Manufacturers
IEI WAFER-5826
Description
IEI WAFER-5826 CPU Board with Embedded Low power consumption CPU and small form factor solution, FAN Less Embedded CPU with PCMCIA I/F for Internet appliance (Web PAD, Car PC)
Part Number
WAFER-5826
Price
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Manufacturer
IEI
Lead Time
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Category
SPECIALTY PRODUCT - AUDIO / VIDEO CAPTURE & BROADCAST
Specifications
BIOS
Award PnP BIOS
Connector
external DB-15 for CRT and one internal 31pin LCD connector (DF9, Hirose)
CPU
NS Geode GX1-300MHz
Dimensions
145 x 102mm (5.8" x 4")
Ethernet
Realtek RTL8139C 10/100Mbps Ethernet controllers. Support WOL function
Expansion Interface
PCMCIA type II socket for PCMCIA daughter board
Form Factor
3.5" disk size Embedded Board
Gross Weight
700g
I/O
2 x RS-232 (16C550 UARTs compatible) 1 x Parallel (SPP/EPP/ECP) 2 x USB 1.1 1 x IrDA (SIR) 1 x IDE channel ( 1 x 44 pin header) 1 x IDE high-density external connector
Operating Humidity
5 ~ 95%, non-condensing
Operating Temperature
0 ~ 60ºC (CPU need cooler)
Power Consumption
12V@1A
Power Supply
Power connector : 12V input - 2-pin (3.96mm pitch). Molex equivalent SPOX header
Processor
AMD Geode
System Memory
up to 512MB (1 x 144pin SO-DIMM)
VRAM
max. 1280 x 1024, colors for CRT
Watchdog Timer
software programmable, support 1 ~ 255 sec. system reset
Features
- Built-in CS5530A chipset, supports TFT LCD & CRT display
- NS Geode GX1-300MHz low power CPU on board
- One 144-pin SODIMM socket supports up to 512MB SDRAM
- PCMCIA type II socket for PCMCIA daughter board
- Realtek RTL8139 10/100Mbps Ethernet chip on board
- Single +12V (Wafer-5825) and +5V (Wafer-5826) support
Datasheet
Extracted Text
Embedded Low power consumption Wafer-5825/5826 CPU and small form factor solution FAN Less Embedded CPU with PCMCIA I/F for Internet appliance (Web PAD, Car PC) 12V Only 5V Only PCMCIA Kit for Wireless LAN application Wafer-5826 Wafer-5825 Wafer-5825 44pin IDE I/F ® External IDE I/F Microsoft ® ® IEI is proud to launch Windows CE support on our embedded solution CE 3.0 NOW AVAILABLE (by request) What is Windows CE? CRT Windows CE is a compact, scalable and flexible operation system in 2xUSB LAN Microsoft's OS family. Migrating from 2.12 to 3.0 by adding real time feature COM 1 and more powerful function, it is expected to greatly enhance the system PS/2 Keyboard/ applicability for industry use. Mouse What are the benefits with Windows CE? SPECIFICATIONS Windows CE is specially developed for below purposes: 1) Common base for software applications CPU: NS Geode GX1-300MHz 2) Modular design for customization BIOS: Award PnP BIOS 3) Minimize memory footprint and maximize syetem performance System Memory: up to 512MB (1x 144pin SO-DIMM) What are IEI's offerings for customers? Display: Built-in CS5530A chipset IEI Windows CE dedicate Team provides a complete emulation environment for building CE image by combining either CE 2.12 kernel, CE 3.0 kernel, V-RAM: share with system memory (up to 4MB) setting by BIOS system drivers and CE-based applications. Customers receive total solutions Resolution: max.1280x1024, 256 colors for CRT 1024x768, 64K for LCD from IEI including OS licensing, driver support, image build and system Connector: external DB-15 for CRT and one internal testing. In addition we welcome customers' CE inquiry on product software/ 31pin LCD connector (DF9, Hirose) hardware compatibility, system integration testing and certification. I/O: – 2 x RS-232 (16C550 UARTs compatible) IEI's embedded systems (NOVA- and Wafer- series) are now – 1 x Parallel (SPP/EPP/ECP) ready to support Windows CE. Please contact us for more – 2 x USB 1.1 information. – 1 x IrDA (SIR) – 1 x IDE channel (1x44 pin header) – 1 x IDE high-density external connector (wafer-5825) DimensionsEthernet: external RJ-45x1 Realtek RTL8139C 10/100Mbps Ethernet controllers Support WOL function 2.0mm pitch floppy port connector (Wafer-5826) Expansion: PCMCIA type II socket for PCMCIA daughter board WDT: software programmable, support 1~ 255 sec. system reset Power connector: 12V input– 2-pin (3.96mm pitch) (Wafer-5825) 5V input–2-pin (3.96mm pitch) (Wafer-5826) Molex equivalent SPOX header Power Consumption (with 64MB SDRAM): Wafer-5825 – 12V@1A; Wafer-5826 – 5V@1.5A Operating Temperature: 0-60°C Relative Humidity: 5~95%, non-condensing Form Factor: 3.5" disk size Embedded Board Dimensions: 145 x 102 mm (5.8" x 4") GW: 700g ORDERING INFORMATION Wafer-5825-300 Embedded NS GX1 300MHz SBC, +12V input with LCD/CRT VGA /LAN /PCMCIA/External IDE Wafer-5826-300 Embedded NS GX1 300MHz SBC, +5V input with LCD/CRT VGA /LAN /PCMCIA/FDD port 2-33 Powered Windows
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Access
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Savings
Maintain legacy systems to prevent costly downtime
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