EIDE

Two Ultra-DMA33/66/100 Bus interfaces at backplane (supports two external IDE drives) or one IDE backplane interface with optional on-board Type I CompactFlash module

Environmental

Emissions Designed to meet FCC Part15, Class A certification Humidity (non-condensing) Operating: 5–95% @ 40 °C Storage: 5–95% @ 40 °C Altitude Operating: 4.5 km (15,000 ft.) Storage: 6 km (20,000 ft.) Shock C-Style: 20 g / 11 ms, 3 axes, up & down, 3 hits/direction Vibration C-Style: 0.04 g2 /Hz @ 5 to 100 Hz, 60 minutes each axis Temperature Range: Standard Operating: 0 °C to +70 °C Storage: -40 °C to +85 °C

External Card

Floppy drive interface at backplane through PC87417 LPC Server I/O

Flash Storage

1 Mbyte Firmware Hub (FWH) for BIOS code Multiple levels of write-protection

GPIO

Intel® 82546GB Dual Port Gigabit Ethernet Controller with integrated MAC and PHY Two RJ-45 connectors on front panel

Keyboard/Mouse

PS/2-style keyboard/mouse port at the front panel from the PC87417 LPC Server I/O

Mechanical

VITA 1.1 VME64x Bus compliant (3-row or 5-row backplane connectors) VITA 1/IEEE 1101.1 air-cooled 6U form factor 233 x 160 x 20 mm Weight – 1.25 lbs

Memory

512 Mbyte or 1 Gbyte of soldered DDR266 SDRAM (PC2100) 64-bit 266 MHz Memory Bus (72-bit with ECC)

MTBF

Calculations are available in accordance with MIL-HDBK-217.

Networking

32 Kbyte NVRAM

Parallel

IEEE 1284 Parallel port at the front panel from the PC87417 LPC Server I/O

PCI bus

Dual PCI interface through the 6300ESB ICH PCI Bus 2: 32-bit, 33 MHz—VME Backplane Bridge, Ultra- SCSI Controller, PCI Expansion site PCI Bus 1: 64-bit, 66 MHz—dedicated to Ethernet Controller Expansion: JX1/JX2 Mictor connectors on 32-bit/33MHz PCI Bus 0 Up to three PMC sites on PMC carrier cards attached to expansion site (TPMCC)

Power Consumption

Peak:* 30 W • Max. sustained:* 26 W • Idle:** 23 W • Inrush: 32 W • VBATT:

Power Requirements

+5 V, (±12V provided to PCI expansion only)

Processor

Intel® Pentium® M processor LV 738 with core processing speed of 1.4 GHz High performance, low power consumption, Intel Architecture (IA) 32 Kbyte L1 instruction and data caches 2 Mbyte L2 on-chip cache 400 MHz Front Side Bus interface through the 855GME GMCH

RTC

Real-time clock feature for timekeeping functions On-board Lithium Battery backup

Safety Criteria

Designed to meet standard UL1950/60950

SCSI

Ultra SCSI Interface (optional) 16-bit interface at backplane

Serial

COM1: full-duplex RS-232 interface COM2: configurable to full-duplex RS-232, async. RS-422, or half-duplex RS-485 interface

Technology

CPU die and ambient temperature Software readable from –55 °C to +125 °C

USB

Two 2.0-compatible USB ports (front and rear I/O) Integrated USB Controller through the 6300ESB ICH

Video Controller

Integrated SVGA video controller through 855GME Graphics and Memory Controller Hub Supports render core and display core frequencies up to 200 MHz 2D and 3D graphics engines 350 MHz 24-bit RAMDAC to drive analog CRT monitor at 1600 x 1200 pixel resolution