® Intel Desktop Board D945GRW Technical Product Specification December 2005 Order Number: D36108-001US ® The Intel Desktop Board D945GRW may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D945GRW Specification Update. Revision History Revision Revision History Date ® -001 First release of the Intel Desktop Board D945GRW Technical Product December 2005 Specification. This product specification applies to only the standard Intel Desktop Board D945GRW with BIOS identifier RW94510J.86A. Changes to this specification will be published in the Intel Desktop Board D945GRW Specification Update before being incorporated into a revision of this document. ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. 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Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. Copyright © 2005, Intel Corporation. All rights reserved. Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, ® power and environmental requirements, and the BIOS for the Intel Desktop Board D945GRW. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board D945GRW and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter Description 1 A description of the hardware used on the Desktop Board D945GRW 2 A map of the resources of the Desktop Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes Typographical Conventions This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type. Notes, Cautions, and Warnings NOTE � Notes call attention to important information. INTEGRATOR’S NOTES # Integrator’s notes are used to call attention to information that may be useful to system integrators. CAUTION Cautions are included to help you avoid damaging hardware or losing data. WARNING Warnings indicate conditions, which if not observed, can cause personal injury. iii Intel Desktop Board D945GRW Technical Product Specification Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) (NxnX) When used in the description of a component, N indicates component type, xn are the relative coordinates of its location on the Desktop Board D945GRW, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area. GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbits/sec Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their respective owners. iv Contents 1 Product Description 1.1 Power Connector Terminology Change .........................................................................9 1.2 Overview ......................................................................................................................10 1.2.1 Feature Summary..........................................................................................10 1.2.2 Manufacturing Options ..................................................................................11 1.2.3 Board Layout .................................................................................................12 1.2.4 Block Diagram ...............................................................................................14 1.3 Online Support .............................................................................................................15 1.4 Processor.....................................................................................................................15 1.5 System Memory ...........................................................................................................16 1.5.1 Memory Configurations .................................................................................17 ® 1.6 Intel 945G Chipset .....................................................................................................21 1.6.1 Intel 945G Graphics Subsystem....................................................................21 1.6.2 USB ...............................................................................................................23 1.6.3 IDE Support...................................................................................................24 1.6.4 Real-Time Clock, CMOS SRAM, and Battery................................................25 1.7 PCI Express* Connector ..............................................................................................29 1.8 IEEE-1394a Connector (Optional) ...............................................................................29 1.9 Legacy I/O Controller ...................................................................................................30 1.9.1 Serial Port......................................................................................................30 1.9.2 Parallel Port...................................................................................................30 1.9.3 Keyboard and Mouse Interface .....................................................................30 1.10 Audio Subsystem .........................................................................................................31 1.10.1 Audio Subsystem Software ...........................................................................31 1.10.2 Audio Connectors..........................................................................................31 1.10.3 8-Channel (7.1) Audio Subsystem.................................................................31 1.11 LAN Subsystem ...........................................................................................................33 ® 1.11.1 Intel 82573E/82573L Gigabit Ethernet Controller........................................33 1.11.2 RJ-45 LAN Connector with Integrated LEDs .................................................33 1.11.3 Alert Standard Format (ASF) Support (Optional) ..........................................34 ® ® 1.11.4 Intel Active Management Technology (Intel AMT) (Optional) ....................34 1.11.5 LAN Subsystem Software..............................................................................36 1.12 Hardware Management Subsystem.............................................................................36 1.12.1 Hardware Monitoring and Fan Control ASIC .................................................36 1.12.2 Chassis Intrusion and Detection....................................................................36 1.12.3 Fan Monitoring...............................................................................................36 1.12.4 Thermal Monitoring........................................................................................37 1.13 Power Management .....................................................................................................38 1.13.1 ACPI ..............................................................................................................38 1.13.2 Hardware Support .........................................................................................40 2 Technical Reference 2.1 Memory Resources ......................................................................................................45 2.1.1 Addressable Memory.....................................................................................45 2.1.2 Memory Map..................................................................................................47 v Intel Desktop Board D945GRW Technical Product Specification 2.2 DMA Channels.............................................................................................................47 2.3 Fixed I/O Map...............................................................................................................48 2.4 Interrupts......................................................................................................................49 2.5 PCI Configuration Space Map......................................................................................50 2.6 Connectors...................................................................................................................50 2.6.1 Back Panel Connectors.................................................................................51 2.6.2 Component-side Connectors.........................................................................52 2.7 Jumper Block ...............................................................................................................60 2.8 Mechanical Considerations..........................................................................................61 2.8.1 Form Factor...................................................................................................61 2.8.2 I/O Shield.......................................................................................................62 2.9 Electrical Considerations..............................................................................................63 2.9.1 DC Loading....................................................................................................63 2.9.2 Add-in Board Considerations.........................................................................63 2.9.3 Fan Connector Current Capability.................................................................64 2.9.4 Power Supply Considerations .......................................................................64 2.10 Thermal Considerations...............................................................................................65 2.11 Reliability......................................................................................................................67 2.12 Environmental ..............................................................................................................68 2.13 Regulatory Compliance................................................................................................69 2.13.1 Safety Regulations ........................................................................................69 2.13.2 European Union Declaration of Conformity Statement..................................69 2.13.3 Product Ecology Statements .........................................................................71 2.13.4 EMC Regulations...........................................................................................74 2.13.5 Product Certification Markings (Board Level) ................................................75 3 Overview of BIOS Features 3.1 Introduction ..................................................................................................................77 3.2 BIOS Flash Memory Organization ...............................................................................78 3.3 Resource Configuration ...............................................................................................78 3.3.1 PCI Autoconfiguration....................................................................................78 3.3.2 PCI IDE Support ............................................................................................78 3.4 System Management BIOS (SMBIOS) ........................................................................79 3.5 Legacy USB Support....................................................................................................79 3.6 BIOS Updates ..............................................................................................................80 3.6.1 Language Support.........................................................................................80 3.6.2 Custom Splash Screen..................................................................................80 3.7 Boot Options ................................................................................................................81 3.7.1 CD-ROM Boot ...............................................................................................81 3.7.2 Network Boot.................................................................................................81 3.7.3 Booting Without Attached Devices ................................................................81 3.7.4 Changing the Default Boot Device During POST ..........................................81 3.8 Adjusting Boot Speed...................................................................................................82 3.8.1 Peripheral Selection and Configuration.........................................................82 3.8.2 BIOS Boot Optimizations...............................................................................82 3.9 BIOS Security Features ...............................................................................................83 vi Contents 4 Error Messages and Beep Codes 4.1 Speaker .......................................................................................................................85 4.2 BIOS Beep Codes........................................................................................................85 4.3 BIOS Error Messages ..................................................................................................85 4.4 Port 80h POST Codes .................................................................................................86 Figures 1. Board Components......................................................................................................12 2. Block Diagram..............................................................................................................14 3. Memory Channel and DIMM Configuration..................................................................17 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs ..............................18 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................18 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs..............................19 7. Single Channel (Asymmetric) Mode Configuration with One DIMM.............................20 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................20 9. Front/Back Panel Audio Connectors for 8-Channel (7.1) Audio Subsystem................32 10. 8-channel (7.1) Audio Subsystem Block Diagram........................................................32 11. LAN Connector LED Locations ....................................................................................33 12. Thermal Sensors and Fan Connectors ........................................................................37 13. Location of the Standby Power Indicator LED .............................................................43 14. Detailed System Memory Address Map.......................................................................46 15. Back Panel Connectors................................................................................................51 16. Component-side Connectors.......................................................................................52 17. Connection Diagram for Front Panel Connector ..........................................................57 18. Connection Diagram for Front Panel USB Connector..................................................59 19. Connection Diagram for IEEE 1394a Connector .........................................................59 20. Location of the Jumper Block.......................................................................................60 21. Board Dimensions........................................................................................................61 22. I/O Shield Dimensions..................................................................................................62 23. Localized High Temperature Zones.............................................................................66 vii Intel Desktop Board D945GRW Technical Product Specification Tables 1. Feature Summary ........................................................................................................10 2. Manufacturing Options.................................................................................................11 3. Board Components Shown in Figure 1 ........................................................................13 4. Supported Memory Configurations ..............................................................................16 5. LAN Connector LED States .........................................................................................33 6. Effects of Pressing the Power Switch ..........................................................................38 7. Power States and Targeted System Power .................................................................39 8. Wake-up Devices and Events......................................................................................40 9. System Memory Map ...................................................................................................47 10. DMA Channels.............................................................................................................47 11. I/O Map ........................................................................................................................48 12. Interrupts......................................................................................................................49 13. PCI Configuration Space Map......................................................................................50 14. Back Panel Connectors Shown in Figure 15................................................................51 15. Component-side Connectors Shown in Figure 16 .......................................................53 16. Front Panel Audio Connector.......................................................................................54 17. Chassis Intrusion Connector........................................................................................54 18. Serial ATA Connectors.................................................................................................54 19. Processor Fan Connector ............................................................................................54 20. Rear Chassis Fan Connector.......................................................................................54 21. Main Power Connector.................................................................................................55 22. Processor Core Power Connector ...............................................................................55 23. Auxiliary Front Panel Power/Sleep LED Connector .....................................................56 24. Front Panel Connector.................................................................................................57 25. States for a One-Color Power LED ..............................................................................58 26. States for a Two-Color Power LED ..............................................................................58 27. BIOS Setup Configuration Jumper Settings.................................................................60 28. DC Loading Characteristics .........................................................................................63 29. Fan Connector Current Capability................................................................................64 30. Thermal Considerations for Components ....................................................................67 31. Environmental Specifications.......................................................................................68 32. Safety Regulations.......................................................................................................69 33. Lead Free Desktop Board............................................................................................73 34. EMC Regulations .........................................................................................................74 35. Product Certification Markings .....................................................................................75 36. BIOS Setup Program Menu Bar...................................................................................78 37. BIOS Setup Program Function Keys............................................................................78 38. Boot Device Menu Options ..........................................................................................81 39. Supervisor and User Password Functions...................................................................83 40. Beep Codes .................................................................................................................85 41. BIOS Error Messages ..................................................................................................85 42. Port 80h POST Code Ranges......................................................................................86 43. Port 80h POST Codes .................................................................................................87 44. Typical Port 80h POST Sequence ...............................................................................90 viii 1 Product Description What This Chapter Contains 1.1 Power Connector Terminology Change .........................................................................9 1.2 Overview ......................................................................................................................10 1.3 Online Support .............................................................................................................15 1.4 Processor.....................................................................................................................15 1.5 System Memory ...........................................................................................................16 ® 1.6 Intel 945G Chipset .....................................................................................................21 1.7 PCI Express* Connector ..............................................................................................29 1.8 IEEE-1394a Connector (Optional) ...............................................................................29 1.9 Legacy I/O Controller ...................................................................................................30 1.10 Audio Subsystem .........................................................................................................31 1.11 LAN Subsystem ...........................................................................................................33 1.12 Hardware Management Subsystem.............................................................................36 1.13 Power Management .....................................................................................................38 1.1 Power Connector Terminology Change Technical Product Specifications for ATX and microATX desktop boards referred to the 2 x 2 power connector as the ATX12V connector. With the arrival of BTX form factor desktop boards, this connector will henceforth be referred to as the Processor Core Power connector. For information about Refer to The BTX form factor http://www.formfactors.org 9 Intel Desktop Board D945GRW Technical Product Specification 1.2 Overview 1.2.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor picoBTX Form Factor (8.00 inches by 10.50 inches [203.20 millimeters by 266.70 millimeters]) Processor Support for the following: ® ® • Intel Pentium D processor in an LGA775 socket with an 800 MHz system bus ® ® • Intel Pentium 4 processor in an LGA775 socket with an 800 or 533 MHz system bus ® ® • Intel Celeron processor in an LGA775 socket with a 533 MHz system bus Memory • Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR2 667 or DDR2 533 DIMMs • Support for up to 4 GB of system memory ® Chipset Intel 945G Chipset, consisting of: ® • Intel 82945G Graphics Memory Controller Hub (GMCH) ® • Intel 82801G I/O Controller Hub (ICH7) ® Video Intel GMA950 onboard graphics subsystem ® Audio Intel High Definition audio subsystem with 8-channel (7.1) analog outputs using the Realtek ALC880 audio codec Legacy I/O Control Legacy I/O controller for serial, parallel, and PS/2* ports USB Support for USB 2.0 devices Peripheral • Eight USB ports Interfaces • One serial port • One parallel port • Two Serial ATA interfaces • One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support • PS/2 keyboard and mouse ports LAN Support Refer to Table 2 on page 11 for a description of LAN subsystem options. ® BIOS • Intel BIOS (resident in the SPI Flash device) • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS Expansion One PCI Express* x16 bus add-in card connector (for use with a PCI Express x16 Capabilities riser card) Instantly Available • Support for PCI Express Revision 1.0a PC Technology • Suspend to RAM support • Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports continued 10 Product Description Table 1. Feature Summary (continued) Hardware Monitor • Hardware monitoring and fan control ASIC Subsystem • Voltage sense to detect out of range power supply voltages • Thermal sense to detect out of range thermal values • Two fan connectors • Two fan sense inputs used to monitor fan activity • Fan speed control 1.2.2 Manufacturing Options Table 2 describes the manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you. Table 2. Manufacturing Options IEEE-1394a IEEE-1394a controller and one front-panel IEEE-1394a connector Interface The board provides one of the following: LAN subsystem ® • Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82573L Gigabit Ethernet Controller ® • Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82573E Gigabit ® Ethernet Controller with Intel Active Management Technology (AMT) support For information about Refer to Available configurations for the board Section 1.3, page 15 11 Intel Desktop Board D945GRW Technical Product Specification 1.2.3 Board Layout Figure 1 shows the location of the major components. A E BB B AA Z C D Y X W F G H I J K L V U M T N S R Q P O OM19001 Figure 1. Board Components Table 3 lists the components identified in Figure 1. 12 Product Description Table 3. Board Components Shown in Figure 1 Item/callout from Figure 1 Description A Back panel connectors B Serial ATA connectors [2] C Front panel USB connector D Chassis intrusion connector E Legacy I/O controller F PCI Express x16 bus riser card connector G IEEE-1394a controller (optional) H Main power connector I BIOS Setup configuration jumper block J Speaker K Intel 82801G I/O Controller Hub (ICH7) L Front panel IEEE-1394a connector (optional) M Auxiliary front panel power LED connector N Front panel connector O LGA775 processor socket P Intel 82945G GMCH Q Remote thermal sensor connector R Processor fan connector S Processor core power connector T DIMM Channel A sockets [2] U Hardware monitoring and fan control ASIC V DIMM Channel B sockets [2] W Battery X Ethernet device Y Rear chassis fan connector Z Audio codec AA Parallel ATE IDE connector BB Front panel audio connector 13 Intel Desktop Board D945GRW Technical Product Specification 1.2.4 Block Diagram Figure 2 is a block diagram of the major functional areas. Back Panel/Front Panel LAN Gigabit Ethernet PCI Express USB USB Ports Connector Controller x1 Interface Serial Port Legacy Parallel Port Parallel ATA Parallel ATA I/O PS/2 Mouse IDE Connector IDE Interface Controller PS/2 Keyboard LGA775 System Bus LPC (800/533 MHz) Processor Socket Bus Intel 945G Chipset PCI Express x16 Interface Intel 82945G Intel 82801G Serial Peripheral Graphics and I/O Controller Hub Interface (SPI) PCI Express Memory Controller (ICH7) Flash Device x16 Hub (GMCH) Connector VGA Display Interface Port Serial ATA Serial ATA IDE Dual-Channel IDE Interface Connectors (2) Memory Bus Channel A SMBus DIMMs (2) Channel B DIMMs (2) Hardware Monitoring Line Out and Fan Control ASIC Mic In Line In/Retasking Jack Front Left/Right Output Audio Codec Mic In/Retasking Jack IEEE-1394a IEEE-1394a Side Surround Left/Right Connector Controller PCI Bus Rear Surround (Optional) (Optional) Center/LFE (Subwoofer) = connector or socket OM18240 Figure 2. Block Diagram 14 DMI Interconnect High Definition Audio Link Product Description 1.3 Online Support To find information about… Visit this World Wide Web site: Intel Desktop Board D945GRW under http://www.intel.com/design/motherbd “Desktop Board Products” or “Desktop Board Support” http://support.intel.com/support/motherboards/desktop Available configurations for the Desktop http://developer.intel.com/design/motherbd/rw/rw_available.htm Board D945GRW Processor data sheets http://www.intel.com/design/litcentr ICH7 addressing http://developer.intel.com/products/chipsets Custom splash screens http://intel.com/design/motherbd/gen_indx.htm Audio software and utilities http://www.intel.com/design/motherbd LAN software and drivers http://www.intel.com/design/motherbd Supported video modes http://www.intel.com/design/motherbd/rw/rw_documentation.htm ® Intel Active Management Technology http://www.intel.com/technology/manage/iamt/index.htm 1.4 Processor The board is designed to support the following processors: • Intel Pentium D processor in an LGA775 processor socket with an 800 MHz system bus • Intel Pentium 4 processor in an LGA775 processor socket with an 800 or 533 MHz system bus • Intel Celeron processor in an LGA775 processor socket with a 533 MHz system bus See the Intel web site listed below for the most up-to-date list of supported processors. For information about… Refer to: Supported processors http://www.intel.com/design/motherbd/rw/rw_proc.htm CAUTION Use only the processors listed on web site above. Use of unsupported processors can damage the board, the processor, and the power supply. INTEGRATOR’S NOTE # Use only ATX12V-compliant power supplies. For information about Refer to Power supply connectors Section 2.6.2.1, page 55 15 Intel Desktop Board D945GRW Technical Product Specification 1.5 System Memory The board has four DIMM sockets and support the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported. • 4 GB maximum total system memory. Refer to Section 2.1.1 on page 45 for information on the total amount of addressable memory. • Minimum total system memory: 128 MB • Non-ECC DIMMs • Serial Presence Detect • DDR2 667 or DDR2 533 MHz SDRAM DIMMs � NOTES To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency. Table 4 lists the supported DIMM configurations. Table 4. Supported Memory Configurations DIMM SDRAM SDRAM Organization Number of SDRAM Capacity Configuration Density Front-side/Back-side Devices 128 MB SS 256 Mbit 16 M x 16/empty 4 256 MB SS 256 Mbit 32 M x 8/empty 8 256 MB SS 512 Mbit 32 M x 16/empty 4 512 MB DS 256 Mbit 32 M x 8/32 M x 8 16 512 MB SS 512 Mbit 64 M x 8/empty 8 512 MB SS 1 Gbit 64 M x 16/empty 4 1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16 1024 MB SS 1 Gbit 128 M x 8/empty 8 2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16 Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to single-sided memory modules (containing one row of SDRAM). INTEGRATOR’S NOTE # It is possible to install four 2048 MB (2 GB) modules for a total of 8 GB of system memory, however, only 4 GB of address space is available. Refer to Section 2.1.1, on page 45 for additional information on available memory. 16 Product Description 1.5.1 Memory Configurations The Intel 82945G GMCH supports two types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used. • Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used. Figure 3 illustrates the memory channel and DIMM configuration. NOTE � The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black. Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM18234 Figure 3. Memory Channel and DIMM Configuration 17 Intel Desktop Board D945GRW Technical Product Specification 1.5.1.1 Dual Channel (Interleaved) Mode Configurations Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs. Channel A, DIMM 0 1 GB Channel A, DIMM 1 Channel B, DIMM 0 1 GB Channel B, DIMM 1 OM18235 Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs Figure 5 shows a dual channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B. Channel A, DIMM 0 256 MB 256 MB Channel A, DIMM 1 Channel B, DIMM 0 512 MB Channel B, DIMM 1 OM18236 Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs 18 Product Description Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels. Channel A, DIMM 0 256 MB 512 MB Channel A, DIMM 1 256 MB Channel B, DIMM 0 512 MB Channel B, DIMM 1 OM18237 Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 19 Intel Desktop Board D945GRW Technical Product Specification 1.5.1.2 Single Channel (Asymmetric) Mode Configurations NOTE � Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated. Channel A, DIMM 0 256 MB Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM18238 Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM Figure 8 shows a single channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B. Channel A, DIMM 0 256 MB 512 MB Channel A, DIMM 1 Channel B, DIMM 0 512 MB Channel B, DIMM 1 OM18239 Figure 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs 20 Product Description ® 1.6 Intel 945G Chipset The Intel 945G chipset consists of the following devices: • Intel 82945G Graphics Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801G I/O Controller Hub (ICH7) with DMI interconnect The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D and display capabilities. The ICH7 is a centralized controller for the board’s I/O paths. For information about Refer to The Intel 945G chipset http://developer.intel.com/ Resources used by the chipset Chapter 2 1.6.1 Intel 945G Graphics Subsystem The Intel 945G chipset contains two separate, mutually exclusive graphics options. Either the GMA950 graphics controller (contained within the 82945G GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express x16 add-in card is installed, the GMA950 graphics controller is disabled. CAUTION The PCI Express x16 connector on this board is intended for use with a PCI Express x16 riser card only. Do not plug a PCI Express x16 add-in card into this connector. Doing so could damage both the PCI Express x16 add-in card and the connector. ® 1.6.1.1 Intel GMA950 Graphics Controller The Intel GMA950 graphics controller features the following: • 400 MHz core frequency • High performance 3-D setup and render engine • High quality texture engine ⎯ DX9* Compliant Hardware Pixel Shader 2.0 ⎯ Alpha and luminance maps ⎯ Texture color-keying/chroma-keying ⎯ Cubic environment reflection mapping ⎯ Enhanced texture blending functions • 3D Graphics Rendering enhancements ⎯ 1.3 Dual Texture GigaPixel/Sec Fill Rate ⎯ 16 and 32 bit color ⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz ⎯ Vertex cache ⎯ Anti-aliased lines ⎯ OpenGL* version 1.4 support with vertex buffer and EXT_Shadow extensions 21 Intel Desktop Board D945GRW Technical Product Specification • 2D Graphics enhancements ⎯ 8, 16,and 32 bit color ⎯ Optimized 256-bit BLT engine ⎯ Color space conversion ⎯ Anti-aliased lines • Video ⎯ Hardware motion compensation for MPEG2 ⎯ Software DVD at 30 fps full screen • Display ⎯ Integrated 24-bit 400 MHz RAMDAC ⎯ Up to 2048 x 1536 at 75 Hz refresh (QXGA) ⎯ DDC2B compliant interface ⎯ With Advanced Digital Display 2 or 2+ (ADD2/ADD2+) cards, support for TV-out / TV-in and DVI digital display connections ⎯ Supports flat panels up to 2048 x 1536 at 60Hz or digital CRT/HDTV at 1920 x 1080 at 85 Hz (with ADD2/ADD2+) ⎯ Two multiplexed DVO port interfaces with 200 MHz pixel clocks using an ADD2/ADD2+ card • Dynamic Video Memory Technology (DVMT) support up to 224 MB ® • Intel Zoom Utility For information about Refer to DVMT Section 1.6.1.2, page 22 Obtaining graphics software and utilities Section 1.3, page 15 1.6.1.2 Dynamic Video Memory Technology (DVMT) DVMT enables enhanced graphics and memory performance through Direct AGP, and highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 224 MB of system memory can be allocated to DVMT on systems that have 512 MB or more of total system memory installed. Up to 128 MB can be allocated to DVMT on systems that have 256 MB but less than 512 MB of total installed system memory. Up to 64 MB can be allocated to DVMT when less than 256 MB of system memory is installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem. DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions. NOTE � The use of DVMT requires operating system driver support. 22 Product Description 1.6.1.3 Advanced Digital Display (ADD2/ADD2+) Card Support The GMCH routes two multiplexed DVO ports that are each capable of driving up to a 200 MHz pixel clock to the PCI Express x16 connector. The DVO ports can be paired for a dual channel configuration to support up to a 400 MHz pixel clock. When an ADD2/ADD2+ card is detected, the Intel GMA950 graphics controller is enabled and the PCI Express x16 connector is configured for DVO mode. DVO mode enables the DVO ports to be accessed by the ADD2/ADD2+ card. An ADD2/ADD2+ card can either be configured to support simultaneous display with the primary VGA display or can be configured to support dual independent display as an extended desktop configuration with different color depths and resolutions. ADD2/ADD2+ cards can be designed to support the following configurations: • TV-Out (composite video) • Transition Minimized Differential Signaling (TMDS) for DVI 1.0 • Low Voltage Differential Signaling (LVDS) • Single device operating in dual channel mode • VGA output • HDTV output 1.6.1.4 Configuration Modes A list of supported modes for the Intel GMA950 graphics controller is available as a downloadable document. For information about Refer to Supported video modes for the board Section 1.3, page 15 1.6.2 USB The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. The ICH7 provides the USB controller for all ports. The port arrangement is as follows: • Six ports are implemented with dual stacked back panel connectors adjacent to the audio connectors • Two ports are routed to a front panel USB connector NOTE � Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices. For information about Refer to The location of the USB connectors on the back panel Figure 15, page 51 The location of the front panel USB connector Figure 16, page 52 23 Intel Desktop Board D945GRW Technical Product Specification 1.6.3 IDE Support The board provides three IDE interface connectors: • One parallel ATA IDE connector that supports two devices • Two serial ATA IDE connectors that support one device per connector 1.6.3.1 Parallel ATE IDE Interface The ICH7’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • Programmed I/O (PIO): processor controls data transfer. • 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. • Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec. • ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible. • ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH7’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec. � NOTE ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling. The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS. For information about Refer to The location of the Parallel ATA IDE connector Figure 16, page 52 1.6.3.2 Serial ATA Interfaces The ICH7’s Serial ATA controller offers two independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of two Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel. For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 2000 operating systems. 24 Product Description NOTE � Many Serial ATA drives use new low-voltage power connectors and require adaptors or power supplies equipped with low-voltage power connectors. For more information, see: http://www.serialata.org/ For information about Refer to The location of the Serial ATA IDE connectors Figure 16, page 52 1.6.4 Real-Time Clock, CMOS SRAM, and Battery A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied. � NOTE If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 12 shows the location of the battery. CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement. FORHOLDSREGEL Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning. OBS! Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning. VIKTIGT! Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna. 25 Intel Desktop Board D945GRW Technical Product Specification VARO Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti. VORSICHT Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend. AVVERTIMENTO Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore. PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. ATENÇÃO Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região. AŚCIAROŽZNAŚĆ Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі. UPOZORNÌNÍ V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí. Προσοχή Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η µπαταρία αντικατασταθεί από µία λανθασµένου τύπου. Οι µπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιµοποιηµένων µπαταριών πρέπει να γίνεται σύµφωνα µε τους κατά τόπο περιβαλλοντικούς κανονισµούς. 26 Product Description VIGYAZAT Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni. AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska. PRECAUŢIE Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului. ВНИМАНИЕ При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям. UPOZORNENIE Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia. POZOR Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. . 27 Intel Desktop Board D945GRW Technical Product Specification UYARI Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır. OСТОРОГА Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля. 28 Product Description 1.7 PCI Express* Connector The board provides one PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec. The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the underlying PCI Express architecture is compatible with PCI Conventional compliant operating systems. Additional features of the PCI Express interface include the following: • Support for the PCI Express enhanced configuration mechanism • Automatic discovery, link training, and initialization • Support for Active State Power Management (ASPM) • SMBus 2.0 support • Wake# signal supporting wake events from ACPI S1, S3, S4, or S5 • Software compatible with the PCI Power Management Event (PME) mechanism defined in the PCI Power Management Specification Rev. 1.1 CAUTION The PCI Express x16 connector on this board is intended for use with a PCI Express x16 riser card only. Do not plug a PCI Express x16 add-in card into this connector. Doing so could damage both the PCI Express x16 add-in card and the connector. 1.8 IEEE-1394a Connector (Optional) The optional IEEE-1394a interface addresses interconnection of both computer peripherals and consumer electronics. The IEEE-1394a interface provides a throughput ranging from 100 Mbits/sec to 400 Mbits/sec. As a manufacturing option, the board includes one IEEE-1394a front-panel connector. For information about Refer to The location of the front panel IEEE-1394a connector Figure 16, page 52 The signal names of the front panel IEEE-1394a connector Section 2.6.2.6, page 59 29 Intel Desktop Board D945GRW Technical Product Specification 1.9 Legacy I/O Controller The legacy I/O controller provides the following features: • One serial port • One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support • Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems • PS/2-style mouse and keyboard interfaces • Intelligent power management, including a programmable wake-up event interface • PCI Conventional bus power management support The BIOS Setup program provides configuration options for the legacy I/O controller. 1.9.1 Serial Port The Serial port A connector is located on the back panel. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support. For information about Refer to The location of the serial port A connector Figure 15, page 51 1.9.2 Parallel Port The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup program to set the parallel port mode. For information about Refer to The location of the parallel port connector Figure 15, page 51 1.9.3 Keyboard and Mouse Interface PS/2 keyboard and mouse connectors are located on the back panel. NOTE � The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected. For information about Refer to The location of the keyboard and mouse connectors Figure 15, page 51 30 Product Description 1.10 Audio Subsystem The board supports the Intel High Definition audio subsystem based on the Realtek ALC880 audio codec. The audio subsystem supports the following features: • Advanced jack sense for two of the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. These two back panel audio jacks are capable of retasking according to user’s definition, or can be automatically switched depending on the recognized device type. • Line out and Mic in functions for front panel audio jacks • A signal-to-noise (S/N) ratio of 95 dB 1.10.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.3, page 15 1.10.2 Audio Connectors The board contains audio connectors on both the back panel and the component side of the board. The front panel audio connector (located on the component side) provides mic in and line out signals for front panel audio connectors. For information about Refer to The location of the front panel audio connector Figure 16, page 52 The signal names of the front panel audio connector Table 16, page 54 The back panel audio connectors Section 2.6.1, page 51 1.10.3 8-Channel (7.1) Audio Subsystem The 8-channel (7.1) audio subsystem includes the following: • Intel 82801G I/O Controller Hub (ICH7) • Realtek ALC880 audio codec • Microphone input that supports a single dynamic, condenser, or electret microphone The back panel audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 9. 31 Intel Desktop Board D945GRW Technical Product Specification Front Panel Audio Connectors Mic In Line Out Line In/Retasking Jack [Blue] Side Surround Front Left/Right Output Left/Right Output [Lime Green] [Gray] Mic In/Retasking Jack [Pink] Center/LFE (Subwoofer) Output [Yellow] Rear Left/Right Output [Black] OM18243 Figure 9. Front/Back Panel Audio Connectors for 8-Channel (7.1) Audio Subsystem Figure 10 is a block diagram of the 8-channel (7.1) audio subsystem. Line Out Front Panel Mic In Line In/Retasking Jack 82801G Intel Realtek Front Left/Right Output I/O Controller High Definition ALC880 Hub Mic In/Retasking Jack Back Audio Link Audio Codec (ICH7) Panel Side Surround Left/Right Output Rear Surround Left/Right Output Center/LFE (Subwoofer) Output OM18242 Figure 10. 8-channel (7.1) Audio Subsystem Block Diagram 32 Product Description 1.11 LAN Subsystem ® The LAN subsystem includes the Intel 82573 Gigabit (10/100/1000 Mbits/sec) Ethernet Controller and an RJ-45 LAN connector with integrated status LEDs. ® 1.11.1 Intel 82573E/82573L Gigabit Ethernet Controller ® The Intel 82573E/82573L Gigabit Ethernet Controller supports the following features: • PCI Express link • 10/100/1000 IEEE 802.3 compliant • Compliant to IEEE 802.3x flow control support • Jumbo frame support • TCP, IP, UDP checksum offload • Transmit TCP segmentation • Advanced packet filtering • Full device driver compatibility • PCI Express Power Management Support The 82573E Gigabit Ethernet Controller also supports Alert Standard Format (ASF) 2.0. 1.11.2 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 11). Table 5 describes the LED states when the board is powered up and the Gigabit LAN subsystem is operating. Green LED Green/Yellow LED OM16513 Figure 11. LAN Connector LED Locations Table 5. LAN Connector LED States LED Color LED State Condition Off LAN link is not established. Left Green On LAN link is established. Blinking LAN activity is occurring. N/A Off 10 Mbits/sec data rate is selected. Right Green On 100 Mbits/sec data rate is selected. Yellow 1000 Mbits/sec data rate is selected. On 33 Intel Desktop Board D945GRW Technical Product Specification 1.11.3 Alert Standard Format (ASF) Support (Optional) The board provides the following ASF support for PCI Express x1 bus add-in LAN cards and PCI Conventional bus add-in LAN cards installed in PCI Conventional bus slot 2: • Monitoring of system firmware progress events, including: ⎯ BIOS present ⎯ Primary processor initialization ⎯ Memory initialization ⎯ Video initialization ⎯ PCI resource configuration ⎯ Hard-disk initialization ⎯ User authentication ⎯ Starting operating system boot process • Monitoring of system firmware error events, including: ⎯ Memory missing ⎯ Memory failure ⎯ No video device ⎯ Keyboard failure ⎯ Hard-disk failure ⎯ No boot media • Boot options to boot from different types of boot devices • Reset, shutdown, power cycle, and power up options • LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. ® ® 1.11.4 Intel Active Management Technology (Intel AMT) (Optional) ® Intel Active Management Technology (Intel AMT) offers IT organizations tamper-resistant and persistent management capabilities. Specifically, Intel AMT is a hardware-based solution that offers encrypted and persistent asset management and remote diagnostics and/or recovery capabilities for networked platforms. With Intel AMT, IT organizations can easily get accurate platform information, and can perform remote updating, diagnostics, debugging and repair of a system, regardless of the state of the operating system and the power state of the system. Intel AMT enables IT organizations to discover, heal, and protect all of their computing assets, regardless of system state in the manner described below. • Discovering hardware and software computing assets: ⎯ Intel AMT stores hardware and software asset information in non-volatile memory and allows IT to read the asset information anytime, even if the PC is off ⎯ Users cannot remove or prevent IT organization access to the information because it does not rely on software agents 34 Product Description • Healing systems remotely, regardless of the operating system or system state: ⎯ Intel AMT provides out-of-band diagnostics and recovery capabilities for IT organizations to remotely diagnose and repair PCs after software, operating system, or hardware failures ⎯ Alerting and event logging help IT organizations detect and diagnose problems quickly to reduce end-user downtime • Protecting the enterprise against malicious software attacks: ⎯ Intel AMT helps IT organizations keep software versions and virus protection consistent and up-to-date across the enterprise ⎯ Version information is stored in non-volatile memory for access anytime by third party software to check and, if necessary, wake a system to perform off-hours updates. The key features of Intel AMT include: • Secure Out of Band (OOB) system management that allows remote management of PCs regardless of system power or operating system state. ⎯ SSL3.1/TLS encryption ⎯ HTTP authentication ⎯ TCP/IP ⎯ HTTP web GUI ⎯ XML/SOAP API • Remote troubleshooting and recovery that can significantly reduce desk-side visits and potentially increasing efficiency of IT technical staff. ⎯ System event log ⎯ IDE-R or PXE boot; Network drive or remote CD boot ⎯ Serial over LAN ⎯ OOB diagnostics ⎯ Remote control ⎯ Remote BIOS update • Proactive alerting that decreases downtime and minimizes time to repair. ⎯ Programmable policies ⎯ Operating system lock-up alert ⎯ Boot failure alert ⎯ Hardware failure alerts • Third party non-volatile storage that prevents users from removing critical inventory, remote control, or virus protection agents. ⎯ Nonvolatile storage for agents ⎯ Tamper-resistant • Remote hardware and software asset tracking that eliminates time-consuming manual inventory tracking, which also reduces asset accounting costs. ⎯ E-Asset Tag ⎯ HW/SW inventory For information about Refer to Intel Active Management Technology http://www.intel.com/technology/manage/iamt/index.htm 35 Intel Desktop Board D945GRW Technical Product Specification 1.11.5 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.3, page 15 1.12 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • Chassis intrusion detection • Fan monitoring and control (through the hardware monitoring and fan control ASIC) • Thermal and voltage monitoring 1.12.1 Hardware Monitoring and Fan Control ASIC The features of the hardware monitoring and fan control ASIC include: • Internal ambient temperature sensor • Two remote thermal diode sensors for direct monitoring of processor temperature and ambient temperature sensing • Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to detect levels above or below acceptable values • Thermally monitored closed-loop fan control, for both fans, that can adjust the fan speed or switch the fans on or off as needed • SMBus interface For information about Refer to The location of the fan connectors and sensors for thermal monitoring Figure 12, page 37 1.12.2 Chassis Intrusion and Detection The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion connector. When the chassis cover is removed, the mechanical switch is in the closed position. 1.12.3 Fan Monitoring ® Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. The level of monitoring and control is dependent on the hardware monitoring ASIC used with the board. For information about Refer to The functions of the fan connectors Section 1.13.2.2, page 41 36 Product Description 1.12.4 Thermal Monitoring Figure 12 shows the location of the sensors and fan connectors. 3 E 1 1 2 4 1 D C B A OM19007 Item Description A Remote ambient temperature sensor B Thermal diode, located on processor die C Ambient temperature sensor, internal to hardware monitoring and fan control ASIC D Processor fan E Rear chassis fan Figure 12. Thermal Sensors and Fan Connectors 37 Intel Desktop Board D945GRW Technical Product Specification 1.13 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan connectors ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Resume on Ring ⎯ Wake from USB ⎯ Wake from PS/2 devices ⎯ Power Management Event signal (PME#) wake-up support 1.13.1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include: • Plug and Play (including bus and device enumeration) • Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives • Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state • A Soft-off feature that enables the operating system to power-off the computer • Support for multiple wake-up events (see Table 8 on page 40) • Support for a front panel power and sleep mode switch Table 6 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 6. Effects of Pressing the Power Switch …and the power switch is If the system is in this state… pressed for …the system enters this state Off Less than four seconds Power-on (ACPI G2/G5 – Soft off) (ACPI G0 – working state) On Less than four seconds Soft-off/Standby (ACPI G0 – working state) (ACPI G1 – sleeping state) On More than four seconds Fail safe power-off (ACPI G0 – working state) (ACPI G2/G5 – Soft off) Sleep Less than four seconds Wake-up (ACPI G1 – sleeping state) (ACPI G0 – working state) Sleep More than four seconds Power-off (ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off) 38 Product Description 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 7 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 7. Power States and Targeted System Power Processor Targeted System (Note 1) Global States Sleeping States States Device States Power G0 – working S0 – working C0 – working D0 – working state. Full power > 30 W state G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – device 5 W < power < 52.5 W state stopped grant specification specific. (Note 2) G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W state RAM. Context except for wake-up saved to RAM. logic. (Note 2) G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W state disk. Context except for wake-up saved to disk. logic. (Note 2) G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W Context not saved. except for wake-up Cold boot is logic. required. G3 – No power to the No power D3 – no power for No power to the system. mechanical off system. wake-up logic, Service can be except when performed safely. AC power is provided by battery disconnected or external source. from the computer. Notes: 1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply. 2. Dependent on the standby power consumption of wake-up devices used in the system. 1.13.1.2 One-Watt Standby In 2001, the U.S. government issued an executive order requiring a reduction in power for appliances and personal computers. This board meets that requirement by operating at 1 W (or less) in S5 (Standby) mode. One-Watt operation applies only to the S5 state when the computer is turned off, but still connected to AC power. One-Watt operation does not apply to the S3 (Suspend to RAM) or S4 (Suspend to disk) states. Newer energy-efficient power supplies using less than 0.5 W (in Standby mode) may also be needed to achieve this goal. 39 Intel Desktop Board D945GRW Technical Product Specification 1.13.1.3 Wake-up Devices and Events Table 8 lists the devices or specific events that can wake the computer from specific states. Table 8. Wake-up Devices and Events These devices/events can wake up the computer… …from this state (Note) LAN S1, S3, S4, S5 Modem (back panel Serial Port A) S1, S3 (Note) PME# signal S1, S3, S4, S5 Power switch S1, S3, S4, S5 PS/2 devices S1, S3 RTC alarm S1, S3, S4, S5 USB S1, S3 WAKE# signal S1, S3, S4, S5 Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On will enable a wake-up event from LAN in the S5 state. NOTE � The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events. 1.13.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The board provides several power management hardware features, including: • Power connector • Fan connectors • LAN wake capabilities • Instantly Available PC technology • Resume on Ring • Wake from USB • Wake from PS/2 keyboard • PME# signal wake-up support • WAKE# signal wake-up support LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. 40 Product Description Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal). NOTE � The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support. 1.13.2.1 Power Connector ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. For information about Refer to The location of the main power connector Figure 16, page 52 The signal names of the main power connector Table 21, page 55 1.13.2.2 Fan Connectors The function/operation of the fan connectors is as follows: • The fans are on when the board is in the S0 or S1 state. • The fans are off when the board is off or in the S3, S4, or S5 state. • Each fan connector is wired to a fan tachometer input of the hardware monitoring and fan control ASIC. • All fan connectors support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed. • All fan connectors have a +12 V DC connection. For information about Refer to The location of the fan connectors Figure 16, page 52 The location of the fan connectors and sensors for thermal monitoring Figure 12, page 37 The signal names of the processor fan connector Table 19, page 54 The signal names of the chassis fan connector Table 20, page 54 1.13.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. 41 Intel Desktop Board D945GRW Technical Product Specification Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in the following ways: • The PCI Express WAKE# signal • The onboard LAN subsystem 1.13.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 8 on page 40 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support, PCI Express add-in cards, and drivers. 1.13.2.5 Resume on Ring The operation of Resume on Ring can be summarized as follows: • Resumes operation from ACPI S1 or S3 states • Detects incoming call similarly for external and internal modems • Requires modem interrupt be unmasked for correct operation 1.13.2.6 Wake from USB USB bus activity wakes the computer from ACPI S1 or S3 states. NOTE � Wake from USB requires the use of a USB peripheral that supports Wake from USB. 42 Product Description 1.13.2.7 Wake from PS/2 Devices PS/2 device activity wakes the computer from an ACPI S1 or S3 state. 1.13.2.8 PME# Signal Wake-up Support When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS). 1.13.2.9 WAKE# Signal Wake-up Support When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state. 1.13.2.10 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 13 shows the location of the standby power indicator LED. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. LED1 OM19006 Figure 13. Location of the Standby Power Indicator LED 43 Intel Desktop Board D945GRW Technical Product Specification 44 2 Technical Reference What This Chapter Contains 2.1 Memory Resources ......................................................................................................45 2.2 DMA Channels.............................................................................................................47 2.3 Fixed I/O Map...............................................................................................................48 2.4 Interrupts......................................................................................................................49 2.5 PCI Configuration Space Map......................................................................................50 2.6 Connectors...................................................................................................................50 2.7 Jumper Block ...............................................................................................................60 2.8 Mechanical Considerations..........................................................................................61 2.9 Electrical Considerations..............................................................................................63 2.10 Thermal Considerations...............................................................................................65 2.11 Reliability......................................................................................................................67 2.12 Environmental ..............................................................................................................68 2.13 Regulatory Compliance................................................................................................69 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes 4 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 4 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: • BIOS/ SPI Flash (2 MB) • Local APIC (19 MB) • Digital Media Interface (40 MB) • Front side bus interrupts (17 MB) • PCI Express configuration space (256 MB) • MCH base address registers, internal graphics ranges, PCI Express ports (up to 512 MB) • Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express add-in cards The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 14 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses. 45 Intel Desktop Board D945GRW Technical Product Specification 4 GB Top of System Address Space FLASH APIC ~20 MB Reserved PCI Memory Range - contains PCI, chipsets, 1 MB Direct Media Interface 0FFFFFH Upper BIOS (DMI), and ICH ranges area (64 KB) (approximately 750 MB) 0F0000H 960 KB 0EFFFFH Lower BIOS Top of usable area DRAM (memory (64 KB; visible to the 16 KB x 4) 0E0000H operating 896 KB 0DFFFFH system) Add-in Card BIOS and Buffer area (128 KB; 16 KB x 8) 0C0000H DRAM 768 KB 0BFFFFH Range Standard PCI/ ISA Video Memory (SMM 1 MB Memory) 640 KB 128 KB 0A0000H DOS 640 KB 09FFFFH Compatibility DOS area Memory (640 KB) 00000H 0 MB 0 KB OM17140 Figure 14. Detailed System Memory Address Map 46 Technical Reference 2.1.2 Memory Map Table 9 lists the system memory map. Table 9. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used. 640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by memory manager software) 512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory 0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory 2.2 DMA Channels Table 10. DMA Channels DMA Channel Number Data Width System Resource 0 8 or 16 bits Open 1 8 or 16 bits Parallel port 2 8 or 16 bits Diskette drive 3 8 or 16 bits Parallel port (for ECP or EPP) 4 8 or 16 bits DMA controller 5 16 bits Open 6 16 bits Open 7 16 bits Open 47 Intel Desktop Board D945GRW Technical Product Specification 2.3 Fixed I/O Map Table 11. I/O Map Address (hex) Size Description 0000 - 00FF 256 bytes Used by the Desktop Board D945GRW. Refer to the ICH7 data sheet for dynamic addressing information. 0170 - 0177 8 bytes Secondary Parallel ATA IDE channel command block 01F0 - 01F7 8 bytes Primary Parallel ATA IDE channel command block (Note 1) 0228 - 022F 8 bytes LPT3 (Note 1) 0278 - 027F 8 bytes LPT2 (Note 1) 02E8 - 02EF 8 bytes COM4 (Note 1) 02F8 - 02FF 8 bytes COM2 0374 - 0377 4 bytes Secondary Parallel ATA IDE channel control block 0377, bits 6:0 7 bits Secondary IDE channel status port 0378 - 037F 8 bytes LPT1 03E8 - 03EF 8 bytes COM3 03F0 - 03F5 6 bytes Diskette channel 03F4 – 03F7 1 byte Primary Parallel ATA IDE channel control block 03F8 - 03FF 8 bytes COM1 04D0 - 04D1 2 bytes Edge/level triggered PIC LPTn + 400 8 bytes ECP port, LPTn base address + 400h (Note 2) 0CF8 - 0CFB 4 bytes PCI Conventional bus configuration address register (Note 3) 0CF9 1 byte Reset control register 0CFC - 0CFF 4 bytes PCI Conventional bus configuration data register FFA0 - FFA7 8 bytes Primary Parallel ATA IDE bus master registers FFA8 - FFAF 8 bytes Secondary Parallel ATA IDE bus master registers Notes: 1. Default, but can be changed to another address range 2. Dword access only 3. Byte access only � NOTE Some additional I/O addresses are not available due to ICH7 address aliasing. The ICH7 data sheet provides more information on address aliasing. For information about Refer to Obtaining the ICH7 data sheet Section 1.3, page 15 48 Technical Reference 2.4 Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH7 component. The PIC is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts. The APIC is supported in Windows 2000 and Windows XP and supports a total of 24 interrupts. Table 12. Interrupts IRQ System Resource NMI I/O channel check 0 Reserved, interval timer 1 Reserved, keyboard buffer full 2 Reserved, cascade interrupt from slave PIC 3 User available (Note 1) 4 COM1 5 User available 6 Diskette drive (Note 1) 7 LPT1 8 Real-time clock 9 User available 10 User available 11 User available 12 Onboard mouse port (if present, else user available) 13 Reserved, math coprocessor 14 Primary Parallel ATA/Serial ATA – Legacy Mode (if present, else user available) 15 Secondary Parallel ATA/Serial ATA – Legacy Mode (if present, else user available) (Note 2) 16 User available (through PIRQA) (Note 2) 17 User available (through PIRQB) (Note 2) 18 User available (through PIRQC) (Note 2) 19 User available (through PIRQD) (Note 2) 20 User available (through PIRQE) (Note 2) 21 User available (through PIRQF) (Note 2) 22 User available (through PIRQG) (Note 2) 23 User available (through PIRQH) Notes: 1. Default, but can be changed to another IRQ. 2. Available in APIC mode only. 49 Intel Desktop Board D945GRW Technical Product Specification 2.5 PCI Configuration Space Map Table 13. PCI Configuration Space Map Bus Device Function Number (hex) Number (hex) Number (hex) Description 00 00 00 Memory controller of Intel 82945G component (Note 1) 00 01 00 PCI Express x16 graphics port 00 02 00 Integrated graphics controller 00 1B 00 Intel High Definition Audio Controller 00 1C 00 PCI Express port 1 00 1C 01 PCI Express port 2 00 1C 02 PCI Express port 3 00 1C 03 PCI Express port 4 00 1D 00 USB UHCI controller 1 00 1D 01 USB UHCI controller 2 00 1D 02 USB UHCI controller 3 00 1D 03 USB UHCI controller 4 00 1D 07 EHCI controller 00 1E 00 PCI bridge 00 1F 00 PCI controller 00 1F 01 Parallel ATA IDE controller 00 1F 02 Serial ATA controller 00 1F 03 SMBus controller (Note 2) 00 00 Gigabit LAN controller (Note 2) 05 00 IEEE-1394a controller (if present) (Note 1) 01 00 00 PCI Express video controller Notes: 1. Present only when a PCI Express x16 graphics card is installed. 2. Bus number is dynamic and can change based on add-in cards used. 2.6 Connectors CAUTION Only the following connectors have overcurrent protection: back panel USB, front panel USB, and PS/2. The other internal connectors are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. This section describes the board’s connectors. The connectors can be divided into these groups: • Back panel I/O connectors (see page 51) • Component-side I/O connectors (see page 52) 50 Technical Reference 2.6.1 Back Panel Connectors Figure 15 shows the location of the back panel connectors. The back panel connectors are color-coded. The figure legend (Table 14) lists the colors used (when applicable). H J L D G AC B EM F IKN OM18244 Figure 15. Back Panel Connectors Table 14 lists the back panel connectors identified in Figure 15. NOTE � The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. Table 14. Back Panel Connectors Shown in Figure 15 Item/callout from Figure 15 Description A PS/2 mouse port [Green] B PS/2 keyboard port [Purple] C Serial port A [Teal] D Parallel port [Burgundy] E VGA port [Blue] F USB ports (four) G LAN H Front left/right channel audio out [Lime green] I USB ports (two) J Audio line in/Retasking Jack [Blue] K Mic in/Retasking Jack [Pink] L Side Surround left/right channel audio out [Gray] M Center channel and LFE (subwoofer) audio out [Yellow] N Rear Surround left/right audio out [Black] 51 Intel Desktop Board D945GRW Technical Product Specification 2.6.2 Component-side Connectors Figure 16 shows the locations of the component-side connectors. A B C D E F G H I J 1 10 12 24 10 9 1 2 2 1 1 2 1 2 3 1 1 1 13 40 1 39 2 1 2 7 10 1 9 8 3 1 2 1 2 4 4 1 O N M L K OM19002 Figure 16. Component-side Connectors 52 Technical Reference Table 15 lists the component-side connectors identified in Figure 16. Table 15. Component-side Connectors Shown in Figure 16 Item/callout from Figure 16 Description A Front panel audio connector B Rear chassis fan connector C Parallel ATA IDE connector D Chassis intrusion connector E Remote thermal sensor connector F Serial ATA connector 0 G Serial ATA connector 1 H Front panel USB connector I Main power connector J PCI Express x16 bus riser card connector K Auxiliary front panel power LED connector L Front panel connector M Front panel IEEE-1394a connector (optional) N Processor core power connector O Processor fan connector 53 Intel Desktop Board D945GRW Technical Product Specification Table 16. Front Panel Audio Connector Pin Signal Name Pin Signal Name 1 Port E [Port 1] Left Channel 2 Ground 3 Port E [Port 1] Right Channel 4 Presence# (dongle present) 5 Port F [Port 2] Right Channel 6 Port E [Port 1] Sense return (jack detection) 7 Port E [Port 1] and Port F [Port 2] 8 Key Sense send (jack detection) 9 Port F [Port 2] Left Channel 10 Port F [Port 2] Sense return (jack detection) INTEGRATOR’S NOTE # The front panel audio connector is colored yellow. Table 17. Chassis Intrusion Connector Pin Signal Name 1 Intruder 2 Ground Table 18. Serial ATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 19. Processor Fan Connector Pin Signal Name 1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL Table 20. Rear Chassis Fan Connector Pin Signal Name 1 FAN_CONTROL 2 +12 V 3 FAN_TACH 54 Technical Reference 2.6.2.1 Power Supply Connectors The board has power supply connectors: • Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected. • Processor core power – a 2 x 2 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting. INTEGRATOR’S NOTE # When using high wattage PCI Express x16 graphics cards, use a power supply with a 2 x 12 main power cable. The 2 x 12 main power cable can provide up to 144 W of power from the +12 V rail. Table 21. Main Power Connector Pin Signal Name Pin Signal Name 1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/off) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Good) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V (Note) (Note) 11 +12 V 23 +5 V (Note) (Note) 12 2 x 12 connector detect 24 Ground Note: When using a 2 x 10 power supply cable, this pin will be unconnected. Table 22. Processor Core Power Connector Pin Signal Name Pin Signal Name 1 Ground 2 Ground 3 +12 V 4 +12 V 55 Intel Desktop Board D945GRW Technical Product Specification 2.6.2.2 Add-in Card Connector The board has one PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec. CAUTION The PCI Express x16 connector on this board is intended for use with a PCI Express x16 riser card only. Do not plug a PCI Express x16 add-in card into this connector. Doing so could damage both the PCI Express x16 add-in card and the connector. NOTE � The PCI Express x16 connector is configured to support only a PCI Express x1 link when the Intel GMA950 graphics controller is enabled. 2.6.2.3 Auxiliary Front Panel Power/Sleep LED Connector Pins 1 and 3 of this connector duplicate the signals on pins 2 and 4 of the front panel connector. Table 23. Auxiliary Front Panel Power/Sleep LED Connector Pin Signal Name In/Out Description 1 HDR_BLNK_GRN Out Front panel green LED 2 Not connected 3 HDR_BLNK_YEL Out Front panel yellow LED 56 Technical Reference 2.6.2.4 Front Panel Connector This section describes the functions of the front panel connector. Table 24 lists the signal names of the front panel connector. Figure 17 is a connection diagram for the front panel connector. Table 24. Front Panel Connector Pin Signal In/Out Description Pin Signal In/Out Description Hard Drive Activity LED Power LED [Orange] [Green] 1 HD_PWR Out Hard disk LED pull-up 2 HDR_BLNK_ Out Front panel green (750 Ω) to +5 V GRN LED 3 HAD# Out Hard disk active LED 4 HDR_BLNK_ Out Front panel yellow YEL LED Reset Switch On/Off Switch [Blue] [Red] 5 Ground Ground 6 FPBUT_IN In Power switch 7 FP_RESET# In Reset switch 8 Ground Ground Power Not Connected 9 +5 V Power 10 N/C Not connected N/C 9 +5 V DC 8 7 Reset Power Switch Switch 6 5 4 3 Dual-colored Single-colored − Power LED Power LED Hard Drive Activity LED + − 2 1 + − + OM18250 Figure 17. Connection Diagram for Front Panel Connector 2.6.2.4.1 Hard Drive Activity LED Connector [Orange] Pins 1 and 3 [Orange] can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: • A Serial ATA hard drive connected to an onboard Serial ATA connector • An IDE hard drive connected to an onboard IDE connector 57 Green Red Orange Blue Intel Desktop Board D945GRW Technical Product Specification 2.6.2.4.2 Reset Switch Connector [Blue] Pins 5 and 7 [Blue] can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.6.2.4.3 Power/Sleep LED Connector [Green] Pins 2 and 4 [Green] can be connected to a one- or two-color LED. Table 25 shows the possible states for a one-color LED. Table 26 shows the possible states for a two-color LED. Table 25. States for a One-Color Power LED LED State Description Off Power off/sleeping Steady Green Running Table 26. States for a Two-Color Power LED LED State Description Off Power off Steady Green Running Steady Yellow Sleeping � NOTE The colors listed in Table 25 and Table 26 are suggested colors only. Actual LED colors are product- or customer-specific. 2.6.2.4.4 Power Switch Connector [Red] Pins 6 and 8 [Red] can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal. 58 Technical Reference 2.6.2.5 Front Panel USB Connector Figure 18 is a connection diagram for the front panel USB connector. INTEGRATOR’S NOTES # • The +5 V DC power on the USB connector is fused. • Pins 1, 3, 5, and 7 comprise one USB port. • Pins 2, 4, 6, and 8 comprise one USB port. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high- speed USB devices. Power Power 1 2 (+5 V DC) (+5 V DC) D− 3 4 D− One One USB USB Port Port 5 6 D+ D+ 7 8 Ground Ground 10 Key (no pin) No Connect OM15963 Figure 18. Connection Diagram for Front Panel USB Connector 2.6.2.6 Front Panel IEEE 1394a Connector (Optional) Figure 19 is a connection diagram for the optional IEEE 1394a connector. TPA+ 1 2 TPA− Ground 3 4 Ground TPB+ 5 6 TPB− 7 8 +12 V DC +12 V DC Key (no pin) 10 Ground OM16107 Figure 19. Connection Diagram for IEEE 1394a Connector INTEGRATOR’S NOTES # • The IEEE 1394a connector is colored blue. • The +12 V DC power on the IEEE 1394a connectors is fused. 59 Intel Desktop Board D945GRW Technical Product Specification 2.7 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 20 shows the location of the jumper block. The jumper block determines the BIOS Setup program’s mode. Table 27 describes the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match. 1 3 J41 OM19005 Figure 20. Location of the Jumper Block Table 27. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration The BIOS uses current configuration information and 1 Normal 1-2 passwords for booting. 3 After the POST runs, Setup runs automatically. The Configure 2-3 1 maintenance menu is displayed. 3 The BIOS attempts to recover the BIOS configuration. Recovery None 1 Recovery media is required. 3 60 Technical Reference 2.8 Mechanical Considerations 2.8.1 Form Factor The board is designed to fit into a BTX-form-factor chassis. Figure 21 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 8.00 inches by 10.50 inches [203.20 millimeters by 266.70 millimeters]. 7.550 [191.77] 0.00 0.250 [6.35] 0.00 10.000 [254.00] 9.550 [242.57] 10.000 10.250 [254.00] [260.36] 2.275 7.800 0.200 [57.79] [198.12] [5.08] OM19003 Figure 21. Board Dimensions 61 Intel Desktop Board D945GRW Technical Product Specification 2.8.2 I/O Shield The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to pass certification testing. Figure 22 shows the I/O shield. Dimensions are given in millimeters [inches]. The figures also indicate the position of each cutout. Additional design considerations for I/O shields relative to chassis requirements are described in the ATX specification. NOTE � The I/O shield drawings in this document are for reference only. I/O shields compliant with the ATX chassis specification 2.03 are available from Intel. 172.93 [6.808] 3.53 [0.138] 13 TYP [0.511] + 0.12 169.98 – 0.13 + 0.004 [6.692 ] – 0.005 9.65 [0.379] 0.00 9.18 [0.000] [0.361] 9.18 11.55 [0.361] [0.454] 9.4 [0.370] Pictorial View OM18270 Figure 22. I/O Shield Dimensions 62 0.00 [0.000] 8.44 [0.332] 27.27 [1.073] 34.62 [1.362] 63.8 [2.511] 101.43 [3.993] 120.02 [4.725] 138.07 [5.435] 154.2 [6.070] Technical Reference 2.9 Electrical Considerations 2.9.1 DC Loading Table 28 lists the DC loading characteristics of the boards. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems. The analysis does not include PCI add-in cards. Minimum values assume a light load placed on the board that is similar to an environment with no applications running and no USB current draw. Maximum values assume a load placed on the board that is similar to a heavy gaming environment with a 500 mA current draw per USB port. These calculations are not based on specific processor values or memory configurations but are based on the minimum and maximum current draw possible from the board’s power delivery subsystems to the processor, memory, and USB ports. Use the datasheets for add-in cards, such as PCI, to determine the overall system power requirements. The selection of a power supply at the system level is dependent on the system’s usage model and not necessarily tied to a particular processor speed. Table 28. DC Loading Characteristics DC Current at: Mode DC Power +3.3 V +5 V +12 V -12 V +5 VSB Minimum loading 210 W 3.6 A 17.2 A 8.7 A 0.0 A 0.3 A (S0) 1.4 A (S3) Maximum loading 310 W 5.1 A 24.6 A 13.5 A 0.0 A 0.3 A (S0) 1.44 A (S3) 2.9.2 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The D945GRW board has one add-in board slot (the PCI Express x16 slot). The total +5 V current draw for add-in boards must not exceed 2 A. 63 Intel Desktop Board D945GRW Technical Product Specification 2.9.3 Fan Connector Current Capability CAUTION The processor fan must be connected to the processor fan connector, not to a chassis fan connector. Connecting the processor fan to a chassis fan connector may result in onboard component damage that will halt fan operation. Table 29 lists the current capability of the fan connectors. Table 29. Fan Connector Current Capability Fan Connector Maximum Available Current Processor fan 2.0 A Rear chassis fan 1.5 A 2.9.4 Power Supply Considerations CAUTION The +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. System integrators should refer to the power usage values listed in Table 28 when selecting a power supply for use with the board. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the following recommendations found in the indicated sections of the ATX form factor specification. • The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2) • The current capability of the +5 VSB line (Section 4.2.1.2) • All timing parameters (Section 4.2.1.3) • All voltage tolerances (Section 4.2.2) 64 Technical Reference 2.10 Thermal Considerations CAUTION This board requires the use of a Type II (Low Profile) Thermal Module for the processor. Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.12. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area o (item E in Figure 23) can reach a temperature of up to 85 C in an open chassis. Figure 23 shows the locations of the localized high temperature zones. 65 Intel Desktop Board D945GRW Technical Product Specification A B C E D OM19004 Item Description A Intel 82945G GMCH B Intel 82801G ICH7 C 1.5 V core and front side bus voltage regulator areas D Processor E Processor voltage regulator area Figure 23. Localized High Temperature Zones 66 Technical Reference Table 30 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 30. Thermal Considerations for Components Component Maximum Case Temperature Intel Pentium 4 processor For processor case temperature, see processor datasheets and processor specification updates o Intel 82945G GMCH 99 C (under bias) o Intel 82801G ICH7 110 C (under bias, without heatsink) o 99 C (under bias, with heatsink) For information about Refer to Intel Pentium 4 processor datasheets and specification updates Section 1.3, page 15 2.11 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D945GRW board is 126,967 hours. 67 Intel Desktop Board D945GRW Technical Product Specification 2.12 Environmental Table 31 lists the environmental specifications for the board. Table 31. Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +70 °C Operating 0 °C to +55 °C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second Packaged Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz 20 Hz to 500 Hz: 0.02 g² Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat) 40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz 68 Technical Reference 2.13 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board D945GRW: • Safety regulations • European Union Declaration of Conformity statement • Product Ecology statements • Electromagnetic Compatibility (EMC) regulations • Product certification markings 2.13.1 Safety Regulations Desktop Board D945GRW complies with the safety regulations stated in Table 32 when correctly installed in a compatible host system. Table 32. Safety Regulations Regulation Title UL 60950-1:2003/ Information Technology Equipment – Safety - Part 1: General Requirements (USA and Canada) CSA C22.2 No. 60950-1-03 EN 60950-1:2002 Information Technology Equipment – Safety - Part 1: General Requirements (European Union) IEC 60950-1:2001, First Edition Information Technology Equipment – Safety - Part 1: General Requirements (International) 2.13.2 European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board D945GRW is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage Directive). The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions. This product follows the provisions of the European Directives 89/336/EEC and 73/23/EEC. 69 Intel Desktop Board D945GRW Technical Product Specification Čeština Tento výrobek odpovídá požadavkům evropských směrnic 89/336/EEC a 73/23/EEC. Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 89/336/EEC & 73/23/EEC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 89/336/EEC & 73/23/EEC. Eesti Antud toode vastab Euroopa direktiivides 89/336/EEC ja 73/23/EEC kehtestatud nõuetele. Suomi Tämä tuote noudattaa EU-direktiivin 89/336/EEC & 73/23/EEC määräyksiä. Français Ce produit est conforme aux exigences de la Directive Européenne 89/336/EEC & 73/23/EEC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 89/336/EEC & 73/23/EEC. Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 89/336/ΕΟΚ και 73/23/ΕΟΚ. Magyar E termék megfelel a 89/336/EEC és 73/23/EEC Európai Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 89/336/ EEC & 73/23/EEC. Italiano Questo prodotto è conforme alla Direttiva Europea 89/336/EEC & 73/23/EEC. Latviešu Šis produkts atbilst Eiropas Direktīvu 89/336/EEC un 73/23/EEC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 89/336/EEC ir 73/23/EEC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 89/336/EEC u 73/23/EEC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC & 73/23/EEC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 89/336/EWG i 73/23/EWG. Portuguese Este produto cumpre com as normas da Diretiva Européia 89/336/EEC & 73/23/EEC. Español Este producto cumple con las normas del Directivo Europeo 89/336/EEC & 73/23/EEC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 89/336/EEC a 73/23/EEC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 89/336/EGS in 73/23/EGS. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 89/336/EEC & 73/23/EEC. Türkçe Bu ürün, Avrupa Birliği’nin 89/336/EEC ve 73/23/EEC yönergelerine uyar. 70 Technical Reference 2.13.3 Product Ecology Statements The following information is provided to address worldwide product ecology concerns and regulations. 2.13.3.1 Disposal Considerations This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly. 2.13.3.2 Recycling Considerations As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to select locations for proper recycling. Please consult the http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. 中文 作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作 恰当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt- Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc. 71 Intel Desktop Board D945GRW Technical Product Specification Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées. Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc. 日本語 インテルでは、環境保護活動の一環として、使い終えたインテル ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル プログラムを発足させました。 対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/intel/ other/ehs/product_ecology/Recycling_Program.htm （英語）をご覧ください。 Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada. Consulte o site http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm (em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc. Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm за информацией об этой программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д. 72 Technical Reference Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur. Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm Web sayfasına gidin. 2.13.3.3 Lead Free Desktop Board The desktop board is lead free. Other box contents may contain lead. Table 33. Lead Free Desktop Board Description Mark Lead-Free: The symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in any of the raw materials and the end product is not greater than 0.1% by weight (1000 ppm). This symbol is also used to indicate conformance to lead-free requirements and definitions adopted under the European Union’s Restriction on Hazardous Substances (RoHS) directive, 2002/95/EC. 73 Intel Desktop Board D945GRW Technical Product Specification 2.13.4 EMC Regulations Desktop Board D945GRW complies with the EMC regulations stated in Table 34 when correctly installed in a compatible host system. Table 34. EMC Regulations Regulation Title FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B, Radio Frequency Devices. (USA) ICES-003 (Class B) Interference-Causing Equipment Standard, Digital Apparatus. (Canada) EN55022: 1998 (Class B) Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union) EN55024: 1998 Information Technology Equipment – Immunity Characteristics Limits and methods of measurement. (European Union) AS/NZS CISPR 22 Australian Communications Authority, Standard for Electromagnetic (Class B) Compatibility. (Australia and New Zealand) CISPR 22, 3rd Edition, Limits and methods of measurement of Radio Disturbance Characteristics of (Class B) Information Technology Equipment. (International) CISPR 24: 1997 Information Technology Equipment – Immunity Characteristics – Limits and Methods of Measurement. (International) VCCI (Class B) Voluntary Control for Interference by Information Technology Equipment. (Japan) Japanese Kanji statement translation: this is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual. Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non- residential environments. 74 Technical Reference 2.13.5 Product Certification Markings (Board Level) Desktop Board D945GRW has the product certification markings shown in Table 35: Table 35. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel desktop boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. Includes Intel name and D945GRW model designation. CE mark. Declaring compliance to European Union (EU) EMC directive (89/336/EEC) and Low Voltage directive (73/23/EEC). Australian Communications Authority (ACA) C-tick mark. Includes adjacent Intel supplier code number, N-232. Japan VCCI (Voluntary Control Council for Interference) mark. S. Korea MIC (Ministry of Information and Communication) mark. For information about MIC certification, go to http://support.intel.com/support/motherboards/desktop/ Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturer’s recognition mark. Consists of a unique UL V-0 recognized manufacturer’s logo, along with a flammability rating (solder side). 75 Intel Desktop Board D945GRW Technical Product Specification 76 3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction ..................................................................................................................77 3.2 BIOS Flash Memory Organization ...............................................................................78 3.3 Resource Configuration ...............................................................................................78 3.4 System Management BIOS (SMBIOS) ........................................................................79 3.5 Legacy USB Support....................................................................................................79 3.6 BIOS Updates ..............................................................................................................80 3.7 Boot Options ................................................................................................................81 3.8 Adjusting Boot Speed...................................................................................................82 3.9 BIOS Security Features ...............................................................................................83 3.1 Introduction The boards use an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as RW94510J.86A. When the BIOS Setup configuration jumper is set to configure mode and the computer is powered- up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below. Maintenance Main Advanced Security Power Boot Exit NOTE � The maintenance menu is displayed only when the Desktop Board is in configure mode. Section 2.7 on page 60 shows how to put the Desktop Board in configure mode. 77 Intel Desktop Board D945GRW Technical Product Specification Table 36 lists the BIOS Setup program menu features. Table 36. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Clears Displays Configures Sets Configures Selects boot Saves or passwords and processor advanced passwords power options discards displays and memory features and security management changes to processor configuration available features features and Setup information through the power supply program chipset controls options Table 37 lists the function keys available for menu screens. Table 37. BIOS Setup Program Function Keys BIOS Setup Program Function Key Description <←> or <→> Selects a different menu screen (Moves the cursor left or right) <↑> or <↓> Selects an item (Moves the cursor up or down) Selects a field (Not implemented) Executes command or selects the submenu Load the default configuration values for the current menu Save the current values and exits the BIOS Setup program Exits the menu 3.2 BIOS Flash Memory Organization The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 4 Mbit (512 KB) flash memory device. 3.3 Resource Configuration 3.3.1 PCI Autoconfiguration The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card. 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. The interface also supports second-generation SATA drives. The BIOS determines the capabilities of each drive and configures them to optimize capacity and performance. To take advantage of the high capacities typically available today, hard drives are 78 Overview of BIOS Features automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending on the capability of the drive. You can override the auto-configuration options by specifying manual configuration in the BIOS Setup program. To use ATA-66/100 features the following items are required: • An ATA-66/100 peripheral device • An ATA-66/100 compatible cable • ATA-66/100 operating system device drivers NOTE � Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive. 3.4 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information: • BIOS data, such as the BIOS revision level • Fixed-system data, such as peripherals, serial numbers, and asset tags • Resource data, such as memory size, cache size, and processor speed • Dynamic data, such as event detection and error logging Non-Plug and Play operating systems, such as Windows NT*, require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. 3.5 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 79 Intel Desktop Board D945GRW Technical Product Specification 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used. To install an operating system that supports USB, follow the operating system’s installation instructions. 3.6 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: ® • Intel Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a 1.44 MB diskette (in a USB diskette drive), or a CD-ROM, or from the file location on the Web. ® • Intel Flash Memory Update Utility, which requires creation of a boot diskette and manual rebooting of the system. Using this utility, the BIOS can be updated from a file on a 1.44 MB diskette (from a USB diskette drive) or a CD-ROM. Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS. NOTE � Review the instructions distributed with the upgrade utility before attempting a BIOS update. For information about Refer to The Intel World Wide Web site Section 1.3, page 15 3.6.1 Language Support The BIOS Setup program and help messages are supported in US English. Additional languages are available in the Integrator’s Toolkit utility. Check the Intel website for details. 3.6.2 Custom Splash Screen ® During POST, an Intel splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE � If you add a custom splash screen, it will share space with the Intel branded logo. For information about Refer to The Intel World Wide Web site Section 1.3, page 15 80 Overview of BIOS Features 3.7 Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, CD-ROM, or the network. The default setting is for the hard drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. 3.7.1 CD-ROM Boot Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot from the next defined drive. 3.7.2 Network Boot The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full. 3.7.3 Booting Without Attached Devices For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: • Video adapter • Keyboard • Mouse 3.7.4 Changing the Default Boot Device During POST Pressing the key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices (as set in the BIOS setup program’s Boot Device Priority Submenu). Table 38 lists the boot device menu options. Table 38. Boot Device Menu Options Boot Device Menu Function Keys Description <↑> or <↓> Selects a default boot device Exits the menu, saves changes, and boots from the selected device Exits the menu without saving changes 81 Intel Desktop Board D945GRW Technical Product Specification 3.8 Adjusting Boot Speed These factors affect system boot speed: • Selecting and configuring peripherals properly • Optimized BIOS boot parameters 3.8.1 Peripheral Selection and Configuration The following techniques help improve system boot speed: • Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds, that minimize hard drive startup delays. • Select a CD-ROM drive with a fast initialization rate. This rate can influence POST execution time. • Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in POST. These features may add time to the boot process. • Try different monitors. Some monitors initialize and communicate with the BIOS more quickly, which enables the system to boot more quickly. 3.8.2 BIOS Boot Optimizations To reduce the POST execution time, use the following BIOS Setup program settings: • In the Boot Menu set the hard disk drive as the first boot device. • In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can reduce up to four seconds of option ROM boot time. NOTE � It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen. This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program). 82 Overview of BIOS Features 3.9 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode. • The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode. • If only the supervisor password is set, pressing the key at the password prompt of the BIOS Setup program allows the user restricted access to Setup. • If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered. • Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer. • For enhanced security, use different passwords for the supervisor and user passwords. • Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length. Table 39 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen. Table 39. Supervisor and User Password Functions Supervisor Password to Password Password Set Mode User Mode Setup Options Enter Setup During Boot Neither Can change all Can change all None None None (Note) (Note) options options Supervisor Can change all Can change a Supervisor Password Supervisor None only options limited number of options User only N/A Can change all Enter Password User User options Clear User Password Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or and user set options limited number Enter Password user user of options Note: If no password is set, any user can change all Setup options. 83 Intel Desktop Board D945GRW Technical Product Specification 84 4 Error Messages and Beep Codes What This Chapter Contains 4.1 Speaker .......................................................................................................................85 4.2 BIOS Beep Codes........................................................................................................85 4.3 BIOS Error Messages ..................................................................................................85 4.4 Port 80h POST Codes .................................................................................................86 4.1 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 12 4.2 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS displays an error message describing the problem (see Table 40). Table 40. Beep Codes Type Pattern Frequency Memory error Three long beeps 1280 Hz Thermal warning Four alternating beeps: High tone: 2000 Hz High tone, low tone, high tone, low tone Low tone: 1600 Hz 4.3 BIOS Error Messages Table 41 lists the error messages and provides a brief description of each. Table 41. BIOS Error Messages Error Message Explanation CMOS Battery Low The battery may be losing power. Replace the battery soon. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values. Memory Size Decreased Memory size has decreased since the last boot. If no memory was removed then memory may be bad. No Boot Device Available System did not find a device to boot. 85 Intel Desktop Board D945GRW Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. The following tables provide information about the POST codes generated by the BIOS: • Table 42 lists the Port 80h POST code ranges • Table 43 lists the Port 80h POST codes themselves • Table 44 lists the Port 80h POST sequence NOTE � In the tables listed above, all POST codes and range values are listed in hexadecimal. Table 42. Port 80h POST Code Ranges Range Category/Subsystem 00 – 0F Debug codes: Can be used by any PEIM/driver for debug. 10 – 1F Host Processors: 1F is an unrecoverable CPU error. 20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected. 30 – 3F Recovery: 3F indicated recovery failure. 40 – 4F Reserved for future use. 50 – 5F I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI. 60 – 6F Reserved for future use (for new busses). 70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error. 80 – 8F Reserved for future use (new output console codes). 90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error. A0 – AF Reserved for future use (new input console codes). B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error. C0 – CF Reserved for future use. D0 – DF Boot device selection. E0 – FF F0 – FF: FF processor exception. E0 – EE: Miscellaneous codes. See Table 43. EF boot/S3: resume failure. 86 Error Messages and Beep Codes Table 43. Port 80h POST Codes POST Code Description of POST Operation Host Processor 10 Power-on initialization of the host processor (Boot Strap Processor) 11 Host processor Cache initialization (including APs) 12 Starting Application processor initialization 13 SMM initialization Chipset 21 Initializing a chipset component Memory 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 24 Programming timing parameters in the memory controller and the DIMMs 25 Configuring memory 26 Optimizing memory settings 27 Initializing memory, such as ECC init 28 Testing memory PCI Bus 50 Enumerating PCI busses 51 Allocating resources to PCI bus 52 Hot Plug PCI controller initialization 53 – 57 Reserved for PCI Bus USB 58 Resetting USB bus 59 Reserved for USB ATA/ATAPI/SATA 5A Resetting PATA/SATA bus and all devices 5B Reserved for ATA SMBus 5C Resetting SMBUS 5D Reserved for SMBUS Local Console 70 Resetting the VGA controller 71 Disabling the VGA controller 72 Enabling the VGA controller Remote Console 78 Resetting the console controller 79 Disabling the console controller 7A Enabling the console controller continued 87 Intel Desktop Board D945GRW Technical Product Specification Table 43. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS2 or USB) 90 Resetting keyboard 91 Disabling keyboard 92 Detecting presence of keyboard 93 Enabling the keyboard 94 Clearing keyboard input buffer 95 Instructing keyboard controller to run Self Test (PS2 only) Mouse (PS2 or USB) 98 Resetting mouse 99 Disabling mouse 9A Detecting presence of mouse 9B Enabling mouse Fixed Media B0 Resetting fixed media B1 Disabling fixed media B2 Detecting presence of a fixed media (IDE hard drive detection etc.) B3 Enabling/configuring a fixed media Removable media B8 Resetting removable media B9 Disabling removable media BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.) BC Enabling/configuring a removable media BDS Dy Trying boot selection y (y=0 to 15) PEI Core E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN EFI_SW_PEI_PC_HANDOFF_TO_NEXT) E2 Permanent memory found E1, E3 Reserved for PEI/PEIMs DXE Core E4 Entered DXE phase E5 Started dispatching drivers E6 Started connecting drivers continued 88 Error Messages and Beep Codes Table 43. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers E7 Waiting for user input E8 Checking password E9 Entering BIOS setup EA TBD – Flash Update EB Calling Legacy Option ROMs EE TBD – Calling INT 19. One beep unless silent boot is enabled EF TBD – Unrecoverable Boot failure/S3 resume failure Runtime Phase/EFI OS Boot F4 Entering Sleep state F5 Exiting Sleep state F8 EFI boot service ExitBootServices ( ) has been called F9 EFI runtime service SetVirtualAddressMap ( ) has been called FA EFI runtime service ResetSystem ( ) has been called PEIMs/Recovery 30 Crisis Recovery has initiated per User request 31 Crisis Recovery has initiated by software (corrupt flash) 34 Loading recovery capsule 35 Handing off control to the recovery capsule 3F Unable to recover 89 Intel Desktop Board D945GRW Technical Product Specification Table 44. Typical Port 80h POST Sequence POST Code Description 21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loading recovery capsule E4 Entered DXE phase 12 Starting Application processor initialization 13 SMM initialization 50 Enumerating PCI busses 51 Allocating resourced to PCI bus 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 95 Keyboard Self Test EB Calling Video BIOS 58 Resetting USB bus 5A Resetting PATA/SATA bus and all devices 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 5A Resetting PATA/SATA bus and all devices 28 Testing memory 90 Resetting keyboard 94 Clearing keyboard input buffer E7 Waiting for user input 01 INT 19 00 Ready to boot 90