™ Chip Fuses 3216TD Series,Time Delay Description RoHS 2002/95/EC • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder ELECTRICAL CHARACTERISTICS % of Amp Rating Opening Time 100% 4 Hours Minimum mm 200% 1 sec. minimum, 120 sec. maximum Dimensions ⁄(inches) 300% 0.05 sec. minimum, 3 sec. maximum Drawing Not to Scale 800% 0.002 sec. minimum, 0.05 sec. maximum unit: mm(inch) 3.2±0.1 Agency Information (0.125) • Recognition File number: E19180, Volume 13 1.6±0.1 5A (0.063) Environmental Data • Thermal Shock: Withstands 5 cycles of -55°C & 125°C • Vibration: MIL-STD-202F, Method 201A, Method 204D 1.0±0.1 Condition D (0.038) • Solderability: ANSI/J-STD-002, Test B th. 0.1mm 0.4±0.1 Ordering 1.0±0.05 • Specify packaging and product code Land Pattern (i.e. TR/3216TD1-R) Soldering Method • Wave Immersion: 260°C, 10 sec max. • Infrared Reflow: 260°C, 30 sec max. • Hand Solder: 350°C, 3 sec max. SPECIFICATIONS Current Voltage Interrupting Resistance Typical Typical 2 Product Code Rating Rating Rating* (ohms)** Melt I t† Voltage AC DC AC/DC Typ. DC Drop (V)‡ 3216TD1-R 1A 63 V 63 V 50 A 0.075 0.32 75 3216TD1.5-R 1.5A 32 V 32 V 35 A 0.050 0.62 75 3216TD2-R 2A 32 V 32 V 35 A 0.030 1.30 60 3216TD2.5-R 2.5A 32 V 32 V 35 A 0.022 2.25 55 3216TD3-R 3A 32 V 32 V 35 A 0.018 3.30 55 3216TD4-R 4A 32 V 32 V 35 A 0.0165 5.20 56 3216TD5-R 5A 32 V 32 V 35 A 0.015 8.40 66 3216TD6.3-R 6.3A 32 V 32 V 35 A 0.0120 13.8 75 3216TD7-R 7A 32 V 32 V 35 A 0.0095 16.9 67 3216TD10-R 10A 32 V 32 V 35 A 0.006 54.4 65 3216TD12-R 12A 32 V 32 V 35 A 0.005 64.0 65 * AC Interrupting Rating (Measured at rated voltage with a unity power factor); DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source) ** DC Cold Resistance (Measured at 10% of rated current) 2 † Typical Melting I t (Measured with a battery bank at rated DC voltage, 10x-rated current at 1 microsecond, not to exceed IR. Above 7a uses 70 micron thickness copper layer test board of IEC 60127-3. Others uses 35 micron thickness copper layer. ‡ Typical Voltage Drop (Measured at rated current after temperature stabilizes) Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatures. ™ Chip Fuses 3216TD Series,Time Delay TIME CURRENT CURVE PACKAGING CODE Packaging Code Description TR 2,500 pieces of fuses on 12mm tape-and-reel on a 180mm reel per EIA-481-A & IEC286-3 Visit us on the web at: North America Europe Asia Pacific www.cooperbussmann.com Cooper Electronic Technologies Cooper Bussmann Cooper Electronic Technologies Cooper Electronic Technologies Cooper Electronic Technologies 1225 Broken Sound Parkway NW P.O. Box 14460 Cooper (UK) Limited Avda. Santa Eulalia, 290 1 Jalan Kilang Timor OC-2620 1/07 Suite F St. Louis, MO 63178-4460 Burton-on-the-Wolds 08223 #06-01 Pacific Tech Centre Boca Raton, FL 33487-3533 Tel: 1-636-394-2877 Leicestershire • LE12 5TH UK Terrassa, (Barcelona), Spain Singapore 159303 © Cooper Electronic Tel: 1-561-998-4100 Fax: 1-800-544-2570 Tel: +44 (0) 1509 882 737 Tel: +34 937 362 812 Tel: +65 278 6151 Technologies 2007 Fax: 1-561-241-6640 Fax: +44 (0) 1509 882 786 +34 937 362 813 Fax: +65 270 4160 Toll Free: 1-888-414-2645 Fax: +34 937 362 719