C-MAX CME8000-TLSH

Description
IC RECEIVER RC BICMOS 28-SSOP
Part Number
CME8000-TLSH
Price
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Manufacturer
C-MAX
Lead Time
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Category
PRODUCTS - C
Datasheet
Extracted Text
Data Sheet
CME8000
C-MAX
The RF Technology Specialist
RC Receiver IC
1 Short Description
The CME8000 is a BiCMOS integrated straight through receiver with build in very high sensitivity
and a pre-decoding of the time signal transmitted from WWVB, DCF77, JJY, MSF and HBG. The
receiver is prepared for multi-mode reception by using an integrated logic. Integrated functions as
stand by mode, integrated antenna switching, integrated crystal switching and a hold mode
function offer features for universal applications.
The power down mode increases the battery lifetime significantly and makes the device ideal for all
kinds of radio controlled time pieces.
2 Features
o Low power consumption (<100µA) o Automatic protocol recognition
o Very high sensitivity (0.4µV) o Pre-decoded protocol information
o Build in pulse decoding for different protocols o Fast data transfer to CPU (100ms)
o Switchable for 3 different frequencies o Use of the CPU clock (32768Hz)
o High selectivity by using crystal filter o Improved noise resistance
o Power down mode o Integrated AGC adaptation
o Only a few external components necessary Two built-in low impedance antenna switches
o AGC hold mode (40 Ohm/3V)
o Wide frequency range (40 ... 120 kHz) o True Bit strength indication
o Low power applications (1.2 .. 5.0 V)
Benefits
o Extended Battery operating time o Easy world time piece design
o Decoding of the signal extremely simplified o Automatic country recognition
o Simplified micro controller software o True signal quality information
o Simplified multi frequency handling
Block Diagram
QIN QLOUT QMOUT QHOUT
VCC VL PON GNDL
ANT1
Bias
crystal switch
CLKSEL
CLOCK
I/O
DR
Logic
Unit
DATA
IN1
rect.- TCO
DT
AGC
IN2
BSI1
BSI2
contr. unit
AGC
ANT2
GND DEM PK SS1 SS2 HLD
Figure 1.
SPEC No. Revision State C-MAX printed Version Page
CME8000 B.11 11.03.05 14.03.2005 English 1 of 21
Data Sheet CME8000 C-MAX
3 Ordering Information
Extended Type Number Package Remarks
CME8000-DDT no die in trays
CME8000-TL* yes SSO28
CME8000-TLQ* Yes SSO28 Taped and reeled
*The packaged version of CME8000 is prepared for lead-free soldering. Soldering parameters are tbd.
4 Absolute Maximum Ratings
Parameters Symbol Value Unit
Supply voltage VCC 5.5 V
Ambient temperature range 1.2 – 2.49V T -20 to +75 °C
amb
Ambient temperature range 2.5 – 5.5V T -40 to +85 °C
amb
Storage temperature range R -55 to +150 °C
stg
Junction temperature T 125 °C
j
Electrostatic handling (MIL Standard 883 D HMB) +/- V 4 kV
ESD
Electrostatic handling (MIL MM ) +/- V 400 V
ESD
5 PAD Coordinates
The CME8000 is available as die for "chip-on-board" mounting and in SSO28 package.
DIE size: 2,73mm x 2,5mm
PAD size: contact window 84µm / 84µm
Thickness: 300µm±10µm
Symbol Function x-axis (µm) y-axis (µm) Pad # (dice) Pin # (SSO28*)
ANT2 Antenna switch 2 924.0 2243.6 1 1
IN2 Input antenna 582.4 2243.6 2 2
IN1 Input antenna 395.3 2243.6 3 3
ANT1 Antenna switch 1 156.5 2101.4 4 4
VCC Supply voltage analog part 156.5 1908.1 5 5
QHOUT Crystal 3 output 156.5 1715.3 6 6
QMOUT Crystal 2 output 156.5 1519.2 7 7
QLOUT Crystal 1 output 156.5 1322.0 8 8
GND Ground analog part 153.8 1161.6 9 9
QIN Crystal input 156.5 881.3 10 10
DEM Capacity for peak-detector 505.2 172.4 11 12
PK Capacity for AGC 767.0 172.4 12 13
TEST Test I/O 1547.2 181.6 13 14
PON Power on 1711.3 181.6 14 16
HLD AGC hold 1959.5 181.6 15 17
GNDL Ground logic part 2319.8 174.5 16 18
BSI 2 Bit strength indicator 2 2518.1 355.0 17 19
BSI 1 Bit strength indicator 1 2518.1 805.6 18 20
DT Data send clock 2517.8 1070.3 19 21
Data Data output 2517.8 1468.7 20 22
DR Data ready in register 2518.1 1919.2 21 23
Clock Input 1024 / 4096Hz 2517.5 2185.9 22 24
SS2 Transmitter select 2 2332.0 2243.7 23 25
SS1 Transmitter select 1 1950.1 2243.7 24 26
VL Supply voltage logic part 1574.9 2241.9 25 27
CLKSEL Clock select 1287.4 2243.7 26 28
SPEC No. Revision State C-MAX printed Version Page
CME8000 B.11 11.03.05 14.03.2005 English 2 of 21
CME8000
MFB
Data Sheet CME8000 C-MAX
6. Pad Layout Pin Layout SSO28
IN1 IN2 ANT2 CLKSEL VL SS1 SS2
ANT2
1 28 CLKSEL
1
3 2 26 25 24 23
22 Clock
4
ANT1
2 27
VL
21
VCC 5 DR
6
QHOUT
IN1 3 26 SS1
QMOUT 7
20
Data
8
QLOUT ANT1 4 25
SS2
GND 9
19 DT
VCC 5 24 Clock
The PAD coordinates
10
QI N
18
BSI1
are referred to the left
bottom point of the contact QHOUT 6 23
DR
window
17 BSI2
QMOUT
Y-axis 7 22
Data
11 12 13 14 15 16
DEM PK TEST PON HLD GNDL DT
QLOUT 8 21
X-axis
20 BSI1
9
Reference point GND
Figure 2. Pad layout
19
10 BSI2
QIN
11 18 GNDL
NC
17
HLD
DEM 12
PK 13 16
PON
14 15
TEST NC
Figure 3. Pin layout SSO28
SPEC No. Revision State C-MAX printed Version Page
CME8000 B.11 11.03.05 14.03.2005 English 3 of 21
Data Sheet CME8000 C-MAX
IN1, IN2 QHOUT, QMOUT, QLOUT
A ferrite antenna is connected between IN1 and In order to achieve a high selectivity, a crystal is
IN2. For high sensitivity, the Q factor of the connected between the Pins QOUT and QIN. It is
antenna circuit should be as high as possible. used with the serial resonant frequency according
Please note that a high Q factor requires to the time-code transmitter and acts as a serial
temperature compensation of the resonant resonator. Up to 3 crystals could be connected
frequency in most cases. We recommend a Q from QLOUT, QMOUT and QHOUT to the
factor between 40 and 150, depending on the common input QIN. The outputs will be
application. An optimal signal-to-noise ratio will be automatically selected by the pin SS1 and SS2
achieved by a resonator resistance of 40 kOhm to (see table). Only one of the outputs is active. Note
100 kOhm. that the output QLOUT is active if JJY40 is
selected. QMOUT is active if a 60kHz protocol is
selected, and QHOUT is only active for DCF or
ANT1, ANT2
HBG.
To realize a reception at different frequencies with
In applications with less than 3 different
one antenna, it is possible to connect additional
frequencies, leave the unused output pins open.
capacitors between the inputs. An internal MOS-
The given parallel capacitor of the filter crystal
switch is activated when a 60kHz protocol is
(about 1.4 pF) is internally compensated so that
activated. A second internal switch is activated
the bandwidth of the filter is about 10 Hz. The
choosing the JJY40 protocol (see table page 9).
impedance of QIN is high. Parasitic loads have to
The capacitors have to be connected between
be avoided.
ANT2 and IN1 for adjusting the 60kHz frequency,
and between ANT1 and IN2 to adjust the
VCC
frequency to 40kHz. Note in this case both
switches are active.
Pad 5
Pin 5
In applications with supply voltages below 2.5V
the impedance of the switches is probably too
110k 110k
high for a good Q-factor.
Q
In applications with less than 3 frequencies leave
the unused pins open
QHOUT PIN6 Pad6
QMOUT PIN7 Pad7
VCC
QLOUT PIN8 Pad8
Pad 5
Pin 5
200k
200k
GND
ANT1
Pad 9
Pad 4
Pin 9
Pin 4
RF - AMP
Figure 5.
IN1 QIN
Pad 3
VCC
Pin 3
IN2
Pad 5
Pin 5
Pad 2
Pin 2 200k
from
ANT2
AGC
Pad 1
QIN
Pin 1
Pad 10
1 k
GND Pin 10
Pad 9
Pin 9
Figure 4.
GND
Pad 9
Pin 9
Figure 6.
SPEC No. Revision State C-MAX printed Version Page
CME8000 B.11 11.03.05 14.03.2005 English 4 of 21
Data Sheet CME8000 C-MAX
DEM
Demodulator output. To ensure the function, an
NOTE: Automatic adjustment of PK and DEM
external capacitor has to be connected at this
timing
output.
To realize a good regulation timings of the
VCC demodulator and the peak detector the charge
and discharge currents for the capacitors at DEM
Pad 5
and PK have different values for the different
Pin 5
protocols. This is automatically switched internally
by choosing the protocol with SS1 and SS2.
DEM
Pad 10
25k
Pin 12
VCC, GND, VL, GNDL
V and GND are the supply voltage inputs for the
GND
CC
analog part. V and GNDL are the supply voltage
L
Pad 9
inputs for the digital part. The positive supplies
Pin 9
Figure 7.
have to be connected externally, and also the
ground pins.
To power down the circuitry it is recommended to
use the PON input and not to switch the power
supply. Switching the power supply results in a
long power up waiting time.
PK
Peak detector output. An external capacitor has to
be connected to ensure the function of the peak
VCC VL
detector. The value of the capacitance influences
the AGC regulation time.
Pad 5 Pad 25
Pin 5 Pin 27
VCC
Pad 5
Pin 5
PK
from
+ GND GNDL
- demodulator
Pad 12 2k
Pad 9 Pad 16
Pin 13
Pin 9 Pin 18
Figure 9.
GND
Pad 9
Pin 9
Figure 8.
SPEC No. Revision State C-MAX printed Version Page
CME8000 B.11 11.03.05 14.03.2005 English 5 of 21
Data Sheet CME8000 C-MAX
CLOCK, DT, PON, HLD
These pins are high impedant MOS-inputs and
require MOS-levels for operating
BSI1, BSI2, DATA, DR
CLOCK
These 4 pin are MOS-outputs, which deliver
To run the IC it is necessary to apply the clock
MOS-level.
chosen by CLKSEL.
All the timings given referred to this clock cycles.
In power down mode a clocking is not necessary.
ESD protection
HLD
VL
AGC hold mode: HLD high (V = V ) sets AGC
HLD CC
Pad 25
HLD off, HLD low (V = 0) or open sets AGC
HLD
PIN 27
HLD on, that is it holds for a short time the AGC
voltage. This can be used to prevent the AGC
from peak voltages, created by e.g. a stepper
motor.
Additional, there will be internal hold function
BSI2 PIN 19 PAD 17
generated, especially during read-out of data. BSI1 PIN 20 PAD 18
PON PIN 16 PAD 14
HLD PIN 17 PAD 15
PON
PON must be either connected to V or GND.
CC GNDL
If PON is connected to GND, the receiver will be
Pad 16
activated. The set-up time is typically 0.5 s after
PIN 18
Figure 11.
applying GND at this pin. If PON is connected to
V , the receiver will switch to power-down mode.
CC
A power down period of min. 2msec is necessary
after switching on the power supply and before
switching to another protocol.
ESD protection
VL
Pad 25
PIN 27
CLOCK PIN 24 PAD 22
DT PIN 21 PAD 19
PON PIN 16 PAD 14
HLD PIN 17 PAD 15
GNDL
Pad 16
PIN 18
Figure 10.
SPEC No. Revision State C-MAX printed Version Page
CME8000 B.11 11.03.05 14.03.2005 English 6 of 21
Data Sheet CME8000 C-MAX
SS1, SS2, CLKSEL
SS1, SS2
5 different protocols and 2 test modes are
selected by this 2 tri-state input pins (see table).
The selection is done in the first 20msec after the
power down period. Then the selected protocol is
internally stored and active until the next power
down.
CLKSEL
The IC can be clocked by 2 different frequencies.
A clock 4096Hz (32768Hz / 8) is expected if
CLKSEL is connected to VCC. CLKSEL open or
connected to GND needs a clock frequency of
1024Hz (32768Hz / 32). The selection is done in
the first 20msec after the power down period.
Then the selected frequency is fix until the next
power down.
ESD protection
VL
Pad 25
PIN 27
300k
SS2 PAD 23
PIN 25
SS1 PIN 26 PAD 24
CLKSEL PIN 28 PAD 26
300k
GNDL
Pad 16
PIN 18
Figure 12.
SPEC No. Revision State C-MAX printed Version Page
CME8000 B.11 11.03.05 14.03.2005 English 7 of 21
Data Sheet CME8000 C-MAX
7 Electrical Characteristics
V = 3V, input signal frequency 77.5 kHz +/- 5 Hz; carrier voltage 100% reduction to 25% for t = 200ms;
MOD
CC
t = 25°C, max./min. limits are at +25...C ambient temperature, unless otherwise specified.
amb
Test condition /
Parameter Symbol Min. Typ. Max. Unit
Pin
**
Supply voltage range (V ,
L
V
CC
1.2 5.0 V
V
CC
No different supply voltages
allowed!)
Supply current I 90 <120 µA
CC
Set-up time after V ON* V = 3V 1.5 s
t
CC CC
Reception frequency range F 40 120 kHz
in
Minimum input voltage V 0.5 0.8 µV
IN1, IN2
in
Maximum input voltage IN1, IN2 V 30 50 mV
in
Setup time after PON for
t 1.5 s
receiver part*
Power-ON control; PON Pad/Pin PON
Quiescent current receiver V =V , Pad/Pin
PON CC
I 0.03 0.05 µA
CC0
OFF V
CC
Set-up time after PON* t 0.5 2 s
Logical Part
(digital inputs: PON, HLD, DT, Clock)
Pins PON, HLD, DT, Clock Low level 0.15 V V
L
High level 0.85 V V
L
Input leakage current 0
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