CRYSTAL RE0102
Specifications
Altitude, MIL-STD-810F, Method*
12,500ft operation, 40,000ft transport
Depth
12.75” (32.4cm)
EMC, MIL-STD-461F, CE102 (conducted) & RE102 (radiated) emissions
Passed with significant margin
Expansion Slots
Mini PCIe slot, 1XSD Socket, 1 mini PCI slot
Height
3” (7.62cm)
Humidity, MIL-STD-810F, Method 507.4*
48 Hour, 95% RH 40-65C with Humidity Kit
Intel CPU Architecture
2.53GHz Intel Core 2 Duo, Penryn socket P, Micro-FCPGA478 w/ 8GB DDR3 RAM, 3.06GHz CPU available temporarily
Internal Bays
One or two SATA 2.5” HDD, rotational or SSD
Mounting
Fixed mount
Operational Temperature, MIL-STD-810F, Method 501.5, Procedure I/II
-20°C to +65°C — see Cooling options below, -40°C with solid state hard drive (SSD)
Option 1 (std)
Low speed, low volume fans, 55oC operation with 54dB audible noise
Option 2
High speed, high volume fans, 65oC operation with 72dB audible noise
Power Supply
10-36VDC with MIL-STD-461 filtering, MIL-STD-704F, 1275
Shock, MIL-STD-810G, Method 516.6, Procedure I
20g, 11msec—functional shock; 40g, 11msec crash hazard shock
Storage, MIL-STD-810F, Method 501.5, Procedure I/II
-55°C to +85°C
System Board
Supports Intel Penryn CPU with DDRIII SO-DIMM 667/800/1066 FSB, dual GB-LAN 82573L, MINI PCI, Mini PCIe Card, IEEE1394, 2xSerial ATAII, Realtek ALC888 7.1 Channel HD Audio, SPDIF and SD. APCI 2.0 power management
Vibration, MIL-STD-810G, Method 514.6, Procedure I
7.18 GRMS, 5-2000Hz, 60 min/axis— w/SSD
Weight
12 lbs (5.5kg) (does not include vibration isolators)
Width
11” (28cm)
Features
- 1XSD socket, 1Xmini PCI slot and 1Xmini PCIe slot
- 6061 hardened structural aircraft aluminum
- All fasteners and connectors retained with locking mechanisms
- Cabling dressed and secured to prevent chafing
- Configuration Management available upon request;designed for long life through Intel Roadmap partnership
- External Ports - 2XPS2, 2XGBLAN, 1XVGA, 6XUSB, 1X1394, 1XRS232, 1XSPDIF and 7.1 channel audio
- High performance Intel Core 2 Duo Mobile 2.53 GHz CPU w/1066MHz FSB, 8GB DDR3, Intel GM45 and ICH9-M chipsets
- MIL-DTL-5541, Type I, Class 3 corrosion protection Built to survive shock and vibration
- Mounting options include fixed mount or vibration
- Multiple attachment points on motherboard and CPU heatsink stabilize PWB
- Optimized for vehicular or UAV applications requiring powerful processing and high volume I/O
- Passed MIL-STD-810G shock and vibration testing
- PC industry standard connectors (excluding PWR)
- Ultra compact rugged design, Height: 3” (7.62cm), Width: 11” (28cm), Depth: 12.75” (32.4cm), Weight: 12 lbs (5.5kg)
Datasheet
Extracted Text
www.crystalrugged.com RE0102 Rugged Embedded Computer Key Features • Ultra compact rugged design Height: 3” (7.62cm) Width: 11” (28cm) Depth: 12.75” (32.4cm) Weight: 12 lbs (5.5kg) • High performance Intel Core 2 Duo Mobile 2.53 GHz CPU w/1066MHz FSB, 8GB DDR3, Intel GM45 and ICH9-M chipsets Rugged Series Structural Features • PC industry standard connectors (excluding PWR) All aluminum construction • Optimized for vehicular or UAV applications requiring • 6061 hardened structural aircraft aluminum powerful processing and high volume I/O • MIL-DTL-5541, Type I, Class 3 corrosion • 1XSD socket, 1Xmini PCI slot and 1Xmini PCIe slot protection Built to survive shock and vibration • External Ports - 2XPS2, 2XGBLAN, 1XVGA, 6XUSB, 1X1394, 1XRS232, 1XSPDIF and 7.1 channel audio • Passed MIL-STD-810G shock and vibration testing • Configuration Management available upon request; designed for long life through Intel® Roadmap • Multiple attachment points on motherboard partnership and CPU heatsink stabilize PWB • Mounting options include fixed mount or vibration • All fasteners and connectors retained with locking mechanisms • Cabling dressed and secured to prevent Superior Cooling and EMI Performance chafing Cooling • High speed, high volume fans offer maximum airflow and are designed for long life • Custom cabling reduces internal pressure drop to increase airflow • Conduction and convection cooling techniques optimized throughout EMI/EMC Plot Showing the +28 volt RETURN Conducted Emissions (CE 102) • Passed EMC, MIL-STD-461F, CE102 and RE102 testing with significant margin • Input power filtering for MIL-STD-461, 704F, 1275 compliance • Applied finish maintains superior EMI/EMC characteristics throughout life of the unit. • Superior grounding paths The radiated emissions data plot for the frequency range 200 MHz to 1000 MHz – Horz. (RE-102) Crystal Group Inc. Employee-owned small business 800.378.1636 All trademarks are properties of their respective owners. Design and specifications are subject to change. © 2012 Crystal Group Inc. All rights reserved. DOC-00093 REV P 01/12 www.crystalrugged.com RE0102 Rugged Embedded Computer Military Standards Operational Temperature, MIL-STD-810F, Method 501.5, -20°C to +65°C — see Cooling options below Procedure I/II -40°C with solid state hard drive (SSD) Storage, MIL-STD-810F, Method 501.5, Procedure I/II -55°C to +85°C Humidity, MIL-STD-810F, Method 507.4* 48 Hour, 95% RH 40-65C with Humidity Kit Altitude, MIL-STD-810F, Method* 12,500ft operation, 40,000ft transport Vibration, MIL-STD-810G, Method 514.6, Procedure I 7.18 G , 5-2000Hz, 60 min/axis— w/SSD RMS Shock, MIL-STD-810G, Method 516.6, Procedure I 20g, 11msec—functional shock; 40g, 11msec crash hazard shock EMC, MIL-STD-461F, CE102 (conducted) & RE102 (radiated) emissions Passed with significant margin Mechanical Height 3” (7.62cm) Width 11” (28cm) Depth 12.75” (32.4cm) Weight 12 lbs (5.5kg) (does not include vibration isolators) CPU Intel® CPU Architecture 2.53GHz Intel Core 2 Duo, Penryn socket P, Micro-FCPGA478 w/ 8GB DDR3 RAM, 3.06GHz CPU available temporarily Expansion Slots Mini PCIe slot, 1XSD Socket, 1 mini PCI slot Internal Bays One or two SATA 2.5” HDD, rotational or SSD Cooling o Option 1 (std) Low speed, low volume fans, 55 C operation with 54dB audible noise o Option 2 High speed, high volume fans, 65 C operation with 72dB audible noise Mounting Fixed mount Power Supply 10-36VDC with MIL-STD-461 filtering, MIL-STD-704F, 1275 System Board Supports Intel Penryn CPU with DDRIII SO-DIMM 667/800/1066 FSB, dual GB-LAN 82573L, MINI PCI, Mini PCIe Card, IEEE1394, 2xSerial ATAII, Realtek ALC888 7.1 Channel HD Audio, SPDIF and SD. APCI 2.0 power management * Crystal Group designs all servers to meet or exceed the specifications listed herein. Due to the sheer number of models and combinations of components (memory, CPU, peripheral cards, hard drives), it is not practical to test every combination of servers offered. Please ask your Crystal Business Development Manager for data on qualification testing for configurations similar to the desired configuration for your application. Crystal Group Inc. Employee-owned small business 800.378.1636 All trademarks are properties of their respective owners. Design and specifications are subject to change. © 2012 Crystal Group Inc. All rights reserved. DOC-00093 REV P 01/12
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