ADVANTECH MIC-3392MIL
Specifications
BIOS
Award 4Mb flash
Chipset
Intel945GME/ICH7M
Controller
Intel 945GME integrated
PLX PCI 6540CB
CPU
Intel Core 2 Duo ULV or Core Duo LV up to 1.6 GHz (2 MB L2 cache)
Dimension
160.0 mm x 233.35 mm
Front Side Bus
533/667 MHz
Humidity (Non-operating)
10 ~ 95 % @ 45° C, non-condensing
Humidity (Operating)
5 ~ 85 % @ 45° C, non-condensing
Interface
Master/Drone
PCI
Up to 64-bit/66 MHz
Processor
Intel Core Duo LV/ULV
Resolution
Up to 2048 x 1536, 64k color at 75 Hz
Temperature ( Non-Operating)
-50 ~ 80° C
Temperature (Operating)
0 ~ 70° C (std CompactPCI SKU), -40 ~ 70° C (conduction-cool with pre-heat)
VRAM
Dynamic
Features
- Boot from network, Compact Flash, or local 2.5" SATA HDD
- Conduction cooled with ANSI/VITA30.1-2002 compliancy
- Four GbE ports, two USB 2.0 ports, two DVI-I ports, one P/S2 port, and one COM interface to the Rear Transition Module
- Intel® 945GME chipset supports 533/667 MHz FSB
- Optional conformal coating and SODIMM gluing service
- Optional one VGA port and two USB 2.0 ports to front panel
- PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.6 R1.0 compliant
- Pre-heat circuitry for reliable cold-booting in low temperature environment, or optional support for IPMI v1.5 without pre-heat
- Supports Intel® Core™ Duo Low Voltage or Core™2 Duo Ultra Low Voltage mobile processor
- Up to 3GB (DDR2 533/667) memory with SODIMM expansion
Datasheet
Advantech-MIC-3392MIL-Datasheet-720146394.pdf
383 KiB
Extracted Text
® 6U CompactPCI Intel Core™ 2 Duo MIC-3392MIL Rugged Processor Blade NEW Features ® Supports Intel Core™ Duo Low Voltage or Core™2 Duo Ultra Low Voltage mobile processor ® Intel 945GME chipset supports 533/667 MHz FSB Up to 3GB (DDR2 533/667) memory with SODIMM expansion Conduction cooled with ANSI/VITA30.1-2002 compliancy Pre-heat circuitry for reliable cold-booting in low temperature environment, or optional support for IPMI v1.5 without pre-heat Boot from network, Compact Flash, or local 2.5" SATA HDD Four GbE ports, two USB 2.0 ports, two DVI-I ports, one P/S2 port, and one COM interface to the Rear Transition Module Optional one VGA port and two USB 2.0 ports to front panel Optional conformal coating and SODIMM gluing service PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.6 R1.0 compliant RoHS COMPLIANT 2002/95/EC Introduction MIC-3392MIL, a CompactPCI PICMG 2.16 compliant single slot 6 U CPU board, comes with three different configurations that meet a wide range of environmental requirements from ruggedized applications. Based on the Intel Core Duo LV or Core 2 Duo ULV processor, it offers a low power dissipation design without the need of on-board forced ventilation. Ruggedized requirements are addressed by a conduction cooled design and extended operating temperature range (-40° C ~ 70° C). Shock and vibration resistances of the board are increased by using wedge locks and a single-piece CNC-milled aluminum alloy plate that conforms to the major IC packages. With highly integrated functional capabilities, the MIC-3392MIL fully utilizes the I/O features of the Intel chipsets. It supports up to 3 GB of 667 MHz DDR2 RAM, an onboard 2.5" Serial ATA HDD, a CompactFlash slot, and a set of I/O functions brought through the backplane to a unique rear transition module, which contains four LAN ports, two DVI-I ports, two USB 2.0 ports, one P/S2 port, and one RS232 port on the panel. Specifications CPU Intel Core 2 Duo ULV or Core Duo LV up to 1.6 GHz (2 MB L2 cache) Processor System Chipset Intel945GME/ICH7M BIOS Award 4Mb flash J1 Connector 32-bit PCI local bus CompactPCI Interface J2 Connector 64-bit PCI local bus J3~J5 Connectors PICMG2.16 + RTM area Controller PLX PCI 6540CB PCI-X to cPCI Bridge Interface Master/Drone Front Side Bus 533/667 MHz Bus PCI Up to 64-bit/66 MHz Technology DDR2 533/667 MHz Max. Capacity 3 GB Memory SODIMM x1 Socket 2 GB memory integrated on board Controller Intel 945GME integrated Graphic VRAM Dynamic Resolution Up to 2048 x 1536, 64k color at 75 Hz Controller Intel 82571EB dual-port Gigabit Ethernet controller Interface 10/100/1000Base-TX Ethernet (on PCIe x4 channel) I/O Connector PICMG2.16 and RJ-45 x2 (RTM rear panel) Ethernet Controller Intel 82546GB dual-port Gigabit Ethernet controller Interface 10/100/1000Base-TX Ethernet (on PCI 32bits/33Mhz) I/O Connector RJ-45 x2 (RTM rear panel) Mode SATA Channel 2 interfaces to CompactPCI connector 1 SATA connector and space reserved for a 2.5" HDD on one of the two channels (optional for non-conduction Storage Site Storage cooled product configuration) Mode IDE Channel 1 interface to CompactPCI connector Storage Site 1 on-board CompactFlash socket on the same channel MIC-3392MIL Specifications USB 2.0 2 host ports (std. USB connectors) on front panel and 4 host interfaces to cPCI connectors DVI-I 2 interfaces to CompactPCI connector Expansion I/O Serial 3 interfaces to CompactPCI connector (1 reserved for BMC IPMI F/W update) Parallel, FDD, PS2 Each with 1 interface to CompactPCI connector Output Local Rest and Interrupt Watchdog Timer Interval Programmable 1s ~ 255s Hardware Monitor Controller Winbond 83627HG Renesas H8S 2167, IPMIv1.5 compliant for standard CompactPCI SKU/Pre-heat F/W for conduction-cool SKU, BMC Controller mutually exclusive ® Operating System Compatibility Windows XP/2000, Linux, VxWorks 6.4 (on request) Front Panel LEDs Miscellaneous x1 blue/yellow for Hot Swap/HDD, x1 green for Master/Drone, x1 yellow BMC Heartbeat, and x1 green for Power (standard cPCI SKU only) Configuration Conduction cooled SKU (with Intel U7500 processor) Power Requirement TDP 37 watts (thermal model available on request) Physical Dimension 160.0 mm x 233.35 mm Operating Non-operating 0 ~ 70° C (std CompactPCI SKU) Temperature -50 ~ 80° C -40 ~ 70° C (conduction-cool with pre-heat) Humidity 5 ~ 85 % @ 45° C, non-condensing 10 ~ 95 % @ 45° C, non-condensing Environment Vibration (5-500 Hz) 1.5 Grms (without on-board 2.5" SATA HDD) 2 G Shock 20G (without on-board 2.5" SATA HDD) 50 G 300m below sea level to 4,000m above sea level Altitude 10,000m above sea level (without conformal coating) Conformance FCC Class A, CE, RoHS Regulatory NEBS Level 3 Designed for GR-63-CORE and GR-1089-CORE Compliance Standards PICMG 2.0 R3.0, PICMG 2.1 R.0, PICMG 2.9 R1.0 (std cPCI SKU), PICMG 2.16 R1.0, ANSI/VITA 30.1-2002 Recommended Configurations CPU Board Rear I/O Board Enclosure MIC-3392MILS-PxE Series RIO-3392MIL-AxE Series MIC-3039-BE, MIC-3042A/B, MIC-3043A/B/C/D, MIC-3056A, MIC-3081B MIC-3392MILC-P1E RIO-3392MIL-AxE Series Customized conduction cool enclosure Ordering Information Front Panel Main On-board Features System Board Conduction Conformal System Storage SODIMM Model Number Cool Coating VGA USB2.0 BMC Reset CPU Memory CF Socket Reset Channel Socket MIC-3392MILS-P1E 1 2 Yes Yes - Intel U7500 2 GB 1 1 1 - MIC-3392MILS-P2E 1 2 Yes Yes - Intel L2400 2 GB 1 1 1 - MIC-3392MILC-P1E - - - - Yes Intel U7500 2 GB 1 - - Yes Rear Panel On-board Header/Socket/Connector RTM CPCI Conformal COM Console USB Model Number Conn. Coating LAN COM DVI-I PS2 USB IDE FDD LPT SATA Interface Interface Interface RIO-3392MIL-A1E 4 1 2 1 2 1 1 1 2 1 1 2 J3 ~ J5 - RIO-3392MIL-A2E 4 1 2 1 2 1 1 1 2 1 1 2 J3 ~ J5 Yes One CF socket Memory DIMM socket One DB-15 VGA port Two USB2.0 ports One passive CPU heatsink MIC-3392MILS-PxE Series MIC-3392MILC-P1E Online Download www.advantech.com/products
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What they say about us
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Fuji
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Applied Materials
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Over the years, the equipment used in our company becomes discontinued, but they’re still of great use to us and our customers. Once these products are no longer available through the manufacturer, finding a reliable, quick supplier is a necessity, and luckily for us, GID Industrial has provided the most trustworthy, quality solutions to our obsolete component needs.
Nidec Vamco
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Trican Well Service
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ConAgra Foods