearing Trusted Platform Module Ownership...............................................51
1.14.9 Software Support...........................................................................................52
2 Technical Reference
2.1 Introduction ..................................................................................................................55
2.2 Memory Resources......................................................................................................55
2.2.1 Addressable Memory.....................................................................................55
2.2.2 Memory Map..................................................................................................57
2.3 DMA Channels.............................................................................................................57
2.4 Fixed I/O Map...............................................................................................................58
2.5 PCI Configuration Space Map......................................................................................59
2.6 Interrupts......................................................................................................................60
2.7 PCI Conventional Interrupt Routing Map .....................................................................61
2.8 Connectors...................................................................................................................63
2.8.1 Back Panel Connectors.................................................................................64
2.8.2 Component-side Connectors.........................................................................66
2.9 Jumper Block ...............................................................................................................77
2.10 Mechanical Considerations..........................................................................................78
2.10.1 D915PGN Board Form Factor .......................................................................78
2.10.2 D915PSY Board Form Factor........................................................................79
2.10.3 I/O Shield.......................................................................................................80
2.11 Electrical Considerations..............................................................................................81
2.11.1 DC Loading....................................................................................................81
2.11.2 Add-in Board Considerations.........................................................................81
2.11.3 Fan Connector Current Capability.................................................................82
2.11.4 Power Supply Considerations .......................................................................82
2.12 Thermal Considerations...............................................................................................83
2.13 Reliability......................................................................................................................85
2.14 Environmental ..............................................................................................................86
2.15 Regulatory Compliance................................................................................................87
2.15.1 Safety Regulations ........................................................................................87
2.15.2 EMC Regulations...........................................................................................87
2.15.3 European Union Declaration of Conformity Statement..................................88
2.15.4 Product Ecology Statements .........................................................................89
2.15.5 Product Certification Markings (Board Level)................................................90
3 Overview of BIOS Features
3.1 Introduction ..................................................................................................................91
3.2 BIOS Flash Memory Organization ...............................................................................92
3.3 Resource Configuration ...............................................................................................92
3.3.1 PCI Autoconfiguration....................................................................................92
3.3.2 PCI IDE Support ............................................................................................92
3.4 System Management BIOS (SMBIOS) ........................................................................93
3.5 Legacy USB Support....................................................................................................93
vi
Contents
3.6 BIOS Updates ..............................................................................................................94
3.6.1 Language Support.........................................................................................94
3.6.2 Custom Splash Screen..................................................................................94
3.7 Boot Options ................................................................................................................95
3.7.1 CD-ROM Boot ...............................................................................................95
3.7.2 Network Boot.................................................................................................95
3.7.3 Booting Without Attached Devices ................................................................95
3.7.4 Changing the Default Boot Device During POST ..........................................95
®
3.8 Fast Booting Systems with Intel Rapid BIOS Boot.....................................................96
3.8.1 Peripheral Selection and Configuration.........................................................96
3.8.2 Intel Rapid BIOS Boot ...................................................................................96
3.9 BIOS Security Features ...............................................................................................97
4 Error Messages and Beep Codes
4.1 BIOS Error Messages ..................................................................................................99
4.2 Port 80h POST Codes ...............................................................................................101
4.3 Bus Initialization Checkpoints ....................................................................................105
4.4 Speaker .....................................................................................................................106
4.5 BIOS Beep Codes......................................................................................................106
Figures
1. D915PGN Board Components.....................................................................................14
2. D915PSY Board Components .....................................................................................16
3. Block Diagram..............................................................................................................18
4. Memory Channel and DIMM Configuration..................................................................22
5. Dual Channel (Interleaved) Mode Configuration with Two DIMMs ..............................23
6. Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................23
7. Dual Channel (Interleaved) Mode Configuration with Four DIMMs..............................24
8. Single Channel (Asymmetric) Mode Configuration with One DIMM.............................25
9. Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................25
10. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem......31
11. High Definition Audio Subsystem Block Diagram ........................................................32
12. LAN Connector LED Locations ....................................................................................33
13. Thermal Monitoring for D915PGN Board .....................................................................36
14. Thermal Monitoring for D915PSY Board......................................................................37
15. Location of the Standby Power Indicator LED .............................................................45
16. Detailed System Memory Address Map.......................................................................56
17. Back Panel Connectors................................................................................................64
18. D915PGN Board Component-side Connectors ...........................................................66
19. D915PSY Board Component-side Connectors ............................................................68
20. Connection Diagram for Front Panel Connector ..........................................................74
21. Connection Diagram for Front Panel USB Connectors................................................76
22. Connection Diagram for IEEE 1394a Connectors........................................................76
23. Location of the Jumper Block.......................................................................................77
24. D915PGN Board Dimensions ......................................................................................78
25. D915PSY Board Dimensions .......................................................................................79
26. I/O Shield Dimensions..................................................................................................80
27. Processor Heatsink for Omni-directional Airflow..........................................................83
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Intel Desktop Board D915PGN/D915PSY Technical Product Specification
28. Localized High Temperature Zones.............................................................................84
Tables
1. Summary of Board Differences ....................................................................................11
2. Feature Summary ........................................................................................................12
3. Manufacturing Options.................................................................................................13
4. D915PGN Board Components Shown in Figure 1.......................................................15
5. D915PSY Board Components Shown in Figure 2. ......................................................17
6. Supported System Bus Frequency and Memory Speed Combinations .......................20
7. Supported Memory Configurations ..............................................................................21
8. LAN Connector LED States .........................................................................................33
9. Effects of Pressing the Power Switch ..........................................................................39
10. Power States and Targeted System Power .................................................................40
11. Wake-up Devices and Events......................................................................................41
12. System Memory Map ...................................................................................................57
13. DMA Channels.............................................................................................................57
14. I/O Map ........................................................................................................................58
15. PCI Configuration Space Map......................................................................................59
16. Interrupts......................................................................................................................60
17. PCI Interrupt Routing Map ...........................................................................................62
18. Back Panel Connectors Shown in Figure 17................................................................65
19. Component-side Connectors Shown in Figure 18. ......................................................67
20. Component-side Connectors Shown in Figure 19. ......................................................69
21. S/PDIF Connector (Optional) .......................................................................................70
22. ATAPI CD-ROM Connector (Optional).........................................................................70
23. Front Panel Audio Connector.......................................................................................70
24. Serial Port B Connector (optional) ...............................................................................70
25. Chassis Intrusion Connector........................................................................................70
26. SCSI Hard Drive Activity LED Connector (Optional)....................................................71
27. Serial ATA Connectors.................................................................................................71
28. Processor Fan Connector ............................................................................................71
29. Chassis Fan Connectors..............................................................................................71
30. Main Power Connector.................................................................................................72
31. ATX12V Power Connector ...........................................................................................73
32. Alternate Power Connector..........................................................................................73
33. Auxiliary Front Panel Power/Sleep LED Connector .....................................................73
34. Front Panel Connector.................................................................................................74
35. States for a One-Color Power LED ..............................................................................75
36. States for a Two-Color Power LED ..............................................................................75
37. BIOS Setup Configuration Jumper Settings.................................................................77
38. DC Loading Characteristics .........................................................................................81
39. Fan Connector Current Capability................................................................................82
40. Thermal Considerations for Components ....................................................................85
41. Environmental Specifications.......................................................................................86
42. Safety Regulations.......................................................................................................87
43. EMC Regulations .........................................................................................................87
44. Product Certification Markings .....................................................................................90
45. BIOS Setup Program Menu Bar...................................................................................92
viii
Contents
46. BIOS Setup Program Function Keys............................................................................92
47. Boot Device Menu Options ..........................................................................................95
48. Supervisor and User Password Functions...................................................................97
49. BIOS Error Messages ..................................................................................................99
50. Uncompressed INIT Code Checkpoints.....................................................................101
51. Boot Block Recovery Code Checkpoints ...................................................................101
52. Runtime Code Uncompressed in F000 Shadow RAM ...............................................102
53. Bus Initialization Checkpoints ....................................................................................105
54. Upper Nibble High Byte Functions.............................................................................105
55. Lower Nibble High Byte Functions.............................................................................106
56. Beep Codes ...............................................................................................................106
ix
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
x
1 Product Description
What This Chapter Contains
1.1 PCI Bus Terminology Change......................................................................................11
1.2 Board Differences ........................................................................................................11
1.3 Overview ......................................................................................................................12
1.4 Online Support .............................................................................................................19
1.5 Processor.....................................................................................................................19
1.6 System Memory ...........................................................................................................20
®
1.7 Intel 915P Chipset......................................................................................................26
1.8 PCI Express Connectors..............................................................................................28
1.9 I/O Controller................................................................................................................29
1.10 Audio Subsystem .........................................................................................................30
1.11 LAN Subsystem ...........................................................................................................32
1.12 Hardware Management Subsystem.............................................................................34
1.13 Power Management .....................................................................................................38
1.14 Trusted Platform Module (Optional) .............................................................................46
1.1 PCI Bus Terminology Change
®
Previous generations of Intel Desktop Boards used an add-in card connector referred to as PCI.
This generation of Intel Desktop Boards adds a new technology for add-in cards: PCI Express.
The 32-bit parallel bus previously referred to as PCI is now called PCI Conventional.
1.2 Board Differences
This TPS describes these Intel Desktop Boards: D915PGN and D915PSY. The Desktop Boards
are identical with the exception of the items listed in Table 1.
Table 1. Summary of Board Differences
D915PGN • ATX Form Factor
• Four PCI Conventional bus connectors
• Two PCI Express* x1 bus add-in card connectors
• Three chassis fan connectors (front chassis, rear chassis 1, and rear chassis 2)
D915PSY • microATX Form Factor
• Two PCI Conventional bus connectors
• One PCI Express x1 bus add-in card connector
• Two chassis fan connectors (front chassis and rear chassis)
11
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
NOTE
✏
Most of the illustrations in this document show only the Desktop Board D915PGN. When there are
significant differences between the two Desktop Boards, illustrations of both boards are provided.
1.3 Overview
1.3.1 Feature Summary
Table 2 summarizes the major features of the Desktop Boards D915PGN and D915PSY.
Table 2. Feature Summary
Form Factor • D915PGN: ATX (12.00 inches by 9.60 inches [304.80 millimeters by
243.84 millimeters])
• D915PSY: microATX Form Factor (9.60 inches by 9.60 inches [243.84
millimeters by 243.84 millimeters])
® ®
Processor Support for an Intel Pentium 4 processor in an LGA775 socket with an 800 or
533 MHz system bus
Memory • Four DDR SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR 400 MHz and DDR 333 MHz DIMMs
• Support for up to 4 GB of system memory
®
Chipset
Intel 915P Chipset, consisting of:
®
• Intel 82915P Memory Controller Hub (MCH)
®
• Intel 82801FB I/O Controller Hub (ICH6)
• 4 Mbit Firmware Hub (FWH)
Video One PCI Express x16 bus add-in card connector
®
Audio Intel High Definition Audio subsystem using the Realtek* ALC860 audio codec
I/O Control LPC Bus I/O controller
USB Support for USB 2.0 devices
Peripheral • Eight USB ports
Interfaces
• One serial port
• One parallel port
• Four Serial ATA interfaces
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
• One diskette drive interface
• PS/2* keyboard and mouse ports
®
LAN Support 10/100 Mbits/sec LAN subsystem using the Intel 82562EZ Platform LAN Connect
(PLC) device
BIOS • Intel/AMI BIOS (resident in the 4 Mbit FWH)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
continued
12
Product Description
Table 2. Feature Summary (continued)
Instantly Available • Support for PCI Local Bus Specification Revision 2.2
PC Technology
• Support for PCI Express Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
Expansion
• PCI Conventional bus connectors (four on the D915PGN; two on the D915PSY)
Capabilities
• PCI Express x1 bus add-in card connectors (two on the D915PGN; one on the
D915PSY)
• One PCI Express x16 bus add-in card connector (both boards)
Hardware Monitor • Hardware monitoring and fan control ASIC
Subsystem
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan connectors
• Three fan sense inputs used to monitor fan activity
• Fan speed control
1.3.2 Manufacturing Options
Table 3 describes the manufacturing options on the Desktop Boards D915PGN and D915PSY. Not
every manufacturing option is available in all marketing channels. Please contact your Intel
representative to determine which manufacturing options are available to you.
Table 3. Manufacturing Options
ATAPI CD-ROM A connector for attaching an internal CD-ROM drive to the onboard audio subsystem.
Connector
ATX fan Additional fan connector for use in larger chassis (D915PGN board only).
connector
IEEE-1394a IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector,
Interface two front-panel connectors).
® ®
Intel 82801FBW I/O controller Hub that supports Intel Wireless Connect Technology.
I/O Controller Hub
(ICH6W)
SCSI Hard Drive Allows add-in hard drive controllers (SCSI or other) to use the same LED as the
Activity LED onboard IDE controller.
Connector
Serial Port B Second serial port accessible via a connector on the component side of the board.
S/PDIF Connector A 1 x 3 connector (mounted on the component side of the board) that provides digital
audio signals in S/PDIF format.
Trusted Platform A component that enhances platform security.
Module (TPM)
For information about Refer to
Available configurations for the Desktop Boards D915PGN and D915PSY Section 1.4, page 19
13
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.3.3 Board Layouts
Figure 1 shows the location of the major components on the Desktop Board D915PGN.
A B D F G H I J K L
C E
M
N
O
MM
LL
KK
P
JJ
Q
R
S
II
T
U
HH
FF DD BB
GG EE CC AA Z Y X W V
OM17051
Figure 1. D915PGN Board Components
Table 4 lists the components identified in Figure 1.
14
Product Description
Table 4. D915PGN Board Components Shown in Figure 1.
Item/callout
from Figure 1 Description
A
Rear chassis fan connector 2
B
Speaker
C
PCI Express x1 bus add-in card connectors
D
ATAPI CD-ROM connector (optional)
E
S/PDIF connector (optional)
F
Realtek ALC860 audio codec
G
Front panel audio connector
H
PCI Conventional bus add-in card connectors
I
Ethernet PLC device (optional)
J
PCI Express x16 bus add-in card connector
K
Rear chassis fan connector 1
L
Back panel connectors
M
Alternate power connector
N
+12V power connector (ATX12V)
O
LGA775 processor socket
P
Processor fan connector
Q
Intel 82915P MCH
R
DIMM Channel A sockets
S
Serial port B connector (optional)
T
DIMM Channel B sockets
U
SCSI LED (optional)
V
I/O controller
W
Power connector
X
Diskette drive connector
Y
Parallel ATE IDE connector
Z
Battery
AA
Chassis intrusion connector
BB
BIOS Setup configuration jumper block
CC
4 Mbit Firmware Hub (FWH)
DD
Front chassis fan connector
EE
Serial ATA connectors
FF
Auxiliary front panel power LED connector
GG
Front panel connector
HH
ATX fan connector (optional)
II
Front panel USB connector
JJ
Intel 82801FB I/O Controller Hub (ICH6)
KK
Front panel IEEE-1394a connectors (optional)
LL
IEEE-1394a controller (optional)
MM
PCI Conventional bus add-in card connectors
15
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
Figure 2 shows the location of the major components on the Desktop Board D915PSY.
A CEF G H I J
B D
K
L
KK
M
JJ
N
II
O
HH
P
Q
R
GG
S
T
EE CC AA
FF DD BB Y X W V U
Z
OM17052
Figure 2. D915PSY Board Components
Table 5 lists the components identified in Figure 2.
16
Product Description
Table 5. D915PSY Board Components Shown in Figure 2.
Item/callout
from Figure 2 Description
A
ATAPI CD-ROM connector (optional)
B
PCI Express x1 bus add-in card connectors
C
Realtek ALC860 audio codec
D
S/PDIF connector (optional)
E
Front panel audio connector
F
PCI Conventional bus add-in card connectors
G
Ethernet PLC device (optional)
H
PCI Express x16 bus add-in card connector
I
Rear chassis fan connector
J
Back panel connectors
K
Alternate power connector
L
+12V power connector (ATX12V)
M
LGA775 processor socket
N
Hardware monitoring and fan control ASIC
O
Processor fan connector
P
Intel 82915P MCH
Q
DIMM Channel A sockets
R
Serial port B connector (optional)
S
DIMM Channel B sockets
T
SCSI LED connector (optional)
U
I/O controller
V
Power connector
W
Diskette drive connector
X
Parallel ATE IDE connector
Y
Battery
Z
Chassis intrusion connector
AA
BIOS Setup configuration jumper block
BB
4 Mbit Firmware Hub (FWH)
CC
Front chassis fan connector
DD
Serial ATA connectors
EE
Auxiliary front panel power LED connector
FF
Front panel connector
GG
Front panel USB connector
HH
Intel 82801FB I/O Controller Hub (ICH6)
II
Front panel IEEE-1394a connectors (optional)
JJ
IEEE-1394a controller (optional)
KK
Speaker
17
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.3.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the boards.
PCI Express x1 Interface
PCI Express x1 Slot 1
Back Panel/Front Panel
USB
D915PGN USB Ports
PCI Express x1 Slot 2
only
Serial Ports
LPC Bus
Parallel Port
Parallel ATA Parallel ATA
I/O
PS/2 Mouse
IDE Connector IDE Interface
Controller
PS/2 Keyboard
LGA775 System Bus Diskette Drive
Processor Socket (800/533 MHz) Connector
LPC Bus
PCI Express
x16 Interface
Intel 82915P Intel 82801FB 4 Mbit
Memory Controller I/O Controller Hub Firmware Hub
PCI Express
(ICH6) (FWH)
Hub (MCH)
x16
Connector
Intel 915P Chipset
Dual-Channel
TPM Component
Memory Bus
Channel A
(Optional)
SMBus
DIMMs (2)
Channel B
DIMMs (2)
10/100 LAN
LAN PLC Connector
IEEE-1394a Connectors
PCI Bus
(Optional)
Serial ATA Serial ATA IDE
IDE Interface Connectors (4)
PCI Bus
Mic In/Retasking Jack B
PCI Slot 1
Line In/Retasking Jack C
Line Out/Retasking Jack D
PCI Slot 2
SMBus
Audio Retasking Jack E [Port 1]
PCI Slot 3
Codec
D915PGN
Retasking Jack F [Port 2]
Hardware Monitoring
only
PCI Slot 4
CD-ROM (optional)
and Fan Control ASIC
S/PDIF (optional)
= connector or socket
OM17053
Figure 3. Block Diagram
18
DMI Interconnect
High Definition Audio Link
LAN Connect
Interface
LPC Bus
Product Description
1.4 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Boards D915PGN and http://www.intel.com/design/motherbd
D915PSY under “Desktop Board
Products” or “Desktop Board Support” http://support.intel.com/support/motherboards/desktop
Available configurations for the Desktop http://developer.intel.com/design/motherbd/gn/gn_available.htm
Board D915PGN
Available configurations for the Desktop http://developer.intel.com/design/motherbd/sy/sy_available.htm
Board D915PSY
Processor data sheets http://www.intel.com/design/litcentr
ICH6 addressing http://developer.intel.com/design/chipsets/datashts
Custom splash screens http://intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
1.5 Processor
The boards are designed to support Intel Pentium 4 processors in an LGA775 processor socket with
an 800 or 533 MHz system bus. See the Intel web site listed below for the most up-to-date list of
supported processors.
For information about… Refer to:
Supported processors for the D915PGN board http://www.intel.com/design/motherbd/gn/gn_proc.htm
Supported processors for the D915PSY board http://www.intel.com/design/motherbd/sy/sy_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
• Use only ATX12V-compliant power supplies.
• Refer to Table 6 on page 20 for a list of supported system bus frequency and memory speed
combinations.
For information about Refer to
Power supply connectors Section 2.8.2.2, page 72
19
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.6 System Memory
The boards have four DIMM sockets and support the following memory features:
• 2.5 V (only) DDR SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 4 GB maximum total system memory. Refer to Section 2.2.1 on page 55 for information on the
total amount of addressable memory.
• Minimum total system memory: 128 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR 400 MHz and DDR 333 MHz SDRAM DIMMs
Table 6 lists the supported system bus frequency and memory speed combinations.
Table 6. Supported System Bus Frequency and Memory Speed Combinations
To use this type of DIMM… The processor's system bus frequency must be…
DDR 400 800 MHz
DDR 333 (Note) 800 or 533 MHz
Note: When using an 800 MHz system bus frequency processor, DDR 333 memory is clocked at 320 MHz. This minimizes
system latencies to optimize system throughput.
✏ NOTES
• Remove the PCI Express x16 video card before installing or upgrading memory to avoid
interference with the memory retention mechanism.
• To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure.
This allows the BIOS to read the SPD data and program the chipset to accurately configure
memory settings for optimum performance. If non-SPD memory is installed, the BIOS will
attempt to correctly configure the memory settings, but performance and reliability may be
impacted or the DIMMs may not function under the determined frequency.
20
Product Description
Table 7 lists the supported DIMM configurations.
Table 7. Supported Memory Configurations
DIMM SDRAM SDRAM Organization Number of SDRAM
Capacity Configuration Density Front-side/Back-side Devices
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers
to single-sided memory modules (containing one row of SDRAM).
INTEGRATOR’S NOTE
#
It is possible to install four 2048 MB (2 GB) modules for a total of 8 GB of system memory,
however, only 4 GB of address space is available. Refer to Section 2.2.1, on page 55 for additional
information on available memory.
21
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.6.1 Memory Configurations
The Intel 82915P MCH supports two types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for real world
applications. Dual channel mode is enabled when the installed memory capacities of both
DIMM channels are equal. Technology and device width can vary from one channel to the
other but the installed memory capacity for each channel must be equal. If different speed
DIMMs are used between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth
operation for real world applications. This mode is used when only a single DIMM is installed
or the memory capacities are unequal. Technology and device width can vary from one
channel to the other. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
Figure 4 illustrates the memory channel and DIMM configuration.
NOTE
✏
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black.
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17054
Figure 4. Memory Channel and DIMM Configuration
22
Product Description
1.6.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 5 shows a dual channel configuration using two DIMMs. In this example, the DIMM0
(blue) sockets of both channels are populated with identical DIMMs.
1 GB Channel A, DIMM 0
Channel A, DIMM 1
1 GB Channel B, DIMM 0
Channel B, DIMM 1
OM17123
Figure 5. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 6 shows a dual channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0
(blue) socket of Channel B.
256 MB Channel A, DIMM 0
256 MB
Channel A, DIMM 1
512 MB Channel B, DIMM 0
Channel B, DIMM 1
OM17122
Figure 6. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
23
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
Figure 7 shows a dual channel configuration using four DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in
Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
256 MB Channel A, DIMM 0
512 MB
Channel A, DIMM 1
256 MB Channel B, DIMM 0
512 MB
Channel B, DIMM 1
OM17124
Figure 7. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
24
Product Description
1.6.1.2 Single Channel (Asymmetric) Mode Configurations
NOTE
✏
Dual channel (Interleaved) mode configurations provide the highest memory throughput.
Figure 8 shows a single channel configuration using one DIMM. In this example, only the DIMM0
(blue) socket of Channel A is populated. Channel B is not populated.
256 MB Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17125
Figure 8. Single Channel (Asymmetric) Mode Configuration with One DIMM
Figure 9 shows a single channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the
DIMM0 (blue) socket of Channel B.
256 MB Channel A, DIMM 0
512 MB
Channel A, DIMM 1
512 MB Channel B, DIMM 0
Channel B, DIMM 1
OM17126
Figure 9. Single Channel (Asymmetric) Mode Configuration with Three DIMMs
25
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
®
1.7 Intel 915P Chipset
The Intel 915P chipset consists of the following devices:
• Intel 82915P Memory Controller Hub (MCH) with Direct Media Interface (DMI) interconnect
• Intel 82801FB I/O Controller Hub (ICH6) with DMI interconnect
• Firmware Hub (FWH)
The MCH is a centralized controller for the system bus, the memory bus, the PCI Express bus, and
the DMI interconnect. The ICH6 is a centralized controller for the board’s I/O paths. The FWH
provides the nonvolatile storage of the BIOS.
For information about Refer to
The Intel 915P chipset http://developer.intel.com/
Resources used by the chipset Chapter 2
1.7.1 USB
The boards support up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and
EHCI-compatible drivers.
The ICH6 provides the USB controller for all ports. The port arrangement is as follows:
• Four ports are implemented with dual stacked back panel connectors adjacent to the audio
connectors
• Four ports are routed to two separate front panel USB connectors
NOTE
✏
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the
requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 17, page 64
The location of the front panel USB connectors on the D915PGN board Figure 18, page 66
The location of the front panel USB connectors on the D915PSY board Figure 19, page 68
1.7.2 IDE Support
The boards provides five IDE interface connectors:
• One parallel ATA IDE connector that supports two devices
• Four serial ATA IDE connectors that support one device per connector
1.7.2.1 Parallel ATE IDE Interface
The ICH6’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
26
Product Description
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH6’s ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
✏ NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections,
noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The boards support Laser Servo (LS-120) diskette technology through the Parallel ATA IDE
interfaces. An LS-120 drive can be configured as a boot device by setting the BIOS Setup
program’s Boot menu to one of the following:
• ARMD-FDD (ATAPI removable media device – floppy disk drive)
• ARMD-HDD (ATAPI removable media device – hard disk drive)
For information about Refer to
The location of the Parallel ATA IDE connector on the D915PGN board Figure 18, page 66
The location of the Parallel ATA IDE connector on the D915PSY board Figure 19, page 68
1.7.2.2 Serial ATA Interfaces
The ICH6’s Serial ATA controller offers four independent Serial ATA ports with a theoretical
maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a
maximum of four Serial ATA devices. A point-to-point interface is used for host to device
connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard
IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for configurations
using the Windows XP and Windows 2000 operating systems.
NOTE
✏
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power
supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
27
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
For information about Refer to
The location of the Serial ATA IDE connectors on the D915PGN board Figure 18, page 66
The location of the Serial ATA IDE connectors on the D915PSY board Figure 19, page 68
1.7.2.3 SCSI Hard Drive Activity LED Connector (Optional)
The SCSI hard drive activity LED connector is a 1 x 2-pin connector that allows an add-in
hard drive controller to use the same LED as the onboard IDE controller. For proper operation, this
connector should be wired to the LED output of the add-in hard drive controller. The LED
indicates when data is being read from, or written to, either the add-in hard drive controller or the
onboard IDE controller (Parallel ATA or Serial ATA).
For information about Refer to
The location of the SCSI hard drive activity LED connector on the D915PGN board Figure 18, page 66
The location of the SCSI hard drive activity LED connector on the D915PSY board Figure 19, page 68
The signal names of the SCSI hard drive activity LED connector Table 26, page 71
1.7.3 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
✏ NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
1.8 PCI Express Connectors
The boards provide the following PCI Express connectors:
• One PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec
• Two PCI Express x1 connectors. The x1 interfaces support simultaneous transfer speeds up to
500 MBytes/sec
The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the
underlying PCI Express architecture is compatible with PCI Conventional compliant operating
systems. Additional features of the PCI Express interface includes the following:
• Support for the PCI Express enhanced configuration mechanism
• Automatic discovery, link training, and initialization
• Support for Active State Power Management (ASPM)
• SMBus 2.0 support
• Wake# signal supporting wake events from ACPI S1, S3, S4, or S5
• Software compatible with the PCI Power Management Event (PME) mechanism defined in the
PCI Power Management Specification Rev. 1.1
28
Product Description
1.9 I/O Controller
The I/O controller provides the following features:
• Two serial ports (Serial Port B is optional)
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.44 MB or 2.88 MB diskette drive
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1 Serial Ports
The Desktop Board can support up to two serial port connectors. Serial port A is located on the
back panel. Serial port B (optional) is accessible using a connector on the component side of board.
The serial ports support data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port A connector Figure 17, page 64
The location of the serial port B connector on the D915PGN board Figure 18, page 66
The location of the serial port B connector on the D915PSY board Figure 19, page 68
The signal names of the serial port B connector Table 24, page 70
1.9.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup
program to set the parallel port mode.
For information about Refer to
The location of the parallel port connector Figure 17, page 64
1.9.3 Diskette Drive Controller
The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the
diskette drive interface.
For information about Refer to
The location of the diskette drive connector on the D915PGN board Figure 18, page 66
The location of the diskette drive connector on the D915PSY board Figure 19, page 68
29
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.9.4 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
✏
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top
PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is
connected or disconnected.
For information about Refer to
The location of the keyboard and mouse connectors Figure 17, page 64
1.10 Audio Subsystem
The boards support the Intel High Definition audio subsystem based on the Realtek ALC860
codec. The audio subsystem supports the following features:
• Advanced jack sense (front and rear panel) that enables the audio codec to recognize the
device that is connected to an audio port. All jacks are capable of retasking according to user’s
definition, or can be automatically switched depending on the recognized device type.
• Stereo input and output for all jacks.
• A signal-to-noise (S/N) ratio of 90 dB.
INTEGRATOR’S NOTE
#
For the front panel jack sensing and automatic retasking feature to function, a front panel
daughter card that is designed for Intel High Definition Audio must be used. Otherwise, an AC ’97
style audio front panel connector will be assumed and the Line Out and Mic In functions will be
permanent.
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.4, page 19
1.10.2 Audio Connectors
The boards contain audio connector on both the back panel and the component side of the board.
The component-side audio connectors include the following:
• Front panel audio (a 2 x 5-pin connector that provides mic in and line out signals for front
panel audio connectors)
• ATAPI CD-ROM (an optional 1 x 4-pin ATAPI-style connector for connecting an internal
ATAPI CD-ROM drive to the audio mixer)
• S/PDIF (an optional 1 x 3 connector that provides S/PDIF output signals)
The functions of the back panel audio connectors are dependent on which subsystem is present.
30
Product Description
For information about Refer to
The location of the front panel audio connector, the optional ATAPI CD-ROM Figure 18, page 66
connector, and the optional S/PDIF connector on the D915PGN board
The location of the front panel audio connector, the optional ATAPI CD-ROM Figure 19, page 68
connector, and the optional S/PDIF connector on the D915PSY board
The signal names of the front panel audio connector Table 23, page 70
The signal names of the optional ATAPI CD-ROM connector Table 22, page 70
The signal names of the optional S/PDIF connector Table 21, page 70
®
1.10.3 Intel High Definition Audio Subsystem
The Intel High Definition Audio subsystem includes the following:
• Intel 82801FB I/O Controller Hub (ICH6)
• Realtek ALC860 audio codec
• Microphone input that supports a single dynamic, condenser, or electret microphone
The front and back audio connectors are configurable through the audio device drivers. The
available configurable audio ports are shown in Figure 10.
Back Panel
Front Panel
Audio Connectors Audio Connectors
Mic In/
Line Out/
Retasking Jack E Line In/
Retasking Jack F
[Port 1] Retasking Jack C
[Port 2]
Line Out/
Retasking Jack D
Mic In/
Retasking Jack B
OM16989
Figure 10. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem
31
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
Figure 11 is a block diagram of the High Definition audio subsystem.
Mic In/Retasking Jack B
Line In/Retasking Jack C
82801FB
Line Out/Retasking Jack D
Intel
I/O Controller ALC860
High Definition Front Panel Mic In/Retasking Jack E [Port 1]
Hub Audio Codec
Audio Link
Front Panel Line Out/Retasking Jack F [Port 2]
(ICH6)
CD-ROM (optional)
S/PDIF (optional)
OM16990
Figure 11. High Definition Audio Subsystem Block Diagram
For information about Refer to
The back panel audio connectors Figure 17, page 64
1.11 LAN Subsystem
The 10/100 Mbits/sec LAN subsystem consists of the following:
• The Intel 82801FB ICH6
• An Intel 82562EZ Platform LAN Connect (PLC) device for 10/100 Mbits/sec Ethernet LAN
connectivity
• An RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN Connect Interface (LCI) between the 82562EZ and the ICH6
• PCI Conventional bus power management
Supports ACPI technology
Supports LAN wake capabilities
®
1.11.1 Intel 82562EZ Physical Layer Interface Device
The Intel 82562EZ provides the following functions:
• Basic 10/100 Ethernet LAN connectivity
• Full device driver compatibility
• Programmable transit threshold
• Configuration EEPROM that contains the MAC address
32
Product Description
1.11.1.1 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 12 below).
Green LED Yellow LED
OM15076
Figure 12. LAN Connector LED Locations
Table 8 describes the LED states when the board is powered up and the 10/100 Mbits/sec LAN
subsystem is operating.
Table 8. LAN Connector LED States
LED Color LED State Condition
Green Off LAN link is not established.
On LAN link is established.
Blinking LAN activity is occurring.
Yellow Off 10 Mbits/sec data rate is selected.
On 100 Mbits/sec data rate is selected.
1.11.2 Alert Standard Format (ASF) Support
The boards provide the following ASF support for PCI Express x1 bus add-in LAN cards and PCI
Conventional bus add-in LAN cards installed in PCI Conventional bus slot 2:
• Monitoring of system firmware progress events, including:
BIOS present
Primary processor initialization
Memory initialization
Video initialization
PCI resource configuration
Hard-disk initialization
User authentication
Starting operating system boot process
• Monitoring of system firmware error events, including:
Memory missing
Memory failure
No video device
Keyboard failure
Hard-disk failure
No boot media
• Boot options to boot from different types of boot devices
• Reset, shutdown, power cycle, and power up options
33
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.11.3 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section 1.4, page 19
®
1.11.4 Intel Wireless Connect Technology (Optional)
Intel Wireless Connect Technology is available for Intel 82801FBW (ICH6W) based SKUs that use
®
an Intel PRO/Wireless 2225BG add-in card. Intel Wireless Connect Technology enables any
desktop PC to join a wireless network or provide wireless Access Point services to a home or small
office network through a wireless configuration wizard. Intel Wireless Connect Technology
features the following:
• Wireless LAN protocols 802.11 b, g
• 11 Mbps performance with 802.11b
• 54 Mbps performance with 802.11g
• WEP, WPA (TKIP/802.1x), and MAC Address filtering for security
• Wi-Fi and WHQL certified
• Integrated Access Point that can support up to 16 clients
1.12 Hardware Management Subsystem
The hardware management features enable the Desktop Boards to be compatible with the Wired for
Management (WfM) specification. The Desktop Board has several hardware management features,
including the following:
• Fan monitoring and control (through the hardware monitoring and fan control ASIC)
• Thermal and voltage monitoring
• Chassis intrusion detection
1.12.1 Hardware Monitoring and Fan Control ASIC
The features of the hardware monitoring and fan control ASIC include:
• Internal ambient temperature sensor
• Two remote thermal diode sensors for direct monitoring of processor temperature and ambient
temperature sensing
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to
detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or
switch the fans on or off as needed
• SMBus interface
For information about Refer to
The location of the fan connectors and sensors for thermal monitoring on Figure 13, page 36
the D915PGN board
The location of the fan connectors and sensors for thermal monitoring on Figure 14, page 37
34
Product Description
the D915PSY board
35
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.12.2 Thermal Monitoring
Figure 13 shows the location of the sensors and fan connectors for the D915PGN board.
13
3
1
A
B
C
4
D
1
13 1
3
H G F E
OM17055
Item Description
A
Thermal diode, located on processor die
B
Remote ambient temperature sensor
C
Ambient temperature sensor, internal to hardware monitoring and fan control ASIC
D
Processor fan
E
Rear chassis fan 1
F
Front chassis fan
G
ATX fan (optional)
H
Rear chassis fan 2
Figure 13. Thermal Monitoring for D915PGN Board
36
Product Description
Figure 14 shows the location of the sensors and fan connectors for the D915PSY board.
3
1
A
B
C
4
D
1
1
3
F E
OM17057
Item Description
A
Thermal diode, located on processor die
B
Remote ambient temperature sensor
C
Ambient temperature sensor, internal to hardware monitoring and fan control ASIC
D
Processor fan
E
Rear chassis fan
F
Front chassis fan
Figure 14. Thermal Monitoring for D915PSY Board
1.12.3 Fan Monitoring
®
Fan monitoring can be implemented using Intel Desktop Utilities, LANDesk* software, or third-
party software. The level of monitoring and control is dependent on the hardware monitoring ASIC
used with the Desktop Board.
For information about Refer to
The functions of the fan connectors Section 1.13.2.2, page 42
37
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.12.4 Chassis Intrusion and Detection
The boards support a chassis security feature that detects if the chassis cover is removed. The
security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion
connector. When the chassis cover is removed, the mechanical switch is in the closed position.
1.13 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
Power connector
Fan connectors
LAN wake capabilities
Instantly Available PC technology
Resume on Ring
Wake from USB
Wake from PS/2 devices
Power Management Event signal (PME#) wake-up support
1.13.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with these boards requires an operating system that
provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 11 on page 41)
• Support for a front panel power and sleep mode switch
38
Product Description
Table 9 lists the system states based on how long the power switch is pressed, depending on how
ACPI is configured with an ACPI-aware operating system.
Table 9. Effects of Pressing the Power Switch
…and the power switch is
If the system is in this state… pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than four seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than four seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)
1.13.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
39
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
Table 10 lists the power states supported by the boards along with the associated system power
targets. See the ACPI specification for a complete description of the various system and power
states.
Table 10. Power States and Targeted System Power
Processor Targeted System
(Note 1)
Global States Sleeping States States Device States Power
G0 – working S0 – working C0 – working D0 – working Full power > 30 W
state state.
G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 52.5 W
state stopped grant device
specification
specific.
(Note 2)
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W
state RAM. Context except for
saved to RAM. wake-up logic.
(Note 2)
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W
state disk. Context except for
saved to disk. wake-up logic.
(Note 2)
G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off system. wake-up logic, Service can be performed
except when safely.
AC power is
provided by
disconnected
battery or external
from the
source.
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered
by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
40
Product Description
1.13.1.2 Wake-up Devices and Events
Table 11 lists the devices or specific events that can wake the computer from specific states.
Table 11. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
(Note)
LAN S1, S3, S4, S5
Modem (back panel Serial Port A) S1, S3
(Note)
PME# signal S1, S3, S4, S5
Power switch S1, S3, S4, S5
PS/2 devices S1, S3
RTC alarm S1, S3, S4, S5
USB S1, S3
WAKE# signal S1, S3, S4, S5
Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On
will enable a wake-up event from LAN in the S5 state.
NOTE
✏
The use of these wake-up events from an ACPI state requires an operating system that provides full
ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.
1.13.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and
Instantly Available PC technology features are used. Failure to do so can damage the power
supply. The total amount of standby current required depends on the wake devices supported and
manufacturing options.
The boards provide several power management hardware features, including:
• Power connector
• Fan connectors
• LAN wake capabilities
• Instantly Available PC technology
• Resume on Ring
• Wake from USB
• Wake from PS/2 keyboard
• PME# signal wake-up support
• WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the +5 V
standby line.
41
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
Resume on Ring enables telephony devices to access the computer when it is in a power-managed
state. The method used depends on the type of telephony device (external or internal).
NOTE
✏
The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an
operating system that provides full ACPI support.
1.13.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system control. When
an ACPI-enabled system receives the correct command, the power supply removes all non-standby
voltages.
When resuming from an AC power failure, the computer returns to the power state it was in before
power was interrupted (on or off). The computer’s response can be set using the Last Power State
feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the main power connector on the D915PGN board Figure 18, page 66
The location of the main power connector on the D915PSY board Figure 19, page 68
The signal names of the main power connector Table 30, page 72
1.13.2.2 Fan Connectors
The function/operation of the fan connectors is as follows:
• The fans are on when the board is in the S0 or S1 state.
• The fans are off when the board is off or in the S3, S4, or S5 state.
• Each fan connector is wired to a fan tachometer input of the hardware monitoring and fan
control ASIC
• All fan connectors support closed-loop fan control that can adjust the fan speed or switch the
fan on or off as needed.
• All fan connectors have a +12 V DC connection
For information about Refer to
The location of the fan connectors on the D915PGN board Figure 18, page 66
The location of the fan connectors on the D915PSY board Figure 19, page 68
The location of the fan connectors and sensors for thermal monitoring on the Figure 13, page 36
D915PGN board
The location of the fan connectors and sensors for thermal monitoring on the Figure 14, page 37
D915PSY board
The signal names of the processor fan connector Table 28, page 71
The signal names of the chassis fan connectors Table 29, page 71
42
Product Description
1.13.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN
network adapter monitors network traffic at the Media Independent Interface. Upon detecting a
Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.
Depending on the LAN implementation, the boards support LAN wake capabilities with ACPI in
the following ways:
• The PCI Express WAKE# signal
• The PCI Conventional bus PME# signal for PCI 2.2 compliant LAN designs
• The onboard LAN subsystem
1.13.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Instantly Available PC technology can damage the power supply.
Instantly Available PC technology enables the boards to enter the ACPI S3 (Suspend-to-RAM)
sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off,
and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a
wake-up device or event, the system quickly returns to its last known wake state. Table 11 on
page 41 lists the devices and events that can wake the computer from the S3 state.
The boards support the PCI Bus Power Management Interface Specification. Add-in boards that
also support this specification can participate in power management and can be used to wake the
computer.
The use of Instantly Available PC technology requires operating system support and PCI 2.2
compliant add-in cards, PCI Express add-in cards, and drivers.
1.13.2.5 Resume on Ring
The operation of Resume on Ring can be summarized as follows:
• Resumes operation from ACPI S1 or S3 states
• Detects incoming call similarly for external and internal modems
• Requires modem interrupt be unmasked for correct operation
43
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.13.2.6 Wake from USB
USB bus activity wakes the computer from ACPI S1 or S3 states.
NOTE
✏
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.13.2.7 Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1 or S3 state.
1.13.2.8 PME# Signal Wake-up Support
When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.13.2.9 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state.
1.13.2.10 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the computer
appears to be off. Figure 15 shows the location of the standby power indicator LED in the
D915PGN board. The LED is in the same location on the D915PSY board.
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power
cord before installing or removing any devices connected to the board. Failure to do so could
damage the board and any attached devices.
44
Product Description
CR3J1
OM17056
Figure 15. Location of the Standby Power Indicator LED
45
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.14 Trusted Platform Module (Optional)
The optional Trusted Platform Module (TPM) is a component on the desktop board that is
specifically designed to enhance platform security above-and-beyond the capabilities of today’s
software by providing a protected space for key operations and other security critical tasks. Using
both hardware and software, the TPM protects encryption and signature keys at their most
vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The
TPM is specifically designed to shield unencrypted keys and platform authentication information
from software-based attacks.
1.14.1 System Requirements
• Intel Desktop Board D915PGN or D915PSY
• Microsoft Windows* 2000 Professional (SP4) or Microsoft Windows XP Professional (SP1)
• NTFS file system required
• Microsoft Internet Explorer* 5.5 or later
• Adobe* Acrobat* 5.0 or later
1.14.2 Warning of Potential Data Loss
CAUTION
Failure to follow the instructions below may cause you to lose data. Read and follow these
instructions prior to Trusted Platform Module initialization.
System integrators, owners, and end users must take precautions to mitigate the chance of data loss.
Data encrypted by any program utilizing the Trusted Platform Module (TPM) may become
inaccessible or unrecoverable if any of the following occurs:
• Lost Password: Loss of any of the passwords associated with the TPM will render encrypted
data inaccessible. No password recovery is available. Read the Security Precautions for
Password Procedures.
• Hard Drive Failure: In the event of a failure of a hard disk (or other storage media) that
contains encrypted data, an image of the hard disk (or other storage media) must be restored
from backup before access to encrypted data may become available. The owner/user should
backup the system hard disk on a regular basis. Read the Security Precautions below for
Hard Drive Backup Procedures.
• Platform Failure: In the event of a platform failure and/or replacement of the motherboard,
recovery procedures may allow migratable keys to be recovered and may restore access to
encrypted data. All non-migratable keys and their associated data will be lost. Both the
Infineon* Security Platform software and Wave Systems* EMBASSY* Trust Suite utilize
migratable keys. Please check any other software that accesses the TPM for migratability.
Read the Security Precautions for Emergency Recovery File Back Up Procedures.
• Loss of Trusted Platform Module Ownership: Trusted Platform Module Ownership/contents
may be cleared (via a BIOS switch) to allow for the transfer of a system to a new owner. If
TPM ownership is cleared, either intentionally or in error, recovery procedures may allow the
migratable keys to be recovered and may restore access to encrypted data. Read the Security
Precautions for Emergency Recovery File Back Up Procedures.
46
Product Description
1.14.3 Security Precautions
Security, like any other aspect of computer maintenance requires planning. What is unique about
security has to do with understanding who "friends" and adversaries are. The TPM provides
mechanisms to enable the owner/user to protect their information from adversaries. To provide this
protection the TPM effectively puts "locks" around the data. Just like physical locks, if keys or
combinations are lost, the assets (i.e., data) may be inaccessible not only to adversaries, but also to
asset owner/user.
The TPM provides two classes of keys: migratable and non-migratable. Migratable keys are
designed to protect data that can be used (i.e., unencrypted) on more than one platform. This has
the advantage of allowing the key data to be replicated (backed-up and restored) to another
platform. This may be because of user convenience (someone uses more than one platform, or the
data needs to be available to more than one person operating on different platforms). This type of
key also has the advantage in that it can be backed-up and restored from a defective platform onto a
new platform. However, migratable keys may not be the appropriate level of protection (e.g., the
user wants the data restricted to a single platform) needed for the application. This requires a non-
migratable key. Non-migratable keys carry with them a usage deficit in that while the key may be
backed-up and restored (i.e., protected from hard disk failure) they are not protected against system
or TPM failure. The very nature of a non-migratable key is that they can be used on one and only
one TPM. In the event of a system or TPM failure, all non-migratable keys and the data associated
with them will be inaccessible and unrecoverable.
CAUTION
The following precautions and procedures may assist in recovering from any of the previously
listed situations. Failure to implement these security precautions and procedures may result in
unrecoverable data loss.
1.14.3.1 Password Procedures
The Infineon Security Platform software allows users to configure passwords from 6 to 255
characters. A good password should consist of:
• At least one upper case letter (A to Z)
• At least one numerical character (0 to 9)
• At least one symbol character (!, @, &, etc.)
Example Passwords: “I wear a Brown hat 2 worK @ least once-a-month” or
“uJGFak&%)adf35a9m”
NOTE
✏
Avoid using names or dates that can be easily guessed such as: birthdays, anniversaries, family
member names, pet names, etc.
All passwords associated with the Infineon Security Platform software (Owner, Emergency
Recovery Token, and User passwords) and the Wave Systems EMBASSY Trust Suite are NOT
RECOVERABLE and cannot be reset without the original text. The system owner should document
all passwords, store them in a secured location (vault, safe deposit box, off-site storage, etc.), and
have them available for future use. These documents should be updated after any password changes.
47
Intel Desktop Board D915PGN/D915PSY Technical Product Specification
1.14.3.2 Emergency Recovery File Back Up Procedures
The Emergency Recovery Token (SPEmRecToken.xml) must be saved or moved to a removable
media (floppy, USB drive, CDR, flash media, etc). Once this is done, the removable media should
be stored in a secure location. DO NOT LEAVE ANY COPIES of the Emergency Recovery Token
on the hard drive or within any hard drive image backups. If a copy of the Emergency Recovery
Token remains on the system, it could be used to compromise the Trusted Platform Module and
platform.
After completing the Infineon Security Platform User Initialization Wizard, a copy of the
Emergency Recovery Archive (SPEmRecArchive.xml) should be copied to a removable media
and stored in a secure location. This procedure should be repeated after any password changes or
the addition of a new user.
1.14.3.3 Hard Drive Image Backup Procedures
To allow for emergency recovery from a hard drive failure, frequent images of the hard drive
should be created and stored in a secure location. In the event of a hard drive failure, the latest
image can be restored to a new hard drive and access to the encrypted data may be re-established.
NOTE
✏
All encrypted and unencrypted data that was added after the last image was created will be lost.
1.14.3.4 Clear Text Backup (Optional)
It is recommended that system owners follow the Hard Drive Image Backup Procedures. To
backup select files without creating a drive image, files can be moved from secured programs or
drive letters to an unencrypted directory. The unencrypted (clear text) files may then be backed up
to a removable media and stored in a secure location. The advantage of the clear text backup is that
no TPM key is required to restore the data. This option is not recommended because the data is
exposed during backup and restore.
1.14.4 Trusted Platform Module Ownership
The Trusted Platform Module is disabled by default when shipped and the owner/end customer of
the system assumes “ownership” of the TPM. This permits the owner of the system to control
initialization of the TPM and create all the passwords associated with the TPM that is used to
protect their keys and data.
System builders/integrators may install both the Infineon Security Platform software and the Wave
System EMBASSY Trust Suite, but SHOULD NOT attempt to use or activate the TPM or either
software package.
48
Product Description
1.14.5 Enabling the Trusted Platform Module
The Trusted Platform Module is disabled by default when shipped to insure that the owner/end
customer of the system initializes the TPM and configures all security passwords. The owner/end
customer should use the following steps to enable the TPM.
1. While the PC is displaying the splash screen (or POST screen), press the message.
continued
102
Error Messages and Beep Codes
Table 52. Runtime Code Uncompressed in F000 Shadow RAM (continued)
Code Description of POST Operation
40 To prepare the descriptor tables.
42 To enter in virtual mode for memory test.
43 To enable interrupts for diagnostics mode.
44 To initialize data to check memory wrap around at 0:0.
45 Data initialized. Going to check for memory wrap around at 0:0 and finding the total system
memory size.
46 Memory wrap around test done. Memory size calculation over. About to go for writing patterns to
test memory.
47 Pattern to be tested written in extended memory. Going to write patterns in base 640k memory.
48 Patterns written in base memory. Going to find out amount of memory below 1M memory.
49 Amount of memory below 1M found and verified. Going to find out amount of memory above 1M
memory.
4B Amount of memory above 1M found and verified. Check for soft reset and going to clear memory
below 1M for soft reset. (If power on, go to check point # 4Eh).
4C Memory below 1M cleared. (SOFT RESET) Going to clear memory above 1M.
4D Memory above 1M cleared. (SOFT RESET) Going to save the memory size. (Go to check
point # 52h).
4E Memory test started. (NOT SOFT RESET) About to display the first 64k memory size.
4F Memory size display started. This will be updated during memory test. Going for sequential and
random memory test.
50 Memory testing/initialization below 1M complete. Going to adjust displayed memory size for
relocation/shadow.
51 Memory size display adjusted due to relocation/ shadow. Memory test above 1M to follow.
52 Memory testing/initialization above 1M complete. Going to save memory size information.
53 Memory size information is saved. CPU registers are saved. Going to enter in real mode.
54 Shutdown successful, CPU in real mode. Going to disable gate A20 line and disable parity/NMI.
57 A20 address line, parity/NMI disable successful. Going to adjust memory size depending on
relocation/shadow.
58 Memory size adjusted for relocation/shadow. Going to clear Hit message.
59 Hit message cleared.
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